TQM756014
Data Sheet
Multi-Mode (WCDMA B4, CDMA BC15, HSPA+, LTE) 3x3 PA Module
Data Sheet:
For additional information and latest specifications, see our website: www.triquint.com
Revision J, August 08, 2012
Functional Block Diagram
Product Description
The TQM756014 is fully matched Power Amplifier Module designed for use in
CDMA BC15 (AWS), WCDMA (Bands 4) and LTE handsets. Its compact 3x3mm
package including a coupler and built-in voltage regulator makes it ideal for
today’s extremely small data enabled phones. Its RF performance meets the
stringent linearity requirements for multi-mode operation.
The TQM756014 is designed on TriQuint’s GaAs BiHEMT technology with CuFlip®
assembly offering state of the art reliability, temperature stability and ruggedness.
The 3-Gain state PA die operates in LPM, MPM and HPM to maximize talk time
over the entire range of operating conditions. To simplify the cost/time of
calibration while in production the TQM776011 can be used in 1-bit operation;
either LPM/HPM with only 4mA of IcQ up to +13dBm in LPM, or MPM/HPM with
9mA of IcQ up to +17dBm in MPM.
Electrical Specifications
Power Supply Current @ 28.3dBm
Note 1: Test Conditions WCDMA Rel99 Test Mode: VCC=3.4VDC, VEN=HIGH, Tc=25°C
Features
GaAs BiHEMT / CuFlip® PA Technology
Typical Quiescent Current values:
LPM: 4 mA
MPM: 9 mA
HPM: 90 mA
Excellent Linearity in all modes
Integrated high performance coupler
Excellent Phase Discontinuity
Built-in voltage regulator functionality
eliminating any external switch circuitry
Small 10-pin, 3x3mm module
Lead-free 260°C / RoHS / Halogen-free
Full ESD protection
Applications
WCDMA B4 Handsets
CDMA2000 BC15 (AWS) Applications
HSUPA, HSDPA, HSPA+ Applications
LTE-Compatible Applications
Package Style
10-Pin Laminate Module
Top View (through package)