Multilayer Ceramic Chip Capacitors
1 of 3
Creation Date : July 13, 2019 (GMT)
C2012X5R1A226K125AB
TDK item description C2012X5R1A226KT****
Applications Commercial Grade
Feature General General (Up to 75V)
Series C2012 [EIA 0805]
Status Production
Size
Length(L) 2.00mm ±0.20mm
Width(W) 1.25mm ±0.20mm
Thickness(T) 1.25mm ±0.20mm
Terminal Width(B) 0.20mm Min.
Terminal Spacing(G) 0.50mm Min.
Recommended Land Pattern (PA) 1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PB) 1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
Recommended Land Pattern (PC) 0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
Capacitance 22μF ±10%
Rated Voltage 10VDC
Temperature Characteristic X5R(±15%)
Dissipation Factor (Max.) 10%
Insulation Resistance (Min.) 4MΩ
Other
Soldering Method Wave (Flow)
Reflow
AEC-Q200 No
Packing Blister (Plastic)Taping [180mm Reel]
Package Quantity 2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
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