Philips Semiconductors Product specification
Dual diode BYM359X
fast, high-voltage
FEATURES SYMBOL QUICK REFERENCE DATA
• Low forward volt drop DAMPER MODULATOR
• Fast switching
• Soft recovery characteristic VR=1500 V VR=800 V
• High thermal cycling
performance VF 1.3 V VF 1.45 V
• Isolated mounting tab IF(RMS) =15.7 A IF(RMS) = 11 A
IFSM 60 A IFSM 60 A
trr 300 ns trr 145 ns
GENERAL DESCRIPTION PINNING SOT186A
Combined damper and modulator PIN DESCRIPTION
diodes in an isolated plastic
envelopeforhorizontaldeflectionin 1 damper cathode
colour TV and PC monitors.
The BYM359X contains diodes 2 common anode/cathode
with performance characteristics
designed specifically for 3 modulator anode.
applications from 16kHz to 56kHz
The BYM359X series is supplied in
the conventional leaded SOT186A
package.
LIMITING VALUES
Tj = 25 ˚C unless otherwise stated DAMPER MODULATOR
SYMBOL PARAMETER CONDITIONS MIN MAX MIN MAX UNIT
VRSM Peak non-repetitive reverse - 1500 - 800 V
voltage.
VRRM Peak repetitive reverse voltage - 1500 - 600 V
VRWM Crest working reverse voltage - 1300 - 600 V
IF(AV) Average forward current sinusoidal;a=1.57 - 10 - 8 A
IF(RMS) RMS forward current - 15.7 - 11.0 A
IFRM Peak repetitive forward current t=25 µs δ= 0.5 - 20 - 16.0 A
Ths 83 ˚C
IFSM Peak non-repetitive forward t = 10ms - 60 - 60 A
current t = 8.3 ms - 66 - 66 A
sinusoidal;
with reapplied
VRWM(MAX)
Tstg Storage temperature -40 150 -40 150 ˚C
TJOperating junction temperature - 150 - 150 ˚C
13
2
damper modulator
123
case
December 1999 1 Rev 1.200
Philips Semiconductors Product specification
Dual diode BYM359X
fast, high-voltage
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Visol R.M.S. isolation voltage from all f = 50-60 Hz; sinusoidal - - 2500 V
three terminals to external waveform;
heatsink R.H. 65% ; clean and dustfree
Cisol Capacitance from T2 to external f = 1 MHz - 10 - pF
heatsink
THERMAL RESISTANCES DAMPER MODULATOR
SYMBOL PARAMETER CONDITIONS TYP. MAX. TYP. MAX. UNIT
Rth j-hs Thermal resistance junction to with heatsink - 4.8 - 4.8 K/W
heatsink compound
Rth j-a Thermal resistance junction to in free air. 55 - - 55 K/W
ambient
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated DAMPER MODULATOR
SYMBOL PARAMETER CONDITIONS TYP. MAX. TYP. MAX. UNIT
VFForward voltage IF = 6.5 A 1.1 1.45 1.15 1.55 V
IF = 6.5 A; Tj = 125˚C 1.05 1.3 1.1 1.45 V
IRReverse current VR = VRWM 10 250 10 100 µA
VR = VRWM 50 500 100 600 µA
Tj = 100 ˚C
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated DAMPER MODULATOR
SYMBOL PARAMETER CONDITIONS TYP. MAX. TYP. MAX. UNIT
trr Reverse recovery time IF = 1 A; VR 30 V; 200 300 125 145 ns
-dIF/dt = 50 A/µs
QsReverse recovery charge 2 A,30 V,20 A/µs 1.2 2.0 0.5 0.7 µC
Vfr Peak forward recovery voltage IF = 6.5 A; 27 - 18.0 - V
dIF/dt = 50 A/µs
December 1999 2 Rev 1.200
Philips Semiconductors Product specification
Dual diode BYM359X
fast, high-voltage
Fig.1. Definition of trr, Qs and Irrm
Fig.2. Definition of Vfr
Fig.3. Modulator maximum forward dissipation,
PF = f(IF(AV)); square wave current waveform;
parameter D = duty cycle = tp/T.
Fig.4. Modulator maximum forward dissipation,
PF = f(IF(AV)); sinusoidal current waveform; parameter
a = form factor = IF(RMS)/IF(AV).
Fig.5. Modulator maximum non-repetitive rms forward
current. IF = f(tp); sinusoidal current waveform;
Tj = 150˚C prior to surge with reapplied VRWM.
Fig.6. Modulator typical and maximum forward
characteristic; IF = f(VF); parameter Tj
0 2 4 6 8
BY329
IF(AV) / A
PF / W
15
10
5
0
4
2.8 2.2 1.9
a = 1.57
Ths(max) / C
150
78
102
126
Vo = 1.25 V
Rs = 0.03 Ohms
100%
time
dI
dt F
IR
IF
Irrm
trr
25%
Qs
1ms 10ms 0.1s 1s 10s
tp / s
IFS(RMS) / A BY229
80
70
60
50
40
30
20
10
0
IFSM
time
time
VF
Vfr
VF
IF
0 1
BY229F
VF / V
IF / A
30
20
10
0 2
0.5 1.5
max
typ
Tj = 150 C
Tj = 25 C
0 2 4 6 8 10 12
BY329
IF(AV) / A
PF / W
20
15
10
5
0
Ths(max) / C
150
54
78
102
126
0.5
0.2
0.1
D = 1.0
D =
tptp
T
T
I
t
Vo = 1.25 V
Rs = 0.03 Ohms
December 1999 3 Rev 1.200
Philips Semiconductors Product specification
Dual diode BYM359X
fast, high-voltage
Fig.7. Modulator maximum Qs at Tj = 25˚C and 150˚C
Fig.8. Modulator maximum trr measured to 25% of Irrm;
Tj = 25˚C and 150˚C
Fig.9. Modulator typical junction capacitance Cd at
f = 1 MHz; Tj = 25˚C
Fig.10. Modulator transient thermal impedance
Zth = f(tp)
1 100
BY329
-dIF/dt (A/us)
Qs / uC
10
1
0.1 10
2 A
IF = 10 A
10 A
1 A
1 A
2 A
Tj = 150 C
Tj = 25 C
1 100
100
10
1 10 1000
BY329
Cd / pF
VR / V
1us 10us 100us 1ms 10ms 100ms 1s 10s
0.001
0.01
0.1
1
10
BY229F
pulse width, tp (s)
Transient thermal impedance, Zth j-hs (K/W)
D =
t
p
t
p
T
T
P
t
D
1 10 100
BY329
-dIF/dt (A/us)
trr / ns
1000
100
10
1 A
IF = 10 A
Tj = 150 C
Tj = 25 C
10A
1A
December 1999 4 Rev 1.200
Philips Semiconductors Product specification
Dual diode BYM359X
fast, high-voltage
Fig.11. Damper maximum non-repetitive rms forward
current. IF = f(tp); sinusoidal current waveform;
Tj = 150˚C prior to surge with reapplied VRWM.
Fig.12. Damper transient thermal impedance
Zth = f(tp)
Fig.13. Damper forward characteristic IF = f(VF);
parameter Tj
1ms 10ms 0.1s 1s 10s
tp / s
IFS(RMS) / A BY359
80
70
60
50
40
30
20
10
0
IFSM
0
30
20
10
0 1.0 2.0
IF / A
VF / V
max
typ
Tj=150C
Tj=25C
BY359
1us 10us 100us 1ms 10ms 100ms 1s 10s
0.001
0.01
0.1
1
10
BY359F
pulse width, tp (s)
Transient thermal impedance, Zth j-hs (K/W)
D =
t
p
t
p
T
T
P
t
D
December 1999 5 Rev 1.200
Philips Semiconductors Product specification
Dual diode BYM359X
fast, high-voltage
MECHANICAL DATA
Dimensions in mm
Net Mass: 2 g
Fig.14. SOT186A; The seating plane is electrically isolated from all terminals.
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
10.3
max
3.2
3.0
4.6
max
2.9 max
2.8
seating
plane
6.4
15.8
max
0.6
2.5
2.54
5.08
123
3 max.
not tinned
3
0.5
2.5
0.9
0.7
M
0.4
15.8
max. 19
max.
13.5
min.
Recesses (2x)
2.5
0.8 max. depth
1.0 (2x)
1.3
December 1999 6 Rev 1.200
Philips Semiconductors Product specification
Dual diode BYM359X
fast, high-voltage
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
December 1999 7 Rev 1.200