TEA1521T/N2 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

File under Integrated Circuits, IC11 2000 Sep 08

INTEGRATED CIRCUITS

TEA152x family

STARplugTM

2000 Sep 08 2

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

FEATURES

•Designed for general purpose supplies up to 50 W

•Integrated power switch:

– TEA1520: 48 Ω; 650 V

– TEA1521: 24 Ω; 650 V

– TEA1522: 12 Ω; 650 V

– TEA1523: 6.5 Ω; 650 V

– TEA1524: 3.4 Ω; 650 V.

•Operates from universal AC mains supplies

(80 to 276 V)

•Adjustable frequency for flexible design

•RC oscillator for load insensitive regulation loop

constant

•Valley switching for minimum switch-on loss (not

implemented in TEA152xAJM versions)

•Frequency reduction at low power output makes low

standby power possible (<100 mW)

•Adjustable overcurrent protection

•Under voltage protection

•Temperature protection

•Short circuit winding protection

•Simple application with both primary and secondary

(opto) feedback

•Available in 8-pin DIP, 14-pin SO and 9-pin DBS

packages.

GENERAL DESCRIPTION

The TEA152x family is a Switched Mode Power

Supply (SMPS) controller IC that operates directly from

the rectified universal mains. It is implemented in the high

voltage EZ-HV SOI process, combined with a low voltage

BICMOS process. The device includes a high voltage

power switch and a circuit for start-up directly from the

rectified mains voltage.

A dedicated circuit for valley switching is built in (not

implemented in TEA152xAJM versions), which makes a

very efficient slim-line electronic powerplug concept

possible.

Initsmostbasicversionofapplication,theTEA152xfamily

acts as a voltage source. Here, no additional secondary

electronics are required. A combined voltage and current

source can be realized with minimum costs for external

components. Implementation of the TEA152x family

renders an efficient and low cost power supply system.

Table 1 Available type numbers

APPLICATIONS

Typical application areas for the STARplugTM are:

•Chargers

•Adapters

•STB (Set Top Box)

•DVD

•CD(R)

•TV/monitor standby supplies

•PC peripherals

•Microcontroller supplies in home applications and small

portable equipment, etc.

RDS(on) DIP8 SO14 DBS9P

48 ΩTEA1520P TEA1520T −

24 ΩTEA1521P TEA1521T −

12 ΩTEA1522P TEA1522T TEA1522AJM

6.5 ΩTEA1523P TEA1523T TEA1523AJM

3.4 ΩTEA1524P −TEA1524AJM

2000 Sep 08 3

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Vdrain(max) maximum voltage at the DRAIN

pin Tj>0°C−−650 V

RDS(on) drain-source on-state resistance

of TEA1520 Tj=25°C; Isource =−0.06 A −48 55.2 Ω

Tj= 100 °C; Isource =−0.06 A −68 78.2 Ω

drain-source on-state resistance

of TEA1521 Tj=25°C; Isource =−0.125 A −24 27.6 Ω

Tj= 100 °C; Isource =−0.125 A −34 39.1 Ω

drain-source on-state resistance

of TEA1522 Tj=25°C; Isource =−0.25 A −12 13.8 Ω

Tj= 100 °C; Isource =−0.25 A −17 19.6 Ω

drain-source on-state resistance

of TEA1523 Tj=25°C; Isource =−0.5 A −6.5 7.5 Ω

Tj= 100 °C; Isource =−0.5 A −9.0 10.0 Ω

drain-source on-state resistance

of TEA1524 Tj=25°C; Isource =−1.0 A −3.4 3.9 Ω

Tj= 100 °C; Isource =−1.0 A −4.8 5.5 Ω

VCC(max) maximum supply voltage −−40 V

fosc frequency range of oscillator 10 100 200 kHz

Idrain supply current drawn from DRAIN

pin no auxiliary supply −1.5 −mA

Tamb ambient temperature −20 −+85 °C

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TEA152xP DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

TEA152xT SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

TEA152xAJM DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length

12/11 mm); exposed die pad SOT523-1

2000 Sep 08 4

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

BLOCK DIAGRAM

handbook, full pagewidth

MGT419

PROTECTION

LOGIC

SUPPLY

TEA152x VALLEY

POWER-UP

RESET

THERMAL

SHUTDOWN

OSCILLATOR

PWM

stop

low freq

100 mV

0.75 V

0.5 V

blank

short circuit winding

overcurrent

10x

2.5 V

1.8 U

DRAIN

n.c.

GND

SOURCE

AUX

REG

VCC

Fig.1 Block diagram.

The valley switching circuit is not implemented in the TEA152xAJM versions.

The pinning shown in this diagram is the pinning of the DIP8 package. For the pinning of

the other packages, see the relevant pinning tables and pin configurations.

2000 Sep 08 5

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

PINNING

SYMBOL PIN DESCRIPTION

TEA152xP TEA152xT TEA152xAJM

VCC 1 1 1 supply voltage

GND 22, 3, 4, 5,

9 and 10 2ground

RC 3 6 3 frequency setting

REG 4 7 4 regulation input

SGND −−5

signal ground; connected to exposed die pad; must be

connected to pin 2

AUX 586

input for voltage from auxiliary winding for timing

(demagnetization)

SOURCE 6 11 7 source of internal MOS switch

n.c. 7 12 and 13 8 not connected

DRAIN 8149

drain of internal MOS switch; input for start-up current

and valley sensing

handbook, halfpage

MGT420

TEA152xP

DRAIN

n.c.GND

SOURCE

AUX

REG

VCC

Fig.2 Pin configuration of TEA152xP.

handbook, halfpage

MGT421

TEA152xT

VCC

GND

REG AUX

GND

SOURCE

n.c.

DRAIN

Fig.3 Pin configuration of TEA152xT.

handbook, halfpage

VCC

GND

REG

SGND

AUX

SOURCE

n.c.

DRAIN

TEA152xAJM

MGT422

Fig.4 Pin configuration of TEA152xAJM.

2000 Sep 08 6

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

FUNCTIONAL DESCRIPTION

The TEA152x family is the heart of a compact flyback

converter, with the IC placed at the primary side. The

auxiliary winding of the transformer can be used for

indirect feedback to control the isolated output. This

additional winding also powers the IC. A more accurate

control of the output voltage and/or current can be

implemented with an additional secondary sensing circuit

and optocoupler feedback.

The TEA152x family uses voltage mode control. The

frequency is determined by the maximum transformer

demagnetizing time and the time of the oscillator. In the

first case, the converter operates in the Self Oscillating

Power Supply (SOPS) mode. In the latter case, it operates

at a constant frequency, which can be adjusted with

external components RRC and CRC. This mode is called

Pulse Width Modulation (PWM). Furthermore, a primary

stroke is started only in a valley of the secondary ringing.

This valley switching principle minimizes capacitive

switch-on losses.

Start-up and under voltage lock-out

Initially, the IC is self supplying from the rectified mains

voltage. The IC starts switching as soon as the voltage on

pin VCC passes the VCC(start) level. The supply is taken

over by the auxiliary winding of the transformer as soon as

VCC is high enough and the supply from the line is stopped

for high efficiency operation.

Whenforsomereasontheauxiliarysupplyisnotsufficient,

the high voltage supply also supplies the IC. As soon as

the voltage on pin VCC drops below the VCC(stop) level, the

IC stops switching and restarts from the rectified mains

voltage.

Oscillator

The frequency of the oscillator is set by the external

resistor and capacitor on pin RC. The external capacitor is

charged rapidly to the VRC(max) level and, starting from a

new primary stroke, it discharges to the VRC(min) level.

Because the discharge is exponential, the relative

sensitivity of the duty factor to the regulation voltage at low

duty factor is almost equal to the sensitivity at high duty

factors. This results in a more constant gain over the duty

factor range compared to PWM systems with a linear

sawtooth oscillator. Stable operation at low duty factors is

easily realized. For high efficiency, the frequency is

reduced as soon as the duty factor drops below a certain

value. This is accomplished by increasing the oscillator

charge time.

Duty factor control

The duty factor is controlled by the internal regulation

voltage and the oscillator signal on pin RC. The internal

regulation voltage is equal to the external regulation

voltage (minus 2.5 V) multiplied by the gain of the error

amplifier (typical 20 dB (10 ×)).

Valley switching (not implemented in TEA152xAJM

versions)

A new cycle is started when the primary switch is switched

on (see Fig.5). After a certain time (determined by the

oscillator voltage RC and the internal regulation level), the

switch is turned off and the secondary stroke starts. The

internal regulation level is determined by the voltage on

pin REG. After the secondary stroke, the drain voltage

shows an oscillation with a frequency of approximately

where Lp is the primary self inductance and Cp is the

parasitic capacitance on the drain node.

As soon as the oscillator voltage is high again and the

secondary stroke has ended, the circuit waits for a low

drain voltage before starting a new primary stroke.

Figure 5 shows the drain voltage together with the valley

signal, the signal indicating the secondary stroke and the

RC voltage.

The primary stroke starts some time before the actual

valley at low ringing frequencies, and some time after the

actual valley at high ringing frequencies. Figure 6 shows a

typical curve for a reflected output voltage N ×Voof 80 V.

This voltage is the output voltage Vo (see Fig.7)

transferred to the primary side of the transformer with the

factor N (determined by the turns ratio of the transformer).

Figure 6 shows that the system switches exactly at

minimum drain voltage for ringing frequencies of 480 kHz,

thus reducing the switch-on losses to a minimum.

At 200 kHz,the next primarystroke is startedat 33°before

the valley. The switch-on losses are still reduced

significantly.

Demagnetization

Thesystemoperatesindiscontinuousconductionmodeall

the time. As long as the secondary stroke has not ended,

the oscillator will not start a new primary stroke. During the

first tsuppr seconds, demagnetization recognition is

suppressed. This suppression may be necessary in

applications where the transformer has a large leakage

inductance and at low output voltages.

2π× LpCp

×()×()

----------------------------------------------------

2000 Sep 08 7

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

handbook, full pagewidth

MGT423

drain

valley

secondary

ringing

secondary

stroke

primary

stroke

secondary

stroke

oscillator regulation level

Fig.5 Signals for valley switching.

A: Start of new cycle with valley switching.

B: Start of new cycle in a classical PWM system.

handbook, halfpage

0 200 400 800

f (kHz)

phase

(°)

−20

−40

MGT424

600

Fig.6 Typical phase of drain ringing at switch-on (at N ×Vo= 80 V).

2000 Sep 08 8

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

Minimum and maximum duty factor

The minimum duty factor of the switched mode power

supply is 0%. The maximum duty factor is set to 75%

(typical value at 100 kHz oscillation frequency).

Overcurrent protection

The cycle-by-cycle peak drain current limit circuit uses the

externalsource resistor to measurethe current. Thecircuit

is activated after the leading edge blanking time tleb. The

protection circuit limits the source voltage to VSRC(max),

and thus limits the primary peak current.

Short circuit winding protection

The short circuit winding protection circuit is also activated

after the leading edge blanking time. If the source voltage

exceeds the short circuit winding protection voltage Vswp,

the IC stops switching. Only a Power-on reset will restart

normal operation. The short circuit winding protection also

protects in case of a secondary diode short circuit.

Overtemperature protection

An accurate temperature protection is provided in the

device. When the junction temperature exceeds the

thermal shutdown temperature, the IC stops switching.

During thermal protection, the IC current is lowered to the

start-up current. The IC continues normal operation as

soon as the overtemperature situation has disappeared.

Overvoltage protection

Overvoltage protection can be achieved in the application

by pulling pin REG above its normal operation level. The

current primary stroke is terminated immediately, and no

new primary stroke is started until the voltage on pin REG

drops to its normal operation level. Pin REG has an

internal clamp. The current feed into this pin must be

limited.

Output characteristics of complete powerplug

OUTPUT POWER

A wide range of output power levels can be handled by

choosing the RDS(on) and package of the TEA152x family.

Power levels up to 50 W can be realised.

ACCURACY

The accuracy of the complete converter, functioning as a

voltage source with primary sensing, is approximately 8%

(mainly dependent on the transformer coupling). The

accuracy with secondary sensing is defined by the

accuracy of the external components. For safety

requirements in case of optocoupler feedback loss, the

primary sensing remains active when an overvoltage

circuit is connected.

EFFICIENCY

An efficiency of 75% at maximum output power can be

achieved for a complete converter designed for universal

mains.

RIPPLE

A minimum ripple is obtained in a system designed for a

maximum duty factor of 50% under normal operating

conditions, and a minimized dead time. The magnitude of

the ripple in the output voltage is determined by the

frequency and duty factor of the converter, the output

current level and the value and ESR of the output

capacitor.

Input characteristics of complete powerplug

INPUT VOLTAGE

Theinputvoltagerangecomprisestheuniversal AC mains

(80 to 276 V).

2000 Sep 08 9

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are measured with respect to

ground; positive currents ﬂow into the device; pins VCC and RC are not allowed to be current driven, pins REG and AUX

are not allowed to be voltage driven.

Notes

1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. All pins are

2500 V maximum, except pin DRAIN, which is 1000 V maximum.

2. Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω series resistor.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

Voltages

VCC low supply voltage continuous −0.4 +40 V

VRC oscillator input voltage −0.4 +3 V

Vsource source of the DMOS power transistor voltage −0.4 +5 V

Vdrain drain of the DMOS power transistor voltage −0.4 +650 V

Currents

IREG regulation input current −6mA

AUX auxiliary winding input current −10 +5 mA

Isource source current of

TEA1520 −0.25 +0.25 A

TEA1521 −0.5 +0.5 A

TEA1522 −1+1A

TEA1523 −2+2A

TEA1524 −3+3A

drain drain current of

TEA1520 −0.25 +0.25 A

TEA1521 −0.5 +0.5 A

TEA1522 −1+1A

TEA1523 −2+2A

TEA1524 −3+3A

General

Ptot total power dissipation

TEA152xP Tamb <45°C−1.0 W

TEA152xT Tamb <50°C−1.0 W

TEA152xAJM Tamb <45°C without heatsink −1.5 W

Tstg storage temperature −55 +150 °C

Tamb ambient temperature −20 +85 °C

Tjjunction temperature −20 +145 °C

Vesd electrostatic discharge voltage human body model; note 1 −2500 V

machine model; note 2 −200 V

2000 Sep 08 10

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

THERMAL CHARACTERISTICS

Note

1. Thermal resistance Rth(j-a) can be lower when the GND pins are connected to sufficient copper area on the

printed-circuit board. See the TEA152x application notes for details.

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611 part E”

CHARACTERISTICS

Tamb =25°C; no overtemperature; all voltages are measured with respect to ground; currents are positive when ﬂowing

into the IC; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(j-a) thermal resistance from junction to ambient note 1

TEA152xP in free air 100 K/W

TEA152xT in free air 91 K/W

TEA152xAJM in free air 65 K/W

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

ICC(operate) supply current normal operation −1.3 1.9 mA

ICC(startup) start-up supply current start-up −180 400 µA

Idrain supply current drawn from DRAIN

pin no auxiliary supply; Vdrain >60V −1.5 2 mA

with auxiliary supply; Vdrain >60V −30 125 µA

ICC(ch) VCC pin charging current Vdrain >60V −6−4−3mA

CC(start) VCC start voltage 9 9.5 10 V

VCC(stop) VCC stop voltage (under voltage

lock-out) 7.0 7.5 8.0 V

Pulse width modulator

δmin minimum duty factor −0−%

δmax maximum duty factor f = 100 kHz −75 −%

SOPS

Vdemag demagnetization recognition

voltage level 50 100 150 mV

tsuppr suppression of transformer ringing

at start of secondary stroke 1.0 1.5 2.0 µs

RC oscillator

VRC(min) minimum voltage of RC oscillator

setting 60 75 90 mV

VRC(max) maximum voltage of RC oscillator

setting 2.4 2.5 2.6 V

tRC(ch) RC charging time −1−µs

osc frequency range of oscillator 10 100 200 kHz

2000 Sep 08 11

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

Duty factor regulator (pin REG)

VREG input voltage 2.4 2.5 2.6 V

GV(erroramp) voltage gain of error ampliﬁer −20 −dB

VREG(clamp) clamping voltage at pin REG IREG =6mA −−7.5 V

Valley switching (not implemented in TEA152xAJM versions)

dV/dtvalley dV/dt for valley recognition −102 −102 V/µs

fvalley ringing frequency for valley

switching N×Vo= 100 V 200 550 800 kHz

td(valley-swon) delay from valley recognition to

switch-on −150 −ns

Current and short circuit winding protection

Vsource(max) maximum source voltage dV/dt = 0.1 V/µs 0.47 0.50 0.53 V

td(propagation) delay from detecting VSRC(max) to

switch-off dV/dt = 0.5 V/µs−160 185 ns

Vswp short circuit winding protection

voltage dV/dt = 0.5 V/µs 0.7 0.75 0.8 V

tleb blanking time for current and short

circuit winding protection 250 350 450 ns

Output stage (FET)

IL(drain) drain leakage current Vdrain = 650 V −−125 µA

V(BR)drain drain breakdown voltage Tj>0°C 650 −−V

DS(on) drain-source on-state resistance

of TEA1520 Tj=25°C; Isource =−0.06 A −48 55.2 Ω

Tj= 100 °C; Isource =−0.06 A −68 78.2 Ω

drain-source on-state resistance

of TEA1521 Tj=25°C; Isource =−0.125 A −24 27.6 Ω

Tj= 100 °C; Isource =−0.125 A −34 39.1 Ω

drain-source on-state resistance

of TEA1522 Tj=25°C; Isource =−0.25 A −12 13.8 Ω

Tj= 100 °C; Isource =−0.25 A −17 19.6 Ω

drain-source on-state resistance

of TEA1523 Tj=25°C; Isource =−0.5 A −6.5 7.5 Ω

Tj= 100 °C; Isource =−0.5 A −9.0 10.0 Ω

drain-source on-state resistance

of TEA1524 Tj=25°C; Isource =−1.0 A −3.4 3.9 Ω

Tj= 100 °C; Isource =−1.0 A −4.8 5.5 Ω

tdrain(f) drain fall time Vi= 300 V; no external capacitor at

drain −75 −ns

Temperature protection

Tprot(max) maximum temperature threshold 150 160 170 °C

Tprot(hys) hysteresis temperature −2−°C

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

2000 Sep 08 12

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

APPLICATION INFORMATION

Further application information can be found in the TEA152x application notes.

handbook, full pagewidth

MGT425

TEA152xP

DRAIN

n.c.

GND

SOURCE

AUX

R1 D2

C6 - Ycap

Z1 C5

CF2

CF1

mains

RAUX

REG

RRC

CRC

CVCC VCC

Fig.7 Primary sensed application; configuration for TEA152xP.

2000 Sep 08 13

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

PACKAGE OUTLINES

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

SOT97-1 95-02-04

99-12-27

UNIT A

max. 12 b

1(1) (1) (1)

b2cD E e M Z

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min. A

max. bmax.

1.73

1.14 0.53

0.38 0.36

0.23 9.8

9.2 6.48

6.20 3.60

3.05 0.2542.54 7.62 8.25

7.80 10.0

8.3 1.154.2 0.51 3.2

inches 0.068

0.045 0.021

0.015 0.014

0.009

1.07

0.89

0.042

0.035 0.39

0.36 0.26

0.24 0.14

0.12 0.010.10 0.30 0.32

0.31 0.39

0.33 0.0450.17 0.020 0.13

050G01 MO-001 SC-504-8

(e )

seating plane

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

pin 1 index

DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1

2000 Sep 08 14

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 8.75

8.55 4.0

3.8 1.27 6.2

5.8 0.7

0.6 0.7

0.3 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0

0.4

SOT108-1

detail X

vMA

(A )

076E06 MS-012

pin 1 index

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.35

0.34 0.16

0.15 0.050

1.05

0.041

0.244

0.228 0.028

0.024 0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

97-05-22

99-12-27

0 2.5 5 mm

scale

SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

2000 Sep 08 15

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.

SOT523-1

0 10 mm5

scale

non-concave

kq2

98-11-12

00-07-03

DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad SOT523-1

view B: mounting base side

UNIT bpL1

(1) DhLq

mm 2.7

2.3

A2(2)

0.80

0.65 0.58

0.48 13.2

12.8

D1(2)

6.2

5.8 3.5

3.5

2.54

1.27

5.08 4.85

QE(1)

14.7

14.3

Z(1)

1.65

1.10

11.4

10.0

6.7

5.5

4.5

3.7 3.4

3.1 1.15

0.85

17.5

16.3

2.8

0.8

3.8

3.6

3.0

2.0 12.4

11.0

0.02

0.3

2000 Sep 08 16

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

SOLDERING

Introduction

Thistextgivesaverybriefinsighttoa complex technology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-holeandsurfacemountcomponentsaremixedon

one printed-circuit board. However, wave soldering is not

always suitable for surface mount ICs, or for printed-circuit

boards with high population densities. In these situations

reflow soldering is often used.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joints for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg(max)). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

MANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temperature of the soldering iron bit

is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between

300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

totheprinted-circuit board byscreen printing, stencillingor

pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating

method.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

WAVE SOLDERING

Conventional single wave soldering is not recommended

forsurfacemountdevices(SMDs)orprinted-circuitboards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•Forpackageswithleadsonfoursides,thefootprintmust

be placed at a 45°angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

MANUAL SOLDERING

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

2000 Sep 08 17

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

Suitability of IC packages for wave, reﬂow and dipping soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

MOUNTING PACKAGE SOLDERING METHOD

WAVE REFLOW(1) DIPPING

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable(2) −suitable

Surface mount BGA, LFBGA, SQFP, TFBGA not suitable suitable −

HBCC, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, SMS not suitable(3) suitable −

PLCC(4), SO, SOJ suitable suitable −

LQFP, QFP, TQFP not recommended(4)(5) suitable −

SSOP, TSSOP, VSO not recommended(6) suitable −

2000 Sep 08 18

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

DATA SHEET STATUS

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DATA SHEET STATUS PRODUCT

STATUS DEFINITIONS (1)

Objective speciﬁcation Development This data sheet contains the design target or goal speciﬁcations for

product development. Speciﬁcation may change in any manner without

notice.

Preliminary speciﬁcation Qualiﬁcation This data sheet contains preliminary data, and supplementary data will be

published at a later date. Philips Semiconductors reserves the right to

make changes at any time without notice in order to improve design and

supply the best possible product.

Product speciﬁcation Production This data sheet contains ﬁnal speciﬁcations. Philips Semiconductors

reserves the right to make changes at any time without notice in order to

improve design and supply the best possible product.

DEFINITIONS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

attheseoratany other conditions abovethosegiveninthe

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Application information  Applications that are

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

norepresentation or warrantythatsuchapplicationswillbe

suitable for the specified use without further testing or

modification.

DISCLAIMERS

Life support applications  These products are not

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductorscustomers usingorsellingtheseproducts

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes  Philips Semiconductors

reserves the right to make changes, without notice, in the

products, including circuits, standard cells, and/or

software, described or contained herein in order to

improve design and/or performance. Philips

Semiconductors assumes no responsibility or liability for

theuseofanyoftheseproducts,conveysnolicenceortitle

under any patent, copyright, or mask work right to these

products,andmakes no representations orwarrantiesthat

these products are free from patent, copyright, or mask

work right infringement, unless otherwise specified.

2000 Sep 08 19

Philips Semiconductors Product speciﬁcation

STARplugTM TEA152x family

NOTES

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

2000 70

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Printed in The Netherlands 613502/01/pp20 Date of release: 2000 Sep 08 Document order number: 9397 750 07242