This document was generated on 07/14/2020 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736560000 Active HDM Backplane Connector System HDM Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 3 Circuits, Gold (Au) 0.76m Documents: 3D Model Drawing (PDF) 3D Model (PDF) Product Specification PS-73670-9999 (PDF) Application Specification AS-73656-1998-001 (PDF) Packaging Specification PK-70873-0819 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Comments Component Type Overview Product Name UPC Backplane Connectors 73656 Backplane Backplane Power Module Power Header HDM Backplane Connector System HDM 800754345361 Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Net Weight Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length PCB Locator PCB Retention PCB Thickness - Recommended Packaging Type Pitch - Mating Interface Pitch - Termination Interface Plating min - Mating Plating min - Termination Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 3 3 Black 250 No 94V-0 No None Beryllium Copper Gold Gold High Temperature Thermoplastic 1.609/g 1 Open Pin Field 3 Vertical 3.50mm No Yes 2.50mm Tube 3.70mm 2.00mm 0.762m 0.051m No Yes Yes -55 to +105C EU ELV Not Relevant EU RoHS China RoHS Compliant REACH SVHC Not Contained Per D(2020)4578-DC (25 June 2020) Halogen-Free Status Low-Halogen For more information, please visit Contact US China ROHS ELV RoHS Phthalates Green Image Not Relevant Not Contained Search Parts in this Series 73656 Series Mates With 73651 HDM Board-to-Board Daughterboard Power Module Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # HDM Power Module 621001100 Removal Tool Backplane Power 622005711 Module Loading Heads Termination Interface: Style Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Voltage - Maximum 15.0A 1.0 Gbps 500V AC Solder Process Data Lead-freeProcess Capability N/A Material Info Reference - Drawing Numbers Application Specification Packaging Specification Product Specification Sales Drawing AS-73656-1998-001 PK-70873-0819 PS-73670-9999 SDA-73656-X00X-001 This document was generated on 07/14/2020 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION