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1. SCOPE
This specifications shall be applied to CHIP INDUCTORS KQM 0603T produced
by KOA corporation.
2. TYPE DESIGNATION
Ty pe designation shall be as the following form.
KQM 0603 T TE R12 J
Termination Surface
Type
Component Size Material Packaging Nominal Inductance Tolerance
Winding
Form
1.6×1.0×0.9
(mm)
T : S n
TE : Embossed
Taping
None : Bulk
1N8 --- 1.8nH
56N --- 56nH
R12 --- 120 nH
D: ±0.5nH
J :± 5%
3. RATING
No ITEM SPECIFICATION
1 Nom inal inductance range 1.6 nH390 nH
2 Nom inal inductance tolerance
3 Q (Quality factor)
4 Self-resonant frequency (MHz)
5 DC resistance (ohm )
6 Allowable current (m A)
7 Measurem ent frequency (MHz)
The rating shall be shown in
the TABLE-1
8 Storage tem perature range -40℃〜 +100
9 Operating tem perature range -40℃〜 +125
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TABLE-1
ORDERING
CODE
NOMINAL
INDUCTANCE
@100MHz
INDUCTANCE
TOLERANCE
QUALITY
FACTOR
MIN.
Q
MEASURING
FREQ.
(MHz)
SELF RESONANT
FREQ.
MIN. (MHz)
DC
RESISTANCE
MAX.
(Ω)
ALLOWABLE
DC CURRENT
MAX. (mA)
KQM0603TTE1N6□ 1.6 n H 24 250 12500 0.030 850
KQM0603TTE1N8□ 1.8 n H 16 250 12500 0.045 850
KQM0603TTE3N3□ 3.3 n H 22 250 6900 0.055 850
KQM0603TTE3N6□ 3.6 n H 25 250 6900 0.059 850
KQM0603TTE3N9□ 3.9 n H 35 250 6900 0.059 850
KQM0603TTE4N3□ 4.3 n H 35 250 6000 0.059 850
KQM0603TTE4N7□ 4.7 n H 35 250 6000 0.059 850
KQM0603TTE5N1□ 5.1 n H 35 250 6000 0.082 750
KQM0603TTE6N8□ 6.8 n H 35 250 6000 0.082 750
KQM0603TTE7N5□ 7.5 n H 35 250 6000 0.082 750
KQM0603TTE8N2□ 8.2 n H 35 250 6000 0.11 700
KQM0603TTE8N7□ 8.7 n H 35 250 4600 0.109 700
KQM0603TTE9N5□ 9.5 n H
C(±0.2nH)
D(±0.5nH)
35 250 6000 0.11 700
KQM0603TTE10N□ 10 n H 35 250 6000 0.11 700
KQM0603TTE11N□ 11 n H 35 250 4600 0.086 700
KQM0603TTE12N□ 12 n H 35 250 4500 0.13 700
KQM0603TTE15N□ 15 n H 40 250 4200 0.13 700
KQM0603TTE16N□ 16 n H 40 250 3800 0.104 700
KQM0603TTE18N□ 18 n H 40 250 3600 0.16 700
KQM0603TTE22N□ 22 n H 40 250 3500 0.17 700
KQM0603TTE23N□ 23 n H 40 250 3300 0.15 700
KQM0603TTE24N□ 24 n H 40 250 3200 0.135 700
KQM0603TTE27N□ 27 n H 40 250 3200 0.21 600
KQM0603TTE30N□ 30 n H 40 250 3000 0.144 600
KQM0603TTE33N□ 33 n H 40 250 2900 0.22 600
KQM0603TTE36N□ 36 n H 40 250 2900 0.25 600
KQM0603TTE39N□ 39 n H 40 250 2800 0.25 600
KQM0603TTE43N□ 43 n H 40 200 2700 0.28 600
KQM0603TTE47N□ 47 n H 38 200 2600 0.28 600
KQM0603TTE51N□ 51 n H 38 200 2600 0.30 600
KQM0603TTE56N□ 56 n H 38 200 2400 0.31 600
KQM0603TTE68N□ 68 n H 38 200 2200 0.34 600
KQM0603TTE72N□ 72 n H 34 150 2100 0.49 400
KQM0603TTE82N□ 82 n H 34 150 2000 0.54 400
KQM0603TTER10□ 100 n H 34 150 1800 0.58 400
KQM0603TTER11□ 110 n H 32 150 1800 0.61 300
KQM0603TTER12□ 120 n H 32 150 1600 0.65 300
KQM0603TTER15□ 150 n H 32 150 1400 1.4 160
KQM0603TTER18□ 180 n H 25 100 1300 2.2 140
KQM0603TTER20□ 200 n H 25 100 1250 2.3 130
KQM0603TTER21□ 210 n H 25 100 1200 2.3 130
KQM0603TTER22□ 220 n H 25 100 1200 2.5 120
KQM0603TTER25□ 250 n H 25 100 1000 2.4 120
KQM0603TTER27□ 270 n H 30 100 1000 2.3 170
KQM0603TTER33□ 330 n H 30 100 800 3.0 100
KQM0603TTER39□ 390 n H
G(±2% )
J(±5% )
K(±10% )
30 100 800 3.7 80
TE : EMBOSSED PLASTIC : TOLERANCE CHARACTER ( C, D, G, J, K, )
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4. DIMENSIONS
LP
H
Ht
W
Wt
Dimension L W H Wt Ht P
mm 1.6±0.1 1.0±0.1 0.9±0.1 0.85±0.1 0.25±0.15 0.35±0.1
5. CONSTRUCTION
Magnet W ire
Ceram ic Core
Inner Coat
FlatTopFilm
E lectrode(Ag/Pd+N i+Sn So lder ing)
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6. MARKING OF INDUCTANCE
The m arking of nominal inductance consists of only one-figure number
as detailed below:
VALUE NUMBER VALUE NUMBER VALUE NUMBER VALUE NUMBER
1.6 nH C 9.5nH B 33 nH 9 120 nH 8
1.8 nH 0 10 nH 3 36 nH P 150 nH 9
3.3 nH X 11 nH K 39 nH 0 180 nH 0
3.6 nH E 12 nH 4 43 nH Q 200 nH U
3.9 nH 1 15 nH 5 47 nH 1 210 nH V
4.3 nH F 16 nH L 51 nH T 220 nH 1
4.7 nH G 18 nH 6 56 nH 2 250 nH W
5.1 nH Y 22 nH 7 68 nH 3 270 nH 2
6.8 nH 2 23 nH S 72 nH 4 330 nH 3
7.5 nH H 24 nH M 82 nH 5 390 nH 4
8.2 nH A 27 nH 8 100 nH 6
8.7 nH J 30 nH N 110 nH 7
No tolerance of inductance shall be indicated.
7. MEASUREMENT METHOD
Nom inal Inductance
Range Test Equipm ent Fixture
Setup Measuring
Frequency
1.6nH to 390nH
4291A RF
Im pedance
Analyzer (H.P)
16193A
Test Fixture
E.L=1.4cm
OSC=500m V
Listed
TABLE-1
8. TEST CONDITIONS
Unless otherwise specified, the test shall be performed at the tem perature of
20±15 and at a relative hum idity of 65±20%. Revers for the test conditions shall be
perform ed at the temperature of 20±2 and at a relative humidity of 65±5%.
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9. RELIABILITY TESTS
9-1 Electrical Characteristics
ITEM REQUIREMENT TEST METHODS
Dielectric
Withstanding
Voltage
No evidence of
flam ing, fuming,
or breakdown
5 seconds at AC 500V applied
between both term inals and film.
Insulation
Resistance
1000MΩ and over 1 minute at D C 100V measured
between both term inals and film.
Flammability IEC 695-2-2 Withstands needle-flam e test.
9-2 Mechanic al Character istics
ITEM REQUIREMENT TEST METHODS
Terminal
Pull Strength No evidence of
dam age Term inals shall be withstand a pull
of 5N in a horizontal direction.
Term inal Bending
Strength No evidence of
breakdown Specim en shall be soldered on bend
test board and force applied to the
opposite side to cause a 3 m m
deflection
Vibration L/L within ±5%
Q/Q within ±10%
2 hours in each direction of X,Y,Z
on PCB at a frequency range of
10-55-10Hz with 1. 5 mm amplitude
Dropping No evidence of
damage
L/L within ±5%
Q/Q within ±10%
Dropping 1 m on the ground of
concrete 1 tim e
Resistance to
Soldering Heat No evidence of
outer dam age
L/L within ±5%
Q/Q within ±10%
Im merse in the solder at 260±5
for 10±1 seconds
Solderability 95% of the
term inal should be
covered with new solder
Im merse in the solder at 230±5
for 3±0.5 seconds
Resistance to
Solvent No dam age and
marking must
rem ain legible
Accordance with MIL-STD-202F
Method 215
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9-3 Environm ental Character istics
ITEM REQUIREMENT TEST METHODS
Low Temperature
Storage
No evidence of
damage
L/L within ±5%
Q/Q within ±10%
Store at -40±2, for 1000 hours
High Tem perature
Storage No evidence of
dam age
L/L within ±5%
Q/Q within ±10%
Store at +125±2, for 1000 hours
Moisture
Endurance No evidence of
dam age
L/L within ±5%
Q/Q within ±10%
Store at +40±2,9095%RH for
1000 hours
Load Life No evidence of
dam age
L/L within ±5%
Q/Q within ±10%
Biased to full rated current at
+125 for 1000 hours
High Tem perature
High Humidity No evidence of
dam age
L/L within ±5%
Q/Q within ±10%
Biased to 10% rated current at
+85,85%RH for 1000 hours
Therm al Shock No evidence of
damage
L/L within ±5%
Q/Q within ±10%
100cycles between
-40/0.5hour and +125/0.5hour
Tem perature
Characteristics L/L within ±5%
L/L to be measured at the
tem perature of between -40 and
+125 as based on the inductance
at 20
Unless otherwise specified, m easurements shall be perform ed within 2 hours after
leaving test samples for more than one hour at the normal tem perature and at the
normal humidity.
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10. PACKAGING
10-1 Bulk packaging
(1) 200pcs CHIP INDUCTORS are packed in a poly bag.
(2) Inner box shall be indicated Type ( KQM0603T), Nominal Inductance,
Tolerance, Quantity, Production lot number,
Manufacture's name or Trade mark..
10-2 Taping
The tapes for taping shall be em bossed carrier tapes of 8 mm width
and 4 mm pitches. The standard quantity per reel be 2,000 pcs.
(1) Dim ensions of Carrier Tape

1
T
φD
11
P
2
P
0
P
φD
2
T
EF
W
0
A
Ch ip Inductor
Tap ing Runn ing D irect ion
B
Feed ing Ho le
[ unit : mm ]
A B W E F T1
1.15±0.05 1.86±0.05 8.0±0.1 1.75±0.10 3.50±0.05 0.98±0.05
T2 P
0 P
1 P
2 φD0 φD1
0.25±0.05 4.0±0.1 4.0±0.1 2.00±0.05 1.5
± 0.60±0.05
0.1
0
20 Pitches accumulation of feeding holes shall be 80±0.15m m.
Top tape peeling strength : 0.1 N0.7 N
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(2) Taped Configuration
Conform ing to EIA-481 standard
・・・・・ ・・・・・ ・・・・・ ・・・・・
Empty Space
Chip Mounting Space
Empty Space Leader Space
Drawing out Direction
160mm Min. 230mm Min. 170mm Min.
Beginning END
(3) Reel Dim ensions and Indication
φB
φA
φC
W1
φD
φA φB φC φD E W W1
180±3 0 60±1.0 13±0.2 21.0±0.8 2.0±0.5 9.0±0.3 11.4±1.0
The following items shall be indicated on the reel.
(
) Type(KQM0603TTE)
(
) Nominal inductance and tolerance
(
) Quantity
(
) Production lot number
(
) Manufacturer’s name or trade m ark
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11 GENERAL INFORMATION
(1) Storage
CHIP INDUCTORS shall not be stored under high temperature and high
hum idity conditions. Especially , do not store TAPING where they are
exposed to heat or direct sunlight. Otherw ise, the packing material m ay be
deformed, causing problems during mounting.
(2) Mounting
Placement force should not be excessive.
(3) Soldering
・Reflow soldering should done at 240 for less than 30 seconds with eutectic
solder, and peak 250 more than 230 for 30-40 seconds withlead free
solder.
When using a soldering iron, temperature shall not exceed 350 and within
3 seconds. Soldering iron time of each electrode shall be allowed only one
time. After soldering, CHIP INDUCTORS shall not be stressed excessively.
(4) Cleaning
It is no problem to use organic solvents.
Since this CHIP INDUCTOR is a coil of ultra-fine wire, it is susceptible to
vibration. If an ultrasonic cleaning unit is used for cleaning, check for any
possibility of problem generation before practical use since such cleaning
units considerably differ in vibration level and mode.
Although the conditions differ depending on the printed board size,
ultrasonic cleaning is generally used in the conditions described below as
examples.
Power : Within 20 W / L
Cleaning times : Within 5 minutes
(5) Pattern design
The land pattern is recommended as follows.
Inductor Position
Solder Resist
C
B
D
A
Land [ UNIT : mm]
A B C D
0.64 1.92 1.02 0.16
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