SMSC LAN8700/LAN8700i Revision 2.3 (04-12-11)
DATASHEET
Datasheet
PRODUCT FEATURES
LAN8700/LAN8700i
±15kV ESD Protected MII/RMII
10/100 Ethernet Transceiver with HP
Auto-MDIX Support and flexPWR®
Technology in a Small Footprint
Single-Chip Ethernet Physical Layer Transceiver
(PHY)
ESD Protection levels of ±8kV HBM without external
protection devices
ESD protection levels of EN/IEC61000-4-2, ±8kV
contact mode, and ±15kV for air discharge mode per
independent test facility
Comprehensive flexPWR® Technology
Flexible Power Management Architecture
LVCMOS Variable I/O voltage range: +1.6V to +3.6V
Integrated 3.3V to 1.8V regulator for optional single
supply operation.
Regulator can be disabled if 1.8V system supply is
available.
Performs HP Auto-MDIX in accordance with IEEE
802.3ab specification
Cable length greater than 150 meters
Automatic Polarity Correction
Latch-Up Performance Exceeds 150mA per
EIA/JESD 78, Class II
Energy Detect power-down mode
Low Current consumption power down mode
Low operating current consumption:
39mA typical in 10BASE-T and
79mA typical in 100BASE-TX mode
Supports Auto-negotiation and Parallel Detection
Supports the Media Independent Interface (MII) and
Reduced Media Independent Interface (RMII)
Compliant with IEEE 802.3-2005 standards
MII Pins tolerant to 3.6V
IEEE 802.3-2005 compliant register functions
Integrated DSP with Adaptive Equalizer
Baseline Wander (BLW) Correction
Vendor Specific register functions
Low profile 36-pin QFN lead-free RoHS compliant
package (6 x 6 x 0.9mm height)
4 LED status indicators
Commercial Operating Temperature 0° C to 70° C
Industrial Operating Temperature -40° C to 85° C
version available (LAN8700i)
Applications
Set Top Boxes
Network Printers and Servers
LAN on Motherboard
10/100 PCMCIA/CardBus Applications
Embedded Telecom Applications
Video Record/Playback Systems
Cable Modems/Routers
DSL Modems/Routers
Digital Video Recorders
Personal Video Recorders
IP and Video Phones
Wireless Access Points
Digital Televisions
Digital Media Adaptors/Servers
POS Terminals
Automotive Networking
Gaming Consoles
Security Systems
POE Applications
Access Control
Order Numbers:
LAN8700C-AEZG for 36-pin, QFN lead-free RoHS compliant package
LAN8700iC-AEZG for (Industrial Temp) 36-pin, QFN lead-free RoHS compliant package
4900 pcs per tray
LAN8700C-AEZG-TR for 36-pin, QFN lead-free RoHS compliant package (tape and reel)
3000 pcs per reel
This product meets the halogen maximum concentration values per IEC61249-2-21
For RoHS compliance and environmental information, please visit www.smsc.com/rohs
±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR® Technology in a Small Footprint
Datasheet
Revision 2.3 (04-12-11) 2 SMSC LAN8700/LAN8700i
DATASHEET
80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000 or 1 (800) 443-SEMI
Copyright © 2011 SMSC or its subsidiaries. All rights reserved.
Circuit diagrams and other informa tion relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for
construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assume d for inaccura cies. SMSC
reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications
before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent
rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated
version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors
known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not
designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property
damage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of
this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a registered
trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders.
SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY,
FITNESS FOR A PARTICULAR PURP OSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE
OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL
DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT;
TORT; NEGLIGENCE OF SMSC OR OTHERS ; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD
TO HAVE FAILED OF ITS ESSENTIAL P URPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE PO SSIBILITY OF SUCH DAMAGES.
±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR® Technology in a Small Footprint
Datasheet
SMSC LAN8700/LAN8700i 3 Revision 2.3 (04-12-11)
DATASHEET
Table of Contents
Chapter 1 General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Chapter 2 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1 Package Pin-out Diagram and Signal Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Chapter 3 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1 I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Chapter 4 Architecture Details. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.1 Top Level Functional Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.2 100Base-TX Transmit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.2.1 100M Transmit Data Across the MII/RMII Interfa ce. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.2.2 4B/5B Encoding. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.2.3 Scrambling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.2.4 NRZI and MLT3 Encoding. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.2.5 100M Transmit Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.2.6 100M Phase Lock Loop (PLL). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.3 100Base-TX Receive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.3.1 100M Receive Input. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.3.2 Equalizer, Baseline Wander Correction and Clock and Data Recovery . . . . . . . . . . . . . 22
4.3.3 NRZI and MLT-3 Decoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.3.4 Descrambling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.3.5 Alignment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.3.6 5B/4B Decoding. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.3.7 Receive Data Valid Signal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.3.8 Receiver Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.3.9 100M Receive Data Across the MII/RMII Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.4 10Base-T Transmit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.4.1 10M Transmit Data Across the MII/RMII Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.4.2 Manchester Encoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.4.3 10M Transmit Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.5 10Base-T Receive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.5.1 10M Receive Input and Squelch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.5.2 Manchester Decoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.5.3 10M Receive Data Across the MII/RMII Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.5.4 Jabber Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.6 MAC Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.6.1 MII . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.6.2 RMII. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.6.3 MII vs. RMII Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.7 Auto-negotiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.7.1 Parallel Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.7.2 Re-starting Auto-negotiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.7.3 Disabling Auto-negotiation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.7.4 Half vs. Full Duplex . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.8 HP Auto-MDIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.9 Internal +1.8V Regulator Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.9.1 Disable the Internal +1.8V Regulator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.9.2 Enable the Internal +1.8V Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR® Technology in a Small Footprint
Datasheet
Revision 2.3 (04-12-11) 4 SMSC LAN8700/LAN8700i
DATASHEET
4.10 nINT/TX_ER/TXD4 Strapping. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.11 PHY Address Strapping and LED Output Polarity Selectio n . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.12 Variable Voltage I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.12.1 Boot Strapping Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.12.2 I/O Voltage Stability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.13 PHY Management Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.13.1 Serial Management Interface (SMI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Chapter 5 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.1 SMI Register Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
5.2 SMI Register Format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
5.3 Interrupt Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
5.3.1 Primary Interrupt System. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
5.3.2 Alternate Interrupt System. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
5.4 Miscellaneous Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
5.4.1 Carrier Sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
5.4.2 Collision Detect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
5.4.3 Isolate Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
5.4.4 Link Integrity Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
5.4.5 Power-Down modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
5.4.6 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
5.4.7 LED Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
5.4.8 Loopback Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
5.4.9 Configuration Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Chapter 6 AC Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
6.1 Serial Management Interface (SMI) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
6.2 MII 10/100Base-TX/RX Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
6.2.1 MII 100Base-T TX/RX Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
6.2.2 MII 10Base-T TX/RX Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
6.3 RMII 10/100Base-TX/RX Timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
6.3.1 RMII 100Base-T TX/RX Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
6.3.2 RMII 10Base-T TX/RX Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
6.4 RMII CLKIN Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
6.5 Reset Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
6.6 Clock Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Chapter 7 DC Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
7.1 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
7.1.1 Maximum Guaranteed Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
7.1.2 Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
7.1.3 Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
7.1.4 DC Characteristics - Input and Output Buffers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Chapter 8 Application Notes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
8.1 Application Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
8.2 Magnetics Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
8.3 Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
8.4 Reference Designs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
8.5 Evaluation board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Chapter 9 Package Outline, Tape and Reel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Chapter 10 Datasheet Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR® Technology in a Small Footprint
Datasheet
SMSC LAN8700/LAN8700i 5 Revision 2.3 (04-12-11)
DATASHEET
List of Figures
Figure 1.1 LAN8700/LAN8700i System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 1.2 LAN8700/LAN8700i Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 2.1 Package Pinout (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 4.1 100Base-TX Data Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 4.2 Receive Data Path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 4.3 Relationship Between Received Data and Specific MII Signals . . . . . . . . . . . . . . . . . . . . . . 24
Figure 4.4 Direct Cable Connection vs. Cross-over Cable Connection. . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 4.5 PHY Address Strapping on LED’s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 4.6 MDIO Timing and Frame Structure - READ Cycle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 4.7 MDIO Timing and Frame Structure - WRITE Cycle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 5.1 Reset Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Figure 5.2 Near-end Loopback Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Figure 5.3 Far Loopback Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Figure 5.4 Connector Loopback Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Figure 6.1 SMI Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Figure 6.2 100M MII Receive Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Figure 6.3 100M MII Transmit Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Figure 6.4 10M MII Receive Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Figure 6.5 10M MII Transmit Timing Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Figure 6.6 100M RMII Receive Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Figure 6.7 100M RMII Transmit Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Figure 6.8 10M RMII Receive Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Figure 6 .9 10M RM II Tr an sm it Tim i n g Diagr am . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Figure 6.10 Reset Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Figure 8.1 Simplified Application Diagram (see Section 8.4, "Reference Designs"). . . . . . . . . . . . . . . . 75
Figure 9.1 36-Pin QFN Package Outline, 6 x 6 x 0.90 mm Body (Lead-Free) . . . . . . . . . . . . . . . . . . . . 78
Figure 9.2 QFN, 6x6 Tape & Reel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Figure 9.3 Reel Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR® Technology in a Small Footprint
Datasheet
Revision 2.3 (04-12-11) 6 SMSC LAN8700/LAN8700i
DATASHEET
List of Tables
Table 2. 1 LAN8700/L AN8 70 0i 36 -PIN QFN Pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 3.1 MII Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 3.2 LED Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 3.3 Management Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 3.4 Boot Strap Configuration Inputs (Note 3.1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 3.5 General Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 3.6 10/100 Line Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 3.7 Analog References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 3.8 Power Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 4.1 4B/5B Code Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 4.2 MII/RMII Signal Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 4.3 Boot Strapping Configuration Resistors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 5.1 Control Register: Register 0 (Basic) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 5.2 Status Register: Register 1 (Basic) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 5.3 PHY ID 1 Register: Register 2 (Extended) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 5.4 PHY ID 2 Register: Register 3 (Extended) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 5.5 Auto-Negotiation Advertisement: Register 4 (Extended). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 5.6 Auto-Negotiation Link Partner Base Page Ability Register: Register 5 (Extended). . . . . . . . . 36
Table 5.7 Auto-Negotiation Expansion Re gister: Register 6 (Extended). . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 5.8 Auto-Negotiation Link Partner Next Page Transmit Register: Register 7 (Extended) . . . . . . . 36
Table 5.9 Register 8 (Extended) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 5.10 Register 9 (Extended) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 5.11 Register 10 (Extended) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 5.12 Register 11 (Extended) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 5.13 Register 12 (Extended) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 5.14 Register 13 (Extended) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 5.15 Register 14 (Extended) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 5.16 Register 15 (Extended) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 5.17 Silicon Revision Register 16: Vendor-Specific. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 5.18 Mode Control/ Status Register 17: Vendor-Specific . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 5.19 Special Modes Register 18: Vendor-Specific . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 5.20 Reserved Register 19: Vendor-Specific. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 5.21 Register 24: Vendor-Specific. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 5.22 Register 25: Vendor-Specific. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 5.23 Symbol Error Counter Register 26: Vendor-Specific. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 5.24 Special Control/Status Indications Register 27: Vendor-Specific . . . . . . . . . . . . . . . . . . . . . . 39
Table 5.25 Special Internal Testability Control Register 28: Vendor-Specific . . . . . . . . . . . . . . . . . . . . . . 39
Table 5.26 Interrupt Source Flags Register 29: Vendor-Specific . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 5.27 Interrupt Mask Register 30: Vendor-Specific. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 5.28 PHY Special Control/Status Register 31: Vendor-Specific . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 5.29 SMI Register Mapping. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 5.30 Register 0 - Basic Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 5.31 Register 1 - Basic Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 5.32 Register 2 - PHY Identifier 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 5.33 Register 3 - PHY Identifier 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 5.34 Register 4 - Auto Negotiation Advertisement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 5.35 Register 5 - Auto Negotiation Link Partner Ability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 5.36 Register 6 - Auto Negotiation Expansion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 5.37 Register 16 - Silicon Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 5.38 Register 17 - Mode Control/Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 5.39 Register 18 - Special Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 5.40 Register 26 - Symbol Error Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR® Technology in a Small Footprint
Datasheet
SMSC LAN8700/LAN8700i 7 Revision 2.3 (04-12-11)
DATASHEET
Table 5.41 Register 27 - Special Control/Status Indications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 5.42 Register 28 - Special Internal Testability Controls. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 5.43 Register 29 - Interrupt Source Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 5.44 Register 30 - Interrupt Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 5.45 Register 31 - PHY Special Control/Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 5.46 Interrupt Management Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 5.47 Alternative Interrupt System Management Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Table 5.48 MODE[2:0] Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Table 6.1 SMI Timing Values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Table 6.2 100M MII Receive Timing Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Table 6.3 100M MII Transmit Timing Values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Table 6.4 10M MII Receive Timing Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Table 6.5 10M MII Transmit Timing Values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Table 6.6 100M RMII Receive Timing Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Table 6.7 100M RMII Transmit Timing Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 6.8 10M RMII Receive Timing Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Table 6.9 10M RMII Transmit Timing Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Table 6.10 RMII CLKIN (REF_CLK)Timing Values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 6.11 Reset Timing Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 6.12 LAN8700/LAN8700i Crystal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Table 7.1 Maximum Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Table 7.2 ESD and LATCH-UP Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Table 7.3 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Table 7.4 Power Consumption Device Only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Table 7.5 MII Bus Interface Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Table 7.6 LAN Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Table 7.7 LED Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Table 7.8 Configuration Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Table 7.9 General Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 7.10 Analog References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 7.11 Internal Pull-Up / Pull-Down Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 7.12 100Base-TX Transceiver Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Table 7.13 10BASE-T Transceiver Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Table 9.1 36-Pin QFN Package Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Table 10.1 Customer Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR® Technology in a Small Footprint
Datasheet
Revision 2.3 (04-12-11) 8 SMSC LAN8700/LAN8700i
DATASHEET
Chapter 1 General Description
The SMSC LAN8700/LAN8700i is a low-power, industrial temperature (LAN8700i), variable I/O voltage,
analog interface IC with HP Auto-MDIX support for hi gh-performance embedded Ethern et applications.
The LAN8700/LAN8700i can be configured to operate on a single 3.3V supply utilizing an integrated
3.3V to 1.8V linear regulator. An option is available to disable the linear regulator to optimize system
designs that have a 1.8V power plane available.
1.1 Architectural Overview
The LAN8700/LAN8700i consists of an encoder/decoder, scrambler/descrambler, wave-shaping
transmitter, output driver, twisted-pair receiver with adaptive equalizer and baseline wander (BLW)
correction, and clock and data recovery functions. The LAN8700/LAN8700i can be configured to
support either the Media Independent Interface (MII) or the Reduced Media Independent Interface
(RMII).
The LAN8700/LAN8700i is compliant with IEEE 802.3-2005 standards (MII Pins tolerant to 3.6V) and
supports both IEEE 802.3-2005 compliant and vendor-specific register functions. It contains a full-
duplex 10-BASE-T/100BASE-TX transceiver and supports 10-Mbps (10BASE-T) operation on
Category 3 and Category 5 unshielded twisted-pair cable, and 100-Mbps (100BASE-TX) operation on
Category 5 unshielded twisted-pair cable.
Hubs and switches with multiple integrated MACs and external PHYs can have a large pin count due
to the high number of pins needed for each MII interface. An increasing pin count causes increasing
cost.
The RMII interface is intended for use on Switch based ASICs or other embedded solutions requiring
minimal pincount for ethernet connectivity. RMII requires only 6 pins for each MAC to PHY interface
plus one common reference clock. The MII requires 16 pins for each MAC to PHY interface.
The SMSC LAN8700/LAN8700i is capable of running in RMII mode. Please contact your SMSC sales
representative for the latest RMII specification.
The LAN8700/LAN8700i referenced throughout this document applies to both the commercial
temperature and industrial temperature components. The LAN8700i refers to only the industrial
temperature component.
Figure 1.1 LAN8700/LAN8700i System Block Diagram
10/100
Media
Access
Controller
(MAC)
or SOC
SMSC
LAN8700/
LAN8700i
Magnetics Ethernet
System Bus
LEDS/GPIO
25 MHz (MII) or 50MHz (RMIII)
Crystal or External Clock
MII /RMII
±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR® Technology in a Small Footprint
Datasheet
SMSC LAN8700/LAN8700i 9 Revision 2.3 (04-12-11)
DATASHEET
Figure 1.2 LAN8700/LAN8700i Architectural Overview
10M Rx
Logic
100M Rx
Logic DSP System:
Clock
Data Recovery
Equalizer
Analog-to-
Digital
100M PLL
Squelch &
Filters
10M PLL
Receive Section
Central
Bias
HP Auto-MDIX
Management
Control
SMI
RMII / MII Logic
TXP / TXN
TXD[0..3]
TX_EN
TX_ER
TX_CLK
RXD[0..3]
RX_DV
RX_ER
RX_CLK
CRS
COL/CRS_DV
MDC
MDIO
SPEED100
LINK
ACTIVITY
FDUPLEX
LED Circuitry
MODE Control
nINT
nRST RXP / RXN
10M Tx
Logic 10M
Transmitter
100M Tx
Logic 100M
Transmitter
Transmit Section
PLL XTAL1
XTAL2
MODE0
MODE1
MODE2
PHY
Address
Latches PHYAD[0..4]
Auto-
Negotiation
Interrupt
Generator
MII MDIX
Control
±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR® Technology in a Small Footprint
Datasheet
Revision 2.3 (04-12-11) 10 SMSC LAN8700/LAN8700i
DATASHEET
Chapter 2 Pin Configuration
2.1 Package Pin-out Diagram and Signal Table
Figure 2.1 Package Pinout (Top View)
nINT/TX_ER/TXD4
MDC
CRS/PHYAD4
MDIO
nRST
TX_EN
VDD_CORE
VDD33
LINK/PHYAD1
ACTIVITY/PHYAD2
FDUPLEX/PHYAD3
XTAL2
CLKIN/XTAL1
RXD3/nINTSEL
RXD1/MODE1
RXD2/MODE2
TXD3
RX_CLK/REGOFF
TX_CLK
RX_ER/RXD4
VDDIO
TXD1
TXD0
TXD2
COL/RMII/CRS_DV
TXP
RXN
VDDA3.3
EXRES1
VDDA3.3
RXP
VDDA3.3
1
2
3
4
5
6
7
8
LAN8700/LAN8700i
MII/RMII Ethernet PHY
36 Pin QFN
GND FLAG
10
11
12
13
14
15
16
24
23
22
21
20
19
32
31
30
29
28
SPEED100/PHYAD0 9RX_DV
RXD0/MODE0
17
TXN
18
27
26
25
36
35
34
33
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Table 2.1 LAN8700/LAN8700i 36-PIN QFN Pinout
PIN NO. PIN NAME PIN NO. PIN NAME
1 nINT/TX_ER/TXD4 19 RX_DV
2 MDC 20 RX_CLK/REGOFF
3 CRS/PHYAD4 21 RX_ER/RXD4
4MDIO22 TXCLK
5nRST23 TXD0
6 TX_EN 24 TXD1
7 VDD33 25 VDDIO
8VDD_CORE26 TXD2
9 SPEED100/PHYAD0 27 TXD3
10 LINK/PHYAD1 28 TXN
11 ACTIVITY/PHYAD2 29 TXP
12 FDUPLEX/PHYAD3 30 VDDA3.3
13 XTAL2 31 RXN
14 CLKIN/XTAL1 32 RXP
15 RXD3/nINTSEL 33 VDDA3.3
16 RXD2/MODE2 34 EXRES1
17 RXD1/MODE1 35 VDDA3.3
18 RXD0/MODE0 36 COL/RMII/CRS_DV
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Chapter 3 Pin Description
This chapter describes the signals on each pin. When a lower case “n” is used at the beginning of the
signal name, it indicates that the signa l is active lo w. For example, nRST indica tes that the reset signal
is active low.
3.1 I/O Signals
The following buffer types are shown in the TYPE column of the tables in this chapter.
I Input. Digital LVCMOS levels.
IPD Input with internal pull-down. Digital LVCMOS levels.
O Output. Digital LVCMOS levels.
OPD Output with internal pull-down. Digital LVCMOS levels.
I/O Input or Output . Digital LVCMOS levels.
IOPD Input or Output with internal pull-down. Digital LVCMOS levels.
IOPU Input or Output with internal pull-up. Digital LVCMOS levels.
Note: The digital signals are not 5V tolerant.They are variable voltage from +1.6V to +3.6V.
AI Input. Analog levels..
AO Output. Analog levels.
Table 3.1 MII Si gnals
SIGNAL NAME TYPE DESCRIPTION
TXD0 I Tr an sm it Da ta 0: Bit 0 of the 4 data bits that are accepted by
the PHY for transmission.
TXD1 I Tr an sm it Da ta 1: Bit 1 of the 4 data bits that are accepted by
the PHY for transmission.
TXD2 I Tr an sm it Da ta 2: Bit 2 of the 4 data bits that are accepted by
the PHY for transmission
Note: This signal should be grounded in RMII Mode.
TXD3 I Tr an sm it Da ta 3: Bit 3 of the 4 data bits that are accepted by
the PHY for transmission.
Note: This signal should be grounded in RMII Mode
nINT/
TX_ER/
TXD4
IOPU MII Transmit Error: When driven high, the 4B/5B encode
process substitutes the Transmit Error code-group (/H/) for the
encoded data word. This input is ignored in 10Base-T operation.
MII Transmit Data 4: In Symbol Interface (5B Decoding) mode ,
this signal becomes the MII Transmit Data 4 line, the MSB of the
5-bit symbol code-group.
Notes:
This signal is not used in RMII Mode.
This signal is mux’d with nINT
See Section 4.10, "nINT/TX_ER/TXD4 Strapping," on page 32
for additional information on configuration/strapping options.
TX_EN IPD Transmit Enable: Indicates that valid data is presented on the
TXD[3:0] signals, for transmission. In RMII Mode, only TXD[1:0]
have valid data.
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TX_CLK O Tr an sm it Cl oc k: 25MHz in 100Base-TX mode. 2.5MHz in
10Base-T mode.
Note: This signal is not used in RMII Mode.
Note: For proper TXCLK operation, RX_ER and RX_DV must
NOT be driven high externally on a hardware reset or
on a LAN8700 power up.
RXD0/
MODE0 IOPU Receive Data 0: Bit 0 of the 4 data bits that are sent by the PHY
in the receive path.
PHY Operating Mode Bit 0: set the default MODE of the PHY.
Note: See Section 5.4.9.2, "Mode Bus – MODE[2:0]," on
page 56, for the MODE options
RXD1/
MODE1 IOPU Receive Data 1: Bit 1 of the 4 data bits that are sent by the PHY
in the receive path.
PHY Operating Mode Bit 1: set the default MODE of the PHY.
Note: See Section 5.4.9.2, "Mode Bus – MODE[2:0]," on
page 56, for the MODE options.
RXD2/
MODE2 IOPU Receive Data 2: Bit 2 of the 4 data bits that are sent by the PHY
in the receive path.
PHY Operating Mode Bit 2: set the default MODE of the PHY.
Notes:
RXD2 is not used in RMII Mode.
See Section 5.4.9.2, "Mode Bus – MODE[2:0]," on page 56, for
the MODE options.
RXD3/
nINTSEL IOPU Receive Data 3: Bit 3 of the 4 data bits that are sent by the PHY
in the receive path.
nINTSEL: On power-up or external reset, the mode of the
nINT/TXER/TXD4 pin is selected.
When RXD3/nINTSEL is floated or pulled to VDDIO, nINT is
selected for operation on pin nINT/TXER/TXD4 (default).
When RXD3/nINTSEL is pulled low to VSS through a resistor,
(see Table 4.3, “Boot Strapping Configuration Resistors,” on
page 33), TXER/TXD4 is selected for operation on pin
nINT/TXER/TXD4.
Notes:
RXD3 is not used in RMII Mode
If the nINT/TXER/TXD4 pin is configured for nINT mode, then
a pull-up resistor is needed to VDDIO on the nINT/TXER/TXD4
pin. see Table 4.3, “Boot Strapping Configuration Resistors,” on
page 33.
See Section 4.10, "nINT/TX_ER/TXD4 Strapping," on page 32
for additional information on configuration/strapping options.
Table 3.1 MII Signals (continued)
SIGNAL NAME TYPE DESCRIPTION
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RX_ER/
RXD4/ OPD Receive Error: Asserted to indicate that an error was detected
somewhere in the frame presently being transferred from the
PHY.
MII Receive Data 4: In Symbol Interface (5B Decoding) mode,
this signal is the MII Receive Data 4 signal, the MSB of the
received 5-bit symbol code-group. Unless configured in this
mode, the pin functions as RX_ER.
Note: This pin has an internal pull-down resistor , and must not
be high during reset. The RX_ER signal is optional in
RMII Mode.
RX_DV O Receive Data Valid: Indicates that recovered and decoded data
nibbles are being presented on RXD[3:0].
Note: This pin has an internal pull-down resistor , and must not
be high during reset. This signal is not used in RMII
Mode.
RX_CLK/
REGOFF IOPD Receive Clock: In MII mode, this pin is the receive clock o utput.
25MHz in 100Base-TX mode. 2.5MHz in 10Base-T mode.
Note: This signal is not used in RMII Mode.
Regulator Off: This pin pulled up to configure the internal 1.8V
regulator off. As described in Section 4.9, this pin is sampled
during the power-on sequence to determine if the internal
regulator should turn on. When the regulator is disabled, external
1.8V must be supplied to VDD_CORE, and the voltage at VDD33
must be at least 2.6 4V before voltage is applied to VDD_CORE.
COL/
RMII/
CRS_DV
IOPD MII Mode Collision Detect: Asserted to indicate detection of
collision condition.
RMII – MII/RMII mode selection is latched on the rising edge of
the internal reset (nreset) based on the following strapping:
Float this pin for MII mode or pull-high with an external resistor
to VDDIO (see Table 4.3, “Boot Strapping Configuration
Resistors,” on page 33) to set the device in RMII mode.
See Section 4.6.3, "MII vs. RMII Configuration," on page 28 fo r
more details.
RMII Mode CRS_DV (Carrier Sense/Receive Data Valid)
Asserted to indicate when the receive medium is non-idle. When
a 10BT packet is received, CRS_DV is asserted, but RXD[1:0] is
held low until the SFD byte (10101011) is received. In 10BT, half-
duplex mode, transmitted data is not looped back onto the
receive data pins, per the RMII standard.
CRS/
PHYAD4 IOPU Carrier Sense: Indicates detection of carrier.
Note: This signal is mux’d with PHYAD4
Table 3.1 MII Signals (continued)
SIGNAL NAME TYPE DESCRIPTION
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Table 3.2 LED Signals
SIGNAL NAME TYPE DESCRIPTION
SPEED100/
PHYAD0 IOPU LED1 – SPEED100 indication. Active indicates that the selected
speed is 100Mbps. Inactive indicates that the selected speed is
10Mbps.
Note: This signal is mux’d with PHYAD0
LINK/
PHYAD1 IOPU LED2 – LINK ON indication. Active indicates that the Link
(100Base-TX or 10Base-T) is on.
Note: This signal is mux’d with PHYAD1
ACTIVITY/
PHYAD2 IOPU LED3 – ACTIVITY indication. Active indicates that there is
Carrier sense (CRS) from the active PMD.
Note: This signal is mux’d with PHYAD2
FDUPLEX/
PHYAD3 IOPU LED4 – DUPLEX indication. Active indicates that the PHY is in
full-duplex mode.
Note: This signal is mux’d with PHYAD3
Table 3.3 Management Signals
SIGNAL NAME TYPE DESCRIPTION
MDIO IOPD Management Data Input/OUTPUT: Serial management data
input/output.
MDC IPD Management Clock: Serial management clock.
Table 3.4 Boot Strap Configuration Inputs (Note 3.1)
SIGNAL NAME TYPE DESCRIPTION
CRS/
PHYAD4 IOPU PHY Address Bit 4: set the default address of the PHY. This
signal is mux’d with CRS
Note: This signal is mux’d with CRS
FDUPLEX/
PHYAD3 IOPU PHY Address Bit 3: set the default address of the PHY.
Note: This signal is mux’d with FDUPLEX
ACTIVITY/
PHYAD2 IOPU PHY Address Bit 2: set the default address of the PHY.
Note: This signal is mux’d with ACTIVITY
LINK/
PHYAD1 IOPU PHY Address Bit 1: set the default address of the PHY.
Note: This signal is mux’d with LINK
SPEED100/
PHYAD0 IOPU PHY Address Bit 0: set the default address of the PHY.
Note: This signal is mux’d with SPEED100
RXD2/
MODE2 IOPU PHY Operating Mode Bit 2: set the default MODE of the PHY.
See Section 5.4.9.2, "Mode Bus – MODE[2:0]," on page 56, for
the MODE options.
Note: This signal is mux’d with RXD2
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Note 3.1 On nRST transition high, the PHY latches the state of the configuration pins in this table.
RXD1/
MODE1 IOPU PHY Operating Mode Bit 1: set the default MODE of the PHY.
See Section 5.4.9.2, "Mode Bus – MODE[2:0]," on page 56, for
the MODE options.
Note: This signal is mux’d with RXD1
RXD0/
MODE0 IOPU PHY Operating Mode Bit 0: set the default MODE of the PHY.
See Section 5.4.9.2, "Mode Bus – MODE[2:0]," on page 56, for
the MODE options.
Note: This signal is mux’d with RXD0
COL/
RMII/
CRS_DV
IOPD Digital Communication Mode: set the digital communications
mode of the PHY to RMII or MII. This signal is muxed with the
Collision signal (MII mode) and Carrier Sense/ receive Data Valid
(RMII mode)
Float for MII mode.
Pull up with a resistor to VDD IO for RMII mode (see Table 4.3,
“Boot Strapping Configuration Resistors,” on page 33) .
RXD3/
nINTSEL IOPU nINT pin mode select: set the mode of pin 1.
Default, left floating pin 1 is nINT, active low interrupt output.
Notes:For nINT mode, tie nINT/TXD4/TXER to VDDIO with a
resistor (see Table 4.3, “Boot Strapping Configuration Resistors,”
on page 33).
Pulled to VSS by a resistor, (see Table 4.3, “Boot Strapping
Configuration Resistors,” on page 33) pin 1 is TX_ER/TXD4,
Transmit Error or Transmit data 4 (5B mode).
Notes:For TXD4/TXER mode, do not tie nINT/TXD4/TXER to
VDDIO or Ground.
Table 3.5 General Signals
SIGNAL NAME TYPE DESCRIPTION
nINT/
TX_ER/
TXD4
IOPU LAN Interrupt – Active Low output. Place an external resistor
(see Table 4.3, “Boot Strapping Configuration Resistors,” on
page 33) pull-up to VCC 3.3V.
Notes:
This signal is mux’d with TXER/TXD4
See Section 4.10, "nINT/TX_ER/TXD4 Strapping," on page 32
for additional details on Strapping options.
nRST I External Rese t – input of the system reset. This signal is active
LOW. When this pin is deasserted, the mode register bits are
loaded from the mode pins as described in Section 5.4.9.2.
Table 3.4 Boot Strap Configuration Inputs (Note 3.1) (continued)
SIGNAL NAME TYPE DESCRIPTION
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CLKIN/
XTAL1 I/O Clock Input – 25 Mhz or 50 MHz exte rnal clock or crystal input.
In MII mode, this signal is the 25 MHz reference input clock
In RMII mode, this signal is the 50 MHz reference input clock
which is typically also driven to the RMII compliant Ethernet MAC
clock input.
Note: See Section 4.10, "nINT/TX_ER/TXD4 Strapping," on
page 32 for additional details on Strapping options.
XTAL2 O Clock Output – 25 MHz crystal output.
Note: Float this pin if using an external clock being driven
through CLKIN/XTAL1
Table 3.6 10/100 Line Interface
SIGNAL NAME TYPE DESCRIPTION
TXP AO Transmit Data Positive: 100Base-TX or 10Base-T differential
transmit outputs to magnetics.
TXN AO Transmit Data Negative: 100Base-TX or 10Base-T differential
transmit outputs to magnetics.
RXP AI Receive Data Positive: 100Base-TX or 10Base-T differential
receive inputs from magnetics.
RXN AI Receive Data Negative: 100Base-TX or 10Base-T differential
receive inputs from magnetics.
Table 3.7 Analog References
SIGNAL NAME TYPE DESCRIPTION
EXRES1 AI Connects to reference resistor of value 12.4K-Ohm, 1%
connected as described in the Analog Layout Guidelines. The
nominal voltage is 1.2V and therefore the resistor will dissipate
approximately 1mW of power.
Table 3.8 Power Signals
SIGNAL NAME TYPE DESCRIPTION
VDDIO POWER +1.6V to +3.6V Variable I/O Pad Power
VDD33 POWER +3.3V Core Regulator Input.
VDDA3.3 POWER +3.3V Analog Power
Table 3.5 General Signals (continued)
SIGNAL NAME TYPE DESCRIPTION
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VDD_CORE POWER +1.8V (Core voltage) - 1.8V for digital circuitry on chip. Supplied
by the on-chip regulator unless configured for regulator off
mode using the RX_CLK/REGOFF pin. Place a 0.1uF capacitor
near this pin and connect the capacitor from this pin to ground.
When using the on-chip regulator, place a 4.7uF ±20%
capacitor with ESR < 1ohm near this pin and connect the
capacitor from this pin to ground. X5R or X7R ceramic
capacitors are recommended since they exhibit an ESR lower
than 0.1ohm at frequencies greater than 10kHz.
VSS POWER
Exposed Ground Flag. The flag must be connected to the
ground plane with an array of vias as described in the Analog
Layout Guidelines
Table 3.8 Power Signals (continued)
SIGNAL NAME TYPE DESCRIPTION
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Chapter 4 Architecture Details
4.1 Top Level Functional Architecture
Functionally, the PHY can be divided into the following sections:
100Base-TX transmit and receive
10Base-T transmit and receive
MII or RMII interface to the controller
Auto-negotiation to automatically determine the best speed and duplex possible
Management Control to read status registers and write control registers
Figure 4.1 100Base-TX Data Path
4.2 100Base-TX Transmit
The data path of the 100Base-TX is shown in Figure 4.1. Each major block is explained below.
4.2.1 100M Transmit Data Across the MII/RMII Interface
For MII, the MAC controller drives the transmit data onto the TXD bus and asserts TX_EN to indicate
valid data. The data is latched by the PHY’s MII block on the rising edge of TX_CLK. The data is in
the form of 4-bit wide 25MHz data.
The MAC controller drives the transmit data onto the TXD bus and asserts TX_EN to indicate valid
data. The data is latched by the PHY’s MII block on the rising edge of REF_CLK. The data is in the
form of 2-bit wide 50MHz data.
4.2.2 4B/5B Encoding
The transmit data passes from the MII block to the 4B/5B encoder. This block encodes the data from
4-bit nibbles to 5-bit symbols (known as “code-groups”) according to Table 4.1. Each 4-bit data-nibble
is mapped to 16 of the 32 possible code-groups. The remaining 16 code-groups are either used for
control information or are not valid.
MAC
Tx
Driver
MLT-3
Converter
NRZI
Converter
4B/5B
Encoder
Magnetics
CAT-5RJ45
25M H z by
5 bits
NRZI
MLT-3
MLT-3
MLT-3
MLT-3
Scrambler
and PISO
125 M bps S erial
MII 25MHz
by 4 bits
TX_CLK
(for M II only)
Ext Ref_CLK (for RMII only)
100M
PLL
MII 25 Mh z b y 4 b its
or
R M II 50M hz by 2 bits
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The first 16 code-groups are referred to by the hexadecimal values of their corre sponding data nibbles,
0 through F. The remaining code-groups are given letter designations with slashes on either side. For
example, an IDLE code-group is /I/, a transmit error code-group is /H/, etc.
The encoding process may be bypassed by clearing bit 6 of register 31. When the encoding is
bypassed the 5th transmit data bit is equivalent to TX_ER.
Note that encoding can be bypassed only when the MAC interface is configured to operate in MII
mode.
Table 4.1 4B/5B Code Table
CODE
GROUP SYM RECEIVER
INTERPRETATION TRANSMITTER
INTERPRETATION
11110 0 0 0000 DATA 0 0000 DATA
01001 1 1 0001 1 0001
10100 2 2 0010 2 0010
10101 3 3 0011 3 0011
01010 4 4 0100 4 0100
01011 5 5 0101 5 0101
01110 6 6 0110 6 0110
01111 7 7 0111 7 0111
10010 8 8 1000 8 1000
10011 9 9 1001 9 1001
10110 A A 1010 A 1010
10111 B B 1011 B 1011
11010 C C 1100 C 1100
11011 D D 1101 D 1101
11100 E E 1110 E 1110
11101 F F 1111 F 1111
11111 I IDLE Sent after /T/R until TX_EN
11000 J First nibble of SSD, translated to “0101”
following IDLE, else RX_ER Sent for rising TX_EN
10001 K Second nibble of SSD, translated to
“0101” following J, else RX_ER Sent for rising TX_EN
01101 T First nibble of ESD, ca uses de-assertion
of CRS if followed by /R/, else assertion
of RX_ER
Sent for falling TX_EN
00111 R Second nibble of ESD, causes
deassertion of CRS if following /T/, else
assertion of RX_ER
Sent for falling TX_EN
00100 H Transmit Error Symbol Sent for rising TX_ER
00110 V INVALID, RX_ER if during RX_DV INVALID
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4.2.3 Scrambling
Repeated data patterns (especially the IDLE code-group) can have power spectral den sities with large
narrow-band peaks. Scrambling the data helps eliminate these peaks and spread the signal power
more uniformly over the entire channel bandwidth. This uniform spectral density is required by FCC
regulations to prevent excessive EMI from being radiated by the physical wiring.
The seed for the scrambler is generated from the PHY address, PHYAD[4:0], ensuring that in multiple-
PHY applications, such as repeaters or switches, each PHY will have its own scrambler sequence.
The scrambler also performs the Parallel In Serial Out conversion (PISO) of the data.
4.2.4 NRZI and MLT3 Encoding
The scrambler block passes the 5-bit wide parallel data to the NRZI converter where it becomes a
serial 125MHz NRZI data stream. The NRZI is encoded to MLT-3. MLT3 is a tri-level code where a
change in the logic level represents a code bit “1” and the logic output remaining at the same level
represents a code bit “0”.
4.2.5 100M Transmit Driver
The MLT3 data is then passed to the analog transmitter, which drives the differential MLT-3 signal, on
outputs TXP and TXN, to the twisted pair media across a 1:1 ratio isolation transformer. The 10Base-
T and 100Base-TX signals pass through the same transformer so that common “magnetics” can be
used for both. The transmitter drives into the 100Ω impedance of the CAT-5 cable. Cable termination
and impedance matching require external components.
11001 V INVALID, RX_ER if during RX_DV INVALID
00000 V INVALID, RX_ER if during RX_DV INVALID
00001 V INVALID, RX_ER if during RX_DV INVALID
00010 V INVALID, RX_ER if during RX_DV INVALID
00011 V INVALID, RX_ER if during RX_DV INVALID
00101 V INVALID, RX_ER if during RX_DV INVALID
01000 V INVALID, RX_ER if during RX_DV INVALID
01100 V INVALID, RX_ER if during RX_DV INVALID
10000 V INVALID, RX_ER if during RX_DV INVALID
Table 4 .1 4B/5B Code Table (continued)
CODE
GROUP SYM RECEIVER
INTERPRETATION TRANSMITTER
INTERPRETATION
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4.2.6 100M Phase Lock Loop (PLL)
The 100M PLL locks onto refe rence clock and gene rate s the 125MHz cl ock used to drive the 12 5 MHz
logic and the 100Base-Tx Transmitter.
Figure 4.2 Receive Data Path
4.3 100Base-TX Receive
The receive data path is shown in Figure 4.2. Detailed descriptions are given below.
4.3.1 100M Receive Input
The MLT-3 from the cable is fed into the PHY (on inputs RXP and RXN) via a 1:1 ratio transformer.
The ADC samples the incoming differential signal at a rate of 125M samples per second. Using a 64-
level quanitizer it generates 6 digital bits to represent each sample. The DSP adjusts the gain of the
ADC according to the observed signal level s such that the full d ynamic range of the ADC can be used.
4.3.2 Equalizer, Baseline Wander Correction and Clock and Data Recovery
The 6 bits from the ADC are fed into the DSP block. The equalizer in the DSP section compensates
for phase and amplitud e distortion caused by the physical channel consisting of magnetics, connectors,
and CAT- 5 cable. The equalizer can restore the signal for any good-quality CAT-5 cable between 1m
and 150m.
If the DC content of the signal is such that the low-frequen cy components fall below the low frequency
pole of the isolation transformer, then the droop characteristics of the transformer will become
significant and Baseline Wander (BLW) on the received signal will result. To prevent corruption of the
received data, the PHY corrects for BLW and can receive the ANSI X3.263-1995 FDDI TP-PMD
defined “killer packet” with no bit errors.
The 100M PLL generates multiple phases of the 125MHz clock. A multiplexer, controll ed by the timing
unit of the DSP, selects the optimum phase for sampling the data. This is used as the received
recovered clock. This clock is used to extract the serial data from the received signal.
MAC
A/D
Converter
MLT-3
Converter
NRZI
Converter
4B/5B
Decoder
Magnetics CAT-5RJ45
100M
PLL
MII 25Mhz by 4 bits
or
RMII 50Mhz by 2 bits
RX_CLK
(for MII only)
25MHz by
5 bits
NRZI
MLT-3MLT-3 MLT-3
6 bit Data
Descrambler
and SIPO
125 Mbps Serial
DSP: Timing
recovery, Equalizer
and BLW Correction
MLT-3
MII/RMII 25MHz
by 4 bits
Ext Ref_CLK (for RMII only)
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4.3.3 NRZI and MLT-3 Decoding
The DSP generates the MLT-3 recovered levels that are fed to the MLT-3 converter. The MLT-3 is then
converted to an NRZI data stream.
4.3.4 Descrambling
The descrambler performs an inverse function to the scrambler in the transmitter and also performs
the Serial In Parallel Out (SIPO) conversion of the data.
During reception of IDLE (/I/) symbols. the descrambler synchronizes its descrambler key to the
incoming stream. Once synchronization is achieved, the descrambler locks on this key and is able to
descramble incoming data.
Special logic in the descrambler ensures synchronization with the remote PHY by searching for IDLE
symbols within a window of 4000 bytes (40us). This window ensures that a maximum packet size of
1514 bytes, allowed by the IEEE 802.3 standard, can be received with no interference. If no IDLE-
symbols are detected with in this time-period, receive ope ration is aborted and the descrambler re-starts
the synchronization process.
The descrambler can be bypassed by setting bit 0 of register 31.
4.3.5 Alignment
The de-scrambled signal is then aligned into 5-bit code-groups by recognizing the /J/K/ Start-of-Stream
Delimiter (SSD) pair at the start of a packet. Once the code-word alignment is determined, it is stored
and utilized until the next start of frame.
4.3.6 5B/4B Decoding
The 5-bit code-groups are translated into 4-bit data nibbles according to the 4B/5B table. The
translated data is presented on the RXD[3:0] signal lines. The SSD, /J/K/, is translated to “0101 0101”
as the first 2 nibbles of the MAC preamble. Reception of the SSD causes the PHY to assert the RX_DV
signal, indicating that valid data is available on the RXD bus. Successive valid code-groups are
translated to data nibbles. Reception of either the End of Stream Delimiter (ESD) consisting of the /T/R/
symbols, or at least two /I/ symbols causes the PHY to de-assert carrier sense and RX_DV.
These symbols are not translated into data.
The decoding process may be bypassed by clearing bit 6 of register 31. When the decoding is
bypassed the 5th receive data bit is driven out on RX_ER/RXD4. Decoding may be bypassed only
when the MAC interface is in MII mode.
4.3.7 Receive Data Valid Signal
The Receive Data Valid signal (RX_DV) indicates that recovered and decoded nibbles are being
presented on the RXD[3:0] outputs synchronous to RX_CLK. RX_DV becomes active after the /J/K/
delimiter has been recognized and RXD is aligned to nibble boundaries. It remains active until either
the /T/R/ delimiter is recognized or link test indicates failure or SIGDET becomes false.
RX_DV is asserted when the first nibble of translated /J/K/ is ready for transfer over the Media
Independent Interface (MII mode).
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Figure 4.3 Relationship Between Received Data and Specific MII Signals
4.3.8 Receiver Errors
During a frame, unexpected co de-groups are considered receive errors. Expected code groups are the
DATA set (0 through F), and the /T/R/ (ESD) symbol pair. When a receive error occurs, the RX_ER
signal is asserted and arbitrary data is driven onto the RXD[3:0] lines. Should an error be detected
during the time that the /J/K/ del imiter is being decoded (bad SSD error), RX_ER is asserted true and
the value ‘1110’ is driven onto the RXD[3:0] lines. Note that the Valid Data signal is not yet asserted
when the bad SSD error occurs.
4.3.9 100M Receive Data Across the MII/RMII Interface
In MII mode, the 4-bit data nibbles are sent to the MII block. These data nibbles are clocked to the
controller at a rate of 25MHz. The controller samples the data on the rising edge of RX_CLK. To ensure
that the setup and hold requirements are met, the nibbles are clocked out of the PHY on the falling
edge of RX_CLK. RX_CLK i s the 25MH z output clo ck for the MII bus. It is recovered from the received
data to clock the RXD bus. If there is no received signal, it is derived from the syste m reference clock
(CLKIN).
When tracking the recei ved data, RX_CLK has a maximum jitte r of 0.8ns (provided that the jitter of the
input clock, CLKIN, is below 100ps).
In RMII mode, the 2-bit data nibbles are sent to the RMII block. These data nibbles are clocked to the
controller at a rate of 50MHz. The controller samples the data on the rising edge of CLKIN/XTAL1
(REF_CLK). To ensure that the setup and hold requirements are met, the nibbles are clocked out of
the PHY on the falling edge of CLKIN/XTAL1 (REF_CLK).
4.4 10Base-T Transmit
Data to be transmitted comes from the MAC layer controller. The 10Base-T transmitter receives 4-bit
nibbles from the MII at a rate of 2.5MHz and converts them to a 10Mbps serial data stream. The data
stream is then Manchester-encoded and sent to the analog transmitter, which drives a signal onto the
twisted pair via the external magnetics.
The 10M transmitter uses the following blocks:
MII (digital)
TX 10M (digital)
10M Transmitter (analog)
10M PLL (analog)
4.4.1 10M Transmit Data Across the MII/RMII Interface
The MAC controller drives the tran smit data onto the TXD BUS. For MII, when the controller has dri ven
TX_EN high to indicate valid data, the data is latched by the MII block on the rising edge of TX_CLK.
The data is in the form of 4-bit wide 2.5MHz data.
5D5 data data data data
RXD
RX_DV
RX_CLK
5D5data data data data
CLEAR-TEXT 5JK
555
TR
Idle
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In order to comply with legacy 10Base-T MAC/Controllers, in Half-duplex mode the PHY loops back
the transmitted data, on the receive path. This does not confuse the MAC/Controller since the COL
signal is not asserted during this time. Th e PHY also supp orts the SQE (Heartbeat) signal. See Section
5.4.2, "Collision Detect," on page 51, for more details.
For RMII, TXD[1:0] shall transition synchronously with resp ect to REF_CLK. When TX_EN is asserted,
TXD[1:0] are accepted for transmission by the LAN8700/LAN8700i. TXD[1:0] shall be “00” to indicate
idle when TX_EN is deasserted. Values of TXD[1:0] other than “00” when TX_EN is deasserted are
reserved for out-of-band signalling (to be defin ed). Values other than “00” on TXD[1:0] while TX_EN is
deasserted shall be ignored by the LAN8700/LAN8700i.TXD[1:0] shall provide valid data for each
REF_CLK period while TX_EN is asserted.
4.4.2 Manchester Encoding
The 4-bit wide data is sent to the TX10M block. The nibbles are converted to a 10Mbps serial NRZI
data stream. The 10M PLL locks onto the external clock or internal oscillator and produces a 20MHz
clock. This is used to Manchester encode the NRZ data stream. When no data is being transmitted
(TX_EN is low), the TX10M block outp uts Normal Link Pulses (NLPs) to maintain communications with
the remote link partner.
4.4.3 10M Transmit Drivers
The Manchester encoded data is sent to the analog transmitter where it is shaped and filtered before
being driven out as a differential signal across the TXP and TXN outputs.
4.5 10Base-T Receive
The 10Base-T receiver gets the Manchester- en coded analog signal from the cabl e via the magnetics.
It recovers the receive clock from the signal and uses this clock to recover the NRZI da ta stream. This
10M serial data is converted to 4-bit data nibbles which are passed to the controller across the MII at
a rate of 2.5MHz.
This 10M receiver uses the following blocks:
Filter and SQUELCH (analog)
10M PLL (analog)
RX 10M (digital)
MII (digital)
4.5.1 10M Receive Input and Squelch
The Manchester signal from the cable is fed into the PHY (on inputs RXP and RXN) via 1:1 ratio
magnetics. It is first filtered to reduce any out-of-band noise. It then passes through a SQUELCH
circuit. The SQUELCH is a set of amplitude and timing comparators that normally reject differential
voltage levels below 300mV and detect and recognize differential voltages above 585mV.
4.5.2 Manchester Decoding
The output of the SQUELCH goes to the RX10M block where it is validated as Manchester encoded
data. The polarity of the signal is also checked. If the polarity is reversed (local RXP is connected to
RXN of the remote partner and vice versa), th en this is identified a nd co rrecte d. The reversed condi ti on
is indicated by the flag “XPOL“, bit 4 in register 27. The 10M PLL is locked onto the received
Manchester signal and from this, generates the received 20MHz clock. Using this clock, the
Manchester encoded data is extracted and converted to a 10MHz NRZI data stream. It is then
converted from serial to 4-bit wide parallel data.
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The RX10M block also detects valid 10Base-T IDLE signals - Normal Link Pulses (NLPs) - to maintain
the link.
4.5.3 10M Receive Data Across the MII/RMII Interface
For MII, the 4 bit data nibbles are sent to the MII block. In MII mode, these data nibbles are valid on
the rising edge of the 2.5 MHz RX_CLK.
For RMII, the 2bit data nibbles are sent to the RMII block. In RMII mode, these data nibbles are valid
on the rising edge of the RMII REF_CLK.
4.5.4 Jabber Detection
Jabber is a condition in which a station transmits for a period of time longer than the maximum
permissible packet length, usually due to a fault condition, that results in holding the TX_EN input for
a long period. Special logic is used to detect the jabber state and abort the transmission to the line,
within 45ms. Once TX_EN is deasserted, the logic resets the jabber condition.
As shown in Table 5.31, bit 1.1 indicates that a jabber condition was detected.
4.6 MAC Interface
The MII/RMII block is responsible for the communicatio n with the controller. Special sets of hand-sh ake
signals are used to indicate that valid received/tra nsmitted data is present on the 4 bit receive/transmit
bus.
The device must be configured in MII or RMII mode. See Section 4.6.3, "MII vs. RMII Configuration,"
on page 28.
4.6.1 MII
The MII includes 16 interface signals:
transmit data - TXD[3:0]
transmit strobe - TX_EN
transmit clock - TX_CLK
transmit error - TX_ER/TXD4
receive data - RXD[3:0]
receive strobe - RX_DV
receive clock - RX_CLK
receive error - RX_ER/RXD4
collision indication - COL
carrier sense - CRS
In MII mode, on the transmit path, the PHY drives the transmit clock, TX_CLK, to the controller. The
controller synchronizes the transmit data to the rising edge of TX_CLK. The controller drives TX_EN
high to indicate valid tran smit d ata. The controll er drives TX_ER high when a transmit erro r is detected.
On the receive path, the PHY drives both the receive data, RXD[3:0], and the RX_CLK signal. The
controller clocks in th e receive data on the rising edge of RX_CLK wh en the PHY drives RX_DV high.
The PHY drives RX_ER high when a receive error is detected.
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4.6.2 RMII
The SMSC LAN8700/LAN8700i supports the low pin count Reduced Media Independent Interface
(RMII) intended for use between Ethernet PHYs and Switch ASICs. Under IEEE 802.3, an MII
comprised of 16 pins for data and control is defined. In devices incorporating many MACs or PHY
interfaces such as switches, the number of pins can add significant cost as the port counts increase.
The management interface (MDIO/MDC) is identical to MII. The RMII interface has the following
characteristics:
It is capable of supporting 10Mb/s and 100Mb/s data rates
A single clock reference is sourced from the MAC to PHY (or from an external source)
It provides independent 2 bit wide (di-bit) transmit and receive data paths
It uses LVCMOS signal levels, compatible with common digital CMOS ASIC processes
The RMII includes 6 interface signals with one of the signals being optional:
transmit data - TXD[1:0]
transmit strobe - TX_EN
receive data - RXD[1:0]
receive error - RX_ER (Optional)
carrier sense - CRS_DV
Reference Clock - CLKIN/XTAL1 (RMII references usually define this signal as REF_CLK)
4.6.2.1 Reference Clock
The Reference Clock - CLKIN, is a continuous clock that provides the timing reference for CRS_DV,
RXD[1:0], TX_EN, TXD[1:0], and RX_ER. The Reference Clock is sourced by the MAC or an external
source. Switch implementations may choose to provide REF_CLK as an in put or an output depending
on whether they provide a REF_CLK output or rely on an external clock distribution device.
The “Reference Clock” frequency must be 50 MH z ± 50 ppm with a duty cycle between 40% and 6 0%
inclusive. The SMSC LAN8700/LAN8700i uses the “Reference Clock” as the network clock such that
no buffering is required on the transmit data path. The SMSC LAN8700/LAN8700i will re cover the clock
from the incoming data stream, the receiver will account for differences between the local REF_CLK
and the recovered clock through use of sufficient elasticity buffering. The elasticity buffer does not
affect the Inter-Packet Gap (IPG) for received IPGs of 36 bits or greater. To tolerate the clock varia tions
specified here for Ethernet MTUs, the elasticity buffer shall tolerate a minimum of ±10 bits.
4.6.2.2 CRS_DV - Carrier Sense/Receive Data Valid
The CRS_DV is asserted by the LAN8700/LAN8700i when the receive medium is non-idle. CRS_DV
is asserted asynchronously on detection of carrier due to the criteria relevant to the operating mode.
That is, in 10BASE-T mode, when squelch is passed or in 100BASE-X mode when 2 non-contiguous
zeroes in 10 bits are detected, carrier is said to be detected.
Loss of carrier shall result in the deassertion o f CRS_DV synchronous to the cycle of REF_CLK which
presents the first di-bit of a nibble onto RXD[1:0] (i.e. CRS_DV is deasserted only on nibble
boundaries). If the LAN8700/LAN8700i has additional bits to be presented on RXD[1:0] following the
initial deassertion of CRS_DV, then the LAN8700/LAN8700i shall assert CRS_DV on cycles of
REF_CLK which present the second di-bit of each nibble and de-assert CRS_DV on cycles of
REF_CLK which present the first di-bit of a nibble. The result is: Starting on nibble boundaries
CRS_DV toggles at 25 MHz in 100Mb/s mode and 2.5 MHz in 10Mb/s mode when CRS ends before
RX_DV (i.e. the FIFO still has bits to transfer when the carrier event ends.) Therefore, the MAC can
accurately recover RX_DV and CRS.
During a false carrier event, CRS_D V shal l remain asse rted for the dura tion of carrier activity. The data
on RXD[1:0] is considered valid once CRS_DV is asserted. However, since the assertion of CRS_DV
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is asynchronous relative to REF_CLK, the data on RXD[1:0] shall be “00” until proper receive signal
decoding takes place.
4.6.3 MII vs. RMII Configuration
The LAN8700/LAN8700i must be configured to support the MII or RMII bus for connectivity to the MAC.
This configuration is done through the COL/RMII/CRS_DV pin. To select MII mode, float the
COL/RMII/CRS_DV pin. To select RMII mode, pu ll the p in high with an extern al resisto r (see Table 4.3,
“Boot Strapping Configuration Resistors,” on page 33) to VDDIO. On the rising edge of the internal
reset (nreset), the register bit 18.14 (MIIMODE) is loaded based on the strapping of the
COL/RMII/CRS_DV pin.
Most of the MII and RMII pins are multiplexed. Table 4.2, "MII/RMII Signal Mapping", shown below,
describes the relationship of the related device pins to what pins are used in MII and RMII mode.
Note 4.1 In RMII mode, this pin needs to tied to VSS.
Note 4.2 The RX_ER signal is optional on the RMII bus. This signal is required by the PHY, but it
is optional for the MAC. The MAC can choose to ignore or not use this signal.
Table 4.2 MII/RMII Signal Mapping
SIGNAL NAME MII MODE RMII MODE
TXD0 TXD0 TXD0
TXD1 TXD1 TXD1
TX_EN TX_EN TX_EN
RX_ER/
RXD4 RX_ER/
RXD4/ RX_ER
Note 4.2
COL/RMII/CRS_DV COL CRS_DV
RXD0 RXD0 RXD0
RXD1 RXD1 RXD1
TXD2 TXD2 Note 4.1
TXD3 TXD3 Note 4.1
TX_ER/
TXD4 TX_ER/
TXD4
CRS CRS
RX_DV RX_DV
RXD2 RXD2
RXD3/
nINTSEL RXD3
TX_CLK TX_CLK
RX_CLK RX_CLK
CLKIN/XTAL1 CLKIN/XTAL1 REF_CLK
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4.7 Auto-negotiation
The purpose of the Auto-negotiation fun ction is to automati cally configure the PHY to the op timum link
parameters based on the capabilities of its link partner. Auto-negotiation is a mechanism for
exchanging configuration in formation betwe en two link-partners and automatically sel ecting the highe st
performance mode of operation su pported by both sides. Auto-n egotiation is fully defined in clause 28
of the IEEE 802.3 specification.
Once auto-negotiation has completed, information about the resolved link can be passed back to the
controller via the Serial Management Interface (SMI). The results of the negotiation process are
reflected in the Speed Indication bits in register 31, as well as the Link Partner Ability Register
(Register 5).
The auto-negotiation pro toco l is a purely physical layer activity and proceeds independently of the MAC
controller.
The advertised capabilities of the PHY are stored in register 4 of the SMI registers. The default
advertised by the PHY is determined by user-defined on-chip signal options.
The following blocks are activated during an Auto-negotiation session:
Auto-negotiation (digital)
100M ADC (analog)
100M PLL (analog)
100M equalizer/BLW/clock recovery (DSP)
10M SQUELCH (analog)
10M PLL (analog)
10M Transmitter (analog)
When enabled, auto-negotiation is started by the occurrence of one of the following events:
Hardware reset
Software reset
Power-down reset
Link status down
Setting register 0, bit 9 high (auto-negotiation restart)
On detection of one of these events, the PHY begins auto-negotiation by transmitting bursts of Fast
Link Pulses (FLP). These are bursts of link pulses from the 10M transmitter. They are shaped as
Normal Link Pulses and can pass uncorrupted down CAT-3 or CAT-5 cable. A Fast Link Pulse Burst
consists of up to 33 pulses. The 17 odd-numbered pulses, which are always present, frame the FLP
burst. The 16 even-numbered pulses, which may be present or absent, contain the data word being
transmitted. Presence of a data pulse represents a “1”, while absence represents a “0”.
The data transmitted by an FLP burst i s known as a “Link Code Word.” These are defined fully in IEEE
802.3 clause 28. In summa ry, the PHY advertises 8 02.3 compliance in its selector field (the first 5 bits
of the Link Code Word). It advertises its technology ability according to the b its set in re gister 4 of the
SMI registers.
There are 4 possible matches of the technology abilities. In the order of priority these are:
100M Full Duplex (Highest priority)
100M Half Duplex
10M Full Duplex
10M Half Duplex
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If the full capabilities of the PHY are advertised (100M, Full Duplex), and if the link partner is capable
of 10M and 100M, then auto-negotiation selects 100M as the highest performance mode. If the link
partner is capable of Half and Full duplex modes, then auto-negotiation selects Full Duplex as the
highest performance operation.
Once a capability match has been determined, th e link code words are repeated w ith the acknowledge
bit set. Any difference in the main con tent of the lin k code words at thi s time w ill cause auto-n egotia tion
to re-start. Auto-negotiation will also re-start if not all of the required FLP bursts are received.
The capabilities advertised during auto-negotiation by the PHY are initially determined by the logic
levels latched on the MODE[2:0] bus after reset complete s. This bus can also be used to disable auto-
negotiation on power-up.
Writing register 4 bits [8:5] allows software control of the capabilities advertised by the PHY. Writing
register 4 does not a utomatically re-start auto-neg otiation. Register 0, bit 9 must be set before the new
abilities will be advertised. Auto-negotiation can also be disabled via software by clearing register 0,
bit 12.
The LAN8700/LAN8700i does not support “Next Page” capability.
4.7.1 Parallel Detection
If the LAN8700/LAN8700i is connected to a device lacking the ability to auto-negotiate (i.e. no FLPs
are detected), it is able to determine the speed of the link based on either 100M MLT-3 symbols or
10M Normal Link Pulses. In this case the link is presumed to be Half Duplex per the IEEE standard.
This ability is known as “Parallel Detection.” This feature ensures interoperability with legacy link
partners. If a link is formed via parallel detection, then bit 0 in register 6 is cleared to indicate that the
Link Partner is not capable of auto-negotiation. The controller has access to this information via the
management interface. If a fault occurs during parallel detection, bit 4 of register 6 is set.
Register 5 is used to store the Link Partner Ability information, which is coded in the received FLPs.
If the Link Partner is not auto-neg otiation capable, then register 5 is updated after completion of parallel
detection to reflect the speed capability of the Link Partner.
4.7.2 Re-starting Auto-negotiation
Auto-negotiation can be re-started at any time by setti ng register 0, bit 9. Auto -negotiation will also re-
start if the link is broken at any time. A broken link is caused by signal loss. This may occur because
of a cable break, or because of an interruption in the signal transmitted by the Link Partner. Auto-
negotiation resumes in an attempt to determine the new link configuration.
If the management entity re-starts Auto-negotiation by writing to bit 9 of the control register, the
LAN8700/LAN8700i will respond by stopping all transmission/receiving operations. Once the
break_link_timer is done, in the Auto-negotiation state-machine (approximately 1200ms) the auto-
negotiation will re-start. The Link Partner will have also dropped the link due to lack of a received
signal, so it too will resume auto-negotiation.
4.7.3 Disabling Auto-negotiation
Auto-negotiation can be disabled by setting register 0, bit 12 to zero. The device will then force its
speed of operation to reflect the information in register 0, bit 13 (speed) and register 0, bit 8 (duplex).
The speed and duplex bits in register 0 should be ignored when auto-negotiation is enabled.
4.7.4 Half vs. Full Duplex
Half Duplex operation relies on the CSMA/CD (Carrier Sense Multiple Access / Collision Detect)
protocol to handle network traffic and collisions. In th is mode, the carrier sense signal, CRS, responds
to both transmit and receive activity. In this mode, If data is received while the PHY is transmitting,
a collision results.
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In Full Duplex mode, the PHY is able to transmit and receive data simultaneously. In this mode, CRS
responds only to receive activity. The CSMA/CD protocol does not apply and collision detection is
disabled.
4.8 HP Auto-MDIX
HP Auto-MDIX facilitates the use of CAT-3 (10 Base-T) or CAT-5 (100 Base-T) me dia UTP interconnect
cable without consideration of interface wiring scheme. If a user plugs in either a direct connect LAN
cable, or a cross-over patch cable, as shown in Figure 4.4 on page 31, the SMSC LAN8700/L AN8700i
Auto-MDIX PHY is capable of configuring the TXP/TXN and RXP/RXN pins for correct transceiver
operation.
The internal logic of the device detects the TX and RX pins of the connecting device. Since the RX
and TX line pairs are interchangeable, special PCB design considerati ons are ne eded to acco mmodate
the symmetrical magnetics and termination of an Auto-MDIX design.
The Auto-MDIX function can be disabled through an internal register.
4.9 Internal +1.8V Regulator Disable
One feature of the flexPWR technology is the ability to configure the internal 1.8V regulator off. When
the regulator is disabled, external 1.8V must be supplied to VDD_CORE. This makes it possible to
reduce total system power, since an external switching regulator with greater efficiency than the
internal linear regulator may be used to provide the +1.8V to the PHY circuitry.
4.9.1 Disable the Internal +1.8V Regulator
To disable the +1.8V internal regulator, a pullup strapping resistor (see Table 4.3, “Boot Strapping
Configuration Resistors,” on page 33) is connected from RXCLK/REGOFF to VDDIO. At power-on,
after both VDDIO and VDDA are within specification, the PHY will sample the RXCLK/REGOFF pin to
determine if the internal regulator should turn on. If the pin is sampled at a voltage greater than VIH,
then the internal regulator is di sabled, and the system must supply +1.8V to the VDD_ CORE pin. The
voltage at VDD33 must be at least 2.64V (0.8 * 3.3V) before voltage is applied to VDD_CORE. As
described in Section 4.9.2, when the RXCLK/REGOFF pin is left floating or connected to VSS, then
the internal regulator is enabled and the system does not supply +1.8V to the VDD_CORE pin.
Figure 4.4 Direct Cable Connection vs. Cross-over Cable Connection.
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When the +1.8V internal regulator is disabled, a 0.1uF capacitor must be added at the VDD_CORE
pin and placed close to the PHY to decouple the external power supply.
4.9.2 Enable the Internal +1.8V Regulator
The 1.8V for VDD_CORE is supplied by the on-chip regulator unless the PHY is configured for
regulator off mode using the RX_CLK/REGOFF pin as described in Section 4.9.1. By default, the
internal +1.8V regulator is enabled when the RXCLK/REGOFF pin i s floating. As shown in Table 7.11,
an internal pull-down resistor straps the regulator on if the RXCLK/REGOFF pin is floating.
During VDDIO and VDDA power-on, if t he RXCLK/REGOF F pin is sample d below V IL, then th e internal
+1.8V regulator will turn on and operate with power from the VDD33 pin.
When using the internal linear regulator, a 4.7uF bypass capacitor with ESR < 1ohm and a 0.1uF
capacitor must always be adde d to VDD_CORE and placed close to the PHY to ensure stability of the
internal regulator.
4.10 nINT/TX_ER/TXD4 Strapping
The nINT, TX_ER, and TXD4 functions share a common pin. There are two functional modes for this
pin, the TX_ER/TXD4 mode and nINT (interrupt) mode. The RXD3/nINTSEL pin is used to select one
of these two functional modes.
The RXD3/nINTSEL pin is latched on the rising edge of the nRST. The system designer must float the
nINTSEL pin to put the nINT/TX_ER/TXD4 pin into nINT mode or pull-low to VSS with an external
resistor (see Table 4.3, “Boot Strapping Configuration Resistors,” on page 33) to set the device in
TX_ER/TXD4 mode. The default setting is to float the pin high for nINT mode.
4.11 PHY Address Strapping and LED Output Polarity Selection
The PHY ADDRESS bits are latched on the rising edge of the internal reset (nRESET). The 5-bit
address word[0:4] is input on the PHYAD[0:4] pins. The default setting is all high 5'b1_1111.
The address lines are strapped as defined in the diagram below. The LED outputs will automatically
change polarity based on the presence of an external pull-down resistor. If the LED pin is pulled high
(by an internal 100K pull-up resistor) to select a logical high PHY address, then the LED output will
be active low. If the LED pin is pulled low (by an external pull-down resistor (see Table 4.3, “Boot
Strapping Configuration Resistors,” on page 33) to select a logical low PHY address, the LED output
will then be an active high output.
To set the PHY address on the LED pins without LEDs or on the CRS pin, float the pin to set the
address high or pull-down the pin with an external resistor (see Table 4.3, “Boot Strapping
Configuration Resistors,” on page 33) to GND to set the address low. See Figure 4.5, "PHY Address
Strapping on LED’s":
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Figure 4.5 PHY Address Strapping on LED’s
4.12 Variable Voltage I/O
The Digital I/O pins on the LAN8700/LAN8700i are variable voltage to take advantage of low power
savings from shrinking technologies. These pins can operate from a low I/O voltage of +1.8V-10% up
to +3.3V+10%. Due to this low voltage feature addition, the system designer needs to take
consideration as for two aspects of their design. Boot strapping configuration and I/O voltage stability.
4.12.1 Boot Strapping Configuration
Due to a lower I/O voltage, a lower strapping resistor needs to be used to ensure the strapped
configuration is latched into the PHY device at power-on reset.
.
4.12.2 I/O Voltage Stability
The I/O voltage the System Designer applies on VDDIO needs to maintain its value with a tolerance
of ± 10%. Varying the voltage up or down, after the PHY has completed power-on reset can cause
errors in the PHY operation.
4.13 PHY Management Control
The Management Control module includes 3 blocks:
Serial Management Interface (SMI)
Management Registers Set
Interrupt
Tabl e 4.3 Boot Strapping Configuration Resistors
I/O voltage Pull-up/Pull-down Resistor
3.0 to 3.6 10k ohm resistor
2.0 to 3.0 7.5k ohm resistor
1.6 to 2.0 5k ohm resistor
LED1-LED4
~270 ohms
Phy Address = 0
LED output = active high
~10K ohms
~270 ohms
LED1-LED4
VDD
Phy Address = 1
LE D output = acti ve low
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4.13.1 Serial Management Interface (SMI)
The Serial Manage ment Interface is used to control the LAN8700/LAN8700i and obtain its status. This
interface supports registers 0 through 6 as required by Clause 22 of the 802.3 standard, as well as
“vendor-specific” registers 16 to 31 allowed by the specification. Non-supported registers (7 to 15) will
be read as hexadecimal “FFFF”.
At the system level there are 2 signals, MDIO and MDC where MDIO is bi-directional open-drain and
MDC is the clock.
A special feature (enabled by register 17 bit 3) forces the PHY to disregard the PHY-Address in the
SMI packet causing the PHY to respond to any address. This feature is useful in multi-PHY
applications and in production testing, where the same register can be written in all the PHYs using a
single write transaction.
The MDC signal is an aperiodic clock provided by the station management controller (SMC). The MDIO
signal receives serial data (commands) from the controller SMC, and sends serial data (status) to the
SMC. The minimum time between edges of the MDC is 160 ns. There is no maximum time between
edges.
The minimum cycle time (time between two consecutive rising or two consecutive falling edges) is 400
ns. These modest timing requirements allow this interface to be easily driven by the I/O port of a
microcontroller.
The data on the MDIO line is latched on the rising edge of the MDC. The frame structure and timing
of the data is shown in Figure 4.6 and Figure 4.7.
The timing relationships of the MDIO signals are further described in Section 6.1, "Serial Management
Interface (SMI) Timing," on page 57.
Figure 4.6 MDIO Timing and Frame Structure - READ Cycle
Figure 4.7 MDIO Timing and Frame Structure - WRITE Cycle
MDC
MDI0
Read Cycle
...
32 1's 0110A4A3A2A1A0R4R3R2R1R0 D1
...
D15 D14 D0
Preamble Start of
Frame OP
Code PHY Address Register Address Turn
Around Data
Data From Phy
Data To Phy
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Chapter 5 Registers
Tab le 5.1 Control Register: Reg ister 0 (Basic)
15 14 13 12 11 10 9 8 7 6543210
Reset Loopback Speed Select A/N Enable Power Down Isolate Restart A/N Duplex Mode Collision Test Reserved
Table 5.2 Status Register: Register 1 (Basic)
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
100Base-
T4 100Base-
TX
Full
Duplex
100Base-
TX
Half
Duplex
10Base-T
Full
Duplex
10Base-T
Half
Duplex
Reserved A/N
Complete Remote
Fault A/N
Ability Link
Status Jabber
Detect Extended
Capability
Table 5.3 PHY ID 1 Register: Register 2 (Extended)
1514131211109876543210
PHY ID Number (Bits 3-18 of the Organizationally Unique Identifier - OUI)
Table 5.4 PHY ID 2 Register: Register 3 (Extended)
1514131211109876543210
PHY ID Number (Bits 19-24 of the Organizationally Unique
Identifier - OUI) Manufacturer Model Number Manufacturer Revision Number
Table 5.5 Auto-Negotiation Advertise ment: Register 4 (Extended)
15 14 13 12 11 10 9 8 7 6 5 43210
Next
Page Reserved Remote
Fault Reserved Pause
Operation 100Base-
T4 100Base-
TX
Full Duplex
100Base-
TX 10Base-T
Full Duplex 10Base-T IEEE 802.3 Selector
Field
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Note: Next Page capability is not supported.
Table 5.6 Auto-Negotiation Link Partner Base Pag e Ability Register: Register 5 (Extended)
15 14 13 1211 10 9 8 7 6 5 43210
Next
Page Acknowledge Remote
Fault Reserved Pause 100Base-
T4 100Base-TX
Full Duplex 100Base-
TX 10Base-T
Full
Duplex
10Base-
TIEEE 802.3 Selector Field
Table 5.7 Auto-Negotiation Expansion Register: Register 6 (Extended)
15141312111098765 4 3 2 1 0
Reserved Parallel
Detect
Fault
Link
Partner
Next Page
Able
Next Page
Able Page
Received Link
Partner
A/N Able
Table 5.8 Auto-Negotiation Link Partner Next Page Transmit Register: Register 7 (Extended)
1514131211109876543210
Reserved
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Table 5.9 Register 8 (Extended)
1514131211109876543210
IEEE Reserved
Table 5.10 Register 9 (Extended)
1514131211109876543210
IEEE Reserved
Tab le 5.11 Register 10 (Extended)
1514131211109876543210
IEEE Reserved
Table 5.12 Register 11 (Extended)
1514131211109876543210
IEEE Reserved
Table 5.13 Register 12 (Extended)
1514131211109876543210
IEEE Reserved
Table 5.14 Register 13 (Extended)
1514131211109876543210
IEEE Reserved
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RSVD = Reserved
Table 5.15 Register 14 (Extended)
1514131211109876543210
IEEE Reserved
Table 5.16 Register 15 (Extended)
1514131211109876543210
IEEE Reserved
Table 5.17 Silicon Revision Register 16: Vendor-Specific
1514131211109876543210
Reserved Silicon Revision Reserved
Table 5.18 Mode Control/ Status Register 17: Vendor-Specific
1
514 13 12 11 10 9 8 7 6 5 4 3 2 1 0
RSVD EDPWRDOWN RSVD LOWSQEN MDPREBP FARLOOPBACK RSVD ALTINT RSVD PHYADBP Force
Good
Link
Status
ENERGYON RSVD
Tabl e 5.19 Special Modes Register 18 : Vendor-Specific
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved MIIMODE Reserved MODE PHYAD
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Table 5.20 Reserved Register 19: Vendor-Specific
1514131211109876543210
Reserved
Table 5.21 Register 24: Vendor-Specific
1514131211109876543210
Reserved
Table 5.22 Register 25: Vendor-Specific
1514131211109876543210
Reserved
Table 5.23 Symbol Error Counter Regist er 26 : Vendor-Specific
1514131211109876543210
Symbol Error Counter
Table 5.24 Special Control/Status Indications Register 27: Vendor-Specific
15 14 13 12 11 10 98765 4 3210
AMDIXCTRL Reserved CH_SELECT Reserved SQEOFF Reserved XPOL Reserved
Table 5.25 Special Internal Testability Control Register 28 : Vendor-Specific
1514131211109876543210
Reserved
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Table 5.26 Interrupt Source Flags Register 29: Vendor-Specific
151413121110987654321 0
Reserved INT7 INT6 INT5 INT4 INT3 INT2 INT1 Reserved
Table 5.27 Interrupt Mask Register 30 : Vendor-Specific
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved Mask Bits Reserved
Table 5.28 PHY Special Control/St a tus Register 31: Vendor-S pecific
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved Autodone Reserved Enable 4B5B Reserved Speed Indication Reserved Scramble Disable
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5.1 SMI Register Mapping
The following registers are supported (register numbers are in decimal):
5.2 SMI Register Format
The mode key is as follows:
RW = Read/write,
SC = Self clearing,
WO = Write only,
RO = Read only,
LH = Latch high, clear on read of register,
LL = Latch low, clear on read of register,
NASR = Not Affected by Software Reset
X = Either a 1 or 0.
Table 5.29 SMI Register Mapping
REGISTER # DESCRIPTION Group
0 Basic Control Register Basic
1 Basic Status Register Basic
2 PHY Identifier 1 Extended
3 PHY Identifier 2 Extended
4 Auto-Negotiation Advertisement Register Extended
5 Auto-Negotiation Link Partner Ability Register Extended
6 Auto-Negotiation Expansion Register Extended
16 Silicon Revision Register Vendor-specific
17 Mode Control/Status Register Vendor-specific
18 Special Modes Vendor-specific
20 Reserved Vendor-specific
21 Reserved Vendor-specific
22 Reserved Vendor-specific
23 Reserved Vendor-specific
26 Symbol Error Counter Register Vendor-specific
27 Control / Status Indication Register Vendor-specific
28 Special internal testability controls Vendor-specific
29 Interrupt Source Register Vendor-specific
30 Interrupt Mask Register Vendor-specific
31 PHY Special Control/Status Register Vendor-specific
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Table 5.30 Register 0 - Basic Con tr ol
ADDRESS NAME DESCRIPTION MODE DEFAULT
0.15 Reset 1 = software reset. Bit is sel f-clearing. For best results,
when setting this bit do not set other bits in this
register. The configuration (as described in
Section 5.4.9.2) is set from the register bit values,
and not from the mode pins.
RW/
SC 0
0.14 Loopback 1 = loopback mode,
0 = normal operation RW 0
0.13 Speed Select 1 = 100Mbps,
0 = 10Mbps.
Ignored if Auto Negotiation is enabled (0.12 = 1).
RW Set by
MODE[2:0]
bus
0.12 Auto-
Negotiation
Enable
1 = enable auto-negotiate process
(overrides 0.13 and 0.8)
0 = disable auto-negotiate process
RW Set by
MODE[2:0]
bus
0.11 Power Down 1 = General power down mode,
0 = normal operation RW 0
0.10 Isolate 1 = electrical isolation of PHY from MII
0 = normal operation RW 0
0.9 Restart Auto-
Negotiate 1 = restart auto-negotiate process
0 = normal operation. Bit is self-clearing. RW/
SC 0
0.8 Duplex Mode 1 = Full duplex,
0 = Half duplex.
Ignored if Auto Negotiation is enabled (0.12 = 1).
RW Set by
MODE[2:0]
bus
0.7 Collision Test 1 = enable COL test,
0 = disable COL test RW 0
0.6:0 Reserved RO 0
Table 5.31 Register 1 - Basic Status
ADDRESS NAME DESCRIPTION MODE DEFAULT
1.15 100Base-T4 1 = T4 able,
0 = no T4 ability RO 0
1.14 100Base-TX Full
Duplex 1 = TX with full duplex,
0 = no TX full duplex ability RO 1
1.13 100Base-TX Half
Duplex 1 = TX with half duplex,
0 = no TX half duplex ability RO 1
1.12 10Base-T Full
Duplex 1 = 10Mbps with full duplex
0 = no 10Mbps with full duplex ability RO 1
1.11 10Base-T Half
Duplex 1 = 10Mbps with half duplex
0 = no 10Mbps with half duplex ability RO 1
1.10:6 Reserved
1.5 Auto-Negotiate
Complete 1 = auto-negotiate process completed
0 = auto-negotiate process not completed RO 0
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1.4 Remote Fault 1 = remote fault condition detected
0 = no remote fault RO/
LH 0
1.3 Auto-Negotiate
Ability 1 = able to perform auto-negotiation function
0 = unable to perform auto-negotiation function RO 1
1.2 Link Status 1 = link is up,
0 = link is down RO/
LL X
1.1 Jabber Detect 1 = jabber condition detected
0 = no jabber condition detected RO/
LH X
1.0 Extended
Capabilities 1 = supports extended capabilities registers
0 = does not support extended capabilities registers RO 1
Table 5.32 Register 2 - PHY Identifier 1
ADDRESS NAME DESCRIPTION MODE DEFAULT
2.15:0 PHY ID Number Assigned to the 3rd through 18th bits of the
Organizationally Unique Identifier (OUI), respectively.
OUI=00800Fh
RW 0007h
Table 5.33 Register 3 - PHY Identifier 2
ADDRESS NAME DESCRIPTION MODE DEFAULT
3.15:10 PHY ID Number Assigned to the 19th through 24th bits of the OUI. RW C0h
3.9:4 Model Number Six-bit manufacturer’s model number. RW 0Ch
3.3:0 Revision Number Four-bit manufacturer’s revision number. RW 4h
Table 5.34 Register 4 - Auto Negotiation Advertisement
ADDRESS NAME DESCRIPTION MODE DEFAULT
4.15 Next Page 1 = next page capable,
0 = no next page ability
This Phy does not support next page ability.
RO 0
4.14 Reserved RO 0
4.13 Remote Fault 1 = remote fault detected,
0 = no remote fault RW 0
4.12 Reserved
4.11:10 Pause Operation 00 = No PAUSE
01 = Symmetric PAUSE
10 = Asymmetric PAUSE toward link partner
11 = Both Symmetric PAUSE and Asymmetric
PAUSE toward local device
R/W 00
Table 5.31 Register 1 - Basic Status (continued)
ADDRESS NAME DESCRIPTION MODE DEFAULT
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4.9 100Base-T4 1 = T4 able,
0 = no T4 ability
This Phy does not support 100Base-T4.
RO 0
4.8 100Base-TX Full
Duplex 1 = TX with full duplex,
0 = no TX full duplex ability RW Set by
MODE[2:0]
bus
4.7 100Base-TX 1 = TX able,
0 = no TX ability RW 1
4.6 10Base-T Full
Duplex 1 = 10Mbps with full duplex
0 = no 10Mbps with full duplex ability RW Set by
MODE[2:0]
bus
4.5 10Base-T 1 = 10Mbps able,
0 = no 10Mbps ability RW Set by
MODE[2:0]
bus
4.4:0 Selector Field [00001] = IEEE 802.3 RW 00001
Table 5.35 Register 5 - Auto Negotiation Link Partner Ability
ADDRESS NAME DESCRIPTION MODE DEFAULT
5.15 Next Page 1 = “Next Page” capable,
0 = no “Next Page” ability
This Phy does not support next page ability.
RO 0
5.14 Acknowledge 1 = link code word received from partner
0 = link code word not yet received RO 0
5.13 Remote Fault 1 = remote fault detected,
0 = no remote fault RO 0
5.12:11 Reserved RO 0
5.10 Pause Operation 1 = Pause Operation is supported by remote MAC,
0 = Pause Operation is not suppo rted by remote MAC RO 0
5.9 100Base-T4 1 = T4 able,
0 = no T4 ability.
This Phy does not support T4 ability.
RO 0
5.8 100Base-TX Full
Duplex 1 = TX with full duplex,
0 = no TX full duplex ability RO 0
5.7 100Base-TX 1 = TX able,
0 = no TX ability RO 0
5.6 10Base-T Full
Duplex 1 = 10Mbps with full duplex
0 = no 10Mbps with full duplex ability RO 0
5.5 10Base-T 1 = 10Mbps able,
0 = no 10Mbps ability RO 0
5.4:0 Selector Field [00001] = IEEE 802.3 RO 00001
Table 5.34 Register 4 - Auto Negotiation Advertis emen t (continued)
ADDRESS NAME DESCRIPTION MODE DEFAULT
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Table 5.36 Register 6 - Auto Negotiation Expansion
ADDRESS NAME DESCRIPTION MODE DEFAULT
6.15:5 Reserved RO 0
6.4 Parallel Detection
Fault 1 = fault detected by parallel detection logic
0 = no fault detected by parallel detection logic RO/
LH 0
6.3 Link Partner Next
Page Able 1 = link partner has next page ability
0 = link partner does not have next page ability RO 0
6.2 Next Page Able 1 = local device has next page ability
0 = local device does not have next page ability RO 0
6.1 Page Received 1 = new page received
0 = new page not yet received RO/
LH 0
6.0 Link Partner Auto-
Negotiation Able 1 = link partner has auto-negotiation ability
0 = link partner does not have auto-negotiation ability RO 0
Table 5.37 Register 16 - Silicon Revision
ADDRESS NAME DESCRIPTION MODE DEFAULT
16.15:10 Reserved RO 0
16.9:6 Silicon Revision Four-bit silicon revision identifier. RO 0001
16.5:0 Reserved RO 0
Table 5.38 Register 17 - Mode Control/Status
ADDRESS NAME DESCRIPTION MODE DEFAULT
17.15:14 Reserved Write as 0; ignore on read. RW 0
17.13 EDPWRDOWN Enable the Energy Detect Power-Down mode:
0 = Energy Detect Power-Down is disabled
1 = Energy Detect Power-Down is enabled
RW 0
17.12 Reserved Write as 0, ignore on read RW 0
17.11 LOWSQEN The Low_Squelch signal is e qual to LOWSQEN AND
EDPWRDOWN.
Low_Squelch = 1 implies a lower threshold
(more sensitive).
Low_Squelch = 0 implies a higher threshold
(less sensitive).
RW 0
17.10 MDPREBP Management Data Preamble Bypass:
0 – detect SMI packets with Preamble
1 – detect SMI packets without preamble
RW 0
17.9 FARLOOPBACK Force the module to the FAR Loop Back mode, i.e. all
the received packets are sent back simultaneously (in
100Base-TX only). This bit is only active in RMII
mode. In this mode the user needs to supply a 50MHz
clock to the PHY. This mode works even if MII Isolate
(0.10) is set.
RW 0
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Note 5.1 The default value of this field is determined by the strapping of the COL/RMII/CRS_DV
pin. Refer to Section 4.6.3, "MII vs. RMII Configuration," on page 28 for additional
information.
17.8:7 Reserved Write as 0, ignore on read. RW 00
17.6 ALTINT Alternate Interrupt Mode.
0 = Primary interrupt system enabled (Default).
1 = Alternate interrupt system enabled.
See Section 5.3, "Interrupt Manag ement," on page 49.
RW 0
17.5:4 Reserved Write as 0, ignore on read. RW 00
17.3 PHYADBP 1 = PHY disregards PHY address in SMI access
write. RW 0
17.2 Force
Good Link Status 0 = normal operation;
1 = force 100TX- link active;
Note: This bit should be set only during lab testing
RW 0
17.1 ENERGYON ENERGYON – indicates whether energy is detected
on the line (see Section 5.4.5.2, "Energy Detect
Power-Down," on page 52); it goes to “0” if no valid
energy is detected within 256ms. Reset to “1” by
hardware reset, unaffected by SW reset.
RO X
17.0 Reserved Write as 0. Ignore on read. RW 0
Table 5.39 Register 18 - Special Modes
ADDRESS NAME DESCRIPTION MODE DEFAULT
18.15 Reserved Write as 0, ignore on read. RW 0
18.14 MIIMODE MII Mode: Reflects the mode of the digital interface:
0 – MII interface.
1 – RMII interface
Note: When writing to this register, the default
value of this bit must always be written back.
RW ,
NASR Note 5.1
18.13:8 Reserved Write as 0, ignore on read. RW,
NASR 000000
18.7:5 MODE PHY Mode of operation. Refer to Section 5.4.9.2,
"Mode Bus – MODE[2:0]," on page 56 for more
details.
RW ,
NASR XXX
EVB8700
default
111
18.4:0 PHYAD PHY Address.
The PHY Address is used for the SMI address and for
the initialization of the Cipher (Scrambler) key. Refer
to Section 5.4.9.1, "Physical Address Bus -
PHYAD[4:0]," on page 56 for more details.
RW ,
NASR PHYAD
EVB8700
default
11111
Table 5.38 Register 17 - Mode Contro l/Status (continued)
ADDRESS NAME DESCRIPTION MODE DEFAULT
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Table 5.40 Register 26 - Symbol Error Counter
ADDRESS NAME DESCRIPTION MODE DEFAULT
26.15:0 Sym_Err_Cnt 100Base-TX receiver-based error register that
increments when an invalid code symbol is received
including IDLE symbols. The counter is incremented
only once per packet, even when the received packet
contains more than one symbol error. The 16-bit
register counts up to 65,536 (216) and rolls over to 0
if incremented beyond that value. This register is
cleared on reset, but is not cleared by reading the
register. It does not increment in 10Base-T mode.
RO 0
Table 5.41 Register 27 - Special Control/Status Indications
ADDRESS NAME DESCRIPTION MODE DEFAULT
27.15 AMDIXCTRL HP Auto-MDIX control
0 - Auto-MDIX enable
1 - Auto-MDIX disabled (u se 27.13 to control channel)
RW 0
27.14 Reserved Reserved RW 0
27.13 CH_SELECT Manual Channel Select
0 - MDI -TX transmits RX receives
1 - MDIX -TX receives RX transmits
RW 0
27.12 Reserved Write as 0. Ignore on read. RW 0
27:11 SQEOFF Disable the SQE (Signal Quality Error) test
(Heartbeat):
0 - SQE test is enabled.
1 - SQE test is disabled.
RW ,
NASR 0
27.10:5 Reserved Write as 0. Ignore on read. RW 000000
27.4 XPOL Polarity state of the 10Base-T:
0 - Normal polarity
1 - Reversed polarity
RO 0
27.3:0 Reserved Reserved RO XXXXb
Table 5.42 Register 28 - Special Internal Testability Controls
ADDRESS NAME DESCRIPTION MODE DEFAULT
28.15:0 Reserved Do not write to this register. Ignore on read. RW N/A
Table 5.43 Register 29 - Interrupt Sourc e Flags
ADDRESS NAME DESCRIPTION MODE DEFAULT
29.15:8 Reserved Ignore on read. RO/
LH 0
29.7 INT7 1 = ENERGYON generated
0 = not source of interrupt RO/
LH X
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29.6 INT6 1 = Auto-Negotiation complete
0 = not source of interrupt RO/
LH X
29.5 INT5 1 = Remote Fault Detected
0 = not source of interrupt RO/
LH X
29.4 INT4 1 = Link Down (link status negated)
0 = not source of interrupt RO/
LH X
29.3 INT3 1 = Auto-Negotiation LP Acknowledge
0 = not source of interrupt RO/
LH X
29.2 INT2 1 = Parallel Detection Fault
0 = not source of interrupt RO/
LH X
29.1 INT1 1 = Auto-Negotiation Page Received
0 = not source of interrupt RO/
LH X
29.0 Reserved Ignore on read. RO/
LH 0
Table 5.44 Register 30 - Interrupt Mask
ADDRESS NAME DESCRIPTION MODE DEFAULT
30.15:8 Reserved Write as 0; ignore on read. RO 0
30.7:1 Mask Bits 1 = interrupt source is enabled
0 = interrupt source is masked RW 0
30.0 Reserved Write as 0; ignore on read RO 0
Table 5.45 Register 31 - PHY Special Control/Status
ADDRESS NAME DESCRIPTION MODE DEFAULT
31.15:13 Reserved Write as 0, ignore on read. RW 0
31.12 Autodone Auto-negotiation done indication:
0 = Auto-negotiation is not done or disabled (or not
active)
1 = Auto-negotiation is done
Note: This is a duplicate of register 1.5, however
reads to register 31 do not clear status bits.
RO 0
31.11:10 Reserved Write as 0, ignore on Read. RW XX
31.9:7 Reserved Write as 0, ignore on Read. RW 0
31.6 Enable 4B5B 0 = Bypass encoder/decoder.
1 = enable 4B5B encoding/decoding.
MAC Interface must be configured in MII mode.
RW 1
31.5 Reserved Write as 0, ignore on Read. RW 0
Table 5.43 Register 29 - Interrupt Source Flags (continued)
ADDRESS NAME DESCRIPTION MODE DEFAULT
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5.3 Interrupt Management
The Management interface supports an interrupt capability that is not a part of the IEEE 802.3
specification. It generates an active low asynchronous interrupt signal on the nINT output whenever
certain events are detected as setup by the Interrupt Mask Register 30.
The Interrupt system on the SMSC LAN8700/8700I has two modes, a Primary Interrupt mode and an
Alternative Interrupt mode. Both systems will assert the nINT pin low when the corresponding mask
bit is set, the difference is how they de-assert the output interrupt signal nINT.
The Primary interrupt mode is the default interrupt mode after a power-up or hard rese t, the Alternative
interrupt mode would need to be setup again after a power-up or hard reset.
5.3.1 Primary Interrupt System
The Primary Interrupt system is the default interrupt mode, (Bit 17.6 = ‘0’). The Primary Interrupt
System is always selected after power-up or hard reset.
To set an interrupt, set the corresponding mask bit in the interrupt Mask register 30 (see Table 5.46).
Then when the event to assert nINT is true, the nINT output will be asserted.
When the corresponding Event to De-Assert nINT is true, then the nINT will be de-asserted.
31.4:2 Speed Indication HCDSPEED value:
[001]=10Mbps Half-duplex
[101]=10Mbps Full-duplex
[010]=100Base-TX Half-duplex
[110]=100Base-TX Full-duplex
RO XXX
31.1 Reserved Write as 0; ignore on Read RW 0
31.0 Scramble Disable 0 = enable data scrambling
1 = disable data scrambling, RW 0
Table 5.46 Interrupt Management Table
Mask Interrupt Source Flag Interrupt Source Event to Assert nINT Event to De-Assert nINT
30.7 29.7 ENERGYON 17.1 ENERGYON Rising 17.1aFalling 17.1 or
Reading register 29
30.6 29.6 Auto-Negotiation
complete 1.5 Auto-Negotiate
Complete Rising 1.5 Falling 1.5 or
Reading register 29
Tab le 5.45 Register 31 - PHY Special Control/Status (continued)
ADDRESS NAME DESCRIPTION MODE DEFAULT
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Note: The ENERGYON bit 17.1 is defaulted to a ‘1’ at the start of the signal acquisition process,
therefore the Interrupt source flag 29.7 will also read as a ‘1’ at power-up. If no signal is
present, then both 17.1 and 29.7 will clear within a few milliseconds.
5.3.2 Alternate Interrupt System
The Alternative method is enabled by writing a ‘1’ to 17.6 (ALTINT).
To set an interrupt, set the corresponding bit of the in the Mask Register 30, (see Table 5.47).
To Clear an interrupt, either clear the corresponding bit in the Mask Register (30), this will de-assert
the nINT output, or Clear the Interrupt Source, and write a ‘1’ to the corresponding Interrupt Source
Flag. Writing a ‘1’ to the Interrupt Source Flag will cause the state machine to check the Interrupt
Source to determine if the Interrupt Source Flag should clear or stay as a ‘1’. If the Condition to De-
Assert is true, then the Interrupt Source Flag is cleared, and the nINT is also de-asserted. If the
Condition to De-Assert is false, then the Interrupt Source Flag remains set, and the nINT remains
asserted.
For example 30.7 is set to ‘1’ to enable the ENERGYON interrupt. After a cable is plugged in,
ENERGYON (17.1) goes active and nINT will be asserted low.
30.5 29.5 Remote Fault Detected 1.4 Remote Fault Rising 1.4 Falling 1.4, or
Reading register 1 or
Reading register 29
30.4 29.4 Link Down 1.2 Link Status Falling 1.2 Reading register 1 or
Reading register 29
30.3 29.3 Auto-Negotiation LP
Acknowledge 5.14 Acknowledge Rising 5.14 Falling 5.14 or
Read register 29
30.2 29.2 Parallel Detection Fault 6.4 Parallel Detection
Fault Rising 6.4 Falling 6.4 or
Reading register 6, or
Reading register 29 or
Re-Auto Negotiate or
Link down
30.1 29.1 Auto-Negotiation Page
Received 6.1 Page Received Rising 6.1 Falling of 6.1 or
Reading register 6, or
Reading register 29
Re-Auto Negotiate, or
Link Down.
a. If th e mask bit is enabled and nINT has been de-asserted while ENERGYON is still high, nINT w ill assert for
256 ms, approximately one se cond after ENERGYON goes low when the Cable is unplugged. To prevent an
unexpected assertion of nINT, the ENERGYON interrupt mask should always be cleared as part of the
ENERGYON interrupt service routine.
Table 5.46 Interrupt Mana gement Ta ble (continued)
Mask Interrupt Source Flag Interrupt Source Event to Assert nINT Event to De-Assert nINT
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To de-assert the nINT interrupt output, either.
1. Clear the ENERGYON bit (17.1), by removing the cable, then writing a ‘1’ to register 29.7.
Or
2. Clear the Mask bit 30.1 by writing a ‘0’ to 30.1.
Note: The ENERGYON bit 17.1 is defaulted to a ‘1’ at the start of the signal acquisition process,
therefore the Interrupt source flag 29.7 will also read as a ‘1’ at power-up. If no signal is
present, then both 17.1 and 29.7 will clear within a few milliseconds.
5.4 Miscellaneous Functions
5.4.1 Carrier Sense
The carrier sense is output on CRS. CRS is a signal defined by the MII specification in the IEEE 802.3u
standard. The PHY asserts CRS based only on receive activity whenever the PHY is either in repeater
mode or full-duplex mode. Otherwi se the PHY asserts CRS base d on either transmit or receive activity.
The carrier sense logic uses the encoded, unscrambled data to determine carrier activity status. It
activates carrier sense with the detection of 2 non-contiguous zeros within any 10 bit span. Carrier
sense terminates if a span of 10 consecutive ones is detected before a /J/K/ Start-of Stream Delimiter
pair. If an SSD pair is detected, carrier sense is asserted until either /T/R/ End–of-Stream Delimiter
pair or a pair of IDLE symbols is detected. Carrier is negated after the /T/ symbol or the first IDLE. If
/T/ is not followed by /R/, then carrier is maintained. Carrier is treated similarly for IDLE followed by
some non-IDLE symbol.
5.4.2 Collision Detect
A collision is the occurrence of simultaneous transmit and receive operations. The COL output is
asserted to indicate that a collision has been detected. COL remains active for the duration of the
collision. COL is changed asynchronously to both RX_CLK and TX_CLK. The COL output becomes
inactive during full duplex mode.
COL may be tested by setting register 0, bit 7 high. This enables the collision test. COL will be asserted
within 512 bit times of TX_EN rising and will be de-asserted within 4 bit times of TX_EN falling.
In 10M mode, COL pulses for approximately 1 0 bit times (1us), 2us after each transmitted packet (de-
assertion of TX_EN). This is the Signal Quality Error (SQE) signal and indicates that the transmission
was successful. The user can disable this pulse by setting bit 11 in register 27.
Table 5.47 Alternative Interrupt System Management Table
Mask Interrupt Source Flag Interrupt Source Event to Assert
nINT Condition to
De-Assert. Bit to Clear
nINT
30.7 29.7 ENERGYON 17.1 ENERGYON Rising 17.1 17.1 low 29.7
30.6 29.6 Auto-Negotiation
complete 1.5 Auto-Negotiate
Complete Rising 1.5 1.5 low 29.6
30.5 29.5 Remote Fault Detected 1.4 Remote Fault Rising 1.4 1.4 low 29.5
30.4 29.4 Link Down 1.2 Link Status Falling 1.2 1.2 high 29.4
30.3 29.3 Auto-Negotiation LP
Acknowledge 5.14 Acknowledge Rising 5.14 5.14 low 29.3
30.2 29.2 Parallel Detection Fault 6.4 Parallel Detection
Fault Rising 6.4 6.4 low 29.2
30.1 29.1 Auto-Negotiation Page
Received 6.1 Page Received Rising 6.1 6.1 low 29.1
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5.4.3 Isolate Mode
The PHY data paths may be electrically isolated from the MII by setting register 0, bit 10 to a logic
one. In isolation mode, the PHY does not respond to the TXD, TX_EN and TX_ER inputs. The PHY
still responds to management transactions.
Isolation provides a means for multiple PHYs to be connected to the same MII without contention
occurring. The PHY is not isolated on power-up (bit 0:10 = 0).
5.4.4 Link Integrity Test
The LAN8700/LAN8700i performs the link integrity test as outlined in the IEEE 802.3u (Clause 24-15)
Link Monitor state diagram. The link status is multiplexed with the 10Mbps link status to form the
reportable link status bit in Serial Management Register 1, and is driven to the LINK LED.
The DSP indicates a valid MLT-3 waveform present on the RXP and RXN signals as defined by the
ANSI X3.263 TP-PMD standard, to the Link Monitor state-machine, using internal signal called
DATA_VALID. When DATA_VALID is asserted the control logic moves into a Link-Ready state, and
waits for an enable from the Auto Negotiation block. When received, the Link-U p state is entered, and
the Transmit and Receive logic blocks become active. Should Auto Negotiation be disabled, the link
integrity logic moves immediately to the Link-Up state, when the DATA_VALID is asserted.
Note that to allow the line to stabilize, the link integrity logic will wait a minimum of 330 μsec from the
time DATA_VALID is asserted until the Link-Ready state is entered. Should the DATA_VALID input be
negated at any time, this logic will immediately negate the Link signal and enter the Link-Down state.
When the 10/100 digital block is in 10Base-T mode, the link status is from the 10Base-T rece iver logic.
5.4.5 Power-Down modes
There are 2 power-down modes for the Phy:
5.4.5.1 General Power-Down
This power-down is controlled by register 0, bit 11. In this mode the entire PHY, except the
management interface, is powe red-down and stays in that condition as long as bit 0.11 is HIGH. When
bit 0.11 is cleared, the PHY powers up and is automatically reset.
5.4.5.2 Energy Detect Power-Down
This power-down mode is activated by setting bit 17.13 to 1. In this mode when no energy is present
on the line the PHY is powered down, except for the manage ment interface, the SQUELCH circu it and
the ENERGYON logic. The ENERGYON logic is used to detect the presence of valid energy from
100Base-TX, 10Base-T, or Auto-negotiation signals
In this mode, when the ENERGYON signal is low, the PHY is powered-down, and nothing is
transmitted. When energy is received - link pulses or packets - the ENERGYON signal goes high, and
the PHY powers-up. It automatically resets itself into the state it had prior to power-d own, and asserts
the nINT interrupt if the ENERGYON interrupt is enabled. The first and possibly the second packet
to activate ENERGYON may be lost.
When 17.13 is low, energy detect power-down is disabled.
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5.4.6 Reset
The PHY has 3 reset sources:
Hardware reset (HWRST): connected to the nRST input. At power up, nRST must not go high until
after the VDDIO and VDD_CORE supplies are stable, as shown in Figure 5.1.
To initiate a hardware reset, nRST must be held LOW for at least 100 us to ensure that the Phy is
properly reset, as shown in Figure 6.10.
During a Hardware reset, an external clock must be supplied to the CLKIN signal.
Software (SW) reset: Activated by writing reg ister 0, bit 15 high. This signal is self- clearing. After the
register-write, internal logic extends the reset by 256µs to allow PLL-stabilization before releasing the
logic from reset.
The IEEE 802.3u standard, clause 22 (22.2.4.1.1) states that the reset process should be completed
within 0.5s from the setting of this bit.
Power-Down reset: Automatically activated when the PHY comes out of power-down mode. The
internal power-down reset is extended by 256µs after exiting the power-down mode to allow the PLLs
to stabilize before the logic is released from reset.
These 3 reset sources are combi ned together in the digi tal block to create the internal “general reset”,
SYSRST, which is an asynchronous reset and is active HIGH. This SYSRST directly drives the PCS,
DSP and MII blocks. It is also input to the Central Bias block in order to generate a short reset for the
PLLs.
The SMI mechanism and registers are reset only by the Hardware and Software resets. During Power-
Down, the SMI registers are not reset. Note that some SMI register bits are not cleared by Software
reset – these are marked “NASR” in the register tables.
For the first 16us after coming out of reset, the MII will run at 2.5 MHz. After that it will switch to 25
MHz if auto-negotiation is enabled.
Figure 5.1 Reset Timing Diagram
VDD_CORE Starts nRST Released
0V
3.3V
1.8V
VDD 33 Starts
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5.4.7 LED Description
The PHY provides four LED signals. These provide a convenient means to determine the mode of
operation of the Phy. All LED signals are either active high or active low.
The four LED signals can be either active-high or active-low. Polarity depends upon the Phy address
latched in on reset. The L AN8700/LAN8700i senses each Phy address bi t and changes the polarity of
the LED signal accordi ngly. If the address bit is set as level “1”, the LED polarity will be set to an active-
low. If the address bit is set as level “0”, the LED polarity will be set to an active-high.
The ACTIVITY LED output is driven active when CRS is active (high). When CRS becomes inactive,
the Activity LED output is extended by 128ms.
The LINK LED output is driven active whenever the PHY detects a valid link. The use of the 10Mbps
or 100Mbps link test status is determined by the condition of the internally determined spee d selection.
The SPEED100 LED output is driven active when the operating speed is 100Mbit/s or during Auto-
negotiation. This LED will go inactive when the operating speed is 10Mbit/s or during line isolation
(register 31 bit 5).
The Full-Duplex LED output is driven active low when the link is operating in Full-Duplex mode.
5.4.8 Loopback Operation
The LAN8700/LAN8700i may be configured for near-end loopback and far loopback.
5.4.8.1 Near-end Loopback
Near-end loopback is a mo de that sends the digital transmit data back out the receive data signals for
testing purpose s as indi cate d by th e blue arrows in Figure 5.2.The near-end loopback mode is enabled
by setting bit register 0 bit 14 to logic one.
A large percentage of the digital circuitry is operational near-end loopback mode, because data is
routed through the PCS and PMA layers into the PMD sublayer before it is looped back. The COL
signal will be inactive in this mode, unless co llision test (bit 0.7) is active. The transmitte rs are powered
down, regardless of the state of TXEN.
Figure 5.2 Near-end Loopback Block Diagram
SMSC
Ethernet Transceiver
10/100
Ethernet
MAC
CAT-5
XFMR
Digital
RXD
TXD
Analog
RX
TX
X
X
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5.4.8.2 Far Loopback
Far loopback is a special test mode for MDI (analog) loopback as indicated by the blue arrows in
Figure 5.3. The far loopback mode is en abled by setting bit register 17 bit 9 to logic one. In this mode,
data that is received from the link partner on the MDI is loope d back out to the link partner. The digital
interface signals on the local MAC interface are isolated.
Note: This special test mode is only available when operating in RMII mode.
5.4.8.3 Connector Loopback
The LAN8700/LAN8700i maintains reliable transmission over very short cables, and can be tested in
a connector loopback as shown in Figure 5.4. An RJ45 loopback cable can be used to route the
transmit signals an the output of the transformer back to the receiver inputs, and this loopback will
work at both 10 and 100.
Figure 5.3 Far Loopback Block Diagram
Figure 5.4 Connector Loopback Block Diagram
Far-end system
SMSC
Ethernet Transceiver
10/100
Ethernet
MAC
CAT-5
XFMR
Digital
RXD
TXD
Analog
RX
TX Link
Partner
X
X
SMSC
Ethernet Transceiver
10/100
Ethernet
MAC XFMR
Digital
RXD
TXD
Analog
RX
TX 1
2
3
4
5
6
7
8
RJ45 Loopback C able.
Created by connecting pin 1 to pin 3
and connecting pin 2 to pin 6.
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5.4.9 Configuration Signals
The PHY has 11 configuration signals whose inputs should be driven continuously, either by external
logic or external pull-up/pull-down resistors.
5.4.9.1 Physical Address Bus - PHYAD[4:0]
The PHYAD[4:0] signals are driven high or low to give each PHY a unique address. This address is
latched into an internal register at end of hardware reset. In a multi-PHY application (such as a
repeater), the controller is able to manage each PHY via the unique address. Each PHY checks each
management data frame for a matching address in the relevant bits. When a match is recognized , the
PHY responds to that particular frame. The PHY address is also used to seed the scrambler. In a multi-
PHY application, this ensures that the scramblers are out of synchronization and disperses the
electromagnetic radiation across the frequency spectrum.
5.4.9.2 Mode Bus – MODE[2:0]
The MODE[2:0] bus controls the configuration of the 10/100 digital block. When the nRST pin is
deasserted, the register bit values are loaded according to the MODE[2:0] pins. The 10/100 digital
block is then configured by the register bit values. When a soft reset occurs (bit 0.15) as described in
Table 5.30, the configuration of th e 10/100 digital blo ck is con trolled by the register bit values, and the
MODE[2:0] pins have no affect.
Table 5.48 MODE[2:0] Bus
MODE[2:0] MODE DEFINITIONS
DEFAULT REGISTER BIT VALUES
REGISTER 0 REGISTER 4
[13,12,10,8] [8,7,6,5]
000 10Base-T Half Duplex. Auto-negotiation disabled. 0000 N/A
001 10Base-T Full Duplex. Auto-negotiation disabled. 0001 N/A
010 100Base-TX Half Duplex. Auto-negotiation
disabled.
CRS is active during Transmit & Receive.
1000 N/A
011 100Base-TX Full Duplex. Auto-ne gotiation disable d.
CRS is active during Receive. 1001 N/A
100 100Base-TX Half Duplex is advertised. Auto-
negotiation enabled.
CRS is active during Transmit & Receive.
1100 0100
101 Repeater mode. Auto-negotiation enabled.
100Base-TX Half Duplex is advertised.
CRS is active during Receive.
1100 0100
110 Power Down mode. In this mode the PHY will
wake-up in Power-Down mode. The PHY cannot be
used when the MODE[2:0] bits are set to this mode.
To exit this mode, the MODE bits in Register 18.7:5
(see Table 5.39) must be configured to some other
value and a soft reset must be issued.
N/A N/A
111 All capable. Auto-negotiation enabled. X10X 1111
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Chapter 6 AC Electrical Characteristics
The timing diagrams and limits in this section define the requirements placed on the external signals
of the Phy.
6.1 Serial Management Interface (SMI) Timing
The Serial Management Interface is used for status and control as described in Section 4.13.
Figure 6.1 SMI Timing Diagram
Table 6.1 SMI Timing Values
PARAMETER DESCRIPTION MIN TYP MAX UNITS NOTES
T1.1 MDC minimum cycle time 400 ns
T1.2 MDC to MDIO (Read from PHY)
delay 0 300 ns
T1.3 MDIO (Write to PHY) to MDC setup 10 ns
T1.4 MDIO (Write to PHY) to MDC hold 10 ns
Clock -
MDC
D ata Ou t -
MDIO
T1.2
Valid Data
(Read from PHY)
T1.1
T1.3 T1.4
D a ta In -
MDIO Valid Data
(Write to P HY )
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6.2 MII 10/100Base-TX/RX Timings
6.2.1 MII 100Base-T TX/RX Timings
6.2.1.1 100M MII Receive Timing
Figure 6.2 100M MII Receive Timing Diagram
Table 6.2 100M MII Receive Timing Values
PARAMETER DESCRIPTION MIN TYP MAX UNITS NOTES
T2.1 Receive signals setup to RX_CLK
rising 10 ns
T2.2 Receive signals hold from
RX_CLK rising 10 ns
RX_CLK frequency 25 MHz
RX_CLK Duty-Cycle 40 %
Clock Out -
RX_CLK
Data Out -
RXD[3:0]
T2.1
RX_DV
RX_ER
T2.2
Valid Data
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6.2.1.2 100M MII Transmit Timing
Figure 6.3 100M MII Transmit Timing Diagram
Table 6.3 100M MII Transmit T imin g Values
PARAMETER DESCRIPTION MIN TYP MAX UNITS NOTES
T3.1 Transmit signals required setup to
TX_CLK rising 12 ns
Transmit signals required hold
after TX_CLK rising 0ns
TX_CLK frequency 25 MHz
TX_CLK Duty-Cycle 40 %
Clock Out -
TX_CLK
Data Out -
TXD[3:0]
T3.1
TX_EN
TX_ER
Valid Data
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6.2.2 MII 10Base-T TX/RX Timings
6.2.2.1 10M MII Receive Timing
Figure 6.4 10M MII Receive Timing Diagram
Tabl e 6.4 10M MII Receive Timing Values
PARAMETER DESCRIPTION MIN TYP MAX UNITS NOTES
T4.1 Receive signals setup to RX_CLK
rising 10 ns
T4.2 Receive signals hold from RX_CLK
rising 10 ns
RX_CLK frequency 2.5 MHz
RX_CLK Duty-Cycle 40 %
Clock Out -
RX_CLK
Data Out -
RXD[3:0]
T4.1
RX_DV
T4.2
Valid Data
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6.2.2.2 10M MII Transmit Timing
Figure 6.5 10M MII Transmit Timing Diagrams
Table 6.5 10M MII Transmit Timing Values
PARAMETER DESCRIPTION MIN TYP MAX UNITS NOTES
T5.1 Transmit signals required setup to
TX_CLK rising 12 ns
Transmit signals required hold
after TX_CLK rising 0ns
TX_CLK frequency 2.5 MHz
TX_CLK Duty-Cycle 50 %
Clock Out -
TX_CLK
Data Out -
TXD[3:0]
T5.1
TX_EN
Valid Data
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6.3 RMII 10/100Base-TX/RX Timings
6.3.1 RMII 100Base-T TX/RX Timings
6.3.1.1 100M RMII Receive Timing
Figure 6.6 100M RMII Receive Timing Diagram
Table 6.6 100M RMII Receive Timing Values
PARAMETER DESCRIPTION MIN TYP MAX UNITS NOTES
T6.1 Output delay from rising edge of
CLKIN to receive signals output
valid
210ns
CLKIN frequency 50 MHz
Clock In -
CLKIN
Data Out -
RXD[1:0]
CRS_DV
Valid Data
T6.1
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6.3.1.2 100M RMII Transmit Timing
Figure 6.7 100M RMII Transmit Timing Diagram
Table 6.7 100M RMII Transmit Timing Values
PARAMETER DESCRIPTION MIN TYP MAX UNITS NOTES
T8.1 Transmit signals required setup to
rising edge of CLKIN 2ns
T8.2 Transmit signals required hold
after rising edge of REF_CLK 1.5 ns
CLKIN frequency 50 MHz
Clock In -
CLKIN
Data Out -
TXD[1:0]
T8.1
TX_EN
T8.2
Valid Data
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6.3.2 RMII 10Base-T TX/RX Timings
6.3.2.1 10M RMII Receive Timing
Figure 6.8 10M RMII Receive Timing Diagram
Table 6.8 10M RMII Receive Timing Values
PARAMETER DESCRIPTION MIN TYP MAX UNITS NOTES
T9.1 Output delay from rising edge of
CLKIN to receive signals output
valid
210ns
CLKIN frequency 50 MHz
Clock In -
CLKIN
D a ta Out -
RXD[1:0]
CRS_DV
V a lid Da ta
T9.1
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6.3.2.2 10M RMII Transmit Timing
Figure 6.9 10M RMII Transmit Timing Diagram
Table 6.9 10M RMII Transmit Timing Values
PARAMETER DESCRIPTION MIN TYP MAX UNITS NOTES
T10.1 Transmit signals required setup to
rising edge of CLKIN 4ns
T10.2 Transmit signals required hold
after rising edge of REF_CLK 2ns
CLKIN frequency 50 MHz
Clock In -
CLKIN
D ata O u t -
TXD[1:0]
T10.1
TX_EN
T10.2
Valid Data
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6.4 RMII CLKIN Timing
6.5 Reset Timing
Table 6.10 RMII CLKIN (REF_CLK)Timing Values
PARAMETER DESCRIPTION MIN TYP MAX UNITS NOTES
CLKIN frequency 50 MHz
CLKIN Frequency Drift ± 50 ppm
CLKIN Duty Cycle 40 60 %
CLKIN Jitter 150 psec p-p – not RMS
Figure 6.10 Reset Timing Diagram
Table 6.11 Reset Timing Values
PARAMETER DESCRIPTION MIN TYP MAX UNITS NOTES
T11.1 Reset Pulse Width 100 us
T11.2 Configuration input setup to
nRST rising 200 ns
T11.3 Configuration input hold after
nRST rising 2ns
T11.4 Output Drive after nRST rising 3 800 ns 20 clock cycles for
25 MHz clock
or
40 clock cycles for
50MHz clock
nRST
Configuration
Signals
T11.1
T11.4
O utput drive
T11.2 T11.3
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6.6 Clock Circuit
LAN8700/LAN8700i can accept either a 25MHz crystal or a 25MHz single-ended clock oscillator
(±50ppm) input for operation in MII mode. If the single-ended clock oscillator method is implemented,
XTAL2 should be left unconnected and XTAL1/CLKIN should be driven with a nominal 0-3.3V clock
signal. The user is re quired to supply a 50MHz single-ended clock for R MII operation . The inp ut clock
duty cycle is 40% minimum, 50% typical and 60% maximum. See Table 6.12 for the recommended
crystal specifications.
Note 6.1 The maximum allowable values for Frequency Tolerance and Frequency Stability are
application dependant. Since any particular appl ication must me et the IEEE ±50 PPM Total
PPM Budget, the combination of these two values must be approximately ±45 PPM
(allowing for aging).
Note 6.2 Frequency Deviation Over Time is also referred to as Aging.
Note 6.3 The total deviation for the Transmitter Clock Frequency is specified by IEEE 802.3u as
±100 PPM.
Note 6.4 0oC for commercial version, -40oC for industrial version.
Note 6.5 +70oC for commercial version, +85oC for industrial version.
This number includes the pad, the bond wire and the lead frame. PCB capacitance is not included in
this value. The XTAL1/CLKIN pin, XTAL2 pin and PCB capacitance values are required to accurately
calculate the value of the two external load capacitors. The total load capacitance must be equivalent
to what the crystal expects to see in the circuit so that the crystal oscillator will op erate at 25.000 MHz.
Table 6.12 LAN8700/LAN8700i Crystal Specificatio ns
PARAMETER SYMBOL MIN NOM MAX UNITS NOTES
Crystal Cut AT, typ
Crystal Oscillation Mode Fundamental Mode
Crystal Calibration Mode Parallel Resonant Mode
Frequency Ffund - 25.000 - MHz
Frequency Tolerance @ 25oCF
tol - - ±50 PPM Note 6.1
Frequency Stability Over Temp Ftemp - - ±50 PPM Note 6.1
Frequency Deviation Over Time Fage - +/-3 to 5 - PPM Note 6.2
Total Allowable PPM Budget - - ±50 PPM Note 6.3
Shunt Capacitance CO-7 typ-pF
Load Capacitance CL- 20 typ - pF
Drive Level PW0.5 - - mW
Equivalent Series Resistance R1--30Ohm
Operating Temperature Range Note 6.4 -Note 6.5 oC
LAN8700/LAN8700i
XTAL1/CLKIN Pin Capacitance -3 typ-pF
LAN8700/LAN8700i XTAL2 Pin
Capacitance -3 typ-pF
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Chapter 7 DC Electrical Characteristics
7.1 DC Characteristics
7.1.1 Maximum Guaranteed Ratings
Stresses beyond those listed in may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
7.1.1.1 Human Body Model (HBM) Performance
HBM testing verifies the ability to withstand the ESD strikes like those that occur during handling and
manufacturing, and is done without power applied to the IC. To pass the test, the device must have
no change in operation or performance due to the event. All pins on the LAN8700 provide ±8kV HBM
protection.
Table 7.1 Maximum Conditions
PARAMETER CONDITIONS MIN TYP MAX UNITS COMMENT
VDD33,VDDIO Power pins to all other pins. -0.5 +3.6 V
Digital IO To VSS ground -0.5 +3.6 V Table 7.5, “MII Bus
Interface Signals,” on
page 71
VSS VSS to all other pins -0.5 +4.0 V
Operating
Temperature LAN8700-AEZG 0 +70 C Commercial temperature
components.
Operating
Temperature LAN8700i-AEZG -40 +85 C Industrial temperature
components.
Storage
Temperature -55 +150 C
Table 7.2 ESD and LATCH-UP Performance
PARAMETER CONDITIONS MIN TYP MAX UNITS COMMENTS
ESD PERFORMANCE
All Pins Human Body Model ±8 kV Device
System EN/IEC61000-4-2 Contact
Discharge ±8 kV 3rd party system test
System EN/IEC61000-4-2 Air-gap
Discharge ±15 kV 3rd party system test
LATCH-UP PERFORMANCE
All Pins EIA/JESD 78, Class II 150 mA
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7.1.1.2 IEN/IEC61000-4-2 Performance
The EN/IEC61000-4-2 ESD specification is an international standard that addresses system-level
immunity to ESD strikes while the end equipment is operational. In contrast, the HBM ESD tests are
performed at the device level with the device powered down.
SMSC contracts with Independent laboratories to test the LAN8700 to EN/IEC61000-4-2 in a working
system. Reports are available upon request. Please contact your SMSC representative, and request
information on 3rd party ESD test results. The reports show that systems designed with the LAN8700
can safely dissipate ±15kV air discharges and ±8kV contact discharges per the EN/IEC61000-4-2
specification without additional board level protection.
In addition to defining the ESD tests, EN/IEC61000-4-2 also categorizes the impact to equipment
operation when the strike occurs (ESD Result Classification). The LAN8700 maintains an ESD Result
Classification 1 or 2 when subjected to an EN/IEC61000-4-2 (level 4) ESD strike.
Both air discharge and contact discharge test techniques for applyin g stress conditions are defined by
the EN/IEC61000-4-2 ESD document.
AIR DISCHARGE
To perform this test, a charged electrode is moved close to the system being tested until a spark is
generated. This test is difficult to reproduce because the discharge is influenced by such factors as
humidity, the speed of approach of the electrode, and construction of the test equipment.
CONTACT DISCHARGE
The uncharged electro de first contacts th e pin to prepare this test, and then the probe tip is energized.
This yields more repeatable results, and is the preferred test method. The independent test laboratories
contracted by SMSC provide test results for both types of discharge methods.
7.1.2 Operating Conditions
7.1.3 Power Consumption
7.1.3.1 Power Consumption Device Only
Power measurements taken over the operating conditions specified. See Section 5.4.5 for a description
of the power down modes.
Table 7.3 Recommended Operating Conditions
PARAMETER CONDITIONS MIN TYP MAX UNITS COMMENT
VDD33 VDD33 to VSS 3.0 3.3 3.6 V
Input Voltage on
Digital Pins 0.0 VDDIO V
Voltage on Analog I/O
pins (RXP, RXN) 0.0 +3.6V V
Ambient Temperature TA LAN8700-AEZG 0 70 C For Commercial
Temperature
TA LAN8700i-AEZG -40 +85 C For Industrial Temperature
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Note: The current at VDD_CORE is either supplied by the internal regulator from current entering at
VDD33, or from an external 1.8V supply when the internal regulator is disabled.
Note 7.1 This is calculated with full flexPWR features activated: VDDIO = 1.8V and internal regulator
disabled.
Note 7.2 Current measurements do not include power applied to the magnetics or the optional
external LEDs. Current measurements taken with VDDIO = +3.3V, unless otherwise
indicated.
Table 7 .4 Power Consumption Device Only
POWER PIN GROUP
VDDA3.3
POWER
PINS(MA)
VDD_CORE
POWER
PIN(MA)
VDDIO
POWER
PIN(MA)
TOTAL
CURRENT
(MA)
TOTAL
POWER
(MW)
100BASE-T /W TRAFFIC
Max 35.6 41.3 4.7 81.6 269.28
Typical 33.3 37.4 4.1 74.8 246.84
Min 31.3 33.4 1.3 66 165.75
Note 7.1
10BASE-T /W TRAFFIC
Max 15.6 22.3 1.1 39 128.7
Typical 15.3 20.8 0.9 37 122.1
Min 14.9 19.1 0.1 34.1 83.88
Note 7.1
ENERGY DETECT POWER
DOWN
Max 10.5 3.3 0.5 13.85 45.7
Typical 9.9 2.7 0.4 13.0 42.9
Min 9.8 2.3 0.3 12.4 37.02
Note 7.1
GENERAL POWER DOWN
Max 0.21 2.92 0.39 3.52 11.62
Typical 0.124 2.6 0.345 3.07 10.131
Min 0.038 2.1 0.3 2.44 4.4454
Note 7.1
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7.1.4 DC Characteristics - Input and Output Buffers
Table 7.5 MII Bus Interface Signals
NAME VIH (V) VIL (V) IOH I
OL V
OL (V) VOH (V)
TXD0 0.68 * VDDIO 0.4 * VDDIO
TXD1 0.68 * VDDIO 0.4 * VDDIO
TXD2 0.68 * VDDIO 0.4 * VDDIO
TXD3 0.68 * VDDIO 0.4 * VDDIO
TX_EN 0.68 * VDDIO 0.4 * VDDIO
TX_CLK -8 mA +8 mA +0.4 VDDIO – +0.4
RXD0/MODE0 -8 mA +8 mA +0.4 VDDIO – +0.4
RXD1/MODE1 -8 mA +8 mA +0.4 VDDIO – +0.4
RXD2/MODE2 -8 mA +8 mA +0.4 VDDIO – +0.4
RXD3/nINTSEL -8 mA +8 mA +0.4 VDDIO – +0.4
RX_ER/RXD4 -8 mA +8 mA +0.4 VDDIO – +0.4
RX_DV -8 mA +8 mA +0.4 VDDIO – +0.4
RX_CLK/REGOFF -8 mA +8 mA +0.4 VDDIO – +0.4
CRS/PHYAD4 -8 mA +8 mA +0.4 VDDIO – +0.4
COL/RMII/CRS_DV -8 mA +8 mA +0.4 VDDIO – +0.4
MDC 0.68 * VDDIO 0.4 * VDDIO
MDIO 0.68 * VDDIO 0.4 * VDDIO -8 mA +8 mA +0.4 VDDIO – +0.4
nINT/TX_ER/TXD4 0.68 * VDDIO 0.4 * VDDIO -8 mA +8 mA +0.4 3.6
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Table 7.6 LAN Interface Signals
NAME VIH VIL IOH I
OL V
OL VOH
TXP
See Table 7.12, “100Base-TX Transceiver Characteristics,” on page 74 and Table 7.13,
“10BASE-T Transceiver Characteristics,” on page 74.
TXN
RXP
RXN
Table 7.7 LED Signals
NAME VIH (V) VIL (V) IOH I
OL V
OL (V) VOH (V)
SPEED100/PHYAD0 0.68 * VDDIO 0.4 * VDDIO -12 mA +12 mA +0.4 VDDIO – +0.4
LINK/PHYAD1 0.68 * VDDIO 0.4 * VDDIO -12 mA +12 mA +0.4 VDDIO – +0.4
ACTIVITY/PHYAD2 0.68 * VDDIO 0.4 * VDDIO -12 mA +12 mA +0.4 VDDIO – +0.4
FDUPLEX/PHYAD3 0.68 * VDDIO 0.4 * VDDIO -12 mA +12 mA +0.4 VDDIO – +0.4
Table 7. 8 Configuration In puts
NAME VIH (V) VIL (V) IOH I
OL V
OL (V) VOH (V)
SPEED100/PHYAD0 0.68 * VDDIO 0.4 * VDDIO -12 mA +12 mA +0.4 VDDIO – +0.4
LINK/PHYAD1 0.68 * VDDIO 0.4 * VDDIO -12 mA +12 mA +0.4 VDDIO – +0.4
ACTIVITY/PHYAD2 0.68 * VDDIO 0.4 * VDDIO -12 mA +12 mA +0.4 VDDIO – +0.4
FDUPLEX/PHYAD3 0.68 * VDDIO 0.4 * VDDIO -12 mA +12 mA +0.4 VDDIO – +0.4
CRS/PHYAD4 0.68 * VDDIO 0.4 * VDDIO -8 mA +8 mA +0.4 VDDIO – +0.4
RXD0/MODE0 0.68 * VDDIO 0.4 * VDDIO
RXD1/MODE1 0.68 * VDDIO 0.4 * VDDIO
RXD2/MODE2 0.68 * VDDIO 0.4 * VDDIO
RX_CLK/REGOFF 0.68 * VDDIO 0.4 * VDDIO
COL/RMII/CRS_DV -8 mA +8 mA +0.4 VDDIO – +0.4
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Note 7.3 These levels apply when a 0-3.3V Clock is driven into CLKIN/XTAL1 and XTAL2 is floating.
The maximum input voltage on XTAL1 is VDDIO + 0.4V.
Table 7.9 General Signals
NAME VIH (V) VIL (V) IOH I
OL V
OL (V) VOH (V)
nINT/TX_ER/TXD4 -8 mA +8 mA +0.4 VDDIO – +0.4
nRST 0.68 * VDDIO 0.4 * VDDIO
CLKIN/XTAL1 (Note 7.3) +1.40 V 0.4 * VDDIO
XTAL2 - -
NC
Table 7.10 Analog References
NAME BUFFER TYPE VIH VIL IOH I
OL V
OL VOH
EXRES1 AI
Table 7. 11 Internal Pull-Up / Pull-Down Conf igurations
NAME PULL-UP OR PULL-DOWN
SPEED100/PHYAD0 Pull-up
LINK/PHYAD1 Pull-up
ACTIVITY/PHYAD2 Pull-up
FDUPLEX/PHYAD3 Pull-up
CRS/PHYAD4 Pull-up
RXD0/MODE0 Pull-up
RXD1/MODE1 Pull-up
RXD2/MODE2 Pull-up
RXD3/nINTSEL Pull-up
nINT/TX_ER/TXD4 Pull-up
nRST Pull-up
COL/RMII/CRS_DV Pull-down
MDIO Pull-down
MDC Pull-down
RX_CLK/REGOFF Pull-down
RX_ER/RXD4 Pull-down
RX_DV Pull-down
TX_EN Pull-down
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Note: For VDDIO operation below +2.5V, SMSC recommends designs add external strapping
resistors in addition the internal strapping resistors to ensure proper strapped operation.
Note 7.4 Measured at the line side of the transformer, line replaced by 100Ω (± 1%) resistor.
Note 7.5 Offset from 16 nS pulse width at 50% of pulse peak
Note 7.6 Measured differentially.
Note 7.7 Min/max voltages guaranteed as measured with 100Ω resistive load.
Table 7.12 100Base-TX Transceiv er Characteristics
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Peak Differential Output Voltage High VPPH 950 - 1050 mVpk Note 7.4
Peak Differential Output Voltage Low VPPL -950 - -1050 mVpk Note 7.4
Signal Amplitude Symmetry VSS 98 - 102 % Note 7.4
Signal Rise & Fall Time TRF 3.0 - 5.0 nS Note 7.4
Rise & Fall Time Symmetry TRFS --0.5nSNote 7.4
Duty Cycle Distortion DCD 35 50 65 % Note 7.5
Overshoot & Undershoot VOS --5%
Jitter 1.4 nS Note 7.6
Table 7.13 10BASE-T Transceiver Characteristics
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Transmitter Peak Differential Output Voltage VOUT 2.2 2.5 2.8 V Note 7.7
Receiver Differential Squelch Threshold VDS 300 420 585 mV
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Chapter 8 Application Notes
8.1 Application Diagram
Note: R5 on the Crystal is used to control the crystal drive strength into the PHY clock generator.
This resistance can be fine tuned to meet the requirements of each crystal manufacturer.
Figure 8.1 Simplified Application Diagram (see Section 8.4, "Reference Designs")
Host System
MAC
(Media Access Controller)
MII/RMII
RX_CLK/REGOFF
nINT/TX_ER/TXD4
MDC
CRS/PHYAD4
MDIO
nRST
TX_EN
VDD_CORE
VDD33
LINK/PHYAD1
ACTIVITY/PHYAD2
FDUPLEX/PHYAD3
XTAL2
CLKIN/XTAL1
RXD3/nINTSEL
RXD1/MODE1
RXD2/MODE2
TXD3
TX_CLK
RX_ER/RXD4
VDDIO
TXD1
TXD0
TXD2
COL/RMII/CRS_DV
TXP
RXN
EXRES1
VDDA3.3
RXP
VDDA3.3
1
2
3
4
5
6
7
8
LAN8700/LAN8700I
MII/RMII Ethernet PHY
36 Pin QFN
GND FLAG
10
11
12
13
14
15
16
24
23
22
21
20
19
32
31
30
29
28
SPEED100/PHYAD0 9RX_DV
RXD0/MODE0
17
TXN
18
27
26
25
36
35
34
33
VDDIO
4.7uF
0.1uF
Variable
Voltage
IO Reg u la tor
Integrated
Magne tics an d R J45 Jack
12.4k 1%
4.7uF
0.1uF
R1
R2
VDD3.3
4.7uF
0.1uF
VDD3.3
Voltage
Regulator
0.1uF
Speed100
Link
Activity
FullDuplex
R3
R4
VDDA3.3
0.1uF
0.1uF
0.1uF
1
2
3
4
5
6
7
8
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8.2 Magnetics Selection
For a list of magnetics selected to operate with the SMSC LAN8700, please refer to the Application
note “AN 8-13 Suggested Magnetics”.
http://www.smsc.com/main/appnotes.html#Ethernet%20Products
8.3 Application Notes
Application examples are given in pdf format on the SMSC LAN8700 web site. The link to the web site
is shown below.
http://www.smsc.com/main/catalog/lan8700.html
Please check the web site periodically for the latest updates.
8.4 Reference Designs
The LAN8700 Reference designs are available on the SMSC LAN8700 web site link below.
http://www.smsc.com/main/catalog/lan8700.html
The reference designs are available in four variations:
a. MII with +3.3V IO
b. RMII with +3.3V IO
c. MII with +1.8V IO
d. RMII with +1.8V IO.
8.5 Evaluation board
The EVB-LAN8700 is a a PHY Evaluation Board (EVB) that interfaces a MAC controller to the SMSC
LAN8700 Ethernet PH Y through an MII connector, and out to an RJ-45 Ethernet Jack through industrial
temperature magnetics for 10/100 connectivity.
Schematics(*.pdf and *.dsn), BOM (bill of materials), user guide, gerber files and Layout boa rd file are
all available on the EVB web site link below.
http://www.smsc.com/main/catalog/evblan8700.html
The EVB-LAN8700 is designed to plug into a user's test system using a 40 pin Media Independent
Interface (MII) connector. The MII connector is an AMP 40 pin Right Angle through hole MII connector,
PN AMP- 174218-2. The mating connector is PN AMP 174217-2.
FEATURES:
Industrial temperature PHY and Magnetics
8 pin SOIC for user configurable Magnetics
On board LED indicators for Speed 100
Full Duplex
RJ-45 Connector LEDs for Link and Activity
Interfaces Through 40-pin Connector as Defined in the MII Specification
Powered by 5.0V from the 40-Pin MII Connector
Standard RJ45 Connector with LED indicators for Link and Activity
Includes Probe Points on All MII Data and Control Signals for Troubleshooting
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Includes 25MHz Crystal for Internal PHY Reference; RX_CLK is Suppli ed to the 40-Pin Connector
Supports user configuration options including PHY address selection
Integrated 3.3V Regulator
APPLICATIONS
The EVB8700 Evaluation board simplifies the process of testing and evaluating an Ethernet
Connection in your application. The LAN8700 device is installed on the EVB board and all associated
circuitry is included, along with all configuration options.
The Benefits of adding an external MII interface are:
Easier system and software development
Verify MAC to PHY interface
Support testing of FPGA implementations of MAC
Assist interoperability test of various networks
Verify MII compliance
Verify performance of HP AutoMDIX feature
Verify Variable IO compliance
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Chapter 9 Package Outline, Tape and Reel
Figure 9.1 36-Pin QFN Package Outline, 6 x 6 x 0.90 mm Body (Lead-Free)
Notes:
1. Controlling Unit: millimeter.
2. Dimension b applies to plated terminals and is measured between 0.15mm and 0.30mm from the
terminal tip. Tolerance on the true position of the terminal is ± 0.05 mm at maximum material
conditions (MMC).
3. Details of terminal #1 identifier are optional but must be located within the zone indicated.
4. Coplanarity zone applies to exposed pad and terminals.
Table 9.1 36-Pin QFN Package Parameters
MIN NOMINAL MAX REMARKS
A 0.80 ~ 1.00 Overall Package Height
A1 0 ~ 0.05 Standoff
A2 0.60 ~ 0.80 Mold Thickness
A3 0.20 REF Copper Lead-frame Substrate
D 5.85 ~ 6.15 X Overall Size
D1 5.55 ~ 5.95 X Mold Cap Size
D2 3.55 ~ 3.85 X exposed Pad Size
E 5.85 ~ 6.15 Y Overall Size
E1 5.55 ~ 5.95 Y Mold Cap Size
E2 3.55 ~ 3.85 Y exposed Pad Size
L 0.35 ~ 0.75 Terminal Length
e 0.50 Basic Terminal Pitch
b 0.18 ~ 0.30 Terminal Width
ccc ~ ~ 0.08 Coplanarity
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Figure 9.2 QFN, 6x6 Tape & Reel
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Datasheet
Revision 2.3 (04-12-11) 80 SMSC LAN8700/LAN8700i
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Note: Standard reel size is 3000 pieces per reel.
Figure 9.3 Reel Dimensions
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Chapter 10 Datasheet Revision History
Table 10.1 Customer Revision History
REVISION LEVEL
& DATE SECTION/FIGURE/ENTRY CORRECTION
Rev. 2.3
(04-12-11) Section 6.5, "Reset Timing," on
page 66 Corrected T11.4 minimum value to 3ns.
Corrected T11.3 to 2ns.
Table 5.39, “Register 18 - Special
Modes,” on page 46 Updated MIIMODE bit description and added
note: “When writing to this register, the default
value of this bit must always be written back.”
Added note regarding default MIIMODE value.
Section 4.6.3, "MII vs. RMII
Configuration," on page 28 Updated section to remove information about
register control of the MII/RMII mode.
Section 5.4.8.2, "Far Loopback," on
page 55 Updated section to remove information about
register control of the MII/RMII mode.
Rev. 2.2
(12-04-09) Table 6.1, "SMI Timing Values" Updated T1.2 maximum to 300ns.
Rev. 2.1
(03-06-09) Section 5.4.6 Removed reference to internal POR system.
Added note the nRST should be low until VDDIO
and VDD_CORE are stable. Added Figure.
Table 5.34 Corrected bit value for Asymmetric and Symmetric
PAUSE.
Section 6.3 Improved timing values.
Section 5.4.8 Enhanced this section.
Section 4.6.3 Added information about register bit 18.14.
Section 6.6 Added section on clock, with crystal specification
table.
Figure 1.1 Removed GPIO from the LED block.
Section 4.11 Removed reference to GP01 pin in third paragraph.
Table 5.45 Renamed Bits 7-9 as Reserved.
Table 5.28 Renamed Bits 7-9 as Reserved.
Rev. 2.0
(07-15-08) Chapter 9, Package Outline, Tape
and Reel Tape and reel drawings and ordering info added.
Rev. 1.9
(03-18-08) Figure 6.7, "100M RMII Transmit
Timing Diagram" Replaced figure.
Rev. 1.9
(03-18-08) Table 6.5, "10M MII Transmit Timing
Values" Removed the text “T5.2” in the “Parameter”
column.
Rev. 1.9
(03-18-08) Figure 6.5, "10M MII Transmit T iming
Diagrams" Replaced figure.
Rev. 1.9
(03-18-08) Table 6.3, "100M MII Transmit
Timin g Valu es" Removed the text “T3.2” in the “Parameter”
column.
±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR® Technology in a Small Footprint
Datasheet
Revision 2.3 (04-12-11) 82 SMSC LAN8700/LAN8700i
DATASHEET
Rev. 1.9
(03-18-08) Figure 6.3, "100M MII Transmit
Timing Diagram" Replaced figure.
Rev. 1.9
(03-18-08) Table 6.11, "Reset Timing Values" Changed the MIN value for T11.3:
From: “400
To: “10”
Rev. 1.9
(03-18-08) Table 6.4, "10M MII Receive Timing
Values" Deleted last row in table.
Rev. 1.9
(03-18-08) Section 4.6.2.1, "Reference Clock" First sentence of second paragraph changed:
From: “between 35% and 65%”
To: “between 40% and 60%”
Rev. 1.8
(02-14-08) Table 6.7 Changed value of T8.1 and T8.2.
Rev. 1.8
(02-14-08) Table 6.6 Changed value of T6.1.
Rev. 1.6
(12-11-07) Section 4.9 Added i nformati on abou t not a pplying VD D_CORE
before VDD33 is at 2.64V.
Rev. 1.6
(12-11-07) Table 3.8, "Power Signals" Updated description of VDD_CORE for information
on using external 1.8V supply.
Rev. 1.6
(12-11-07) Table 3.1, "MII Signals" Updated description of RX_CLK/REGOFF to add
power supply sequencing information.
Rev. 1.6
(12-11-07) Table 5.33, "Register 3 - PHY
Identifier 2" Updated Revision Number to match the LAN8700C
silicon.
Rev. 1.5
(10-04-07) Chapter 8, Application Notes Figure 8.1 has been updated. In addition, the
following cross reference added to caption:
(see Section 8.4, "Reference Designs").
Rev. 1.4
(09-17-07) Section 7.1.4 Changed VIH to 0.68*VDDIO.
Changed VIL to 0.4*VDDIO.
Rev. 1.3
(06-27-07) Table 6.9 Moved parameter T10.2 in Table 6.9 from MAX
column to MIN column.
Rev. 1.3
(06-27-07) Table 6.5 Moved parameter T5.2 in Table 6.5 from MAX
column to MIN column.
Rev. 1.2
(05-29-07) Table 5.48 Added description when the MODE[2:0] bits are set
to 110.
Rev. 1.2
(05-29-07) Table 5.30 Corrected Default value for bit 0.11 to the value of
0. This bit does not get set when the MODE[2:0]
bits are set to 110.
Rev. 1.2
(05-23-07) Section 5.4.9.2 Added detail about MODE[2:0] pins having no
affect at soft reset.
Rev. 1.2
(05-23-07) Table 5.30 Added note to reset description (bit 0.15).
Rev. 1.2
(05-23-07) Table 3.5 AT nRST, added note that register bit values are
loaded from the Mode pins upon deassertion.
Table 10.1 Customer Revision History (continued)
REVISION LEVEL
& DATE SECTION/FIGURE/ENTRY CORRECTION
±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR® Technology in a Small Footprint
Datasheet
SMSC LAN8700/LAN8700i 83 Revision 2.3 (04-12-11)
DATASHEET
Rev. 1.2
(05-23-07) Table 7.11 Added RX_DV to table.
Rev. 1.2
(05-23-07) Table 3.1 Added note that RX_DV and RX_ER cannot be
high during reset.
Rev. 1.2
(05-23-07) Table 6.7 Moved parameter T8.2 from MAX column to MIN
column.
Rev. 1.1
(04-17-07) Table 7.4 Changed column headings to add clarity regardin g
source of current. Added Note.
Rev. 1.1
(04-17-07) Table 3.4 Removed RX_CLK/REGOFF because it made
Note 3.1 false.
Rev. 1.1
(04-12-07) Table 5.40 Added this table to describe the register.
Rev. 1.1
(04-12-07) Table 5.29 Added Register 26.
Rev. 1.1
(04-12-07) Table 5.23 Changed description from Reserved to Symbol
Error Counter.
Rev. 1.0
(04-04-07) Table 5.30, “Register 0 - Basic
Control,” on page 42 Table modified: Default column for “Power Down”
and “Isolate”.
Rev 1.0
(01-12-07) Section 4.6.3, "MII vs. RMII
Configuration," on page 28 Fixed a typo, GPO0/MII is on the 187,
COL/RMII/CRS_DV is on the 8700.
Section 8.1, "Application Diagram,"
on page 75 Added support components to crystal in application
diagram circuit. also add ed a note to the bottom to
indicate that purpose of R5 added.
Table 5.33, “Register 3 - PHY
Identifier 2,” on page 43 Corrected reg3 values.
Section 4.9.1, "Disable the Internal
+1.8V Regulator," on page 31 Changed paragraph to correctly reflect operation
VDDIO and VDDA latch 1.8V regulator. 1.8v strap
above VIH or below VIL.
Table 10.1 Customer Revision History (continued)
REVISION LEVEL
& DATE SECTION/FIGURE/ENTRY CORRECTION