IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung High Power Infrared Emitter (850 nm) Lead (Pb) Free Product - RoHS Compliant SFH 4059 Wesentliche Merkmale Features * Sehr kleines Gehause: (LxBxH) 3.2 mm x 1.6mm x 1.85 mm * Sehr hohe Gesamtleistung * Very small package: (LxWxH) 3.2 mm x 1.6 mm x 1.85 mm * High optical total power Anwendungen Applications * * * * * * * * Miniaturlichtschranken Industrieelektronik Mobile Gerate Messen/Steuern/Regeln" Miniature photointerrupters Industrial electronics Mobile devices For drive and control circuits Sicherheitshinweise Safety Advices Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefahrlich fur das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, mussen gema den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden. Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Typ Type Bestellnummer Ordering Code Strahlstarkegruppierung1) (IF = 70 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) SFH 4059 Q65111A0020 40 (typ. 100) 1) gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr 2010-11-09 1 SFH 4059 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top , Tstg - 40 ... + 85 C Sperrspannung Reverse voltage VR 5 V Vorwartsgleichstrom Forward current IF 70 mA Stostrom, tp = 10 s, D = 0 Surge current IFSM 700 mA Verlustleistung Power dissipation Ptot 140 mW 540 K/W 360 K/W Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 5 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 5 mm2 each Warmewiderstand Sperrschicht - Lotstelle bei RthJS Montage auf Metallkernplatine Thermal resistance junction - soldering point, mounted on metal core board Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 70 mA, tp = 10 ms peak 860 nm Schwerpunkts-Wellenlange der Strahlung Centroid Wavelength IF = 70 mA, tp = 10 ms centroid 850 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 70 mA, tp = 10 ms 42 nm Abstrahlwinkel Half angle 10 Grad deg. Aktive Chipflache Active chip area A 0.04 mm2 2010-11-09 2 SFH 4059 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Abmessungen der aktiven Chipflache Dimension of the active chip area LxB LxW 0.2 x 0.2 mm Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 70 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 70 mA, RL = 50 tr , tf 12 ns Durchlassspannung Forward voltage IF = 70 mA, tp = 20 ms VF 1.6 (< 2.0) V Sperrstrom Reverse current IR not designed for A reverse operation Gesamtstrahlungsfluss Total radiant flux IF = 70 mA, tp = 20 ms e typ 40 mW Temperaturkoeffizient von Ie bzw. e, IF = 70 mA Temperature coefficient of Ie or e, IF = 70 mA TCI - 0.5 %/K Temperaturkoeffizient von VF, IF = 70 mA Temperature coefficient of VF, IF = 70 mA TCV - 0.7 mV/K Temperaturkoeffizient von , IF = 70 mA Temperature coefficient of , IF = 70 mA TC + 0.3 nm/K 2010-11-09 3 SFH 4059 Strahlstarke Ie in Achsrichtung1) gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Symbol Werte Values SFH 4059 -U Einheit Unit SFH 4059 -V SFH 4059 -AW Strahlstarke Radiant intensity IF = 70 mA, tp = 20 ms Ie min Ie max 40 80 63 125 100 200 mW/sr mW/sr Strahlstarke Radiant intensity IF = 500 mA, tp = 25 s Ie typ 350 550 900 mW/sr 1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one bin in one packing unit (variation lower 2:1) Abstrahlcharakteristik Radiation Characteristics Irel = f () 40 30 20 10 0 OHF04384 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 2010-11-09 1.0 0.8 0.6 0.4 0 4 20 40 60 80 100 120 SFH 4059 Relative Spectral Emission Irel = f () Ie = f (IF) Radiant Intensity Ie 70 mA Single pulse, tp = 25 s OHF04406 101 OHF04135 100 Ie I rel % IF I e (70 mA) 80 Max. Permissible Forward Current IF = f (TA), RthJA = 540K/W 100 OHF04264 80 mA 70 60 5 50 60 10 -1 40 5 40 30 10-2 20 20 5 10 0 700 750 800 nm 950 850 10-3 0 10 5 10 1 5 10 2 mA IF OHF03826 0.8 IF A 0.7 t 0.3 10-3 IF 0.8 IF A 0.7 0.2 0.5 0.4 0.3 0.2 5 0.1 0.1 1.5 2 2.5 V 3 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp VF 2010-11-09 OHF04266 t D = TP T 0.005 0.01 0.02 0.03 0.05 0.1 0.2 0.5 1 5 1 80 C 100 tP IF T 0.6 0.4 0.5 60 D= 0.5 -2 tP D = TP 0.6 0 40 Permissible Pulse Handling Capability IF = f (), TA = 85 C, duty cycle D = parameter OHF04265 5 10-4 20 TA Permissible Pulse Handling Capability IF = f (), TA = 25 C, duty cycle D = parameter 10-1 10 0 IF Forward Current IF = f (VF) Single pulse, tp = 100 s 100 A 0 10 3 5 D= 0.005 0.01 0.02 0.03 0.05 0.1 0.2 0.5 1 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp SFH 4059 Mazeichnung Package Outlines Mae in mm/ Dimensions in mm. Gehause / Package Epoxydharz / Epoxy Farbe / Colour Schwarz / black Gehausemarkierung/ Package marking Pad 1: Kathode / cathode Pad 2: Anode / anode 2010-11-09 6 SFH 4059 Gurtung / Polaritat und Lage Verpackungseinheit 2000/Rolle, o180 mm Method of Taping / Polarity and Orientation Packing unit 2000/reel, o180 mm Mae in mm (inch) / Dimensions in mm (inch). Empfohlenes Lotpaddesign Recommended Solder Pad Reflow Loten Reflow Soldering Mae in mm / Dimensions in mm (inch). 2010-11-09 7 SFH 4059 Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 3 Preconditioning acc. to JEDEC Level 3 (nach J-STD-020-D.01) (acc. to J-STD-020-D.01) OHA04525 300 C T 250 Tp 245 C 240 C tP 217 C 200 tL 150 tS 100 50 25 C 0 0 50 100 150 200 250 s 300 t Pb-Free (SnAgCu) Assembly Profile Feature Recommendation Max. Ratings Ramp-up Rate to Preheat* 25C to 150C 2C / sec 3C / sec Time ts from TSmin to TSmax (150C to 200C 100s min. 60sec max. 120sec Ramp-up Rate to Peak*) TSmax to TP 2C / sec 3C / sec ) Liquidus Temperture TL 217C Time tL above TL 80sec max. 100sec Peak Temperature TP 245C max. 260C Time tP within 5C of the specified peak temperature TP - 5K 20sec min. 10sec max. 30sec Ramp-down Rate* TP to 100C 3C / sec 6C / sec maximum Time 25C to Peak temperature max. 8 min. All temperatures refer to the center of the package, measured on the top of the component * slope calculation T/t: t max. 5 sec; fulfillment for the whole T-range 2010-11-09 8 SFH 4059 Published by OSRAM Opto Semiconductors GmbH Leibnizstrasse 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2010-11-09 9