For board-to-FPC A4S Narrow pitch connectors (0.4mm pitch) FEATURES m m 0m 2. 5m 2. Socket 1. Width 2.5 mm slim two-piece type connector Compact and slim structure contributes overall miniaturization of product design. <Compared to F4S (40 pins, when mated)> * Width: 30% down * Footprint: 30% down Header 2. " " ensures high resistance to various environments in lieu of slim and low profile body Ni barrier construction Bellows contact construction (Against solder rise!) (Against dropping!) F4S 1.0 A4S Porosity treatment 0.8 (Against corrosive gases!) RoHS compliant 2.5 3.6 V notch and Double contact constructions (Against foreign particles and flux!) 3. Mated heights of 0.8 and 1.0 mm are available for the same foot pattern. 4. Connectors for inspection available APPLICATIONS Board-to-FPC connections of mobile equipment (cellular phones, smart phones, laptops, and portable music players, etc.) ORDERING INFORMATION AXE 2 5: Narrow Pitch Connector A4S (0.4 mm pitch) Socket 6: Narrow Pitch Connector A4S (0.4 mm pitch) Header Number of pins (2 digits) Mated height <Socket> 1: For mated height 0.8/1.0 mm <Header> 1: For mated height 0.8 mm 2: For mated height 1.0 mm Functions 2: Without positioning bosses Surface treatment (Contact portion / Terminal portion) <Socket> 7: Ni plating on base, Au plating on surface (for Ni barrier available) <Header> 4: Ni plating on base, Au plating on surface Package Nil: Embossed packaging (8 mm pitch) D: Embossed packaging (4 mm pitch) -1- ACCTB7E 201602-T Narrow pitch connectors A4S (0.4mm pitch) PRODUCT TYPES 8 mm pitch embossed packaging Mated height 0.8mm 1.0mm Number of pins 10 12 14 16 18 20 22 24 26 28 30 32 34 36 40 44 50 54 60 64 70 80 10 12 14 20 24 26 30 32 40 44 50 54 60 70 80 Part number Socket AXE510127 AXE512127 AXE514127 AXE516127 AXE518127 AXE520127 AXE522127 AXE524127 AXE526127 AXE528127 AXE530127 AXE532127 AXE534127 AXE536127 AXE540127 AXE544127 AXE550127 AXE554127 AXE560127 AXE564127 AXE570127 AXE580127 AXE510127 AXE512127 AXE514127 AXE520127 AXE524127 AXE526127 AXE530127 AXE532127 AXE540127 AXE544127 AXE550127 AXE554127 AXE560127 AXE570127 AXE580127 Packing Header AXE610124 AXE612124 AXE614124 AXE616124 AXE618124 AXE620124 AXE622124 AXE624124 AXE626124 AXE628124 AXE630124 AXE632124 AXE634124 AXE636124 AXE640124 AXE644124 AXE650124 AXE654124 AXE660124 AXE664124 AXE670124 AXE680124 AXE610224 AXE612224 AXE614224 AXE620224 AXE624224 AXE626224 AXE630224 AXE632224 AXE640224 AXE644224 AXE650224 AXE654224 AXE660224 AXE670224 AXE680224 Inner carton (1-reel) Outer carton 5,000 pieces 10,000 pieces Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact us for connectors having a number of pins other than those listed above. 4 mm pitch embossed packaging Mated height 0.8mm Number of pins Part number Packing 10 Socket AXE510127D Header AXE610124D 12 14 16 20 24 30 34 40 44 50 60 64 AXE512127D AXE514127D AXE516127D AXE520127D AXE524127D AXE530127D AXE534127D AXE540127D AXE544127D AXE550127D AXE560127D AXE564127D AXE612124D AXE614124D AXE616124D AXE620124D AXE624124D AXE630124D AXE634124D AXE640124D AXE644124D AXE650124D AXE660124D AXE664124D Inner carton (1-reel) Outer carton 15,000 pieces 30,000 pieces Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact us for connectors having a number of pins other than those listed above. -2- ACCTB7E 201602-T Narrow pitch connectors A4S (0.4mm pitch) SPECIFICATIONS Characteristics Electrical characteristics Mechanical characteristics Item Rated current Rated voltage Specifications 0.3A/pin contact (Max. 5 A at total pin contacts) 60V AC/DC Dielectric strength 150V AC for 1 min. Insulation resistance Min. 1,000M (initial) Contact resistance Max. 90m Composite insertion force Composite removal force Contact holding force (Socket contact) Ambient temperature Max. 1.200N/pin contact x pin contacts (initial) Min. 0.165N/pin contact x pin contacts Soldering heat resistance Storage temperature Conditions No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. Using 250V DC megger (applied for 1 min.) Based on the contact resistance measurement method specified by JIS C 5402. Measuring the maximum force. As the contact is axially pull out. No icing or condensation. Min. 0.20N/pin contact -55C to +85C Peak temperature: 260C or less (on the surface of the PC board around the connector terminals) 300C within 5 sec. 350C within 3 sec. -55C to +85C (product only) -40C to +50C (emboss packing) Infrared reflow soldering Soldering iron No icing or condensation. Conformed to MIL-STD-202F, method 107G Environmental characteristics Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) Lifetime characteristics Unit weight Order Temperature (C) 1 -55 -30 2 3 85 +30 4 -55 -30 5 cycles, insulation resistance min. 100M, contact resistance max. 90m 120 hours, insulation resistance min. 100M, contact resistance max. 90m 24 hours, insulation resistance min. 100M, contact resistance max. 90m H2S resistance (header and socket mated) 48 hours, contact resistance max. 90m Insertion and removal life 30 times Time (minutes) 30 Max. 5 30 Max. 5 Conformed to IEC60068-2-78 Bath temperature 40C2C, humidity 90% to 95% R.H. Conformed to IEC60068-2-11 Bath temperature 35C2C, saltwater concentration 5%1% Bath temperature 40C2C, gas concentration 3 ppm 1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/ hours 20 pin contacts Socket: 0.02 g Header: 0.01 g Material and surface treatment Part name Molded portion Contact and Post Material LCP resin (UL94V-0) Copper alloy Surface treatment -- Contact portion: Base: Ni plating Surface: Au plating Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Soldering terminals: Sockets: Base: Ni plating Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating Surface: Au plating (except the terminal tips) -3- ACCTB7E 201602-T Narrow pitch connectors A4S (0.4mm pitch) DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ Dimension table (mm) Terminal coplanarity A B0.1 0.400.05 0.150.03 0.77 0.08 2.50 (Contact and soldering terminals) 2.20 CAD Data 0.70 (Suction face) Socket (Mated height: 0.8 mm/1.0 mm) (0.90) Z note 0.300.03 C0.1 1.06 2.50 Y note General tolerance: 0.2 Note: Since the soldering terminals has a single-piece construction, sections Y and Z are electrically connected. Number of pins/ dimension 10 4.50 1.60 3.40 12 14 16 18 20 22 24 26 28 30 32 34 36 40 44 50 54 60 64 70 80 4.90 5.30 5.70 6.10 6.50 6.90 7.30 7.70 8.10 8.50 8.90 9.30 9.70 10.50 11.30 12.50 13.30 14.50 15.30 16.50 18.50 2.00 2.40 2.80 3.20 3.60 4.00 4.40 4.80 5.20 5.60 6.00 6.40 6.80 7.60 8.40 9.60 10.40 11.60 12.40 13.60 15.60 3.80 4.20 4.60 5.00 5.40 5.80 6.20 6.60 7.00 7.40 7.80 8.20 8.60 9.40 10.20 11.40 12.20 13.40 14.20 15.40 17.40 B C A B C Header (Mated height: 0.8 mm) Dimension table (mm) Terminal coplanarity A B0.1 0.400.05 0.150.03 0.65 2.00 0.84 1.46 Soldering terminals (0.31) Soldering terminals 0.150.03 C0.1 0.08 (Post and soldering terminals) 1.42 0.70 (Suction face) CAD Data General tolerance: 0.2 -4- Number of pins/ dimension 10 3.80 1.60 3.20 12 14 16 18 20 22 24 26 28 30 32 34 36 40 44 50 54 60 64 70 80 4.20 4.60 5.00 5.40 5.80 6.20 6.60 7.00 7.40 7.80 8.20 8.60 9.00 9.80 10.60 11.80 12.60 13.80 14.60 15.80 17.80 2.00 2.40 2.80 3.20 3.60 4.00 4.40 4.80 5.20 5.60 6.00 6.40 6.80 7.60 8.40 9.60 10.40 11.60 12.40 13.60 15.60 3.60 4.00 4.40 4.80 5.20 5.60 6.00 6.40 6.80 7.20 7.60 8.00 8.40 9.20 10.00 11.20 12.00 13.20 14.00 15.20 17.20 A ACCTB7E 201602-T Narrow pitch connectors A4S (0.4mm pitch) 0.70 (Suction face) Header (Mated height: 1.0 mm) Terminal coplanarity A B0.1 0.400.05 0.150.03 0.85 Dimension table (mm) 0.08 1.42 0.150.03 C0.1 3.80 1.60 3.20 12 14 20 24 26 30 32 40 44 50 54 60 70 80 4.20 4.60 5.80 6.60 7.00 7.80 8.20 9.80 10.60 11.80 12.60 13.80 15.80 17.80 2.00 2.40 3.60 4.40 4.80 5.60 6.00 7.60 8.40 9.60 10.40 11.60 13.60 15.60 3.60 4.00 5.20 6.00 6.40 7.20 7.60 9.20 10.00 11.20 12.00 13.20 15.20 17.20 0.84 1.46 Soldering terminals (0.31) Soldering terminals Number of pins/ dimension 10 2.00 (Post and soldering terminals) General tolerance: 0.2 A B C Header Header Socket 1.000.1 0.800.1 Socket and Header are mated Socket EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping (In accordance with JIS C 0806-3:1999. However, not applied to the mounting-hole pitch of some connectors.) Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) (D1) (A +0.3 -0.1 ) (A0.3) (B) Top cover tape (C) (1.75) (4.0) (C) (1.75) Label 380 dia. Tape II (4.0) Tape I Embossed carrier tape Embossed mounting-hole (2.0) (8.0) (8.0) (2.0) Taping reel .1 +0 0 5 1. .1 +0 0 5 1. Leading direction after packaging * 8 mm pitch embossed packaging . a di a. di * 4 mm pitch embossed packaging Tape III (2.0) (4.0) (C) (1.75) (4.0) Leading direction after packaging (A +0.3 -0.1 ) 1. 5 +0 0 .1 di a. -5- ACCTB7E 201602-T Narrow pitch connectors A4S (0.4mm pitch) Dimension table (Unit: mm) * 8 mm pitch embossed packaging Type/Mated height Number of pins Type of taping A B C D Quantity per reel Common for sockets and headers 0.8 mm/1.0 mm Max. 24 26 to 70 80 Tape I Tape I Tape II 16.0 24.0 32.0 -- -- 28.4 7.5 11.5 14.2 17.4 25.4 33.4 5,000 5,000 5,000 * 4 mm pitch embossed packaging Type/Mated height Number of pins Type of taping A B C D Quantity per reel Common for sockets and headers 0.8 mm Max. 24 30 to 64 Tape III Tape III 16.0 24.0 -- -- 7.5 11.5 17.4 25.4 15,000 15,000 Connector orientation with respect to embossed tape feeding direction Type Common for A4S Direction of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. -6- ACCTB7E 201602-T Narrow pitch connectors A4S (0.4mm pitch) For board-to-FPC A4S Connectors for inspection usage (0.4mm pitch) 0m 2. 5m 2. Header m m Socket FEATURES APPLICATIONS 1. 3,000 mating and unmating cycles 2. Same external dimensions and foot pattern as standard type. 3. Improved mating Insertion and removal easy due to a reduction in mating retention force. This is made possible by a simple locking structure design. Ideal for module unit inspection and equipment assembly inspection Note: Mating retention force cannot be warranted. Please avoid using for applications other than inspection. RoHS compliant TABLE OF PRODUCT TYPES : Available for sale Product name A4S for inspection 10 12 14 16 18 20 22 24 26 28 Number of pins 30 32 34 36 40 44 50 54 60 64 70 80 Notes: 1. Please inquire about number of pins other than those shown above. 2. Please inquire with us regarding availability. 3. Please keep the minimum order quantities no less than 50 pieces per lot. 4. Please inquire if further information is needed. PRODUCT TYPES Socket Specifications Without positioning bosses Part No. AXE5E26 Specifications Without positioning bosses Header Part No. AXE6E26 Note: When placing an order, substitute the "" (asterisk) in the above part number with the number of pins for the specific connector. NOTES (0.65) 0.400.03 0.230.03 1.100.03 2.400.03 1.660.03 0.600.03 (0.53) 0.400.03 0.230.03 (0.50) Recommended PC board pattern (TOP VIEW) 0.200.03 1.900.03 * Header (Mated height: 0.8mm/1.0mm) Recommended PC board pattern (TOP VIEW) 2.900.03 1.060.03 (0.92) * Socket (Mated height: 0.8mm/1.0mm) C 30 0.900.03 1.450.03 0. 0.450.03 0.800.03 : Insulation area 1.260.01 2.300.01 C 30 0. 0.900.01 1.450.01 0.400.01 0.200.01 (0.52) 0.400.01 0.200.01 1.660.01 0.600.01 (0.53) Metal mask thickness: When 120m (Terminal opening ratio: 70%) (Metal-part opening ratio: 100%) (0.40) Recommended metal mask pattern Metal mask thickness: When 120m (Terminal opening ratio: 70%) (Metal-part opening ratio: 70%) 2.000.01 2.800.01 Recommended metal mask pattern 2.900.01 1.600.01 (0.65) Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. 0.450.01 0.800.01 Please refer to the latest product specifications when designing your product. -7- ACCTB7E 201602-T For board-to-board/board-to-FPC Notes on Using Narrow pitch Connectors/ High Current Connectors About safety Remarks 1) Do not use these connectors beyond the specification sheets. The usage outside of specified rated current, dielectric strength, and environmental conditions and so on may cause circuitry damage via abnormal heating, smoke, and fire. 2) In order to avoid accidents, your thorough specification review is appreciated. Please contact us if your usage is out of the specifications. Otherwise, Panasonic Corporation cannot guarantee the quality and reliability. 3) Panasonic Corporation is consistently striving to improve quality and reliability. However, the fact remains that electrical components and devices generally cause failures at a given statistical probability. Furthermore, their durability varies with use environments or use conditions. In this respect, please check for actual electrical components and devices under actual conditions before use. Continued usage in a state of degraded condition may cause the deteriorated insulation, thus result in abnormal heat, smoke or firing. Please carry out safety design and periodic maintenance including redundancy design, design for fire spread prevention, and design for malfunction prevention so that no accidents resulting in injury or death, fire accidents, or social damage will be caused as a result of failure of the products or ending life of the products. Regarding the design of devices and PC board patterns 1) When using the board to board connectors, do not connect a pair of board with multiple connectors. Otherwise, misaligned connector positions may cause mating failure or product breakage. 2) With mounting equipment, there may be up to a 0.2 to 0.3-mm error in positioning. Be sure to design PC boards and patterns while taking into consideration the performance and abilities of the required equipment. 3) Some connectors have tabs embossed on the body to aid in positioning. When using these connectors, make sure that the PC board is designed with positioning holes to match these tabs. 4) To ensure the required mechanical strength when soldering the connector terminals, make sure the PC board meets recommended PC board pattern design dimensions given. 5) PC board Control the thicknesses of the coverlay and adhesive to prevent poor soldering. This connector has no stand-off. Therefore, minimize the thickness of the coverlay, etc. so as to prevent the occurrence of poor soldering. 6) For all connectors of the narrow pitch series, to prevent the PC board from coming off during vibrations or impacts, and to prevent loads from falling directly on the soldered portions, be sure to design some means to fix the PC board in place. Example) Secure in place with screws Screw Connector Spacer PC board Spacer When connecting PC boards, take appropriate measures to prevent the connector from coming off. 7) When mounting connectors on a FPC board: * When the connector soldered to FPC is mated or unmated, solder detachment may occur by the force to the terminals. Connector handling is recommended in the condition when the reinforcing plate is attached to the backside of FPC where the connector is mounted. The external dimension of the reinforcing plate is recommended to be larger than the dimension of "PC board recommended process pattern" (extended dimension of one side is approximately 0.5 to 1.0 mm). The materials and thickness of the reinforcing plate are glass epoxy or polyimide (thickness 0.2 - 0.3 mm) or SUS (thickness 0.1 - 0.2 mm). * As this connector has temporary locking structure, the connector mating may be separated by the dropping impact depend on the size, weight or bending force of the FPC. Please consider the measures at usage to prevent the mating separation. 8) The narrow pitch connector series is designed to be compact and thin. Although ease of handling has been taken into account, take care when mating the connectors, as displacement or angled mating could damage or deform the connector. Regarding the selection of the connector placement machine and the mounting procedures 1) Select the placement machine taking into consideration the connector height, required positioning accuracy, and packaging conditions. 2) Be aware that if the chucking force of the placement machine is too great, it may deform the shape of the connector body or connector terminals. 3) Be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations. 4) Depending on the size of the connector being used, self alignment may not be possible. In such cases, be sure to carefully position the terminal with the PC board pattern. 5) The positioning bosses give an approximate alignment for positioning on the PC board. For accurate positioning of the connector when mounting it to the PC board, we recommend using an automatic positioning machine. -1- 6) In case of dry condition, please note the occurrence of static electricity. The product may be adhered to the embossed carrier tape or the cover tape in dry condition. Recommended humidity is from 40%RH to 60%RH and please remove static electricity by ionizer in manufacturing process. ACCTB48E 201606-T Notes on Using Narrow pitch Connectors/High Current Connectors Regarding soldering Terminal Paste solder PC board foot pattern 5) When mounting on both sides of the PC board and the connector is mounting on the underside, use adhesives or other means to ensure the connector is properly fixed to the PC board. (Double reflow soldering on the same side is possible.) 6) The condition of solder or flux rise and wettability varies depending on the type of solder and flux. Solder and flux characteristics should be taken into consideration and also set the reflow temperature and oxygen level. 7) Do not use resin-containing solder. Otherwise, the contacts might be firmly fixed. 8) Soldering conditions Please use the reflow temperature profile conditions recommended below for reflow soldering. Please contact us before using a temperature profile other than that described below (e.g. lead-free solder). 3) Touch the soldering iron to the foot pattern. After the foot pattern and connector terminal are heated, apply the solder wire so it melts at the end of the connector terminals. Apply the solder wire here Upper limited (Solder heat resistance) Lower limited (Solder wettability) Terminal Temperature Peak temperature 260C 230C 180C 150C So ld iro erin n g Reflow soldering 1) Measure the recommended profile temperature for reflow soldering by placing a sensor on the PC board near the connector surface or terminals. (Please refer to the specification for detail because the temperature setting differs by products.) 2) As for cream solder printing, screen printing is recommended. 3) When setting the screen opening area and PC board foot pattern area, refer the recommended PC board pattern and window size of metal mask on the specification sheet, and make sure that the size of board pattern and metal mask at the base of the terminals are not increased. 4) Please pay attentions not to provide too much solder. It makes miss mating because of interference at soldering portion when mating. Small angle as possible up to 45 degrees Peak temperature Preheating 220C 200C PC board 25 sec. 60 to 120 sec. 70 sec. Time For products other than the ones above, please refer to the latest product specifications. 9) The temperature profiles given in this catalog are values measured when using the connector on a resin-based PC board. When performed reflow soldering on a metal board (iron, aluminum, etc.) or a metal table to mount on a FPC, make sure there is no deformation or discoloration of the connector before mounting. 10) Consult us when using a screenprinting thickness other than that recommended. Hand soldering 1) Set the soldering iron so that the tip temperature is less than that given in the table below. Table A Product name Soldering iron temperature SMD type connectors 300C within 5 sec. 350C within 3 sec. Pattern 4) Be aware that soldering while applying a load on the connector terminals may cause improper operation of the connector. 5) Thoroughly clean the soldering iron. 6) Flux from the solder wire may get on the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any solder before use. 7) These connector is low profile type. If too much solder is supplied for hand soldering, It makes miss mating because of interference at soldering portion. Please pay attentions. Solder reworking 1) Finish reworking in one operation. 2) In case of soldering rework of bridges. Don't use supplementary solder flux. Doing so may cause contact problems by flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. 2) Do not allow flux to spread onto the connector leads or PC board. This may lead to flux rising up to the connector inside. Handling Single Components 1) Make sure not to drop or allow parts to fall from work bench. 2) Excessive force applied to the terminals could cause warping, come out, or weaken the adhesive strength of the solder. Handle with care. 3) Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. Precautions for mating This product is designed with ease of handling. However, in order to prevent the deformation or damage of contacts and molding, take care and do not mate the connectors as shown right. Press-fitting while the mating inlets of the socket and header are not matched. Strongly pressed and twisted Tilted mating -2- ACCTB48E 201606-T Notes on Using Narrow pitch Connectors/High Current Connectors Cleaning flux from PC board There is no need to clean this product. If cleaning it, pay attention to the following points to prevent the negative effect to the product. 1) Keep the cleaning solvent clean and prevent the connector contacts from contamination. 2) Some cleaning solvents are strong and they may dissolve the molded part and characters, so pure water passed liquid solvent is recommended. Handling the PC board after mounting the connector When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive force. The soldered areas should not be subjected to force. Storage of connectors 1) To prevent problems from voids or air pockets due to heat of reflow soldering, avoid storing the connectors in areas of high humidity. 2) Depending on the connector type, the color of the connector may vary from connector to connector depending on when it is produced. Some connectors may change color slightly if subjected to ultraviolet rays during storage. This is normal and will not affect the operation of the connector. 3) When storing the connectors with the PC boards assembled and components alreeady set, be careful not to stack them up so the connectors are subjected to excessive forces. 4) Avoid storing the connectors in locations with excessive dust. The dust may accumulate and cause improper connections at the contact surfaces. 4) When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 5) There may be variations in the colors of products from different production lots. This is normal. 6) The connectors are not meant to be used for switching. 7) Product failures due to condensation are not covered by warranty. Other Notes 1) Do not remove or insert the electrified connector (in the state of carrying current or applying voltage). 2) Dropping of the products or rough mishandling may bend or damage the terminals and possibly hinder proper reflow soldering. 3) Before soldering, try not to insert or remove the connector more than absolutely necessary. Regarding sample orders to confirm proper mounting When ordering samples to confirm proper mounting with the placement machine, connectors are delivered in 50piece units in the condition given right. Consult a sale representative for ordering sample units. Please refer to the latest product specifications when designing your product. Condition when delivered from manufacturing Reel Embossed tape amount required for the mounting Required number of products for sample production (Delivery can also be made on a reel by customer request.) (Unit 50 pcs.) -3- ACCTB48E 201606-T