TDA7052BTN1 - NXP SEMICONDUCTORS

DATA SH EET

Product specification

Supersedes data of 1996 May 28 1997 Aug 15

INTEGRATED CIRCUITS

TDA7052B

Mono BTL audio amplifier with DC

volume control

1997 Aug 15 2

NXP Semiconductors Product specification

Mono BTL audio amplifier with DC volume

control TDA7052B

FEATURES

•DC volume control

•Few external components

•Mute mode

•Thermal protectio n

•Short-circuit proof

•No switch-on and switch-off clic ks

•Good overall stab ility

•Low power cons umption

•Low HF radiation

•ESD protected on all pins.

GENERAL DESCRIPTION

The TDA7052B and TDA7052BT are 1 W and 0.5 W mono

Bridge-Tied Load (BTL) output amplifiers with DC volume

control.

They have been designed for use in TV and monitors, but

are also suitable for use in battery-fed portable recorde r s

and radios.

A Missing Current Limiter (MCL) is built in. The MCL circuit

is activated when the difference in current between the

output terminal of each amplifier exceeds 100 mA

(300 mA typ.). This level of 100 mA allows for headphone

applications (single-ended).

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETERS CONDITIONS MIN. TYP. MAX. UNIT

VPsupply voltage 4.5 −18 V

POoutput power VP=6V

TDA7052B RL=8Ω0.9 1.0 −W

TDA7052BT RL=16Ω0.5 0.55 −W

Gv(max) maximum total voltage gain 39.5 40.5 41.5 dB

φgain control 68 73.5 −dB

Iq(tot) total quiescent current VP=6V; R

L=∞−9.2 13 mA

THD total harmonic distortion

TDA7052B PO=0.5W −0.3 1 %

TDA7052BT PO=0.25W −0.3 1 %

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA7052B DIP8 p lastic dual in-line package; 8 leads (300 mil) SOT97-1

TDA7052BT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

1997 Aug 15 3

NXP Semiconductors Product specification

Mono BTL audio amplifier with DC volume

control TDA7052B

BLOCK DIAGRAM

handbook, full pagewidth

input

6MSA705 - 1

TDA7052B

TDA7052BT

5I + i

I – i

TEMPERATURE

PROTECTION

signal

ground

DC volume control

n.c.

positive output

negative output

power

ground

Vref STABILIZER

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

VP1 supply voltage

IN+ 2 input

GND1 3 signal ground

VC 4 DC volume control

OUT+ 5 positive output

GND2 6 power ground

n.c. 7 not connec te d

OUT−8 negative output Fig.2 Pin configuration.

handbook, halfpage 1

MSA704 - 1

VPOUT

GND2

OUT

GND1

n.c.

TDA7052B

TDA7052BT

1997 Aug 15 4

NXP Semiconductors Product specification

Mono BTL audio amplifier with DC volume

control TDA7052B

FUNCTIONAL DESCRIPTION

The TDA7052B and TDA7052BT are mono BTL outpu t

amplifiers with DC volume control which have been

designed for use in TV and monitors but are also suitable

for use in battery-fed portable recorders and radios.

In conventional DC volume circuits the contr ol or in put

stage is AC coupled to the output stage via external

capacitors to keep the offset voltage low. In the TDA7052B

and TDA7052BT the DC volume control stage is integrated

into the input stage so that no coupling capacitors are

required. W ith this configuration, a low offset vo ltage is

maintained and the minimum supply voltage remains low.

The BTL principle offer s the follo wing advantages:

•Lower peak value of the supply current

•The frequency of the ripple on the supply voltage is twice

the signal frequency.

Consequently, a re duced power supp ly with smaller

capacitors can be used which results in co st re ductions.

For portable appl ications there is a trend to decrease the

supply voltage , r es ulting in a reduction of ou tp ut power at

conventional output stages. Using the BTL principle

increases the output power.

The maximum gain of the amplifier is fixed at 40.5 dB.

The DC volume control stage has a logarithmic control

characteristic. Therefore, the total gain can be controlled

from 40.5 dB to −33 dB. If the DC volume control voltage

falls below 0.4 V, the device will switch to the mute mode.

The amplifier is short-circuit proof to ground, VP and

across the load. Also a thermal protection circuit is

implemented. If the crystal temper ature rises above

+150 °C the gain will be reduced, thereby reducing the

output power. Special attention is give n to s witch -on and

switch-off clicks, low HF radiation and a good overall

stability.

Power dissipation

Assume for the TDA7052B that VP=6V; R

L=8Ω.

The maximum sine wave dissipation is 0.9 W.

The Rth j-a of the package is 100 K/W.

Therefore Tamb(max) =150−100 ×0.9 = 60 °C.

Assume for the TDA7052BT that VP=6V; R

L=16Ω.

The maximum sine wave diss ipation is 0.46 W.

The Rth j-a of the package is 155 K/W.

Therefore Tamb(max) =150−155 ×0.46 = 78 °C.

LIMITING VALUES

In accordance with the A bsolute Maxi m u m Rating System (IEC 134).

THERMAL CHARACTE RISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VPsupply vo ltage −18 V

V2, 4 input voltage pins 2 and 4 −5V

IORM repetitive peak output current −1.25 A

IOSM non-repetitive peak output current −1.5 A

Ptot total power dissipation Tamb ≤25 °C

TDA7052B −1.25 W

TDA7052BT −0.8 W

Tamb operating ambient temperature −40 +85 °C

Tstg storage temperature −55 +150 °C

Tvj virtual junction temperature −+150 °C

Tsc short-circuit time −1h

SYMBOL PARAMETER VALUE UNIT

Rth j-a thermal resistance from junction to ambient in free air

TDA7052B 100 K/W

TDA7052BT 155 K/W

1997 Aug 15 5

NXP Semiconductors Product specification

Mono BTL audio amplifier with DC volume

control TDA7052B

CHARACTERISTICS

VP=6V; V

DC = 1.4 V; f = 1 kHz; RL=8Ω; Tamb =25°C; unless otherwise specified (see Fig.13).

Notes

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being

equal to the DC output offset voltage divided by RL.

2. The noise output volta ge (RMS value) at f = 500 kHz is measured with R S=0Ω an d B = 5 kHz.

3. The ripple rejection is measured with RS=0Ω and f = 100 Hz to 10 kHz. The ripple voltage VR of 200 mV

(RMS value) is applied to the positive supply rail.

4. The noise output voltage (RMS value) is measured with RS=5kΩ unweighted.

5. The DC volume contr ol c an be configured in severa l way s. Two possible circuits are sho wn in Figs 14 and 15.

The circuits at the volume control pin will influence the switch-on and switch-off behaviour and the maximum voltage

gain.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

VPsupply voltage 4.5 −18 V

Iq(tot) tot al quiescent current note 1; RL=∞−9.2 13 mA

Maximum gain (V4=1.4V)

POoutput power THD = 10%

TDA7052B 0.9 1.0 −W

TDA7052BT 0.5 0.55 −W

THD total harmonic distortion

TDA7052B PO=0.5W −0.3 1 %

TDA7052BT PO=0.25W −0.3 1 %

Gv(max) maximum total voltage gain 39.5 40.5 41.5 dB

VIinput signal handling (R MS value) Gv(max) =0dB; THD<1% 1.0 −−V

Vno noise output voltage (RMS value) note 2; f = 50 0 kHz −210 −μV

B bandwidth at −1dB −0.02 to 300 −kHz

SVRR supply voltage ripple rejection note 3 48 60 −dB

⎪ΔVO⎪DC output offset voltage ⎪V8−V5⎪−0200mV

ZIinput impedance (pin 3) 15 20 25 kΩ

Mute position

VOoutput voltage in mute position note 4; V4≤0.4 V;

VI=1.0V −− 30 μV

DC volume control; note 5

φgain control 68 73.5 −dB

I4control current V4=0V −20 −25 −30 μA

1997 Aug 15 6

NXP Semiconductors Product specification

Mono BTL audio amplifier with DC volume

control TDA7052B

Fig.3 Gain control as a function of DC volume

control.

handbook, halfpage

0 2.0

−80

−120

MBH372

0.4 0.8 1.2 1.6

−40

(dB)

V (V)

Fig.4 Noise output voltage as a function of DC

volume control.

Measured with RS=5kΩ unweighted.

Frequency range is 22 Hz to 22 kHz.

handbook, halfpage

2.0

VDC (V)

MBH373

−1

−2

0.4

Vno

(mV)

0.8 1.2 1.6

Fig.5 Control current as a function of DC volume

control.

handbook, halfpage

0 2.0

−15

−25

MBH376

0.4 0.8 1.2 1.6

−5

VDC (V)

IDC

(μA)

Fig.6 Quiescent curr ent versus supply v oltage.

Measured with RL=∞.

handbook, halfpage

020

MBH367

(mA)

81216

VP (V)

1997 Aug 15 7

NXP Semiconductors Product specification

Mono BTL audio amplifier with DC volume

control TDA7052B

Fig.7 Total harmonic distortion versus output

power.

(1) VP=5V; R

L=8Ω.

(2) VP=6V; R

L=8Ω.

(3) VP=12V;R

L=25Ω.

handbook, halfpage

MBH368

10−11PO (W)

THD

(%)

8(1) (2) (3)

Fig.8 Total harmonic distortion versus frequ ency.

PO=0.1W.

(1) Gv(max) =40dB.

(2) Gv(max) =30dB.

handbook, halfpage

MBH369

−2

−1

110

f (kHz)

THD

(%)

(1)

(2)

Fig.9 Output power versus sup ply voltage.

Measured at a THD of 10%. The maximum output power is limited by

the maximum power dissipation an d the maximum available output

current.

(1) RL=8Ω.

(2) RL=16Ω.

(3) RL=25Ω.

handbook, halfpage

020

2.5

0.5

MBH370

1.0

1.5

2.0

(W)

81216

VP (V)

(1)

(2) (3)

Fig.10 Total worst case power dissipation versus

supply voltage.

(1) RL=8Ω.

(2) RL=16Ω.

(3) RL=25Ω.

handbook, halfpage

020

2.5

0.5

MBH371

1.0

1.5

2.0

(W)

81216

VP (V)

(1) (2) (3)

1997 Aug 15 8

NXP Semiconductors Product specification

Mono BTL audio amplifier with DC volume

control TDA7052B

Fig.11 Supply voltage ripple rejection versus

frequency.

Measured with VR=0.2V.

(1) VDC =1.4V.

(2) VDC =0.4V.

handbook, halfpage

−70

−60

−50

−40

−30

−20 MBH374

10−210−111010

f (kHz)

SVRR

(dB)

(1)

(2)

Fig.12 Input signal handling.

Measured at a THD of 1% and a voltage gain of 0 dB.

handbook, halfpage

020

2.0

0.4

MBH375

0.8

1.2

1.6

(V)

81216

VP (V)

QUALITY SPECIFICATION

In accordance with “SNW-FQ-611E”, if this type is used as an audio amplifier .

1997 Aug 15 9

NXP Semiconductors Product specification

Mono BTL audio amplifier with DC volume

control TDA7052B

TEST AND APPLICATION INFORMATION

For single-end application the output peak current may not exceed 100 mA; at higher ou tput currents the short circuit

protection (MCL) will be activated.

handbook, full pagewidth

input 0.47 μF

MSA706 - 2

100 nF 220 μF

TDA7052B

TDA7052BT

VP = 6 V

(1)

5 kΩ

−

STABILIZER TEMPERATURE

PROTECTION

ground

volume

control

RL = 8 Ω

n.c.

I + i

I – i

Fig.13 Test and applicatio n diagram.

To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as

possibl e to the IC.

(1) This capaci tor can be omitted if the 220 μF electrolytic capacitor is connec ted close to p in 1 .

1997 Aug 15 10

NXP Semiconductors Product specification

Mono BTL audio amplifier with DC volume

control TDA7052B

Fig.14 Applicatio n with potentiometer as volume

control; maximum gain = 34 dB.

handbook, halfpage

MCD387

volume

control

1 MΩ1 μF

Fig.15 Applic ation with potentiometer as vo lume

control; maximum gain = 40 dB.

handbook, halfpage

MBH360

volume

control

= 6 V

22 kΩ

56 kΩ

1 μF

1997 Aug 15 11

NXP Semiconductors Product specification

Mono BTL audio amplifier with DC volume

control TDA7052B

PACKAGE OUTLINES

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT97-1 99-12-27

03-02-13

UNIT A

max. 12 b1(1) (1) (1)

b2cD E e M Z

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min. A

max. bmax.

1.73

1.14 0.53

0.38 0.36

0.23 9.8

9.2 6.48

6.20 3.60

3.05 0.2542.54 7.62 8.25

7.80 10.0

8.3 1.154.2 0.51 3.2

inches 0.068

0.045 0.021

0.015 0.014

0.009

1.07

0.89

0.042

0.035 0.39

0.36 0.26

0.24 0.14

0.12 0.010.1 0.3 0.32

0.31 0.39

0.33 0.0450.17 0.02 0.13

050G01 MO-001 SC-504-8

(e )

seating plane

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

pin 1 index

IP8: plastic dual in-line package; 8 leads (300 mil) SOT97

-1

1997 Aug 15 12

NXP Semiconductors Product specification

Mono BTL audio amplifier with DC volume

control TDA7052B

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.05 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

O8: plastic small outline package; 8 leads; body width 3.9 mm SOT96

-1

99-12-27

03-02-18

1997 Aug 15 13

NXP Semiconductors Product specification

Mono BTL audio amplifier with DC volume

control TDA7052B

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth acco un t of sold er ing ICs can be found in

our “IC Package Databook” (order cod e 9398 652 90011).

DIP

SOLDERING BY DIPPING OR BY WAVE

The maximum permissible temperatur e of the s old er is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic bod y mus t not ex ceed the

specified maximum storage temperature (Tstg max). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature with in the permissible limit.

REPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds . If the bit temper ature is

between 300 and 400 °C, contact may be up to 5 seconds.

REFLOW SOLDERING

Reflow soldering techniques are suitable for all SO

packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-s yringe dispensin g before package placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from

215to250°C.

Preheating is necessary to dry the pas te and evaporate

the binding agent. Preheating dura tio n: 45 minutes at

45 °C.

WAVE SOLDERING

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

•A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

techniqu e sh ould be used.

•The longitudinal ax is of the package foo tp rint must be

parallel to the solder flow.

•The package footprint must incorporate solder thieves at

the downstream end.

During placement and before soldering, the package must

be fixed with a droplet of adh esive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Maximum permissible solder temp erature is 260 °C, and

maximum duration of pack age immersion in solder is

10 seconds, if cooled to less than 150 °C within

6 seconds. Typical dwell time is 4 seconds at 25 0 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

REPAIRING SOLDERED JOINTS

Fix the component by first so ldering two diagonally-

opposite end leads. Use only a low voltage solder ing iron

(less than 24 V) applied to th e flat part of the lead. Contact

time must be limit ed to 10 seconds at up t o 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operatio n wi th in 2 to 5 seconds bet we en

270 and 320 °C.

1997 Aug 15 14

NXP Semiconductors Product specification

Mono BTL audio amplifier with DC volume

control TDA7052B

DATA SHEET STATUS

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this do cument was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This document contains data from the objective s pe cification for product

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet Production This document contains the pr oduct specification.

DISCLAIMERS

Limited warranty and liability ⎯ Information in this

document is believed to be accurate and reliab le .

However, NXP Semiconduc tors does not give any

representations or warranties, expressed or implied, as to

the accuracy or completeness of such information and

shall have no liability for the consequences of use of such

information.

In no event shall NXP Semiconductors be liable for any

indirect, incidental, punitive, special or consequential

damages (including - without limitation - lost profits, lost

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other legal theory.

Notwithstanding any damages that customer might incur

for any reason whatsoever, NXP Semiconductors’

aggregate and cu mulative liability towards customer for

the products described herein shall be limited in

accordance with the Terms and conditions of commercial

sale of NXP Semiconductors.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to informa t ion

published in this doc ument, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

Suitability for use ⎯ NXP Semiconduct ors pr oduc ts are

not designed, au thorized or warran ted to be suitable for

use in life support, life-critical or safety-critical systems or

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reason ably be

expected to result in pe rs onal injury, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductor s pr oducts in such equi pme nt or

application s and therefor e such inclusion and/or use is at

the customer’s own risk.

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of

their applications and products using NXP

Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or

customer product design. It is customer’s sole

responsibility to determine whether the NXP

Semiconductors pro du ct is su itable and fit for the

customer’s applications and products planned, as well as

for the planned a pplication and use of custom er’s third

party customer(s). Customers should provide appropriate

design and opera t ing saf eg ua rd s to minimize the risks

associated with their applications and products.

NXP Semiconduc tors does n ot a ccept any liabil ity rela ted

to any default, damage, costs or problem which is based

on any weakne ss or default in t he customer’s applic ations

or products, or the application or use by customer’s third

party customer( s) . C us to m er is responsible for doin g all

necessary testing for the customer’s applications and

products using NXP Semiconductors products in order to

avoid a default of the applic ations and the products or of

the application or use by customer’s third p arty

customer(s). NXP does not accept any liability in this

respect.

1997 Aug 15 15

NXP Semiconductors Product specification

Mono BTL audio amplifier with DC volume

control TDA7052B

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) will cause permanent damage to

the device. Limiting values are stress ratin gs only and

(proper) operation of the device at these or any other

conditions abo ve those given in the Recommended

operating conditions section (if present) or the

Characteristics sections of this document is not warranted.

Constant or repeated exposure to limiting values will

permanently and irreversibly affect the quality and

reliability of the device.

Terms and conditions of commercial sale ⎯ NXP

Semiconductors products are sold subject to the general

terms and conditio ns of commercial sale, as published at

http://www.nxp.com/profile/terms, unless other wis e

agreed in a valid written ind i vidual agreement. In case an

individual agreeme nt is co nc luded only the terms and

conditions of the resp ective agreement shall apply. NXP

Semiconductors hereby expressly objects to apply i ng the

customer’s general terms and conditions with regard to the

purchase of NXP Semicon ductors products by customer.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for acceptance or the grant, conveyan ce or

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other industrial or intellectual property rights.

Export control ⎯ This document as well as the item(s)

described he re in may be subject to export control

regulations. Export might require a prior authorization from

national auth or itie s.

Quick refer ence data ⎯ The Quick reference data is an

extract of th e product data given in the Limiting values and

Characteristics sections of this document, an d as such is

not complete, exhaus tive or legally binding.

Non-automotive qualified products ⎯ Unless this data

sheet expressly states that this specific NXP

Semiconductors product is au tomotive qualified, the

product is not suitable for automotive use. It is neither

qualified nor te sted in accordanc e with automot ive testing

or application requirements. NXP Semiconductors accepts

no liability for inclusion and/or use of non-automotive

qualified prod ucts in automotive eq uip m en t or

applications.

In the event that customer uses the product for design-in

and use in automotive applications to automotive

specifications and standards, customer (a) shall use the

product without NXP Semiconductors’ warranty of the

product for such au t omo tive application s, use and

specifications, and (b) whenever customer uses the

product for automotive applications beyond NXP

Semiconductors’ specifications such use shall be solely at

customer’s own ris k, and (c) customer fully inde m nifies

NXP Semiconductors for any liability, damages or failed

product clai ms r esult ing fr om custo mer desi gn an d us e o f

the product for automotive ap plic ations beyond NXP

Semiconductors ’ st andard warranty and NXP

Semiconductors’ product specifications.

NXP Semiconductors

provides High Performance Mixed Signal and Standard Product

solutions that leverage its leading RF, Analog, Power Management,

Interface, Security and Digital Processing expertise

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For additional information p lease visit: http://www.nxp.com

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All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information pr e sent ed in this documen t d oes not form par t o f an y q uotation or contra ct, is believed to be accur ate a nd re li a ble and may be chan ged

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or inte llectual property rights.

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimer s. No changes were made to the tech nical content, except for package outline

drawings which were updated to the latest version.

Printed in The Netherlands 547027/1200/03/pp16 Date of rel eas e: 1997 Aug 15 Document order number: 9397 750 02729