1.6X0.8mm SMD CHIP LED LAMP ATTENTION KP-1608PBC BLUE OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Description 1.6mmX0.8mm SMT LED, 1.1mm THICKNESS. The Blue source color devices are made with InGaN LOW POWER CONSUMPTION. on SiC Light Emitting Diode. W IDE VIEW ING ANGLE. Static electricity and surge damage the LEDS. IDEAL FOR BACKLIGHT AND INDICATOR. It is recommended to use a wrist band or VARIOUS COLORS AND LENS TYPES AVAILABLE. anti-electrostatic glove when handling the LEDs. PACKAGE: 2000PCS / REEL . All devices, equipment and machinery must be electrically LEAD AND CADMIUM FREE. grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3.Specifications are subject to change without notice. SPEC NO: DSAB1013 REV NO: V.5 DATE: MAY/06/2004 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: L.L.NIE PAGE: 1 OF 4 Selection Guide Part No. Dice KP-1608PBC Iv (mcd) @ 20mA Lens Type BLUE (InGaN) Viewing Angle Min. Typ. 2 1/2 18 45 120 WATER CLEAR Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25C Symbol Parameter Device peak Peak Wavelength Blue D Dominate Wavelength 1/2 Typ. Max. Units Test Conditions 468 nm IF=20mA Blue 470 nm IF=20mA Spectral Line Half-width Blue 25 nm IF=20mA C Capacitance Blue 65 pF VF=0V;f=1MHz VF Forward Voltage Blue 3.65 4.2 V IF=20mA IR Reverse Current Blue 10 uA VR = 5V Absolute Maximum Ratings at TA=25C Parameter Blue Units Power dissipation 102 mW DC Forward Current 30 mA Peak Forward Current [1] 160 mA 5 V Reverse Voltage Operating / Storage Temperature -40C To +85C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAB1013 REV NO: V.5 DATE: MAY/06/2004 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: L.L.NIE PAGE: 2 OF 4 Blue KP-1608PBC SPEC NO: DSAB1013 REV NO: V.5 DATE: MAY/06/2004 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: L.L.NIE PAGE: 3 OF 4 KP-1608PBC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAB1013 REV NO: V.5 DATE: MAY/06/2004 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: L.L.NIE PAGE: 4 OF 4