AON5802B
Symbol Min Typ Max Units
BV
DSS
30 V
V
DS
=30V, V
GS
=0V 1
T
J
=55°C 5
I
GSS
±10 µA
BV
GSO
±12 V
V
GS(th)
Gate Threshold Voltage 0.6 1.1 1.5 V
I
D(ON)
55 A
12 15.5 19
T
J
=125°C 19 23.5 29
13 16 20 mΩ
14 18 23 mΩ
17 23 30 mΩ
g
FS
32 S
V
SD
0.71 0.9 V
I
S
2.5 A
C
iss
920 1150 pF
C
oss
105 pF
C
rss
52 pF
R
g
1.7 2.5 KΩ
Q
g
(10V)
17.5 24 nC
Q
g
(4.5V)
7.5 10 nC
Gate resistance V
GS
=0V, V
DS
=0V, f=1MHz
Total Gate Charge
Total Gate Charge
SWITCHING PARAMETERS
Static Drain-Source On-Resistance
Diode Forward Voltage
mΩ
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
I
DSS
µA
Zero Gate Voltage Drain Current
Drain-Source Breakdown Voltage
Gate-Source Breakdown Voltage V
DS
=0V, I
G
=±250uA
Gate-Body leakage current
On state drain current V
GS
=4.5V, V
DS
=5V
Reverse Transfer Capacitance V
GS
=0V, V
DS
=15V, f=1MHz
V
DS
=V
GS,
I
D
=250µA
V
DS
=0V, V
GS
=±10V
Maximum Body-Diode Continuous Current
Input Capacitance
Output Capacitance
Forward Transconductance I
S
=1A,V
GS
=0V
V
DS
=5V, I
D
=7A
DYNAMIC PARAMETERS
V
GS
=2.5V, I
D
=4A
R
DS(ON)
V
GS
=3.1V, I
D
=5A
V
GS
=4.0V, I
D
=5A
I
D
=250µA, V
GS
=0V
V
GS
=4.5V, I
D
=7A
gs
Q
gd
2.5 nC
t
D(on)
0.32 0.42 µs
t
r
0.55 µs
t
D(off)
4.35 µs
t
f
2.4 µs
t
rr
21.6 26 ns
Q
rr
10 nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Turn-Off Fall Time
Gate Drain Charge
Turn-On DelayTime
I
F
=7A, dI/dt=100A/µs
Body Diode Reverse Recovery Charge
Body Diode Reverse Recovery Time I
F
=7A, dI/dt=100A/µs
Turn-On Rise Time
Turn-Off DelayTime V
GS
=10V, V
DS
=15V, R
L
=2.1Ω,
R
GEN
=3Ω
A: The value of RθJA is measured with the device mounted on 1in2FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The
value in any given application depends on the user's specific board design. The current rating is based on the steady state thermal resistance
rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The SOA
curve provides a single pulse rating.
Rev.6. 0: July 2013 www.aosmd.com Page 2 of 5