SCD55100A, SCD55101A, SCD55102A, SCD55103A, SCD55104A
2008-07-22 10
Row Strobing
Multiplexer and Display Driver
The ten characters are row multiplexed with RAM resident column
data. The strobe rate is established by the internal or external
MUX Clock rate. The MUX Clock frequency is divided by a 320
counter chain. This results in a typical strobe rate of 750 Hz. By
pulling the Clock SEL line low, the display ca n be operated from an
external MUX Clock. The external clock is attached to the CLK I/O
connection (pin 15). The maxim um external MUX Clock frequency
should be limited to 1.0 MHz.
An asynchronous hardware Reset (pin 13) is also provided. Bring-
ing this pin low will clear the Character Address Register, Control
W ord Register , RAM, and blanks the displa y. This action lea ves the
display set at Char acter Address 0, and the Brightness Lev el set at
100%.
Electrical & Mechanical Considerations
Interconnect Considerations
Optimum product performance can be had when the following
electrical and mechanical recommendations are adopted. The
SCD5510XA’s IC is constructed in a high speed CMOS process,
consequently high speed noise on the SERIAL DATA, SERIAL
DATA CLOCK, LOAD and RESET lines may cause incorrect data
to be written into the serial shift register. Adhere to transmission
line termination procedures when using fast line drivers and long
cables (>10 cm).
Good digital grounds (pins 14, 28) and power supply decoupling
(pins 6, 9, 20, 23) will insure that ICC (<400 mA peak) switching
currents do not generate localized ground bounce. Therefore it is
recommended that each display package use a 0.1 µF and 20 µF
capacitor between VCC and ground.
When the internal MUX Clock is being used connect the CLKSEL
pin to VCC. In those applications where RESET will not be con-
nected to the system’s reset control, it is recommended that this
pin be connected to the center node of a series 0.1 µF and 100 kΩ
RC network. Thus upon initial power up the RESET will be held
low for 10 ms allowing adequate time for the system power supply
to stabilize.
The SCD5510XA allows up to 1.7 W of power dissipation at 70 °
and 1.29 W power dissipation at a maximum operating tempera-
ture of 85°C . Approximately 60% of this power is dissipated by the
IC to the PC board via the VCC connection (pin s 6, 9, 20 , 23). Op ti-
mum thermal reliability is obtained by connecting all of the VCC
pins to a com mon pad locat ed on both si des of the PC b oard. This
techniqu e o ffers a low thermal resis tan ce for IC to system am bi-
ent.
ESD Protection
The input protect ion structure of th e SC D55 10 0A/ 1A/2 A/3 A/ 4A
provides significant protection against ESD damage. It is capable
of withstanding discharges greater than 2.0 kV. Take all the stan-
dard precautions, normal for CMOS components. These include
properly grounding personnel, tools, tables, and transport carriers
that come in contact with unshielded parts. If these conditions are
not, or cannot be met, keep the leads of the device shorted
together or the parts in anti-static packaging .
Soldering Considerations
The SCD55100A/1A/2A/3A/4A can be hand soldered with SN63
solder using a grounded iron set to 260°C.
Wave soldering is also possible following these conditions: Pre-
heat that does not e xceed 93°C on the solder side of the PC board
or a package surface temperature of 85°C. Water soluble organic
acid flux (except carboxylic acid) or rosin-based RMA flux without
alcohol can be used.
Wa ve temperature of 245°C ± 5°C with a dwell between 1.5 sec. to
3.0 sec. Exposure to the wave shou ld no t exceed temperatures
above 260°C for five s econ ds a t 1. 59 mm (0.063") below the seat-
ing plane. The p ackages should no t be imm er sed in th e wa ve.
Post Solder Cleaning Procedures
The least offensive cleaning solution is hot D.I. water (60 °C) for
less than 15 minutes . Addition of mild saponifiers is acceptab le. Do
not use commercial dishwasher detergents.
For faster cleaning, solvents may be used. Exercise care in choos-
ing solvents as some may chemically attack the nylon package.
Maxim um e x posure should not exceed two min utes at elevated tem -
peratur e s. Accept able so lvent s are TF (t richlo rot rifluo ret ha ne ) , TA,
111 Trichloroethane, and unheated acetone.(1)
Note:
1) Acceptable commercial solvents are: Basic TF, Arklone, P.
Genesolv,
D. Genesolv DA, Blaco-Tron TF and Blaco-Tron TA.
Unacceptable solvents contain alcohol, methanol, methylene
chloride, ethanol, TP35, TCM, TMC, TMS+, TE, or TES. Since
many commercial mixtures exist, contact a solvent vendor for
chemical composition information. Some major solvent manufac-
turers are: Allied Chemical Cor poration, Specialty Chemical Divi-
sion, Morristown, NJ; Baron-Blakeslee, Chicago, IL; Dow
Chemical, Midland, MI; E.I. DuPont de Nemours & Co., Wi lming-
ton, DE.
IDXX5188
Row 0
Row 1
Row 2
Row 3
Row 4 01234
Columns
Load Row 0
Load
4
Row 4
Columns
10 2 3
Row 3
Row 1
Row 0
Row 2
Load Row 1
Columns
Row 4 1
0 2 43
Load Row 2
Row 2
Row 1
Row 3
Row 0
Row 4 0Columns
213
4
Load Row 3
Row 0
Row 3
Row 1
Row 2
Row 4
Columns
012 43
Row 2
Row 1
Row 3
Row 0
Load Row 4Row