APDS-9702
Signal Conditioning IC for Optical Proximity Sensors
with Digital I2C Interface
Data Sheet
Description
APDS-9702 is a signal conditioning IC that enhances the
performance and robustness of the optical sensors used
for proximity or object detection.
APDS-9702 is a single chip solution that consists of an I2C
Write function, oscillation circuit, LED driver circuit and
sunlight cancellation circuit integrated into a single chip.
APDS-9702 has artificial light immunity and is also op-
erational under the sun. Design flexibility is optimized as
APDS-9702 can be paired up with an integrated proximity
sensor or discrete pair solution.
APDS-9702 can be disabled to maximize power savings
and battery life in applications such as portable or bat-
tery-operated devices. The LED current of the optical
proximity sensors can be configured to different levels
using a limiting resistor at the LEDA pin. APDS-9702 also
provides user options in frequency, suitable burst rate,
comparator threshold setting and burst off period that can
reduce power consumption. These low power consump-
tion features makes it also ideal for low power mobile and
handheld devices.
APDS-9702 is capable of operating at voltage supply
ranging from 2.4 V to 3.6 V. APDS-9702 has two separate
output pins for analog and digital outputs. This provides
flexibility to use either the analog or digital output (or
both) depending on the requirements of the application.
The device is packaged in 8-pin QFN package measuring
0.55mm(H) x 2mm(W) x 2mm(L).
Ordering Information
Part Number Packaging Quantity
APDS-9702-020 Tape & Reel 2500 per reel
Application Support Information
The Application Engineering Group is available to
assist you with the application design associated with
APDS-9702 module. You can contact them through your
local sales representatives for additional details.
Features
x Low power consumption
– Internal oscillation circuit to drive LED in pulse
mode
– Low shut down current
– External LED drive-current control
x Complete shutdown mode
– Low shutdown current
x Supply voltage : 2.4 V to 3.6 V
x Operational in sunlight conditions up to 100klux(with
HSDL-9100)
x Artificial light immunity
x Analog & Digital output available
– Built in comparator for digital output
– Digital output remains Low during object detected.
x Wide bandwidth Trans-impedance amplifier
x External capacitor and resistor for integration and gain
controls
x Flexibility to enhance detection distance up to 200mm
with HSDL-9100 or further with external discrete pair
x Small 2mm x 2mm QFN 8-pin package
x Design flexibility to pair with Avago Proximity Sensors
or discrete pair solution
x Lead-free & RoHS Compliant
Applications
x PDA and mobile phones
x Digital Camera
x Portable and Handheld devices
x Personal Computers/Notebooks
x Amusement/Games/Vending Machines
x Industrial Automation
x Contactless Switches
x Sanitary Automation
2
APDS-9702 Block Diagram
Figure 1. APDS-9702 Block Diagram
Sunlight
Cancellation
(8) VCC
(7) LEDA
(6) PFILT
(2) SCL
(4) GND
(5) PD
(1) SDA
(3) DOUT
R1
LED
PIN
R3
CX3
Avago
Proximity Sensor
VCC
R2
V-I Converter
TIA
Comparator
I2C
(Optional)
Oscillator
Timing
Control
RpRp
VCC
100k 500k300k
+
Latch
3
APDS-9702 pin-out and I/O Configurations
Pin 1
Pin 2
Pin 3
Pin 4
Pin 8
Pin 7
Pin 6
Pin 5
PIN #1
CORNER
I/O Pins Configuration Table
Pin Symbol Type Description
1 SDA Digital I/O I2C Serial Data I/O terminal
I2C input / output signal
2 SCL Digital I/P I2C Serial Clock Input terminal
I2C clock input signal
3 DOUT Digital O/P Digital Output
An open drain output that requires a pull-up resistor of recommended value 10k :
DOUT = Low at last LED pulse of burst when VPFILT > VTH, DOUT remains Low during
object detected.
DOUT = High at last LED pulse of burst when VPFILT < VTH, DOUT remains High during
object not detected.
Please refer to Output Waveforms Definition.
4 GND Ground Ground
5 PD Analog I/P Photo-Detector Input
Connect to Cathode of photo-detector (proximity sensor)
6 PFILT Analog O/P Analog Output
Connect to integration circuit (R3 & CX3)
7 LEDA Analog O/P LED Driver Output
Connect to Anode of LED (proximity sensor)
8 VCC Supply Voltage Supply
Absolute Maximum Ratings
Parameter Symbol Min. Max. Units Conditions
Supply Voltage VCC 0 3.6 V Ta=25°C
Input Logic Voltage VI0 3.6 V Ta=25°C
Reflow Soldering Temperature 260 °C
Recommended Operating Conditions
Parameter Symbol Min. Max. Units Conditions
Operating Temperature TA-40 85 °C
Storage Temperature TS-40 125 °C
Supply Voltage VCC 2.4 3.6 V
4
Electrical & Optical Specifications (Ta=25°C)
Parameters Symbol Minimum Typical Maximum Units Conditions
Input
Logic High Input Voltage VIH 0.7*VCC V
Logic Low Input Voltage VIL 0.3* VCC V
Logic High Input Current IIH 0.1 PAV
I ≥ VIH
Logic Low Input Current IIL 0.1 PAV
I ≤ VIL
Shutdown Current ISD 1PA Vcc = 3.0 V, TRG = X, PWR = 0
Standby Current ISB 70 100 PA Vcc = 3.0 V, TRG = 0, PWR = 1
Output
Digital Output Low Level VOL 0 0.3 V IDOUT(Low) = 2 mA, Vcc = 3.0 V
Digital Output High Level VOH Vcc – 0.3 V Vcc = 3.0 V, R2 = 10k:
Built-in Resistor at PFILT RFILT 100k, 300k,
500k
:Through I2C set.
Transmitter
ILED Pulse Current ILED 125 235 mA Vcc = 3.0 V, R1 = 10:
Number of LED Pulse 16 x (1, 2, …,
16 times)
Through I2C set.
LED Pulse Frequency 12.5, 25, 50,
100
kHz Through I2C set.
Pulse Duty Cycle = 50%.
LED Burst Duration vs.
OFF Period
1/16, 1/64,
1/128, 1/256
Through I2C set.
Receiver
Photodiode Input
Current (PD)
IPD 03PA
Current Gain IPFILT/IPD 20 times Vcc = 3.0 V [1]
Comparator Threshold
Threshold voltage VTH 0.12
0.17
0.22
0.27
0.32
0.37
0.42
0.47
0.52
0.57
0.62
0.67
0.72
0.77
0.82
0.87
V TH = 0000,
TH = 0001,
TH = 0010,
TH = 0011,
TH = 0100,
TH = 0101,
TH = 0110,
TH = 0111,
TH = 1000,
TH = 1001,
TH = 1010,
TH = 1011,
TH = 1100,
TH = 1101,
TH = 1110,
TH = 1111
Sunlight Cancellation
DC Current, PD IDC 100 PA Vcc = 3.0 V[1]
Note:
1. Specified by design, not production tested.
5
Typical Application Circuit
VCC
R2
VCC
MCU APDS-9702
1
2
3
4
SDA
SCL
DOUT
8
5
6
7
Reflective Object
LEDA
PFILT
PDGND
R1
R3 (Optional)
CX1 CX2
CX3
Avago
Proximity Sensor
RpRp
ADC
GPIO
SDA
SCL
(Optional)
Figure 2. Typical Application Circuit for APDS-9702
Recommended Avago
Proximity Sensor Description
HSDL-9100 Integrated Reflective Proximity Sensor
Component Recommended Values ( with HSDL-9100)
R1 10 : ± 5%, 0.25W
R2 10k: ± 5%
R3 1M: ± 5%
Rp 10k: ± 5%
CX1 100 nF ± 20% X 7R, Ceramic,
CX2 6.8 PF ± 20%, Tantalum
CX3 3.3 nF ± 20% X 7R, Ceramic
6
I2C Definition
APDS-9702 operates as slave device on I2C bus for clock frequency (SCL) up to 400 kHz. The basic protocol of I2C bus is
described below, for more details and specifications, please refer to I2C-bus specification and user manual.
SCL
SDA
SP
START condition STOP condition
START and STOP conditions
SDA
SCL
1728
acknowledgement
signal from slave
MSB
START or
repeated START
condition
byte complete,
interrupt within slave
S or Sr
ACK
clock line held LOW while
interrupts are serviced
ACK
9Sr or P
1 2 3 to 8 9
acknowledgement
signal from receiver
STOP or
repeated START
condition
Sr
P
1 2 3 to 8 9
ACK
MSB MSB
Data transfer on I2C bus
SCL
SDA
S
START
condition ADDRESS
1-7 8 9 1-7 8 9 1-7 8 9
P
STOP
condition
ACKDATA
High byte
DATA
Low byte ACKACK
W
A complete data transfer
1 7 1181811
S Slave Address Wr A Data Byte A Data Byte A P
S Start Condition
Wr Write”0”
A Acknowledge (0 for ACK)
P Stop Condition
Master-to-Slave
Slave-to-Master
Slave Address: 1010100 (Default)
7
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
TRG PWR NB3 NB2 NB1 NB0 F1 F0 DC1 DC0 TH3 TH2 TH1 TH0 R1 R0
Default 0 0 0 0 0 1 0 0 1 0 0 1 0 0 0 0
Register Definition
Register Type Description Remark
TRG Trigger This pin is active high.
TRG = 1 o Normal proximity sensing operations
TRG = 0 o No operation (Default)
PWR Power PWR = 0 o Power Shut Down (Default)
PWR = 1 and TRG = 0 o Standby
PWR = 1 and TRG = 1 o Active Operations
NB<3:0> NBurst Number of LED Pulse per Burst = 16 x (1, 2, …, 16 times);
0x0 = 16-pulse, 0x1 = 32-pulse (Default), …, 0xE = 240-pulse,
0xF = 256-pulse
Figure 3
F<1:0> Frequency 00 = 12.5kHz (Default), 01 = 25kHz, 10 = 50kHz, 11 = 100kHz;
Wave is fixed at 50% Duty Cycle
Figure 3
DC<1:0> Duration Cycle LED Burst Duration versus OFF period;
00 = 1:16, 01 = 1:64, 10 = 1:128 (Default) and 11 = 1:256
Figure 3
TH<3:0> Threshold,
VTH
16 options of Comparator Threshold Setting;
0000 = 0.12V, 0001 = 0.17V, 0010 = 0.22V, 0011 = 0.27V,
0100 = 0.32V (Default), 0101 = 0.37V, 0110 = 0.42V, 0111 = 0.47V,
1000 = 0.52V, 1001 = 0.57V, 1010 = 0.62V, 1011 = 0.67V,
1100 = 0.72V, 1101 = 0.77V, 1110 = 0.82V, 1111 = 0.87V
Figure 4
R<1:0> RFLIT Programmable Filter Register;
00 = No resistor (Default), 01 = 100k, 10 = 300k, 11 = 500k
Figure 5
Burst Pulse OFF PeriodLED Burst Duration
Number of LED Pulses
50% DC
Duration Cycle = LED Burst Duration:
Burst Pulse OFF Period
Figure 3. LEDA Burst Pulses Definition
8
Transmit Burst Pulses Definition
Operation ON/OFF condition is shown in the following table:
TRG PWR Condition
X 0 Shut down
0 1 Standby Mode
1 1 Active Mode, pulses sent
The burst pulses at LEDA pin will be activated under 2 state conditions with 2 different start-up timing. The following
diagrams explained these 2 scenarios.
(a) State condition 1:
From Shut down -> Standby Mode -> Active Mode: Burst pulses at LEDA pin are activated after 1.3 ms
LEDA Burst Pulses
>1.3 ms
I2C
Shutdown
I2C
Standby
I2C
Active
(b) State condition 2:
From Shut down -> Active Mode: Burst pulses at LEDA pin are activated after 1.3 ms
LEDA Burst Pulses
>1.3 ms
I2C
Shutdown
I2C
Active
9
Output Waveforms Definition
Figure 4. Output Waveforms Definition
PFILT
LEDA
Burst Pulses
VTH
DOUT
Object detected Object detected Object not detected No object detected
10
RFILT Definition
There are built-in resistors at PFILT (pin 6) to provide 4 options to set the desired resistor for integrated RC circuit.
R0 R1 Resistor Value
0 0 Open. External resistor R3 is required to be in parallel with CX3
0 1 100k ohm. R3 become optional.
1 0 300k ohm. R3 become optional.
1 1 500k ohm. R3 become optional.
Figure 5. RFILT definition
(6) PFILT
(4) GND
R3 (Optional)CX3
V-I Converter
Comparator 500K300K100K
+
11
APDS 9702 Performance Charts
RELATIVE LED CURRENT VS VCC
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8
VCC (V)
RELATIVE LED CURRENT
RELATIVE LED CURRENT VS TEMPERATURE
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
-60 -40 -20 0 20 40 60 80 100
TEMPERATURE (°C)
RELATIVE LED CURRENT
RELATIVE STANDBY CURRENT VS TEMPERATURE
0.00
0.20
0.40
0.60
0.80
1.00
1.20
-60 -40 -20 0 20 40 60 80 100
RELATIVE ICC STANDBY
AVERAGE PEAK LED CURRENT VS R1
0
50
100
150
200
250
300
024681012
R1 (OHMS)
PEAK LED CURRENT (mA)
TEMPERATURE (°C)
2.4V
2.7V
3.0V
VCC
3.3V
RELATIVE ICC STANDY CURRENT VS VCC
0
0.2
0.4
0.6
0.8
1
1.2
2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8
VCC (V)
RELATIVE ICC STANDY CURRENT
12
APDS-9702 Package Dimensions
QFN 8-Pin Package
Note:
1. All Dimensions in mm. Tolerance ±0.1mm unless specified.
2. Marking Information:
The unit is marked ‘YWW LLa’ on the chip.
Y = Year (Last digit of the year)
WW = work week (1-54)
LL = Lot number (01-99)
a = Denote this is an I2C part.
0.50
0.10
0.02
SIDE VIEW
2
2
Pin #1 ID On Top
TOP VIEW
0.7
0.40
0.28
0.125
(x4)
0.25
(x8)
0.25
(x6)
1.20
0.60
0.35
45°
X
1234
5678
5
1
86
324
7
BOTTOM VIEW
13
Recommended Minimum Land pattern and Keep-out Area
Keep-out Area Recommendations:
Area of Solder Land pattern = 2.3mm x 2.1mm
Module placement tolerance & keep out on each side with
no lead = 0.55mm & keep out on each side solder lead =
0.8mm
Keep-out area = 3.9mm x 3.2mm
Dimension in mm.
Recommended tolerances +/-0.1mm
0.1
0.5
0.32
2.2
2
0.22
R0.175
0.25 0.25
0.5
2
SOLDER LAND PATTERN
14
APDS-9702 Tape and Reel Dimensions
Tape Dimensions
4.00 ± 0.10
4.00 ± 0.10
Ø 1.00 + 0.25
2.00 ± .05 Ø 1.50 + .10
1.75 ± 0.10
3.50 ± .05
8.00 + .30
.10
.254 ± 0.02
2.30 ± 0.10 2.30 ± 0.10
5° MAX 5° MAX
A. K. B.
ALL DIMENSIONS IN mm.
0.75 ± 0.10
YWW
LLa
UNIT ORIENTATION
IN POCKET
15
Reel Dimensions
ø60.0 ± 0.5
ø56.8 ± 0.5
R75.0
R12.7
60°
REEL MADE IN MALAYSIA
SEE DETAIL A
øN
øA
W3
(INCLUDES FLANGE
DISTORTION AT
OUTER EDGE)
W2
(MEASURE
AT HUB)
W1
(MEASURE
AT HUB)
AA
B
B
E
1.6
11.3
1.6
1.9
FRONT VIEW SECTION: BB BACK VIEW
SECTION: AA
ARBOR HOLE
DETAIL A
SCALE 2:1
ø13.0 ± 0.5
0.2
ø20.2 MIN
1.5 MIN
All Dimensions in mm.
Packaging
All APDS-9702 options are shipped in ESD proof packaging.
This part is compliant to JEDEC MSL 1.
Recommended Storage Conditions
Storage Temperature The units in tape and reel are recommended to be kept in a controlled climate
environment, with temp at 25 +5/-10°C and relative humidity at 55 +/-15%.
Time from unsealing to soldering This part is compliant to JEDEC MSL-1 (unlimited floor life at < 30°C / 85%RH)
Product SPecifications
TAPE WIDTH ØAØNWTW2
(MAX)
W3 E
08MM 180 60 ±2.0 8.4 14.4 8.4 4.0 ± 0.1
+1.5
–0.0
+2.5
–0.5
+0.0
–2.0
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-2238EN - March 3, 2010
Recommended Reflow Profile
50 100 300150 200 250
t-TIME
(SECONDS)
25
80
120
150
180
200
230
255
0
T - TEMPERATURE (°C)
R1
R2
R3 R4
R5
217
MAX 260C
60 sec to 90 sec
Above 217 C
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL DOWN
The reflow profile is a straight-line representation of
a nominal temperature profile for a convective reflow
solder process. The temperature profile is divided into
four process zones, each with different 'T/'time tem-
perature change rates or duration. The 'T/'time rates or
duration are detailed in the above table. The temperatures
are measured at the component to printed circuit board
connections.
In process zone P1, the PC board and APDS-9702 pins are
heated to a temperature of 150°C to activate the flux in
the solder paste. The temperature ramp up rate, R1, is
limited to 3°C per second to allow for even heating of both
the PC board and APDS-9702 pins.
Process zone P2 should be of sufficient time duration (100
to 180 seconds) to dry the solder paste. The temperature is
raised to a level just below the liquidus point of the solder,
usually 200°C (392°F).
Process zone P3 is the solder reflow zone. In zone P3, the
temperature is quickly raised above the liquidus point of
solder to 255°C (491°F) for optimum results. The dwell time
above the liquidus point of solder should be between 20
and 40 seconds. It usually takes about 20 seconds to assure
proper coalescing of the solder balls into liquid solder
and the formation of good solder connections. Beyond a
dwell time of 40 seconds, the intermetallic growth within
the solder connections becomes excessive, resulting in
the formation of weak and unreliable connections. The
temperature is then rapidly reduced to a point below the
solidus temperature of the solder, usually 200°C (392°F), to
allow the solder within the connections to freeze solid.
Process zone P4 is the cool down after solder freeze. The
cool down rate, R5, from the liquidus point of the solder to
25°C (77°F) should not exceed 6°C per second maximum.
This limitation is necessary to allow the PC board and
APDS-9702 pins to change dimensions evenly, putting
minimal stresses on the APDS-9702.
It is recommended to perform reflow soldering no more
than twice.
