Product Specification PCI EXPRESS CARD EDGE CONN. V-TYPE 1085847 02-SEP-'09 Rev.E 1. 1. Scope : 1.1 1.1 Contents PCI EXPRESS CARD EDGE CONN. V-TYPE This specification covers the requirements for product performance, test methods and quality assurance provisions of PCI EXPRESS CARD EDGE CONN. V-TYPE. Applicable product description and part numbers are as shown in Appendix 1. 2. 2. Applicable Documents: The following documents form a part of this specification to the extent specified herein. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence. 2.1 AMP 2.1 A. 109-5000 : AMP Specifications : A. 109-5000 B. 501-5453 : : Test Specification, General Requirements for Test Methods B. 501-5453 2 : Test Report 2.2 Commercial Standards and Specifications A. MIL-STD-202 A. MIL-STD-202 Test Method for Electronic and Electric Parts -- Tel:-- Fax:-- (c)Copyright 1996 by TYCO ELECTRONICS AMP K.K. All Right Reserved. 1 of 11 PCI EXPRESS CARD EDGE CONN. V-TYPE 108-5847 3. 3. Requirements : 3.1 3.1 Design and Construction : Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. 3.2 3.2 Materials : A. Contact A. Copper Alloy Finish ; contact area : Gold plated. Dipping area : Tin plated B. Underplate : Nickel plated. B. Housing UL94V-0 3.3 Thermoplastic UL94V-0 3.3 Ratings : A. : 50 VAC A. Voltage Rating : 50 VAC B. : 1.1A B. Current Rating : C. 3.4 :40 C +85 C 1.1 A C. Temperature Rating : 40 C to 85 C 3.4 Performance Requirements and Test Descriptions : Fig. 1 The product shall be designed to meet the electrical, mechanical and environmental performance requirements specified in Fig. 1. All tests shall be performed in the room temperature, unless otherwise specified. Rev.E 2 of 11 PCI EXPRESS CARD EDGE CONN. V-TYPE 108-5847 3.5 3.5 Test Requirements and Procedures Summary Para. Test Items 3.5.1 Requirements Procedures Examination of Product No physical damage Visual inspection No physical damage Electrical Requirements 3.5.2 3.5.3 3.5.4 3.5.5. () 30 m () R=20 m () 20 mV 10 mA Fig.3 AMP 109-5311-1 Termination Resistance (Low Level) 30 m Max. (Initial) R=20 m Max. (Final) Subject mated contacts assembled in housing to 20 mV Max open circuit at 10 mA. Refer to Fig.3. AMP Spec. 109-5311-1 0.5 mA 0.5 kVAC 1 AMP 109-5301 Dielectric withstanding Voltage No creeping discharge nor flashover shall occur. Current leakage : 0.5 mA Max. 0.5 kVAC for 1 minute. Test between adjacent circuits of unmated connectors. AMP Spec. 109-5301 500 M () 100 M () 500 V DC AMP 109-5302 Insulation Resistance 500 M Min. (Initial) 100 M Min. (Final) Impressed voltage 500 V DC. Test between adjacent circuits of unmated connectors. AMP Spec. 109-5302 30 Fig.3 AMP 109-5310 Temperature Rising 30Max. under loaded rating current. Measure temperature rising by energized current. Fig.3 AMP Spec. 109-5310 Fig.1 Fig.1 (CONT.) Rev.E 3 of 11 PCI EXPRESS CARD EDGE CONN. V-TYPE 108-5847 Para. Test Items Requirements Procedures Mechanical Requirements 3.5.6 () 100 mA 1 sec. 102000Hz 30.38 m/s2 (3.1 G), 3 15 AMP109-21-5 EIA-364-28,test condition VII, test condition letter D Vibration (Random) 100 mA applied. No electrical discontinuity greater than 1 sec. shall occur. Vibration Frequency : 10 to 2000 Hz (Random) Accelerated Velocity : 30.38 m/s2 (3.1 G),rms. Vibration Direction : In each of 3 mutually perpendicular planes Duration : 15 minute each Module board should be fixed on the connector mount board or test jig. AMP Spec. 109-5201 EIA-364-28, test condition VII, test condition letter D Fig. 1 Fig. 1 (CONT.) Rev.E 4 of 11 PCI EXPRESS CARD EDGE CONN. V-TYPE 108-5847 Para. Test Items 3.5.7 3.5.8 3.5.9 Requirements Procedures 1 sec. : 490 m/s2 ( 50 G) : : 11 m sec. : X, Y, Z 3 18 AMP 109-5208 A Physical Shock No electrical discontinuity greater than 1 sec. shall occur. Module board should be fixed on the connector mount board or test jig. Accelerated Velocity : 490 m/s2 ( 50 G) Waveform : Halfsine Duration: 11 m sec. Number of Drops : 3 drops each to normal and reversed directions of X, Y and Z axes, totally 18 drops. AMP Spec. 109-5208 Condition A 1.15N0.12kgf/2 12.5 mm/ 1.700.01mm AMP 109-5206 Module Board Insertion Force 1.15N(0.12kgf)/ Contact Pair Max. Operation speed : 12.5mm/min. Measure the force required to mate connectors. Using steel gauge 1.70.01mm thk AMP Spec. 109-5206 0.15N0.015kgf/2 12.5 mm/ 1.440.01mm AMP 109-5206 Module Board Removal Force 0.15N(0.015kgf)/Contact Pair Min. Operation speed : 12.5mm/min. Measure the force required to unmate connectors. Using steel gauge 1.440.01mm thk AMP Spec. 109-5206 Fig. 1 Fig. 1 (CONT.) Rev.E 5 of 11 PCI EXPRESS CARD EDGE CONN. V-TYPE 108-5847 Para. Test Items 3.5.10 Requirements Procedures 50 AMP 109-5213 Durability R=20 m Max. (Final) No. of Cycles : 50 cycles. AMP Spec. 109-5213 () 20 AMP 109-5213 Durability No physical damage No. of Cycles : 20 cycles. AMP Spec. 109-5213 3 Reseating No physical damage No. of Cycles : 3 cycles. 95% 2455 51 100 Solderability Wet Solder Coverage : 95% Min. Resistance to Soldering Heat No physical damage shall occur . Solder Temperature : 2455 Immersion Duration : 51 seconds Flux : Alpha 100 (NON- active rosin base) 2605 101 EIA-364-56C, test condition letter B 35010 31 EIA-364-56C, test condition letter A Flow Soldering and Pot Soldering Test connector of housing boss with solder masking tape. Solder Temperature : 2605 Immersion Duration : 101 sec. EIA-364-56C, test condition letter B Manual Soldering Solder Temperature : 35010 Immersion Duration : 31 sec EIA-364-56C, test condition letter A 3.5.13 3.5.14 R=20 m () (Preconditioning) 3.5.12 () (Repeated Mate/Unmate) 3.5.11 Fig. 1 Fig. 1 (CONT.) Rev.E 6 of 11 PCI EXPRESS CARD EDGE CONN. V-TYPE 108-5847 Para. Test Items Requirements Procedures Environmental Requirements 3.5.15 3.5.16 3.5.17 100 M () R=20 m () 253653C, 503803 % R.H. 24 10C AMP 109-5106 EIA-364-31 Humidity-Temperature Cycling Insulation resistance (final) 100 M Min. R=20 m Max. (Final) Mated connector, 253653C, 503803 % R. H. 24 cycles Cold shock 10C performed. AMP Spec. 109-5106 EIA-364-31 R=20 m () 55 +0/-3C / 30 85 +3/-0C / 30 1 10 AMP 109-5103 A EIA-364-32, test condition I Thermal Shock R=20 m Max. (Final) Mated connector 55 +0/-3C /30 min., 85 +3/-0C /30 min. Making this a cycle, repeat 10 cycles. AMP Spec. 109-5103 Condition A EIA-364-32, test condition I R=20 m () 153853 C 2/ min. 5 10 Thermal Cycling R=20 m Max. (Final) Mated connector 153853 C Thermal ramp : 2 C /min min. Dwell time : 5min min. 10 cycles Fig. 1 Fig. 1 (CONT.) Rev.E 7 of 11 PCI EXPRESS CARD EDGE CONN. V-TYPE 108-5847 Para. Test Items Requirements Procedures Environmental Requirements 3.5.18 3.5.19 3.5.20 () R=20 m () 105 C:168 AMP 109-5104-2 A EIA-364-17,method A Temperature Life (Heat Aging) R=20 m Max. (Final) Mated connector. 105 C, Duration : 168 hours AMP Spec. 109-5104-2 Condition A EIA-364-17,method A () 105 C:92 AMP 109-5104-2 A EIA-364-17,method A Temperature Life (Preconditioning) No physical damage Mated connector. 105 C, Duration : 92 hours AMP Spec. 109-5104-2 Condition A EIA-364-17,method A R=20 m () 30,70 % R.H. ,10 Cl2 103 ppb NO2 20050 ppb H2S 105 ppb EIA-364-65, class IIA Mixed flowing gas R=20 m Max. (Final) Mated connector. 30, 70% R.H. 10Days Cl2 : 103 ppb NO2: 20050 ppb H2S : 105ppb EIA-364-65, class IIA Fig. 1 Fig. 1 (END) Rev.E 8 of 11 PCI EXPRESS CARD EDGE CONN. V-TYPE 108-5847 2. 2. Product Qualification Test Sequence Test Examination 1 Examination of Product 1,5 Termination Resistance ( ) (Low Level) Dielectric withstanding 2,6 Voltage Insulation Resistance 3,7 Temperature rising ( ) Vibration (Random) Physical Shock Board Insertion Force Board Removal Force Durability (Repeated ( ) Mate/Unmate) Durability () (Preconditioning) Reseating Solderability Resistance to Soldering Heat Humidity-Temperature 4 Cycling Thermal Shock Thermal cycling Temperature Life (Heat () Aging) Temperature Life (Preconditioning) Mixed flowing gas 2 3(b) 4(b) 1,3 1,5,8 1,4 2,6,9 2,5 2 7 3 /Test Group 5 6 7 8 9 10 11 12 /Trst Sequence (a) 1,4 1,4 1,3 1,3 1,5,8,11 1,5,8 1,5,8,111,5,8,11,14 2,5 2,6,9,12 2,6,9 2,6,9,122,6,9,12,15 2 3 3 3 2 3 3 3 3 10 7 10 13 7 10 4 4 2 7 4 4 4 7 FIG.2 (a) Numbers indicate sequence in which the tests are performed. (b) Discontinuities shall not take place in this test group, during tests. Rev.E 9 of 11 PCI EXPRESS CARD EDGE CONN. V-TYPE 108-5847 Fig.3 Fig.3 Termination Resistance Measuring points and Temperature Rising Measuring points. Rev.E 10 of 11 PCI EXPRESS CARD EDGE CONN. V-TYPE 108-5847 1 The applicable product descriptions and part numbers are asa shown in Appendix 1 Product Part No. X-1612163-X X-1871181-X Description PCI EXPRESS CARD EDGE CONN. V-TYPE X-1746220-X PCI EXPRESS CARD EDGE CONN. V-TYPE WITH EXTRACTOR X-1759850-X PCI EXPRESS CARD EDGE CONN. 280POS, V-TYPE X-1759446-X PCI EXPRESS CARD EDGE CONN. 280POS, V-TYPE X-2023157-X PCI EXPRESS CARD EDGE CONN. 280POS, V-TYPE X-2023159-X PCI EXPRESS CARD EDGE CONN. 212POS, V-TYPE Appendix 1 Rev.E 11 of 11