1. Product profile
1.1 General description
Four planar PIN diode array in SOT363 small SMD plastic package.
1.2 Features and benefits
High voltage current controlled RF resistor for RF attenuators
Low diode capacitance
Very low series inductance
Low distortion
1.3 Applications
RF attenuators
(SAT) TV applications
Car radio applications
2. Pinning information
3. Ordering information
BAP70AM
Silicon PIN diode array
Rev. 2 — 7 September 2010 Product data sheet
Table 1. Discrete pinning
Pin Description Simplified outline Graphic symbol
1 anode diode 1
2 cathode diode 2
3 anode diode 3 / cathode diode 4
4 anode diode 4
5 cathode diode 3
6 anode diode 2 / cathode diode 1
132
4
56
sym11
8
321
465
Table 2. Ordering information
Type number Package
Name Description Version
BAP70AM - plastic surface-mounted package; 6 leads SOT363
BAP70AM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 2 — 7 September 2010 2 of 8
NXP Semiconductors BAP70AM
Silicon PIN diode array
4. Marking
5. Limiting values
6. Thermal characteristics
Table 3. Marking
Type number Marking code Description
BAP70AM N9* * = - : made in Hong Kong
* = p : made in Hong Kong
* = t : made in Malaysia
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRreverse voltage - 50 V
IFforward current - 100 mA
Ptot total power dissipation Tsp =90°C- 300mW
Tstg storage temperature −65 +150 °C
Tjjunction temperature −65 +150 °C
Table 5. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-sp) thermal resistance from junction
to solder point 260 K/W
BAP70AM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 2 — 7 September 2010 3 of 8
NXP Semiconductors BAP70AM
Silicon PIN diode array
7. Characteristics
Table 6. Characteristics
Tamb = 25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage IF=50mA - 0.9 1.1 V
IRreverse current VR= 50 V - - < 100 nA
Cddiode capacitance see Figure 1; f = 1 MHz;
VR=0V - 570 - fF
VR=1V - 400 - fF
VR=5V - 270 - fF
VR= 20 V - 200 250 fF
rDdiode forward resistance see Figure 2; f = 100 MHz;
IF= 0.5 mA - 77 100 Ω
IF=1mA - 40 50 Ω
IF=10mA - 5.4 7 Ω
IF=100mA - 1.4 1.9 Ω
τLcharge carrier life time when switched from IF=10mA to
IR=6mA; R
L= 100 Ω; measured at
IR=3mA
-1.25-μs
LSseries inductance IF= 100 mA; f = 100 MHz - 0.6 - nH
f=1MHz; T
j=25°C. f = 100 MHz; Tj=25°C.
Fig 1. Diode capacitance as a fun ction of reverse
voltage; typical values Fig 2. Diode forward resistance as a function of
forward current; typical values
VR (V)
02015510
001aaa461
400
300
500
600
Cd
(fF)
200
103
102
10
1
mce007
10−1110
rD
(Ω)
IF (mA) 102
BAP70AM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 2 — 7 September 2010 4 of 8
NXP Semiconductors BAP70AM
Silicon PIN diode array
8. Package outline
Fig 3. Package outline SOT363
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT363 SC-88
wBM
bp
D
e1
e
pin 1
index A
A1
Lp
Q
detail X
HE
E
vMA
AB
y
0 1 2 mm
scale
c
X
132
456
Plastic surface-mounted package; 6 leads SOT36
3
UNIT A1
max bpcDEe1HELpQywv
mm 0.1 0.30
0.20
2.2
1.8
0.25
0.10
1.35
1.15 0.65
e
1.3 2.2
2.0 0.2 0.10.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
0.25
0.15
A
1.1
0.8
04-11-08
06-03-16
BAP70AM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 2 — 7 September 2010 5 of 8
NXP Semiconductors BAP70AM
Silicon PIN diode array
9. Abbreviations
10. Revision history
Table 7. Abbreviations
Acronym Description
PIN P-type, Intrinsic, N-type
SMD Surface Mounted Device
RF Radio Frequency
SAT SATellite
Table 8. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BAP70AM v.2 20100907 Product data sheet - BAP70AM v.1
Modifications: •The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors
•Legal texts have been adapted to the new company name where appropriate
•Table 3 on page 2: Marking code has been updated to current situation.
BAP70AM v.1 20061120 Product data sheet - -
BAP70AM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 2 — 7 September 2010 6 of 8
NXP Semiconductors BAP70AM
Silicon PIN diode array
11. Legal information
11.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) d escribed in th is docume nt may have cha nged since this docume nt was publish ed and ma y diffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full informatio n see the relevant full data
sheet, which is available on request via the local NXP Semicond uctors sales
office. In case of any inconsistency or conflict wit h the short data sheet, the
full data sheet shall pre va il.
Product specificat io n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
11.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warrant ies, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconduct ors’ aggregate and cumulati ve liability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semicondu ctors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suit able for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe propert y or environmenta l
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whet her the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Custo mers should provide appropriate
design and operating safeguards to minimize the risks associated with t heir
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party custo m er(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter m s and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or inte llectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contain s data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
BAP70AM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 2 — 7 September 2010 7 of 8
NXP Semiconductors BAP70AM
Silicon PIN diode array
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It i s neit her qualif ied nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standards, custome r
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such au tomotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y
liability, damages or failed product claims resulting from customer design an d
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
11.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respective ow ners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BAP70AM
Silicon PIN diode array
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 7 September 2010
Document identifier: BAP70 AM
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
13. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 2
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
9 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 5
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 5
11 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6
11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6
11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
12 Contact information. . . . . . . . . . . . . . . . . . . . . . 7
13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
