DATA SHEET PHOTOCOUPLER PS2502-1,-2,-4,PS2502L-1,-2,-4 HIGH ISOLATION VOLTAGE DARLINGTON TRANSISTOR TYPE MULTI PHOTOCOUPLER SERIES -NEPOC Series- DESCRIPTION The PS2502-1, -2, -4 and PS2502L-1, -2, -4 are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon darlington connected phototransistor. The PS2502-1, -2, -4 are in a plastic DIP (Dual In-line Package) and the PS2502L-1, -2, -4 are lead bending type (Gull-wing) for surface mount. FEATURES PIN CONNECTION * High isolation voltage (BV = 5 000 Vr.m.s.) (Top View) * High current transfer ratio (CTR = 2 000% TYP.) PS2502-1, PS2502L-1 * High-speed switching (tr, tf = 100 s TYP.) 4 3 1. Anode 2. Cathode 3. Emitter 4. Collector * Ordering number of tape product: PS2502L-1-E3, E4, F3, F4, PS2502L-2-E3, E4 * Safety standards * UL approved: File No. E72422 1 2 PS2502-2, PS2502L-2 APPLICATIONS 8 7 6 5 1, 3. Anode 2, 4. Cathode 5, 7. Emitter 6, 8. Collector * Power supply * Telephone/FAX * FA/OA equipment 1 * Programmable logic controller 2 3 4 PS2502-4, PS2502L-4 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 1, 3, 5, 7. Anode 2, 4, 6, 8. Cathode 9, 11, 13, 15. Emitter 10, 12, 14, 16. Collector The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PN10226EJ02V0DS (2nd edition) Date Published March 2006 CP(K) Printed in Japan The mark shows major revised points. NEC Compound Semiconductor Devices, Ltd. 1988, 2006 PS2502-1,-2,-4,PS2502L-1,-2,-4 PACKAGE DIMENSIONS (UNIT : mm) DIP Type (New package) PS2502-1 6.50.5 4.60.35 3.50.3 3.20.4 4.150.4 7.62 0 to 15 +0.1 0.25 -0.05 1.250.15 0.500.10 0.25 M 2.54 Caution New package 1-ch only DIP Type PS2502-2 PS2502-1 4.60.5 6.50.5 6.50.5 9.70.5 7.62 0 to 15 +0.1 0.25 -0.05 1.250.15 3.50.3 3.30.5 4.150.4 3.50.3 3.30.5 4.150.4 7.62 0.500.10 1.250.15 0.500.10 0.25 M 0.25 M 2.54 2.54 PS2502-4 6.50.5 19.80.5 3.50.3 3.30.5 4.150.4 7.62 0.500.10 1.250.15 2.54 2 0.25 M Data Sheet PN10226EJ02V0DS 0 to 15 +0.1 0.25 -0.05 0 to 15 +0.1 0.25 -0.05 PS2502-1,-2,-4,PS2502L-1,-2,-4 Lead Bending Type (New package) PS2502L-1 0.1 +0.1 -0.05 3.50.3 0.25 +0.1 -0.05 6.50.5 4.60.35 0.90.25 9.600.4 1.250.15 0.25 M 2.54 0.15 Caution New package 1-ch only Lead Bending Type PS2502L-2 PS2502L-1 4.60.5 0.90.25 9.600.4 1.250.15 0.25 M 0.25 M 2.54 0.1 +0.1 -0.05 0.90.25 9.600.4 1.250.15 0.15 0.15 PS2502L-4 1.250.15 0.25 M 2.54 0.15 Data Sheet PN10226EJ02V0DS 0.1 +0.1 -0.05 0.25 +0.1 -0.05 6.50.5 19.80.5 3.50.3 2.54 0.25 +0.1 -0.05 3.50.3 0.1 +0.1 -0.05 3.50.3 0.25 +0.1 -0.05 6.50.5 6.50.5 9.70.5 0.90.25 9.600.4 3 PS2502-1,-2,-4,PS2502L-1,-2,-4 MARKING EXAMPLE PS2502-1 PS2502-2, -4 No. 1 pin Mark No. 1 pin Mark 2502 ML601 M L Assembly Lot 6 01 N Week Assembled Year Assembled (Last 1 Digit) In-house Code CTR Rank Code Package 4 Made in Japan Made in Taiwan L 6 01 Week Assembled Year Assembled (Last 1 Digit) In-house Code CTR Rank Code Package Standard PKG L N Standard PKG New PKG J K New PKG Data Sheet PN10226EJ02V0DS Country Assembled Type Number Assembly Lot PS2502-2 NL601 Made in Japan Made in Taiwan L N PS2502-1,-2,-4,PS2502L-1,-2,-4 ORDERING INFORMATION Part Number Order Number Solder Plating Packing Style Safety Standard Application Part Approval Number Specification PS2502-1 PS2502-1-A Pb-Free PS2502L-1 PS2502L-1-A PS2502L-1-E3 PS2502L-1-E3-A PS2502L-1-E4 PS2502L-1-E4-A PS2502L-1-F3 PS2502L-1-F3-A PS2502L-1-F4 PS2502L-1-F4-A PS2502-2 PS2502-2-A PS2502L-2 PS2502L-2-A PS2502L-2-E3 PS2502L-2-E3-A PS2502L-2-E4 PS2502L-2-E4-A PS2502-4 PS2502-4-A PS2502L-4 PS2502L-4-A Magazine case 100 pcs Standard products *1 PS2502-1 (UL Approved) Embossed Tape 1 000 pcs/reel Embossed Tape 2 000 pcs/reel Magazine case 45 pcs PS2502-2 Embossed Tape 1 000 pcs/reel Magazine case 20 pcs PS2502-4 *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25 C, unless otherwise specified) Parameter Diode Symbol Unit PS2502-1, PS2502-2,-4 PS2502L-1 PS2502L-2,-4 Reverse Voltage VR 6 V Forward Current (DC) IF 80 mA/ch Power Dissipation Derating Power Dissipation *1 Peak Forward Current Transistor Ratings PD/C 1.5 1.2 mW/C PD 150 120 mW/ch IFP 1 A/ch Collector to Emitter Voltage VCEO 40 V Emitter to Collector Voltage VECO 6 V Collector Current Power Dissipation Derating Power Dissipation Isolation Voltage *2 IC 200 160 mA/ch PC/C 2.0 1.6 mW/C PC 200 160 mW/ch BV 5 000 Vr.m.s. Operating Ambient Temperature TA -55 to +100 C Storage Temperature Tstg -55 to +150 C *1 PW = 100 s, Duty Cycle = 1% *2 AC voltage for 1 minute at TA = 25C, RH = 60% between input and output Pins 1-2 shorted together, 3-4 shorted together (PS2502-1, PS2502L-1). Pins 1-4 shorted together, 5-8 shorted together (PS2502-2, PS2502L-2). Pins 1-8 shorted together, 9-16 shorted together (PS2502-4, PS2502L-4). Data Sheet PN10226EJ02V0DS 5 PS2502-1,-2,-4,PS2502L-1,-2,-4 ELECTRICAL CHARACTERISTICS (TA = 25C) Parameter Diode Transistor Symbol Conditions Forward Voltage VF IF = 10 mA Reverse Current IR VR = 5 V Terminal Capacitance Ct V = 0 V, f = 1.0 MHz ICEO VCE = 40 V, IF = 0 mA CTR IF = 1 mA, VCE = 2 V VCE(sat) IF = 1 mA, IC = 2 mA Collector to Emitter Dark MIN. TYP. MAX. Unit 1.17 1.4 V 5 A 50 pF 400 nA Current Coupled Current Transfer Ratio 200 2 000 % *1 (IC/IF) Collector Saturation 1.0 V Voltage VI-O = 1.0 kVDC Isolation Capacitance CI-O V = 0 V, f = 1.0 MHz 0.5 pF *2 Rise Time tr VCC = 10 V, IC = 2 mA, RL = 100 100 s *2 tf 100 *1 CTR rank (only PS2502-1, PS2502L-1) K : 2 000 to (%) L : 700 to 3 400 (%) M : 200 to 1 000 (%) *2 Test circuit for switching time Pulse Input VCC PW = 1 ms Duty Cycle = 1/10 IF 50 6 RI-O Fall Time 10 11 Isolation Resistance VOUT RL = 100 Data Sheet PN10226EJ02V0DS PS2502-1,-2,-4,PS2502L-1,-2,-4 TYPICAL CHARACTERISTICS (TA = 25C, unless otherwise specified) DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE 100 PS2502-2 PS2502L-2 PS2502-4 PS2502L-4 1.5 mW/C 50 1.2 mW/C 0 Forward Current IF (mA) Transistor Power Dissipation PC (mW) PS2502-1 PS2502L-1 25 50 75 100 125 200 PS2502-2 PS2502L-2 100 PS2502-4 PS2502L-4 1.6 mW/C 0 25 100 75 125 150 Ambient Temperature TA (C) FORWARD CURRENT vs. FORWARD VOLTAGE COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE 160 50 140 TA = +100 C +60 C +25 C 10 5 0 C -25 C -55 C 1 0.5 5 mA 120 100 80 2 mA 60 40 1 mA 20 0.8 50 Ambient Temperature TA (C) 100 0.7 2 mW/C 50 0.1 0.9 1.0 1.1 1.2 1.4 1.3 0 1.5 IF = 0.5 mA 2 4 6 8 10 Forward Voltage VF (V) Collector to Emitter Voltage VCE (V) COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATURE COLLECTOR CURRENT vs. COLLECTOR SATURATION VOLTAGE 200 VCE = 2 V 5V 10 V 24 V 40 V 1000 100 10 1 -50 -25 0 25 50 75 100 Ambient Temperature TA (C) Remark 5 mA 100 10 000 Collector Current IC (mA) Collector to Emitter Dark Current ICEO (nA) PS2502-1 PS2502L-1 150 150 Collector Current IC (mA) Diode Power Dissipation PD (mW) 150 2 mA 50 1 mA 10 0.5 mA 5 0.2 mA 1 0.5 0.2 0.4 IF = 0.1 mA 0.6 0.8 1.0 1.2 1.4 1.6 Collector Saturation Voltage VCE(sat) (V) The graphs indicate nominal characteristics. Data Sheet PN10226EJ02V0DS 7 PS2502-1,-2,-4,PS2502L-1,-2,-4 CURRENT TRANSFER RATIO vs. FORWARD CURRENT 8 000 1.4 Normalized to 1.0 at TA = 25 C, IF = 1 mA, VCE = 2 V 1.2 Current Transfer Ratio CTR (%) Normalized Current Transfer Ratio CTR NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE 1.0 0.8 0.6 0.4 0.2 -25 0 50 25 75 5 000 4 000 3 000 2 000 1 000 0.1 100 1 5 10 30 Forward Current IF (mA) SWITCHING TIME vs. LOAD RESISTANCE CURRENT TRANSFER RATIO vs. FORWARD CURRENT 3 000 tf 100 50 Current Transfer Ratio CTR (%) VCC = 5 V, 500 IC = 2 mA, CTR = 2 280 % tr td 10 5 ts 100 500 1k VCE = 2 V 2 500 2 000 Sample A B C D 1 500 1 000 500 0 5k 10 50 100 500 Load Resistance RL () Forward Current IF ( A) SWITCHING TIME vs. LOAD RESISTANCE FREQUENCY RESPONSE 10 000 5 000 tf VCC = 5 V, IF = 1 mA, CTR = 2 280 % 1 000 500 ts 100 50 tr IF = 1 mA, VCE = 2 V 0 Normalized Gain GV 2 30 50 0.5 Ambient Temperature TA (C) 1 000 Switching Time t ( s) Sample A B C D 6 000 0 -50 Switching Time t ( s) VCE = 2 V 7 000 -5 -10 -15 RL = 100 -20 10 td 300 500 1k 5k 10 k 50 k 100 k Load Resistance RL () Remark 8 0.2 0.5 1 2 5 10 20 Frequency f (kHz) The graphs indicate nominal characteristics. Data Sheet PN10226EJ02V0DS 50 100 200 PS2502-1,-2,-4,PS2502L-1,-2,-4 LONG TERM CTR DEGRADATION 1.2 IF = 1 mA CTR (Relative Value) 1.0 TA = 25 oC 0.8 TA = 60 oC 0.6 0.4 0.2 0 10 102 103 104 105 106 Time (Hr) Remark The graph indicates nominal characteristics. Data Sheet PN10226EJ02V0DS 9 PS2502-1,-2,-4,PS2502L-1,-2,-4 TAPING SPECIFICATIONS (UNIT : mm) 1.550.1 4.5 MAX. 10.30.1 7.50.1 1.5 +0.1 -0 16.00.3 2.00.1 4.00.1 1.750.1 Outline and Dimensions (Tape) 4.00.1 5.30.1 8.00.1 0.4 Tape Direction PS2502L-1-E3 PS2502L-1-E4 Outline and Dimensions (Reel) 2.00.5 21.00.8 80.01.0 R 1.0 2542.0 2.00.5 13.00.2 17.51.0 21.51.0 Packing: 1 000 pcs/reel 10 Data Sheet PN10226EJ02V0DS 15.9 to 19.4 Outer edge of flange PS2502-1,-2,-4,PS2502L-1,-2,-4 1.550.1 4.5 MAX. 10.30.1 7.50.1 1.5 +0.1 -0 16.00.3 2.00.1 4.00.1 1.750.1 Outline and Dimensions (Tape) 4.00.1 5.30.1 8.00.1 0.4 Tape Direction PS2502L-1-F3 PS2502L-1-F4 Outline and Dimensions (Reel) 2.00.5 21.00.8 1001.0 R 1.0 3302.0 2.00.5 13.00.2 17.51.0 21.51.0 Packing: 2 000 pcs/reel Data Sheet PN10226EJ02V0DS 15.9 to 19.4 Outer edge of flange 11 PS2502-1,-2,-4,PS2502L-1,-2,-4 4.5 MAX. 10.30.1 7.50.1 1.5 +0.1 -0 16.00.3 2.00.1 4.00.1 1.750.1 Outline and Diumensions (Tape) 4.00.1 10.40.1 1.550.1 12.00.1 0.3 Tape Dimesion PS2502L-2-E4 PS2502L-2-E3 Outline and Dimensions (Reel) R 1.0 1001.0 2.00.5 13.00.2 3302.0 2.00.5 21.00.8 17.51.0 21.51.0 Packing: 1 000 pcs/reel 12 Data Sheet PN10226EJ02V0DS 15.9 to 19.4 Outer edge of flange PS2502-1,-2,-4,PS2502L-1,-2,-4 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering * Peak reflow temperature 260C or below (package surface temperature) * Time of peak reflow temperature 10 seconds or less * Time of temperature higher than 220C 60 seconds or less * Time to preheat temperature from 120 to 180C 12030 s * Number of reflows Three * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating) Time (s) (2) Wave soldering * Temperature 260C or below (molten solder temperature) * Time 10 seconds or less * Preheating conditions 120C or below (package surface temperature) * Number of times One (Allowed to be dipped in solder including plastic mold portion.) * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by soldering iron * Peak temperature (lead part temperature) 350C or below * Time (each pins) 3 seconds or less * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100C. Data Sheet PN10226EJ02V0DS 13 PS2502-1,-2,-4,PS2502L-1,-2,-4 (4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler's input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. 3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler Check the setting values before use, since the forward current conditions at CTR measurement differ according to product. When using products other than at the specified forward current, the characteristics curves may differ from the standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual operating conditions and thoroughly take variations or the like into consideration before use. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. 14 Data Sheet PN10226EJ02V0DS PS2502-1,-2,-4,PS2502L-1,-2,-4 When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. * The information in this document is current as of March, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 Data Sheet PN10226EJ02V0DS 15 PS2502-1,-2,-4,PS2502L-1,-2,-4 Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth. 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