MPR03X
Rev 7, 7/2012
Freescale Semiconductor
Data Sheet: Technical Data
An Energy Efficient Solution by Freescale
© 2008, 2009, 2011, 2012 Freescale Semiconductor, Inc. All rights reserved.
Proximity Capacitive Touch
Sensor Controller
The MPR03X is an Inter-Integrated Circuit Communication (I2C)
driven Capacitive Touch Sensor Controller , optimized to manage two
electrodes with interrupt functionality, or three electrodes with the
interrupt disabled. It can accommodate a wide range of
implementations due to increased sensitivity and a specialized
feature set.
Features
• 6 µA supply current with two electrodes being monitored with
32 ms response time and IRQ enabled
• Compact 2 x 2 x 0.65 mm 8-lead µDFN package
• Supports up to 3 touch pads
• Only one external component needed
• Intelligent touch detection capacity
• 4 µA maximum shutdown current
• 1.71 V to 2.75 V operation
• Threshold based detection with hysteresis
•I
2C interface, with optional IRQ
• Multiple devices in a system allow for up to 6 electrodes (need
MPR032 with second I2C address)
• -40°C to +85°C operating temperature range
Implementations
• Switch Replacements
• Touch Pads
Typical Applications
• PC Peripherals
• MP3 Players
• Remote Controls
• Mobile Phones
• Lighting Controls
ORDERING INFORMATION
Device Name Temperature Range Case Number Touch Pads I2C Address Shipping
MPR031EPR2 -40C to +85C 1944 (8-Pin DFN) 3-pads 0x4A Tape and Reel
MPR032EPR2 -40C to +85C 1944 (8-Pin DFN) 3-pads 0x4B Tape and Reel
MPR031
MPR032
Top View
Figure 1. Pin Connections
Bottom View
8-PIN DFN
CASE 1944
1
SCL
2
3
8
7
6
54
SDA
VSS
VDD
IRQ/ELE2
ELE1
ELE0
REXT
MPR03X
Interface
I²C Serial
VSS
SDA
SCL
MPR03X
ELE0
ELE1
VDD
INT
1
2
VSS
75k
REXT
MPR03X with 2 Electrodes and 2 Pads
MPR03X
Sensors
2Freescale Semiconductor
1 Device Overview
1.1 Introduction
MPR03X is a small outline, low profile, low voltage touch sensor controller in a 2 mm x 2 mm DFN which manages up to three
touch pad electrodes. An I2C interface communicates with the host contro ller at data rates up to 400 kbits/sec. An optional
interrupt output advises the host of electrode status changes. The interrupt output is a multiplexed with the third electrode output,
so using the interrupt output reduces the num ber of electrode inputs to two. The MPR03X includes three levels of input signal
filtering to detect pad input condition changes due to touch without any processing by the application.
1.2 Internal Block Diagram
Figure 2. Functional Block Diagram
ELE0
ELE1
ELE2
0
1
2
012
Current Source Multiplexor
Input Source Multiplexor
Iref
3Set Source Curr ent
Mi rr or Iset
Select Chan
Selec t
Chan
Set Input Channel
Sel Set Grounded
Electrodes
10 Bit ADC
Enable
Convert
Clock
Data 10 ADC Result
8MHz
Star t C onver si on
Shutdown
2
4
2
Interrupt
Controller
I²C
Interface
32 kHz
Oscillator
User
Registers
Debounced
Results
Magnitude
Comparator
Avera g e
Filtered
Debounce
Result
Debounce Filter Registers
4 x Max Registers
4 x Sum Registers
4xMinRegisters
SDA
SCL
IRQ SET
CLR
Shutdown
Debounce
Interval
Debounce
Count
Sample
Interval
Sample
Count
Debounce
and
Sample
Counters
Average
Filtered
Sample
Result
Sample Filter Registers
Max R egiste r
Sum Register
Min R e gis ter
Set Source Curr ent
Set Input Channel
ADC Result
8MHz
Star t C onver si on
Shutdown
8MHz
Oscillator
Shutdown
ADC C on tr o ller
Traffic
SDA
SCL
IRQ
32 kHz8 MHz
Set Grounded
Electrodes
Number of
Electrodes
Un-Touched
Baseline
Filter
0V
REXT
MPR03X
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Freescale Semiconductor 3
2 External Signal Description
2.1 Device Pin Assignment
Table 1 show s the pin assignment for the MPR03X. For a more detailed description of the functionality of each pin, refer to the
appropriate chapter.
The package available for the MPR03X is a 2 x 2 mm 8 pin DFN. The package and pinout is shown in Figure 3.
Figure 3. Package Pinouts
2.2 Recommended System Connections
The MPR03X Capacitive Touch Sensor Controller requires one external passive component. As shown in Table 1, the REXT line
should have a 75 kconnected from the pin to GND. This resistor needs to be 1% tolerance.
In addition to the one resistor, a bypass capacitor of 10 µF should always be used between the VDD and VSS lines and a
4.7 k pull-up resistor should be included on the IRQ. Note: This condition is when pin 8 is used for interrupt indication and not
for electrode sensing.
The remaining two connections are SCL and SDA. Depending on the specific application, each of these control lines can be used
by connecting them to a host controller. In the most minimal system, the SCL and SDA must be connected to a master I2C
interface to commu n icate with the MPR03X. All of the connections for the MPR03X are shown by the schematic in Figure 4.
Table 1. Device Pin Assignment
Pin Name Function
1SCL
I2C Serial Clock Input
2SDA
I2C Serial Data I/O
3V
SS Ground
4V
DD Positive Supply Voltage
5 REXT Reference Resistor
Connect a 75 k ±1% resistor from REXT to VSS
6 ELE0 Electrode 0
7 ELE1 Electrode 1
8IRQ/ELE2 Interrupt Output or Touch Electrode Input 2
IRQ is the active-low open-drain interrupt output
1
SCL
2
3
8
7
6
54
SDA
VSS
VDD
IRQ/ELE2
ELE1
ELE0
REXT
MPR03X
Interface
I²C Serial
3
VSS
SDA
SCL
MPR03X
ELE0
ELE1
IRQ/ELE2
1
2
VSS
75k
VDD
REXT
MPR03X
Sensors
4Freescale Semiconductor
Figure 4. Recommended System Connections Schematic
2.3 Serial Interface
The MPR03X uses an I2C Serial Interface. The I2C protocol implementation and the specifics of communicating with the Touch
Sensor Controller are detailed in the following sections.
2.3.1 Serial-Addressing
The MPR03X operates as a slave that sends and receives data through an I2C 2-wire interface. The interface uses a Serial Data
Line (SDA) and a Serial Clock Line (SCL) to achieve bi-directional communication between master(s) and slave(s). A master
(typically a microcontroller) initiates all data transfers to and from the MPR03X, and it generates the SCL clock that synchronizes
the data transfer.
The MPR03X SDA line operates as both an input and an open-drain output. A pull-up resistor, typically 4.7k, is required on
SDA. The MPR03X SCL line operates only as an input. A pull-up resistor , typically 4.7k, is required on SCL if there are multiple
masters on the 2-wire interface, or if the master in a single-master system has an open-drain SCL output.
Each transmission consists of a ST AR T condition (Figure 5) sent by a master , followed by the MPR03X’s 7-bit slave address plus
R/W bit, a register address byte, one or more data bytes, and finally a STOP condition.
Figure 5. Wire Serial Interface Timing Details
2.3.2 Start and Stop Conditions
Both SCL and SDA remain high when the interface is not busy. A master signals the begi nning of a transmission with a
START (S) condition by transitioning SDA from high to low while SCL is high. When the master has finished communicating with
the slave, it issues a STOP (P) condition by transitioning SDA from low to high while SCL is high. The bus is then free for another
transmission.
Figure 6. Bit Transfer
SCL
SDA
tLOW
tHIGH
tF
tR
tHD STA
tHD DAT
tHD STA
tSU DAT tSU STA
tBUF
tSU STO
START
CONDIT ION
STOP
CONDIT ION
REPEATED START
CONDIT ION
START
CONDIT ION
DATA LINE STABLE
DATA VALID CHANGE OF
DATA ALLOWED
SDA
SCL
MPR03X
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Freescale Semiconductor 5
2.3.3 Bit Transfer
One data bit is transferred during each clock pul se (Figure 7). T he data on SDA must remain stable while SCL is high.
Figure 7. Stop and Start Co nditions
2.3.4 Acknowledge
The acknowledge bit is a clocked 9th bit (Figure 8) which the recipient uses to handshake receipt of each byte of data. Thus each
byte transferred effectively requires 9 bits. The master generates the 9th clock pulse, and the recipient pulls down SDA during
the acknowledge clock pulse, such that the SDA line is stable low during the high period of the clock pulse. When the master is
transmitting to the MPR03X, the MPR03X generates the acknowledge bit, since the MPR03X is the recipient. When the MPR03X
is transmitting to the master, the master gene rates the acknowledge bit, since the master is the recipie nt.
Figure 8. Acknowledge
2.3.5 The Slave Address
The MPR03X has a 7-bit long slave address (Figure 9). The bit following the 7-bit slave address (bit eight) is the R/W bit, which
is low for a write command and high for a read command.
Figure 9. Slave Address
The MPR03X monitors the bus continuously, waiting for a START condition followed by its slave address. When a MPR03X
recognizes its slave address, it acknowledges and is then ready for continued communication.
The MPR031 and MPR032 slave addresses are show in Table 2.
Table 2.
Part Number I2C Address
MPR031 0x4A
MPR032 0x4B
START
CONDITION
SDA
SCL
STOP
CONDITION
PS
START
CONDITION
SDA
BY TRANSMITTER
S
12 89
CLOCK PULSE FOR
ACKNOWLEDGEMENT
SDA
BY RECEIVER
SCL
SDA 1 R/W ACK
MSB
SCL
010010
MPR03X
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6Freescale Semiconductor
2.3.6 Message Format for Writing the MPR03X
A write to the MPR03X comprises the transmission of the MPR03X’s keyscan slave address with the R/W bit set to 0, followed
by at least one byte of information. The first byte of information is the command byte. The command byte determines which
register of the MPR03X is to be written by the next byte, if received. If a STOP condition is detected after the command byte is
received, the MPR03X takes no further action (Figure 10) beyond storing the command byte. Any bytes received after the
command byte are data bytes.
Figure 10. Command Byte Received
Any bytes received after the command byte are data bytes. The first data byte goes into the internal register of the MPR03X
selected by the command byte (Figure 11).
Figure 11. Command and Single Data Byte Receiv ed
If multiple data bytes are transmitted before a STOP condition is detected, these bytes are generally sto r ed in subsequent
MPR03X internal registers because the command byte address generall y auto -increments (Section 2.4).
2.3.7 Message Format for Reading the MPR03X
MPR03X is read using MPR03X's internally stored register address as address pointer , the same way the stored register address
is used as address pointer for a write. The pointer generally auto-increments after each data byte is read using the same rules
as for a write (Table 5). Thus, a read is initiated by first configuring MPR03X's register address by performing a write (Figure 10)
followed by a repeated start. The master can now read 'n' consecutive bytes from MPR03X, with first data byte being read from
the register addressed by the in itialized register address.
Figure 12. Reading MPR03X
SAAAP
0
SL AVE ADD RESS COMMAN D BYT E DATA BYT E
acknowledge from MPR03X
R/W 1byte
auto-i ncrement memory
word address
D15 D14 D13 D12 D11 D10 D9 D8 D1 D0D3 D2D5 D4D7 D6
How command byte and data byte
map into MPR03X's registers
acknowledge from
MPR03X
acknowledge from
MPR03X
SAAP1
SLAVE ADDRESS DATA BYT E
R/W n bytes
auto-i ncrement memory
word address
D1 D0D3 D2D5 D4D7 D6
acknowledge from MPR03X
acknowledge from master
NA
MPR03X
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Freescale Semiconductor 7
2.3.8 Operation with Multiple Master
The application should use repeated starts to address the MPR03X to avoid bus confusion between I2C masters.On a I2C bus,
once a master issues a start/repeated start condition, that master owns the bus until a stop condition occurs. If a master that does
not own the bus attempts to take control of that bus, then improper addressing may occur. An address may always be rewritten
to fix this problem. Follow I2C protocol for multiple master configurations.
2.4 Register Address Map
Table 3. Register Address Map
Register Register Address Burst Mode
Auto-Increment
Address
Touch Status Register 0x00
Register Address + 1
ELE0 Filtered Data Low Register 0x02
ELE0 Filtered Data High Register 0x03
ELE1 Filtered Data Low Register 0x04
ELE1 Filtered Data High Register 0x05
ELE2 Filtered Data Low Register 0x06
ELE2 Filtered Data High Register 0x07
ELE0 Baseline Value Register 0x1A
ELE1 Baseline Value Register 0x1B
ELE2 Baseline Value Register 0x1C
Max Half Delta Register 0x26
Noise Half Delta Register 0x27
Noise Count Limit Register 0x28
ELE0 Touch Threshold Register 0x29
ELE0 Release Threshold Register 0x2A
ELE1 Touch Threshold Register 0x2B
ELE1 Release Threshold Register 0x2C
ELE2 Touch Threshold Register 0x2D
ELE2 Release Threshold Register 0x2E
AFE Configuration Register 0x41
Filter Configuration Register 0x43
Electrode Configuration Register 0x44 0x00
MPR03X
Sensors
8Freescale Semiconductor
3 Functional Overview
3.1 Introduction
The MPR03X has an analog front, a digital filter, and a touch recognition system. This data interp retation can be done many
different ways but the method used in the MPR03X is explain ed in this chapter.
3.2 Understanding the Basics
MPR03X is a touch pad controller which manages two or three touch pad electrodes. An I²C interface communicates with the
host, and an optional interrupt output advises the host of electrode status changes. The interrupt output is a multiplexed function
with the third electrode input, so using the interrupt output reduces the number of electrode inputs to two.
The primary application for MPR03X is the management of user interface touch pads. Monitoring touch pads involves detecting
small changes of pad capacitance. MPR03X incorporates a self calibration function which continually adjusts the baseline
capacitance for each individual electrode. Therefore, the host only has to configure the delta thresholds to interpret a touch or
release.
MPR03X uses a state machine to operate a capacitive measurement engine to analyze the electrodes and determine whether a
pad has been touched or released. Between measurements the MPR03X draws negligible current. The application controls
MPR03X's configuration, making trade-offs between noise rejection, touch response time, and power consumption.
3.3 Implementation
The touch sensor system can be tailored to specific applications by varying the following: a capacitance detector, a raw data low
pass filter, a baseline management system, and a touch detection system. In the following sections, the functionality and
configuration of each block will be described.
Electrodes can be connected to the MPR03X in tw o different configurati ons, one with an IRQ and one without (Figure 13).
Figure 13. MPR03X Pad and Interrupt Connection Options
1
2
3
ELE0
ELE1
ELE2
Interface
I²C Serial
VSS
SDA
SCL
MPR03X
ELE0
ELE1
VDD
INT
1
2
SDA
SCL
MPR03X
VDD
Interface
I²C Serial
VSS
VSS
75k
REXT
VSS
75k
REXT
MPR03X with 2 Electrodes and 2 Pads MPR03X with 3 Electrodes and 3 Pads
MPR03X
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Freescale Semiconductor 9
4 Modes of Operation
4.1 Introduction
MPR03X’s operation modes are Stop, Run1, and Run2. Stop mode is the start-up and configuration mode.
4.2 Stop Mode
In Stop mode, the MPR03X does not monitor any of the electrodes. This mode is the lowest power state.
4.2.1 Initial Power Up
On power-up, the device is in Stop mode, registers are reset to the initial values shown in Table 4, and MPR03X starts in Stop
mode drawing minimal supply current. The user configurable pin IRQ/ELE2 defaults to being the interrupt output IRQ fu nction.
IRQ is reset on power-up, and so defaults to logic high. Since the IRQ is an open-drain output, IRQ will be high impedance.
4.2.2 Stop Mode Usage
In order to set the configuration registers, the device must be in stop mode. This is achieved by setting the EleEn field in th e
Electrode Configuration register to zero.
Table 4. Power-Up Register Configurations
Register Power-Up Condition Register Address HEX Value
Touch Status Register Cleared 0x00 0x00
ELE0 Filtered Data Low Register Cleared 0x02 0x00
ELE0 Fil te red Data High Register Cleared 0x03 0x00
ELE1 Filtered Data Low Register Cleared 0x04 0x00
ELE1 Fil te red Data High Register Cleared 0x05 0x00
ELE2 Filtered Data Low Register Cleared 0x06 0x00
ELE2 Filtered Data High Register Cleared 0x07 0x00
ELE0 Ba seline Value Register Cleared 0x1A 0x00
ELE1 Ba seline Value Register Cleared 0x1B 0x00
ELE2 Ba seline Value Register Cleared 0x1C 0x00
Max Half Delta Register Cleared 0x26 0x00
Noise Half Delta Register Cleared 0x27 0x00
Noise Count Limit Register Cleared 0x28 0x00
ELE0 Touch Threshold Register Cleared 0x29 0x00
ELE0 Rele ase Threshold Register Cleared 0x2A 0x00
ELE1 Touch Threshold Register Cleared 0x2B 0x00
ELE1 Rele ase Threshold Register Cleared 0x2C 0x00
ELE2 Touch Threshold Register Cleared 0x2D 0x00
ELE2 Rele ase Threshold Register Cleared 0x2E 0x00
AFE Configuration Register 6 AFE samples, 16 µA charge current 0x41 0x10
Filter Configuration Register 16 ms detection sample interval,
4 samples for the second level filter,
0.5 µS charge tim e
0x43 0x24
Electrode Configuration Register Stop mode. ELE2/IRQ pin is interrupt
function, 0x44 0x00
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4.3 Run1 Mode
In Run1 Mode, the MPR03X monitors 1, 2, or 3 electrodes which are connected to a user defined array of touch pads. When only
1 or 2 electrodes are selected, the IRQ/ELE2 pin is automaticall y configured as an open drain interrupt output.
When 3 electrodes are selected in Run1 Mode, the IRQ/ELE 2 pin becomes the third electrode input, ELE2 (Figure 14).
Figure 14. Electrode/Pad Connections in Run Mode
4.4 Run2 Mode
In Run2 Mode, all enabled electrodes act as a single electrode by internally connecting the electrode pins together. The entire
surface of all the touch pads is used as a single pad, increasing the total area of the conductor.
When 2 electrodes are selected in Run2 Mode, the IRQ/ELE2 pin is automatically configured as an open drain interrupt output.
When 3 electrodes are selected, the IRQ/ELE2 pin becomes the third electrode inp ut, ELE2 (Figure 15).
Figure 15. Electrode/Pad Connectio ns in Area Detection Mode
4.5 Electrode Configuration Register
The Electrode Configuration Register manages the configuration of the Electrode outputs in addition to the mode of the part. The
address of the Electrode Configuration Register is 0x44.
Figure 16. Electro de Configuration Register
76543210
R0CalLock ModeSel EleEn
W
Reset:00000000
= Unimplemented
ELE0
ELE1 Capacitance
Measurement
Engine
Filters
and
Touch
Detection
ELE2
3
1
2
Run1 Mode with 3 Electrodes
INT Interrupt
Run1 Mode with 2 Electrodes
ELE1
ELE0
Capacitance
Measurement
Engine
Filters
and
Touch
Detection
1
2
INT Interrupt
Run1 Mode with 1 Electrode
ELE0 Capacitance
Measurement
Engine Filters
and
Touch
Detection
1
ELE0
ELE1
INT
Capacitance
Measurement
Engine
Filters
and
Touch
Detection
ELE2 Interrupt
Run2 Mode to 2 Pads
3
1
2ELE1
ELE0
Capacitance
Measurement
Engine
Filters
and
Touch
Detection
Run2 Mode to 3 Pads
1
2
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Freescale Semiconductor 11
Table 5. Electrode Configuration Register Field Descriptions
Field Description
6
CalLock Calibration Lock – The Calibration Lock bit selects whether calibration is enabled
or disabled.
0 Enabled – In this state baseline calibration is enabled.
1 Disabled – In this state baseline calibration is disabled.
5:4
ModeSel Mode Select – The Mode Select field selects which Run Mode the sensor will
operate in. This register is ignored when in Stop Mode.
00 Encoding 0 – Run1 Mode is enabled.
01 Encoding 1 – Run2 Mode is enabled.
10 Encoding 2 – Run2 Mode is enabled.
11 Encoding 3 – Run2 Mode is enabled.
3:0
EleEn Electrode Enable – The Electrode Enable Field selects the electrode and IRQ
functionality.
0000 Encoding 0 – Stop Mode
0001 Encoding 1 – Run Mode with ELE0 is enabled, ELE1 is disabled, IRQ is
enabled.
0010 Encoding 2 – Run Mode with ELE0 is enabled, ELE1 is enabled, IRQ is
enabled.
0011 Encoding 3 – Run Mode with ELE0 is enabled, ELE1 is enabled, ELE2 is
enabled.
~
1111 Encoding 15 – Run Mode with ELE0 is enab led, ELE1 is enabled, ELE2 is
enabled.
MPR03X
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12 Freescale Semiconductor
5 Output Mechanisms
5.1 Introduction
The MPR03X has three outputs: the touch status, values from the second level filter (Section 8.3), and the calibrated baseline
values. The application can either use the touch status or a combination of second level filter data with the baseline data to
determine when a touch occurs.
5.2 Touch Status
Each Electrode has an associated single bit that denotes whether or not the pad is currently touched. This output is generated
using the touch threshold and release threshold registers to determine when a pad is considered touched or untouched.
Configuration of this system is discussed in Section 9.
5.2.1 Touch Status Register
The Touch Pad S tatus Register is a read only register for determining the current status of the touch pad. The I2C slave address
of the Touch Pad Status Register is 0x00.
Figure 17. Touch Status Register
76543210
ROCF 0 0 0 0 E2S E1S E0S
W
Reset:00000000
= Unimplemented
Table 6. Touc h Pad Status Register Field Desc riptions
Field Description
7
OCF Over Current Fl ag – The Over Curren t Fl ag shows when too much current is on the REXT
pin. If it is set all other status flags and registers are cleared and the device is set to Stop
mode. When OCF is set, the MPR03X cannot be put back into a Run mode.
0 – Current is within limits.
1 – Current is above limits. Writing a 1 to this field will clear the OCF.
2
E2S Electrode 2 Status – The Electrode 2 Status bit shows touched or not touched.
0 – Not Touched
1 – Touched
1
E1S Electrode 1 Status – The Electrode 1 Status bit shows touched or not touched.
0 – Not Touched
1 – Touched
0
E0S Electrode 0 Status – The Electrode 0 Status bit shows touched or not touched.
0 – Not Touched
1 – Touched
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5.3 Filtered Data
Each electrode has an associated filtered output. This output is gene rated through register settings and a low pass filter
implementation (Section 8.4).
5.3.1 Filtered Data Low Register
The Filtered Data Low register contains the data on each of the electrodes. It is paired with the Filtered Data High register for
reading the 10 bit A/D value. The address of the ELE0 Filtered Data Low register is 0x02. The address of the ELE1 Filtered Data
Low register is 0x04. The address of the ELE2 Filtered Data Low register is 0x06.
Figure 18. Filtered Data Low Register
5.3.2 Filtered Data High Register
The Filtered Data High register contains the data on each of the electrodes. It is paired with the Filtered Data Low register for
reading the 10 bit A/D value. The address of the ELE0 Filtered Data High register is 0x03. The address of the ELE1 Filtered Data
High register is 0x05. The address of the ELE2 Filtered Data High register is 0x07.
Figure 19. Filtered Data High Register
76543210
RFDLB
W
Reset:00000000
= Unimplemented
Table 7. Filtered Data Lo w Register Field Descriptions
Field Description
7:0
FDLB Filtered Data Low Byte – The Filtered Data Low Byte displays the lower 8 bits of
the 10 bit filtered A/D reading.
00000000 Encoding 0
~
11111111 Encoding 255
76543210
R000000 FDHB
W
Reset:00000000
= Unimplemented
Table 8. Filtered Data High Register Field Descriptions
Field Description
7:0
FDHB Filtered Data High Bits – The Filtered Data High Bits displays the higher 2 bits of
the 10 bit filt e red A/D reading .
00 Encoding 0
~
11 Encoding 3
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14 Freescale Semiconductor
5.4 Baseline Values
In addition to the second level filter data, the data from the baseline filter (or third leve l fil te r) is al so disp la ye d. In this case, the
least two signi ficant bits are removed before the 10-bit value is displayed in the re gister.
5.4.1 Baseline Value Register
The Baseline Value register contains the third level filtered data on each of the electrodes. It is a truncated 10 bit A/D value
displayed in the 8 bit register. The address of the ELE0 Baseline V alue register is 0x1A. The address of the ELE1 Baseline V alue
register is 0x1B. The address of the ELE2 Baseline Value register is 0x1C.
Figure 20. Filtered Data High Register
76543210
RBV
W
Reset:00000000
= Unimplemented
Table 9. Filter ed Data High Register Fiel d Descriptions
Field Description
7:0
BV Baseline Value – The Baseline Value byte displays the higher 8 bits of the 10 bit
baseline value.
00000000 Encoding 0 – The 10 bit baseline value is between 0 and 3.
~
11111111 Encoding 255 – The 10 bit baseline value is between 102 0 and 1023.
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Freescale Semiconductor 15
6 Interrupts
6.1 Introduction
The MPR03X has one interrupt output that is triggered on any touch related event. The interrupts trigger on both the up or down
motion of a finger as defined by a set of configurable thresholds.
6.2 Triggering an Interrupt
An interrupt is asserted any time data changes in the Touch S t atus Register (Section 5.2). This means that if an electrode touch
or release occurs, an interrupt will alert the application of the change.
6.3 Interrupt Handling
The MPR03X has one interrupt output that is asserted on any touch related event. The interrupts trigger on both the up or down
motion of a finger as defined by a set of configurable thresholds as described in Section 9. To service an interrupt, the application
must read the Touch Status Register (Section 5.2) and determine the current condition of the system. As soon as an I2C read
takes place the MPR03X will release the interrupt.
6.4 IRQ Pin
The IRQ pin is an open-drain latching interrupt output which requires an external pull-up resistor . The pin will latch down based
on the condi ti on s in Section 6.2. The pin will de-assert when an I2C transaction reads from the MPR03X.
MPR03X
Sensors
16 Freescale Semiconductor
7 Theory of Operation
7.1 Introduction
The MPR03X utilizes the principle that a capacitor holds a fixed amount of charge at a specific electric potential. Both the
implementation and the configuration will be described in this section.
7.2 Capacitance Measurement
The basic measurement technique used by the MPR03X is to charge up the capacitor C on one electrode input with a DC current
I for a time T (the charge time). Before measurement, the electrode input is grounded, so the electrode voltage starts from 0 V
and charges up with a slope, Equation 1, where C is the pad capacitance on the electrode (Figure 21). All of the other electrodes
are grounded during this measurement. At the end of time T, the electrode voltage is measured with a 10 bit AD C. The voltage
is inversely proportional to capacitance according to Equation 2.The electrode is then discharged back to ground at the same
rate it was charged.
Equation 1
Equation 2
Figure 21. MPR03X Electrode Measurement Charging Pad Capacitance
When measuring capacitance there are some inherent restrictions due to the methodology used. On the MPR03X the voltage
after charging must be in the range that is shown in Figure 22.
Figure 22.
C
I
dt
dV
CTI
V
Electrode Charge Time T
V
Electrode Voltage
Electrode
Charging
Electrode
Discharging
Electrode voltage measured here
2T
Electrode Discharge Time
Valid ADC Values vs. VDD
0
100
200
300
400
500
600
700
800
900
1.71 1.91 2.11 2.31 2.51 2.71
VDD (V)
ADC Counts
ADChigh
ADCmid
ADClow
MPR03X
Sensors
Freescale Semiconductor 17
The valid operating range of the electrode charging source is 0.7V to (VDD-.7)V. This means that for a given VDD the valid ADC
(voltage visible to the digital interface) range is given by
, Equation 3
and
. Equation 4
These equations are represented in the graph. In the nominal case of VDD = 1.8V the ADC range is shown below in Table 10.
Any ADC counts outside of the range shown are invalid and settin gs must be adjusted to be within this range. If capacitance
variation is of importance for an application after the current output, charge time and supply voltage are determined th en the
following equations can be used. The valid range for capacitance is calculated by using the minimum and maximum ADC values
in the capacitance equation. Substituting the low and high ADC equations into the capacitance equation yields the equations for
the minimum and maximum capacitance values which are
and . Equation 5
7.3 Sensitivity
The sensitivity of the MPR03X is relative to the capacitance range being measured. Given the ADC value, current and time
settings capacitance can be calculated,
. Equation 6
For a given capacitance the sensitivity can be measured by taking the derivative of this equation. The result of this is the
following equation, representing the change in capacitance per one ADC count, where the ADC in the equation represents the
current value.
Equation 7
This relationship is shown in the following graph by taking the midpoints off all possible ranges by varying the current and time
settings. The midpoint is assumed to be 512 for ADC and the nominal supply voltage of 1.8V is used.
Table 10.
VDD ADChigh ADClow ADCmid
1.8 625.7778 398.2222 512

1024
7.
DD
low V
ADC


1024
7.
DD
DD
high V
V
ADC
7.
DD
low VTI
C
7. TI
Chigh
ADCV TI
C
DD
1024
2
1024
ADCV TI
dADC
dC
DD
MPR03X
Sensors
18 Freescale Semiconductor
Figure 23.
Smaller amounts of change indicate increased sensitivity for the capacitance sensor . Some sample values are shown in Table 11.
In the above cases, the capacitance is assumed to be in the middle of the range for specific settings. Within the capacitance
range the equation is nonlinear , thus the sensitivity is best with the lowest capacitance. This graph shows the sensitivity derivative
reading across the valid range of capacitances for a set I, T, and VDD. For simple small electrodes (that are approximately
21 pF) and a nominal 1.8V supply the following graph is representative of this effect.
Figure 24.
Table 11.
pF Sensitivity (pF/ADC count)
10 -0.01953
100 -0.19531
Sensitivity vs. Midpoint Capacitance for VDD =1.8V
-5
-4.5
-4
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0500 1000 1500 2000 2500
Midpoint Capacitance (pF)
Sensitivity (pF/ADC Count)
dC/dADC @cmid (pF/1 ADC Count)
0
Sensitivity vs. Capacitance for VDD =1.8VandI=36μAandT=.5μS
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.1
10 12 14 16 18 20 22 24 26 28 30
Sensitivity (pF/ADC Count)
Maximum
Minimum
C/ADC
Capacitance
MPR03X
Sensors
Freescale Semiconductor 19
7.4 Configuration
From the implementation above, there are two eleme nts that can be configured to yield a wide range of capacitance readings
ranging from 0.455 pF to 2874.39 pF. The two configurable components are the electrode charge current and the electrode
charge time.
The electrode charge current can be configured to equal a range of values between 1 A and 63 A. This value is set in the CDC
in the AFE Configuration register (Section 7.4.1).
The electrode charge time can be configured to equal a range of values between 500 ns and 32 S. This value is set in the CDT
in the Filter Configuration Register (Section 8.3.1).
7.4.1 AFE Configuration Register
The AFE (Analog Front End) Configuration Register is used to set both the Charge/Discharge Current and the number of samples
taken in the lowest level filter . The address of the AFE Configuration Register is 0x41.
Figure 25. AFE Configuration Regist er
76543210
RFFI CDC
W
Reset:00010000
= Unimplemented
Table 12. AFE Configuration Register Field Descriptions
Field Description
7:6
FFI First Filter Iterations – The first filter iterations field selects the number of samples
taken as input to the first level of filtering.
00 Encoding 0 – Sets samples taken to 6
01 Encoding 1 – Sets samples taken to 10
10 Encoding 2 – Sets samples taken to 18
11 Encoding 3 – Sets samples taken to 34
5:0
CDC Charge Discharge Curre nt – The Cha rge Discharge Current field selects the
supply current to be used when charging and discharging an electrode.
000000 Encoding 0 – Disables Electrode Charging
000001 Encoding 1 – Sets the current to 1uA
~
111111 Encoding 63 – Sets the current to 63uA
MPR03X
Sensors
20 Freescale Semiconductor
8Filtering
8.1 Introduction
The MPR03X has three levels of filtering. The first and second level filters will allow the application to condition the signal for
undesired input variation. The third level filter can be configured to reject to uch stimulus and be used as a baseline for touch
detection. Each level of filtering will be further describ ed in this section.
8.2 First Level
The first level filter is designed to filter high frequency noise by averaging samples taken over short periods of time. The number
of samples can be configured to equal a set of values rangin g from 6 to 34 samples. This value is set by the FFI in the AFE
Configuration Register (Section 7.4.1). The timing of this filter is also determined by the configuration of the electrode charge time
in the Filter Configuration Registe r (Section 8.3.1).
Note that the electrode charge time must be configured for the capacitance in the application. The resulting value will affect the
period of the first level filter.
8.3 Second Level
The second level filter is designed to filter low frequency noise and reject false touches due to inconsistent data. The number of
samples can be configured to equal a set of values ranging from 4 to 18. This value is set by the SFI in the Filter Configuration
Register (Section 8.3.1). The timing of this filter is also determined by the configuration of ESI in the Filter Configuration Register
(Section 8.3.1).
Note that the ESI (Electrode Sample Interval) must be configured to accommodate the low power requirements of a system.
Thus, the resulting value will affect the period of the second level filter.
The raw data from the second level of filte ring is output in the Filtered Data High and Filtered Data Low registers, as shown in
Section 5.3.
8.3.1 Filter Configuration Register
The Filter Configuration register is used to set the electrode charge/discharge time (CDT), second level filter iteration (SFI), and
electrode sample intervals (ESI). The address of the Electrode Configuration Register is 0x43.
Figure 26. Filter Configuration Register
76543210
RCDT SFI ESI
W
Reset:00100100
= Unimplemented
MPR03X
Sensors
Freescale Semiconductor 21
8.4 Third Level Filter
The Third Level Filter is designed for varying implementations. It can be used as either an additional low pass filter for the
electrode data or a baseline for touch detection. For it to function as a baseline filter , it must be used in conjunction with the touch
detection system described in the next chapter. To use the filter as an additional layer for low pass filtering, the touch detection
system must be disabled by setting all of the touch thresholds to zero (refer to Section 9.2). Although, in most cases the third
level of filter will be used as a baseline filter . The primary difference between these implementations is this: if a touch is detected
the baseline filter will hold its current value until the touch is released. The touch/release configuration will be described in
Chapter 9.
When a touch is not currently detected, the baseline filter will operate based on a few conditions. These are configured through
a set of registers including the Max Half Delta Register , the Noise Half Delta Register, and the Noise Count Limit.
8.4.1 Max Half Delta Register
The Max Half Delta register is used to set the Max Half Delta for the Third Level Filter. The address of the Max Half Delta Register
is 0x26.
Figure 27. Max Half Delta Register
Table 13. Filter Configuration Register Field Descriptions
Field Description
7:5
CDT Charge Discharge Time – The Charge Discharge Time field selects the amount
of time an electrode charges an d discharges.
000 Encoding 0 – Invalid
001 Encoding 1 – Time is set to 0.5 s
010 Encoding 2 – Time is set to 1 s
~
111 Encoding 7 – Time is set to 32 s.
4:3
SFI Second Filter Iterations – The Second Filter Iterations field selects the number of
samples taken for the second level filter.
00 Encoding 0 – Number of samples is set to 4
01 Encoding 1 – Number of samples is set to 6
10 Encoding 2 – Number of samples is set to 10
11 Encoding 3 – Number of samples is set to 18
2:0
ESI Electrode Sample Interval – The Electrode Sample Interval field selects the
period between samples used for the second level of filtering.
000 Encoding 0 – Period set to 1 ms
001 Encoding 1 – Period set to 2 ms
~
111 Encoding 7 – Period set to 128 ms
76543210
R0 0 MHD
W
Reset:00000000
= Unimplemented
Table 14. Max Half Delta Register Fiel d Descriptions
Field Description
5:0
MHD Max Half Delta – The Max Half Delta determines the largest magnitude of
variation to pass through the third level filter.
000000 DO NOT USE THIS CODE
000001 Encoding 1 – Sets the Max Half Delta to 1
~
111111 Encoding 63 – Sets the Max Half Delta to 63
MPR03X
Sensors
22 Freescale Semiconductor
8.4.2 Noise Half Delta Register
The Noise Half Delta register is used to set the Noise Half Delta for the third level filter. The address of the Noise Half Delta
Register is 0x27.
Figure 28. Noise Half De lta Register
8.4.3 Noise Count Limit Register
The Noise Count Limit register is used to set the Noise Count Limit for the Third Level Filter . The address of the Noise Half Delta
Register is 0x28.
Figure 29. Noise Count Limit Register
76543210
R0 0 NHD
W
Reset:00000000
= Unimplemented
Table 15. Noise Half Delta Register Field Descriptions
Field Description
5:0
NHD Noise Half Delta – The Noise Half Delta determines the incremental change when
non-noise drift is detected.
000000 DO NOT USE THIS CODE
000001 Encoding 1 – Sets the Noise Half Delta to 1
~
111111 Encoding 63 – Sets the Noise Half Delta to 63
76543210
R0 0 0 0 NCL
W
Reset:00000000
= Unimplemented
Table 16. Noise Count Limit Register Field Descriptions
Field Description
3:0
NCL Noise Count Limit – The Noise Count Limit determines the number of samples consecutively
greater than the Max Half Delta necessary before it can be determined that it is non-noise .
0000 Encoding 0 – Sets the Noise Count Limit to 1 (every time over Max Half Delta)
0001 Encoding 1 – Sets the Noise Count Limit to 2 consecutive samples over Max Half Delta
~
1111 Encoding 15 – Sets the Noise Count Limit to 15 consecutive samples over Max Half Del ta
MPR03X
Sensors
Freescale Semiconductor 23
9 Touch Detection
9.1 Introduction
The MPR03X uses a threshold based system to determine when touches occur. This section will describe that mechanism.
9.2 Thresholds
When a touch pad is pressed, an increase in capacitance will be generated. The resulting effect will be a reduction in the ADC
counts. When the difference between the second level filter value and the third level filter value is signi ficant, the system will
detect a touch. Wh en a to uch is de tected, there are a couple of effects: the third level filter output becomes fixed (refer to
Section 8.4), an interrupt is generated (refer to Section 6), and the touch status register (Section 5.2) is updated.
The touch detection system is controlled using two threshold re gisters for each independent electrode. The Touch Threshol d
register represents the delta at which the system will trigger a touch. The Release Threshold represents the difference at which
a release would be detecte d. In either case the system will respond by changing the previously menti oned items.
9.2.1 Touch Threshold Register
The Touch Threshold Register is used to set the touch threshold for each of the electrodes. The address of the ELE0 Touch
Threshold Register is 0x29. The address of the ELE1 Touch Th reshold Register is 0x2B. The address of the ELE2 Touch
Threshold Register is 0x2D.
Figure 30. Touch Threshold Register
9.2.2 Release Threshold Register
The Release Threshold Register is used to set the release threshold for each of the electrodes. The address of the ELE0 Release
Threshold Register is 0x2A. The address of the ELE1 Release Threshold Register is 0x2C. The address of the ELE2 Release
Threshold Register is 0x2E.
Figure 31. Release Threshold Register
76543210
RTTH
W
Reset:00000000
= Unimplemented
Table 17. Touch Threshold Register Field Descriptions
Field Description
7:0
TTH Touch Threshold – The Touch Threshold Byte sets the trip point for detecting a
touch.
00000000 Encoding 0
~
11111111 Encoding 255
76543210
RRTH
W
Reset:00000000
= Unimplemented
Table 18. Release Threshold Register Field Descriptions
Field Description
7:0
RTH Release Threshold – The Release Threshold Byte sets the trip point for detecting
a touch.
00000000 Encoding 0
~
11111111 Encoding 255
MPR03X
Sensors
24 Freescale Semiconductor
Appendix A Electrical Characteristics
A.1 Introduction
This section contains electrical and timing specifications.
A.2 Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond the
limits specified in Table 19 may affect device reliability or cause permanent damage to the device. For functional operating
conditions, refer to the remaining tables in this section. This device contains circuitry protecting against damage due to high static
voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher
than maximum-rated voltages to this high-impedance circuit.
A.3 ESD and Latch-up Protection Characteristics
Normal handling precautions should be used to avoid exposur e to static discharge.
Qualification tests are performed to ensure that thes e devices can withstand exposure to reasonable levels of static without
suffering any permanent damage. During the device qualification ESD stresses were performed for the Human Body Model
(HBM), the Machine Model (MM) and the Charge Device Model (CDM).
A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device specification. Complete
DC parametric and functional testing is performed per the applicable device specification at room temperature followed by hot
temperature, unless specified otherwise in the device specification.
Table 19. Absolute Maximum Ratings - Voltage (with respect to V SS)
Rating Symbol Value Unit
Supply Voltage VDD -0.3 to +2.9 V
Input Voltage
SCL, SDA, IRQ VIN VSS - 0.3 to VDD + 0.3 V
Operating Temperature Range TSG -40 to +85 °C
Storage Temperature Range TSG -40 to +125 °C
Table 20. ESD and Latch-up Test Conditions
Rating Symbol Value Unit
Human Body Model (HBM) VESD ±4000 V
Machine Model (MM) VESD ±200 V
Charge Device Model (CDM) VESD ±500 V
Latch-up current at TA = 85°C ILATCH ±100 mA
MPR03X
Sensors
Freescale Semiconductor 25
A.4 DC Characteristics
This section includes information abo ut power supply requirements and I/O pin characteristics.
1. Parameters tested 100% at final test at room temperature; limits at -40°C and +85°C verified by characterization, not tested in production
2. Limits verified by characterization, not tested in production
A.5 AC Characteristics
1. Parameters tested 100% at final test at room temperature; limits at -40°C and +70°C verified by characterization, not tested in production
2. Limits verified by characterization, not tested in production.
Table 21. DC Characteristics (Temperature Range = –40°C to 85°C Ambient)
(Typical Operating Circuit, VDD = 1.71 V to 2.75 V, TA = TMIN to TMAX, unless otherwise noted. Typical current values are at
VDD = 1.8 V, TA = +25°C.)
Parameter Symbol Conditions Min Typ Max Units
Operating Supply Voltage VDD 1.71 1.8 2.75 V 1
Average Supply Current IDD Run1 Mode @ 1 ms sample period 43 57.5 A2
Average Supply Current IDD Run1 Mode @ 2 ms sample period 22 32 A2
Average Supply Current IDD Run1 Mode @ 4 ms sample period 14 19.4 A2
Average Supply Current IDD Run1 Mode @ 8 ms sample period 8 13.3 A2
Average Supply Current IDD Run1 Mode @ 16 ms sample period 6 10.1 A2
Average Supply Current IDD Run1 Mode @ 32 ms sample period 5 8.6 A2
Average Supply Current IDD Run1 Mode @ 64 ms sample period 4 7.8 A2
Average Supply Current IDD Run1 Mode @ 128 ms sample period 4 7.5 A2
Measurem en t Su pp l y Cu rre nt IDD Peak of measurement duty cycle 1.25 1.5 mA 2
Idle Supply Current IDD Stop Mode 1.5 4 A1
Electrode Charge Current
Accuracy
ELE_
Relative to nominal values programmed
in Register 0x41 -6 +6 % 1
Electrode Input Working Range
ELE_ Electrode charge current accuracy
within specification 0.7 VDD - 0.7 V 1
Input Leakage Current ELE_ IIH, IIL 0.025 1 A1
Input Self-Capacitance ELE_ 15 pF 2
Input High Voltage SDA, SCL V IH 0.7 x VDD V2
Input Low Voltage SDA, SCL VIL 0.3 x VDD V2
Input Leakage Current
SDA, SCL IIH, IIL 0.025 1 A2
Input Capacitance
SDA, SCL 7pF
2
Output Low Voltage
SDA, IRQ VOL IOL = 6mA 0.5V V 1
Power On Reset VTLH VDD rising 1.08 1.35 1.62 V 2
VTHL VDD falling 0.88 1.15 1.42 V 2
AC CHARACTERISTICS
(Typical Operating Circuit, VDD = 1.71V to 2.75V, T A = TMIN to TMAX, unless otherwise noted. Typical values are at VDD = 1.8V,
TA = +25°C.)
Parameter Symbol Conditions Min Typ Max Units
8 MHz Internal Oscillator fH7.44 8 8.56 MHz 1
32 kHz Internal Oscillator fL20.8 32 43.2 kHz 1
MPR03X
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26 Freescale Semiconductor
A.6 I2C AC Characteristics
This section includes information about I2C AC Characteristics.
Table 22. I2C AC Characteristics
(Typical Operating Circuit, VDD = 1.71 V to 2.75 V, TA = TMIN to TMAX, unless otherwise noted. Typical current values are at
VDD = 1.8 V, TA = +25° C.)
Parameter Symbol Conditions Min Typ Max Units
Serial Clock Frequency fSCL 400 kHz 1
Bus Free Time Between a STOP and a START
Condition tBUF 1.3 µs 2
Hold Time, (Repeated) START Condition tHD, STA 0.6 µs 2
Repeated START Condition Setup Time tSU, STA 0.6 µs 2
STOP Condition Setup Time tSU, STO 0.6 µs 2
Data Hold Time tHD, DAT 0.9 µs 2
Data Setup Time tSU, DAT 100 ns 2
SCL Clock Low Period tLOW 1.3 µs 2
SCL Clock High Period tHIGH 0.7 µs 2
Rise Time of Both SDA and SCL Signals,
Receiving tR20+0.1
Cb
300 ns 2
Fall Time of Both SDA and SCL Signals,
Receiving tF20+0.1
Cb
300 ns 2
Fall Time of SDA Transmitting tF.TX 20+0.1
Cb
250 ns 2
Pulse Width of Spike Suppressed tSP 25 ns 2
Capacitive Load for Each Bus Line Cb400 pF 2
MPR03X
Sensors
Freescale Semiconductor 27
Appendix B Brief Register Descriptions
REGISTER Abrv Fields REGISTER
ADDRESS Initial Value
Touch Status Register TS OCF E2S E1S E0S 0x00 0x00
ELE0 Filtered Data Low Register E0FDL E0FDLB 0x02 0x00
ELE0 Filtered Data High Register E0FDH E0FDHB 0x03 0x00
ELE1 Filtered Data Low Register E1FDL E1FDLB 0x04 0x00
ELE1 Filtered Data High Register E1FDH E1FDHB 0x05 0x00
ELE2 Filtered Data Low Register E2FDL E2FDLB 0x06 0x00
ELE2 Filtered Data High Register E2FDH E2FDHB 0x07 0x00
ELE0 Baseline Value Register E0BV E0BV 0x1A 0x00
ELE1 Baseline Value Register E1BV E1BV 0x1B 0x00
ELE2 Baseline Value Register E2BV E2BV 0x1C 0x00
Max Half Delta Register MHD MHD 0x26 0x00
Noise Half Delta Register NHD NHD 0x27 0x00
Noise Count Limit Register NCL NCL 0x28 0x00
ELE0 Touch Threshold Register E0TTH E0TTH 0x29 0x00
ELE0 Release Threshold Register E0RTH E0RTH 0x2A 0x00
ELE1 Touch Threshold Register E1TTH E1TTH 0x2B 0x00
ELE1 Release Threshold Register E1RTH E1RTH 0x2C 0x00
ELE2 Touch Threshold Register E2TTH E2TTH 0x2D 0x00
ELE2 Release Threshold Register E2RTH E2RTH 0x2E 0x00
AFE Configuration Register AFEC FFI CDC 0x41 0x08
Filter Configuration Register FC CDT SFI ESI 0x43 0x04
Electrode Configuration Register EC CalL
ock ModeSel EleEn 0x44 0x00
MPR03X
Sensors
28 Freescale Semiconductor
Appendix C Ordering Information
C.1 Ordering Information
This section contains ordering information for MPR03X devices.
C.2 Device Numbering Scheme
All Proximity Sensor Products have a similar numbering scheme. The below diagram explains what each part number in the
family represents.
ORDERING INFORMATION
Device Name Temperature Range Case Number Touch Pads I2C Address Shipping
MPR031EPR2 -40C to +85C 1944 (8-Pin DFN) 3-pads 0x4A Tape and Reel
MPR032EPR2 -40C to +85C 1944 (8-Pin DFN) 3-pads 0x4B Tape and Reel
M
Status
(M = Fully Qualified, P = Preproduction)
PR
Proximity Sensor Product
EE X P
Number of Electrodes
(03 = 3 electrode device)
Package Designator
Version
(Q = QFN, EJ = TSSOP, EP = µDFN)
MPR03X
Sensors
Freescale Semiconductor 29
PACKAGE DIMENSIONS
PAGE 1 OF 3
MPR03X
Sensors
30 Freescale Semiconductor
PAGE 2 OF 3
MPR03X
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Freescale Semiconductor 31
PAGE 3 OF 3
MPR03X
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32 Freescale Semiconductor
Table 23. Revision History
Revision
number Revision
date Descriptio n of changes
7 07/2011 •Changed Figure 25 AFE Configuration Register Reset From: 0 0 0 0 0 0 0 0, To : 0 0 0 1 0 0 0 0
•Changed Figure 26 Filter Configuration Register Reset From: 0 0 0 0 0 0 0 0, To: 0 0 1 0 0 1 0 0
MPR03X
Rev. 7
7/2012
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