This is information on a product in full production.
May 2012 Doc ID 15755 Rev 2 1/10
10
X00619
0.8 A sensitive gate SCR
Datasheet − production data
Features
■IT(RMS) = 0.8 A
■VDRM, VRRM = 600 V
■IGT = 30 to 200 µA
Applications
■Limited gate current topologies
■Ground fault circuit interrupters
■Overvoltage crowbar protection in power
supplies
■Protection in electronic ballasts
■Capacitive discharge ignitions
■Ignitors (lighting, oven...)
Description
The X006 SCR can be used as on/off function in
applications where topology does not offer high
current for gate triggering.
This device is optimized in forward voltage drop
and inrush current capabilities for reduced power
losses and high reliability in harsh environments.
Table 1. Device summary
IT(RMS) 0.8 A
VDRM / VRRM 600 V
IGT 30 to 200 µA
A
K
G
TO-92
X00619-MA
A
KG
A
A
K
G
SOT-223
X00619MN
www.st.com
Characteristics X00619
2/10 Doc ID 15755 Rev 2
1 Characteristics
Table 2. Absolute ratings (limiting values, Tj = 25 °C unless otherwise specified)
Symbol Parameter Value Unit
IT(RMS) On-state rms current (180 °Conduction angle) TO-92 TL = 83 °C 0.8 A
SOT-223 Tc = 107 °C
IT(AV) Average on-state current (180 °Conduction angle) TO-92 TL = 83 °C 0.5 A
SOT-223 Tc = 107 °C
ITSM Non repetitive surge peak on-state current tp = 8.3 ms Tj = 25 °C 10 A
tp = 10 ms 9
I²tI
²t Value for fusing tp = 10 ms Tj = 25 °C 0.4 A2s
di/dt Critical rate of rise of on-state current
IG = 2 x IGT
, tr ≤ 100 ns F = 60 Hz Tj = 125 °C 50 A/µs
IGM Peak gate current tp = 20 µs Tj = 125 °C 1 A
PG(AV) Average gate power dissipation Tj = 125 °C 0.1 W
Tstg
Tj
Storage junction temperature range
Operating junction temperature range
- 40 to + 150
- 40 to + 125 °C
Table 3. Electrical characteristics (Tj = 25 °C unless otherwise specified)
Symbol Test conditions Value Unit
IGT VD = 12 V, RL = 140 Ω
MIN. 30 µA
MAX. 200
VGT 0.8 V
VGD VD = VDRM, RL = 3.3 kΩ, RGK = 1 kΩTj = 125 °C MIN. 0.2 V
VRG IRG = 10 µA MIN. 5 V
IHIT = 50 mA, RGK = 1 kΩMAX. 5 mA
ILIG = 1 mA, RGK = 1 kΩ MAX. 6 mA
dV/dt VD = 67% VDRM, RGK = 1 kΩTj = 125 °C MIN. 40 V/µs
Table 4. Static electrical characteristics
Symbol Test conditions Value Unit
VTM ITM = 1 A, tp = 380 µs Tj = 25 °C
MAX
1.35 V
VTO Threshold voltage Tj = 125 °C 0.85 V
RdDynamic resistance 245 mΩ
IDRM IRRM VDRM = VRRM, RGK = 1 kΩTj = 25 °C 1 µA
Tj = 125 °C 100 µA
X00619 Characteristics
Doc ID 15755 Rev 2 3/10
Table 5. Thermal resistances
Symbol Parameter Value Unit
Rth(j-l) Junction to leads (DC) TO-92
Max.
70
°C/W
Rth(j-c) Junction to case (DC) SOT-223 30
Rth(j-a) Junction to ambient (DC) TO-92 150
S = 5 cm2SOT-223 60
Figure 1. Maximum average power
dissipation versus average
on-state current
Figure 2. Average and DC on-state current
versus case temperature (SOT-223)
P(W)
0.0
0.2
0.4
0.6
0.0 0.1 0.2 0.3 0.4 0.5 0.6
°°° °
°DC
I (A)
T(AV)
360°
α
α= 30°, 60°, 90°, 120°, 180°, DC
I (A)
T(AV)
0.0
0.2
0.4
0.6
0.8
1.0
0 25 50 75 100 125
SOT-223
T (°C)
l
α= 30°, 60°, 90°, 120°, 180°, DC
Figure 3. Average and DC on-state current
versus lead temperature (TO-92)
Figure 4. Average and DC on-state current
versus ambient temperature (free
air convection)
I (A)
T(AV)
0.0
0.2
0.4
0.6
0.8
1.0
0 25 50 75 100 125
TO-92
T (°C)
l
α= 30°, 60°, 90°, 120°, 180°, DC
I (A)
T(AV)
0.0
0.2
0.4
0.6
0.8
1.0
0 25 50 75 100 125
TO-92
S
CU
= 0.5 cm²
T (°C)
amb
α= 180°
DC
SOT-223
S
CU
= 5 cm²
Characteristics X00619
4/10 Doc ID 15755 Rev 2
Figure 5. Relative variation of thermal
impedance junction to ambient
versus pulse duration
Figure 6. Relative variation of gate trigger,
holding and latching current versus
junction temperature
Z/R
th(j-a) th(j-a)
0.01
0.10
1.00
1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
SOT-223
S
CU
= 5 cm²
TO-92
S
CU
= 0.5 cm²
t (s)
p
I,I,I[T] /
GTHL j
I ,I ,I [T =25°C]
GTHL j
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
-40 -20 0 20 40 60 80 100 120
I
GT
I
H
and I
L
Typical values
T (°C)
j
Figure 7. Relative variation of holding
current versus gate-cathode
resistance (typical values)
Figure 8. Relative variation of dV/dt immunity
versus gate-cathode resistance
(typical values)
I [R ] / I [ =1k ]
HGK H
ΩR
GK
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
R(k)
GK Ω
dV/dt[R ] / dV/dt[ =1k ]
GK ΩRGK
0.1
1.0
10.0
100.0
1.0E-01 1.0E+00 1.0E+01
VD= 0.67xVDRM
R(k)
GK Ω
Figure 9. Relative variation of dV/dt immunity
versus gate-cathode capacitance
(typical values)
Figure 10. Surge peak on-state current versus
number of cycles
dV/dt[C ] / dV/dt[ =1k ]
GK ΩRGK
1
10
100
1 10
V
D
= 0.67xV
DRM
R
gk
= 1 kΩ
C (nF)
GK
0
1
2
3
4
5
6
7
8
9
10
1 10 100 1000
Non repetitive
T
j
initial=25 °C
Repetitive
T
l
= 25 °C
One cycle
tp=10ms
Number of cycles
I (A)
TSM
X00619 Characteristics
Doc ID 15755 Rev 2 5/10
Figure 13. Thermal resistance junction to ambient versus copper surface under tab (SOT-223)
Figure 11. Non repetitive surge peak on state
current for a sinusoidal pulse and
corresponding value of I2T
Figure 12. On-state characteristics (maximum
values)
I (A), I t (A s)
TSM 22
0
1
10
100
0.01 0.10 1.00 10.00
ITSM
I²t
Tjinitial=25 °C
t(ms)
p
I (A)
TM
0.1
1.0
10.0
0.5 1.0 1.5 2.0 2.5 3.0
Tjmax
Vto =0.85 V
Rd=245 mΩ
TJ=125 C
TJ=25 C
V (V)
TM
R (°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Epoxy printed circuit board FR4
copper thickness = 35 µm
S(cm²)
Ordering information scheme X00619
6/10 Doc ID 15755 Rev 2
2 Ordering information scheme
Figure 14. Ordering information scheme
X 006 19 M A 1AA2
Sensitive SCR series
Sensitivity
Voltage
Package
Package
Current
006 = 0.8 A
2AL2 = Ammopack (TO-92)
5AL2 = Tape and reel (TO-92 and SOT-223)
19 = 30 µA to 200 µA
M = 600 V
A = TO-92
N = SOT-223
1AA2 = Bulk (TO-92)
X00619 Package information
Doc ID 15755 Rev 2 7/10
3 Package information
●Epoxy meets UL94, V0
●Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 6. TO-92 (plastic) dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A - 1.35 - - 0.053 -
B - - 4.70 - - 0.185
C - 2.54 - - 0.100 -
D 4.40 - - 0.173 - -
E 12.70 - - 0.500 - -
F - - 3.70 - - 0.146
a - - 0.50 - - 0.019
A
F
C
B
a
DE
Package information X00619
8/10 Doc ID 15755 Rev 2
Figure 15. SOT-223 footprint
Table 7. SOT-223 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A1.800.071
A1 0.02 0.10 0.001 0.004
B 0.60 0.70 0.85 0.024 0.027 0.033
B1 2.90 3.00 3.15 0.114 0.118 0.124
c 0.24 0.26 0.35 0.009 0.010 0.014
D(1)
1. Do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm (0.006inches)
6.30 6.50 6.70 0.248 0.256 0.264
e 2.3 0.090
e1 4.6 0.181
E(1) 3.30 3.50 3.70 0.130 0.138 0.146
H 6.70 7.00 7.30 0.264 0.276 0.287
V 10° max
A
A1
e1
D
B1
HE
e
12
4
3
B
Vc
3.25
1.32
7.80
5.16
1.32
2.30 0.95
X00619 Ordering information
Doc ID 15755 Rev 2 9/10
4 Ordering information
5 Revision history
Table 8. Ordering information
Order code Marking Package Weight Base qty Delivery mode
X00619MA1AA2
X0619 MA TO-92 0.2 g
2500 Bulk
X00619MA2AL2 2000 Ammopack
X00619MA5AL2 2000 Tape and reel
X00619MN5AL2 X0 619 MN SOT-223 0.12 g 1000
Table 9. Document revision history
Date Revision Changes
26-May-2009 1 First issue
03-May-2012 2 Added SOT-223 package.
X00619
10/10 Doc ID 15755 Rev 2
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