September 2006
Advance Information
Copyright © Alliance Memory. All rights reserved.
AS7C1025C
5V 128K X 8 CMOS SRAM (Center power and ground)
12/5/06, v. 1.0 Alliance Memory P. 1 of 9
®
Features
Industrial (-40o to 85oC) temperature.
Organization: 131,072 x 8 bits
High speed
- 15 ns address access time
- 6 ns output enable access time
Low power consumption via chip deselect
Easy memory expansion with
CE
,
OE
inputs
Center power and ground
TTL/LVTTL-compatible, three-state I/O
JEDEC-standard package
- 32-pin, 400 mil SOJ
ESD protection >
_ 2000 volts
Logic block diagram
131,072 x 8
Array
(1,048,576)
pm
a
esn
e
S
Input buffer
01A 11
A2
1
A31
A41
A51
A61
A
I/O0
I/O7
OE
CE
WE
Address decoder
redo
c
ed
s
se
rd
d
A
Control
circuit
9A
A0
A1
A2
A3
A4
A5
A6
A7
V
CC
GND
A8
Pin arrangement
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A16
A15
A14
A13
OE
I/O7
I/O6
GND
VCC
I/O5
I/O4
A12
A11
A10
A9
A8
A0
A1
A2
A3
CE
I/O0
I/O1
VCC
GND
I/O2
I/O3
WE
A4
A5
A6
A7
C5
201C7SA
32-pin SOJ (400 mil)
AS7C1025C
12/5/06, v. 1.0 Alliance Memory P. 2 of 9
®
Functional description
The AS7C1025C is a 5V high-performance CMOS 1,048,576-bit Static Random Access Memory (SRAM) devices organized
as 131,072 x 8 bits. They are designed for memory applications where fast data access, low power, and simple interfacing are
desired.
Equal address access and cycle times (tAA, tRC, tWC) of 15 ns with output enable access times (tOE) of 6 ns are ideal for high-
performance applications. The chip enable input CE permits easy memory and expansion with multiple-bank memory
systems.
When CE is high, the device enters standby mode. If inputs are still toggling, the device will consume ISB power. If the bus is
static, then full standby power is reached (ISB1).
A write cycle is accomplished by asserting write enable (
WE
) and chip enable (
CE
). Data on the input pins I/O0 through I/O7
is written on the rising edge of
WE
(write cycle 1) or
CE
(write cycle 2). To avoid bus contention, external devices should
drive I/O pins only after outputs have been disabled with output enable (
OE
) or write enable (
WE
).
A read cycle is accomplished by asserting output enable (
OE
) and chip enable (
CE
), with write enable (
WE
) high. The chips
drive I/O pins with the data word referenced by the input address. When either chip enable or output enable is inactive or write
enable is active, output drivers stay in high-impedance mode.
All chip inputs and outputs are TTL-compatible, and operation is from a single 5 V supply. The AS7C1025C is packaged in
common industry standard packages.
Note:
Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect reliability.
Key: X = don’t care, L = low, H = high.
Absolute maximum ratings
Parameter Symbol Min Max Unit
Voltage on VCC relative to GND Vt1 –0.50 +7.0 V
Voltage on any pin relative to GND Vt2 –0.50 VCC + 0.5 V
Power dissipation PD 1.25 W
Storage temperature (plastic) Tstg –55 +125 oC
Ambient temperature with VCC applied Tbias –55 +125 oC
DC current into outputs (low) IOUT 50 mA
Truth table
CE WE OE
Data Mode
H X X High Z Standby (ISB, ISB1)
L H H High Z Output disable (ICC)
L H L DOUT Read (ICC)
L L X DIN Write (ICC)
AS7C1025C
12/5/06, v. 1.0 Alliance Memory P. 3 of 9
®
Notes:
VIL min = -1.0V for pulse width less than 5ns, once per cycle.
VIH max = VCC+2.0V for pulse width less than 5ns, once per cycle.
Recommended operating conditions
Parameter Symbol Min Nominal Max Unit
Supply voltage VCC 4.5 5.0 5.5 V
Input voltage VIH 2.2 VCC + 0.5 V
VIL –0.5 0.8 V
Ambient operating temperature (Industrial) TA–40 85 oC
DC operating characteristics (over the operating range)1
Parameter Symbol Test conditions
AS7C1025C-15
UnitMin Max
Input leakage current | ILI | VCC = Max, VIN = GND to VCC 5 µA
Output leakage current | ILO | VCC = Max, CE = VIH,
Vout = GND to VCC
5 µA
Operating power supply current ICC
VCC = Max
CE ? VIL, f = fMax, IOUT = 0 mA 160 mA
Standby power supply current1ISB
VCC = Max
CE ? VIH, f = fMax
40 mA
ISB1
VCC = Max
CE ? VCC–0.2 V,
VIN ? 0.2 V or VIN ? VCC –0.2 V,
f = 0
10 mA
Output voltage VOL IOL = 8 mA, VCC = Min 0.4 V
VOH IOH = –4 mA, VCC = Min 2.4 V
Capacitance (f = 1 MHz, Ta = 25o C, VCC = NOMINAL)2
Parameter Symbol Signals Test conditions Max Unit
Input capacitance CIN A,
CE
,
WE
,
OE
VIN = 3dV 8 pF
I/O capacitance CI/O I/O VIN = VOUT = 3dV 8 pF
Note:
This parameter is guaranteed by device characterization, but is not production tested.
AS7C1025C
12/5/06, v. 1.0 Alliance Memory P. 4 of 9
®
Key to switching waveforms
Read waveform 1 (address controlled)3,6,7,9
Read waveform 2 (CE and OE controlled)3,6,8,9
Read cycle (over the operating range)3,9
Parameter Symbol
AS7C1025C-15
Unit NotesMin Max
Read cycle time tRC 15 ns
Address access time tAA 15 ns 3
Chip enable (
CE
) access time tACE 15 ns 3
Output enable (
OE
) access time tOE 6 ns
Output hold from address change tOH 4 ns 5
CE
low to output in low Z tCLZ 3 ns 4, 5
CE
low to output in high Z tCHZ 0 6 ns 4, 5
OE
low to output in low Z tOLZ 0 ns 4, 5
OE
high to output in high Z tOHZ 0 5 ns 4, 5
Power up time tPU 0 ns 4, 5
Power down time tPD 12 ns 4, 5
Undefined/don’t careFalling inputRising input
A
ddress
D
OUT
Data valid
t
OH
t
AA
t
RC
current
Supply
OE
D
OUT
t
OE
t
OLZ
t
ACE
t
CHZ
t
CLZ
t
PU
t
PD
I
CC
I
SB
50% 50%
Data valid
t
RC1
CE
t
OHZ
AS7C1025C
12/5/06, v. 1.0 Alliance Memory P. 5 of 9
®
Write waveform 1 (WE controlled)10,11
Write cycle (over the operating range)11
Parameter Symbol
AS7C1025C-15
Unit NotesMin Max
Write cycle time tWC 15 ns
Chip enable (
CE
) to write end tCW 8 ns
Address setup to write end tAW 8 ns
Address setup time tAS 0 ns
Write pulse width tWP 8 ns
Write recovery time tWR 0 ns
Address hold from end of write tAH 0 ns
Data valid to write end tDW 6 ns
Data hold time tDH 0 ns 4, 5
Write enable to output in high Z tWZ 5 ns 4, 5
Output active from write end tOW 3 ns 4, 5
t
AW
t
AH
t
WC
Address
WE
D
OUT
t
DH
t
OW
t
DW
t
WZ
t
WP
t
AS
Data valid
D
IN
t
WR
AS7C1025C
12/5/06, v. 1.0 Alliance Memory P. 6 of 9
®
Write waveform 2 (CE controlled)10,11
AC test conditions
Notes:
1 During VCC power-up, a pull-up resistor to VCC on
CE
is required to meet ISB specification.
2 This parameter is sampled, but not 100% teste d.
3 For test conditions, see AC Test Conditions, Figures A and B.
4t
CLZ and tCHZ are specified with CL = 5 pF, as in Figure B. Transition is measured ±200 mV from steady-state voltage.
5 This parameter is guarante ed, but not 100% tested.
6
WE
is high for read cycle.
7
CE
and
OE
are low for read cycle.
8 Address is valid prior to or coincident with
CE
transition low.
9 All read cycle timings are reference d from the last valid addre ss to the first transitioning address.
10 N/A
11 All write cycle timings are referenced fro m the last valid addre ss to the first transitioning addre ss.
12 N/A.
13 C = 30 pF, excep t all high Z and low Z parameters where C = 5 pF.
t
AW
Address
CE
WE
D
OUT
t
CW
t
WP
t
DW
t
DH
t
AH
t
WZ
t
WC
t
AS
Data valid
D
IN
t
WR
Output load: see Figure B.
Input pulse level: GND to 30 V. See Figure A.
Input rise and fall times: 3 ns. See Figure A.
Input and output timing reference levels: 1.5 V.
168
Ω
Thevenin equivalent:
D
OUT
+1.728 V
255
Ω
C
13
480
Ω
D
OUT
GND
+5 V
Figure B: 5 V Output load
10%
90%
10%
90%
GND
+3.0V
Figure A: Input pulse
3 ns
AS7C1025C
12/5/06, v. 1.0 Alliance Memory P. 7 of 9
®
Package dimensions
eD
E1
Pin 1
b
B
A1
A2 c
E
Seating
plane
E2
A
32-pin SOJ
400 mil
Symbol
32-pin SOJ
400 mil
Min Max
A0.132 0.146
A1 0.025 -
A2 0.105 0.115
B0.026 0.032
b0.015 0.020
c0.007 0.013
D0.820 0.830
E0.354 0.378
E1 0.395 0.405
E2 0.435 0.445
e0.050 BSC
Note: This part is compatible with both pin numbering
conventions used by various manufacturers.
AS7C1025C
12/5/06, v. 1.0 Alliance Memory P. 8 of 9
®
Ordering Codes
Package Volt/Temp 15 ns
Plastic SOJ, 400 mil 5V industrial AS7C1025C-15JIN
Part numbering system
AS7C 1025C –XX X X X
SRAM prefix Device
number Access time Package:
J = SOJ 400 mil
Temperature range
I = industrial, -40°
C to 85° C
N = LEAD FREE
PART
Alliance Memory, Inc.
1116 South Amphlett
San Mateo, CA 94402
Tel: 650-525-3737
Fax: 650-525-0449
www.alliancememory.com
Copyright © Alliance Memory
All Rights Reserved
Part Number: AS7C1025C
Document Version: v. 1.0
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AS7C1025C
®
®