1. Anode
2. Cathode
3. Emitter
4. Collector
12
43
PIN CONNECTION
(Top View)
DESCRIPTION
The PS2561A-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon
phototransistor to realize an excellent cost performance.
The PS2561A-1 is in a plastic DIP (Dual I n-line Package) a nd the PS2561 AL-1 is lead bending type (Gu ll-wing) fo r
surface mount.
The PS2561AL1-1 is lead bending L1 type and the PS2561AL2-1 is lead bending L2 type (Gull-wing).
FEATURES
• Lead-free product : Solder plating specification Sn-Bi
• High isolation voltage (BV = 5 000 Vr.m.s.)
• Ordering number of taping product: PS2561AL-1-E3, E4, F3, F4
: PS2561AL2-1-E3, E4
• Safety standards
• UL, BSI, CSA, NEMKO, DEMKO, SEMKO, FIMKO, approved
• DIN EN60747-5-2 (VDE0884 Part2) approved (option)
APPLICATIONS
• Power supply
• Telephone/FAX.
• FA/OA equipment
• Programmable logic controller
NEC Compound Semiconductor Devices 2003, 2004
DATA SHEET
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
PHOTOCOUPLER
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
HIGH ISOLATION VOLTAGE
SINGLE TRANSISTOR TYPE
MULTI PHOTOCOUPLER SERIES −NEPOC Series−
Document No. PN10222EJ02V0DS (2nd edition)
Date Published May 2004 CP(K)
Printed in Japan
The mark shows major revised points.
PACKAGE DIMENSION S (UNI T : mm)
DIP Type Long Creepage Distance
Lead Bending Type Long Creepage Distance (Gull-Wing)
PS2561A-1
3.5±0.3
4.15±0.43.2±0.4
2.54
1.25±0.15 0.50±0.10
0.25
M
4.6±0.35
6.5±0.5
0 to 15˚
7.62
0.25
+0.1
–0.05
12
43
PS2561AL1-1
0 to 15˚
0.25
+0.1
–0.05
10.16
2.54
0.25 M
0.50±0.1
1.25±0.15
3.85
±0.4
3.15
±0.35
3.5
±0.3 6.5±0.5
4.6±0.35
12
43
PS2561AL-1
0.25
M
4.6±0.35
6.5±0.5
3.5±0.3
2.54
1.25±0.15
0.15
0.9±0.25
9.60±0.4
0.25
+0.1
–0.05
0.1
+0.1
–0.05
12
43
PS2561AL2-1
0.25 M
0.25
2.54
1.25±0.15
3.5±0.3 6.5±0.5
4.6±0.35
11.8
+0.2
–0.5
0.25
+0.1
–0.05
0.25±0.2
0.9±0.25
10.16
12
43
Data Sheet PN10222EJ02V0DS
2
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
MARKING EXAMPLE
2561A
N 301 Assembly Lot
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
No. 1 pin
Mark
N301
Package
New PKG
Made in Japan Made in Taiwan
EH
Solder plating
specification
Sn-Pb
Sn-Bi JK
Data Sheet PN10222EJ02V0DS 3
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
ORDERING INFORMATION (1/2)
Part Number Package Packing Style Safety Standard
Approval Solder plating
Specification Application Part
Number *1
PS2561A-1 4-pin DIP Magazine case 100 pcs Standard products Sn-Pb PS2561A-1
PS2561AL-1 (UL, CSA, BSI,
PS2561AL1-1 NEMKO, DEMKO,
PS2561AL2-1 SEMKO, FIMKO
PS2561AL-1-E3 Embossed Tape 1 000 pcs/reel approved)
PS2561AL-1-E4
PS2561AL2-1-E3 Embossed Tape 1 000 pcs/reel
PS2561AL2-1-E4
PS2561AL-1-F3 Embossed Tape 2 000 pcs/reel
PS2561AL-1-F4
PS2561A-1-V Magazine case 100 pcs DIN EN60747-5-2
PS2561AL-1-V (VDE0884 Part2)
PS2561AL1-1-V Approved products
PS2561AL2-1-V (option)
PS2561AL-1-V-E3 Embossed Tape 1 000 pcs/reel
PS2561AL-1-V-E4
PS2561AL2-1-V-E3 Embossed Tape 1 000 pcs/reel
PS2561AL2-1-V-E4
PS2561AL-1-V-F3 Embossed Tape 2 000 pcs/reel
PS2561AL-1-V-F4
PS2561A-1-A Magazine case 100 pcs Standard products Sn-Bi
PS2561AL-1-A (UL, CSA, BSI,
PS2561AL1-1-A NEMKO, DEMKO,
PS2561AL2-1-A SEMKO, FIMKO
PS2561AL-1-E3-A Embossed Tape 1 000 pcs/reel approved)
PS2561AL-1-E4-A
PS2561AL2-1-E3-A Embossed Tape 1 000 pcs/reel
PS2561AL2-1-E4-A
PS2561AL-1-F3-A Embossed Tape 2 000 pcs/reel
PS2561AL-1-F4-A
*1 For the application of the Safety Standard, following part number should be used.
Data Sheet PN10222EJ02V0DS
4
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
ORDERING INFORMATION (2/2)
Part Number Package Packing Style Safety Standard
Approval Solder plating
Specification Application Part
Number *1
PS2561A-1-V-A 4-pin DIP Magazine case 100 pcs DIN EN60747-5-2 Sn-Bi PS2561A-1
PS2561AL-1-V-A (VDE0884 Part2)
PS2561AL1-1-V-A Approved products
PS2561AL2-1-V-A (option)
PS2561AL-1-V-E3-A Embossed Tape 1 000 pcs/reel
PS2561AL-1-V-E4-A
PS2561AL2-1-V-E3-A Embossed Tape 1 000 pcs/reel
PS2561AL2-1-V-E4-A
PS2561AL-1-V-F3-A Embossed Tape 2 000 pcs/reel
PS2561AL-1-V-F4-A
*1 For the application of the Safety Standard, following part number should be used.
Data Sheet PN10222EJ02V0DS 5
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
ABSOLUTE MAXIMUM RA TI NGS (TA = 25°C, unless otherwis e specified)
Parameter Symbol Ratings Unit
Diode Reverse Voltage VR 6 V
Forward Current (DC) IF 30 mA
Power Dissipation Derating
∆
PD/°C 1.5 mW/°C
Power Dissipation PD 150 mW
Peak Forward Current*1 IFP 0.5 A
Transistor Collector to Emitter Voltage VCEO 70 V
Emitter to Collector Voltage VECO 5 V
Collector Current IC 30 mA
Power Dissipation Delay
∆
PC/°C 1.5 mW/°C
Power Dissipation PC 150 mW
Isolation Voltage*2 BV 5 000 Vr.m.s.
Operating Ambient Temperature TA −55 to +100 °C
Storage Temperature Tstg −55 to +150 °C
*1 PW = 100
µ
s, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output
Data Sheet PN10222EJ02V0DS
6
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Diode Forward Voltage VF IF = 10 mA 1.2 1.4 V
Reverse Current IR VR = 5 V 5
µ
A
Terminal Capacitance Ct V = 0 V, f = 1.0 MHz 10 pF
Transistor Collector to E m i t t e r D a r k
Current ICEO VCE = 70 V, IF = 0 mA 100 nA
Coupled Current Transfer Ratio
(IC/IF)*1 CTR IF = 5 mA, VCE = 5 V 50 300 %
Collector Saturation
Voltage VCE (sat) IF = 10 mA, IC = 2 mA 0.13 0.3 V
Isolation Resistance RI-O VI-O = 1.0 kVDC 1011 Ω
Isolation Capacitance CI-O V = 0 V, f = 1.0 MHz 0.4 pF
Rise Time*2 tr VCC = 10 V, IC = 2 mA, RL = 100 Ω 5
µ
s
Fall Time*2 tf 7
*1 CTR rank
N : 50 to 300 (%)
H : 80 to 160 (%)
Q : 100 to 200 ( %)
W : 130 to 260 (%)
*2 Test circuit for switching time
PW = 100 s
Duty Cycle = 1/10
V
CC
V
OUT
R
L
= 100 Ω
50 Ω
I
F
Pulse Input
µ
Data Sheet PN10222EJ02V0DS 7
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specifie d)
200
150
100
50
025 50 75 100 125
1.5 mW/˚C
Diode Power Dissipation PD (mW)
Ambient Temperature TA (˚C)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
200
150
100
50
025 50 75 100 125
1.5 mW/˚C
Transistor Power Dissipation PC (mW)
Ambient Temperature TA (˚C)
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
100
1.51.41.31.21.11.00.90.80.7
50
10
5
1
0.5
0.1
0˚C
–25˚C
–55˚C
+60˚C
+25˚C
T
A
= +100˚C
Forward Current IF (mA)
Forward Voltage VF (V)
FORWARD CURRENT vs.
FORWARD VOLTAGE
0.05
Collector Current IC (mA)
Collector to Emitter Voltage VCE (V)
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
25
10
20
02
468
IF = 1 mA
15
5
10
IF = 2 mA
IF = 5 mA
IF = 10 mA
Collector to Emitter Dark Current ICEO (nA)
Ambient Temperature TA (˚C)
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
1
10
100
1 000
10 000
0 25 50 75 100
VCE = 70 V
VCE = 24 V
Collector Saturation Voltage VCE(sat) (V)
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
Collector Current IC (mA)
0.1
1
10
0 0.2 0.4 0.6 0.8 1.0
IF = 1mA
IF = 2mA
IF = 5mA
IF = 10mA
Remark The graphs indicate nominal characteristics.
Data Sheet PN10222EJ02V0DS
8
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
Normalized to 1.0
at T
A
= 25˚C,
I
F
= 5 mA, V
CE
= 5 V
Ambient Temperature T
A
(˚C)
Normalized Current Transfer Ratio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
–
50
–
25 0 25 50 75 100
CTR:270%
CTR:130%
Load Resistance R
L
(Ω)
Switching Time t ( s)
µ
SWITCHING TIME vs.
LOAD RESISTANCE
0.1
1
10
100
10 100 1 000 10 000
tf
tr
td
ts
I
C
= 2 mA, V
CC
= 10 V,
CTR = 216%
Frequency f (kHz)
Normalized Gain G
V
FREQUENCY RESPONSE
R
L
= 1 kΩ
300 Ω
100 Ω
IF = 5 mA,
VCE = 5 V
5
0
–
5
–
10
–
15
–
20
–
25
0.1 1 10 100 1 000
Load Resistance R
L
(kΩ)
SWITCHING TIME vs.
LOAD RESISTANCE
Switching Time t ( s)
µ
1
10
100
1 000
1 10 100
t
r
t
d
t
s
t
f
I
F
= 5 mA, V
CC
= 5 V,
CTR = 216%
TA = 25˚C
TA = 60˚C
I
F
= 5 mA (TYP.)
1.2
1.0
0.8
0.6
0.4
0.2
010
2
10
3
10
4
10
5
Time (Hr)
CTR (Relative Value)
LONG TERM CTR DEGRADATION
10
TA = 25˚C
TA = 60˚C
1.2
1.0
0.8
0.6
0.4
0.2
010
2
10
3
10
4
10
5
10
0
50
100
150
200
250
300
0.01 0.1 1 10 100
V
CE
= 5 V,
n = 2
B
Sample A
Forward Current I
F
(mA)
Current Transfer Ratio CTR (%)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
Remark The graphs indicate nominal characteristics.
Data Sheet PN10222EJ02V0DS 9
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
TAPING SPECIFICATIONS (UNIT : mm)
Tape Direction
Outline and Dimensions (Tape)
Outline and Dimensions (Reel)
Packing: 1 000 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
PS2561AL-1-E3 PS2561AL-1-E4
1.55±0.1
2.0±0.1
4.0±0.1
1.75±0.1
4.5 MAX.
4.0±0.1
0.4
5.3±0.1
8.0±0.1
7.5±0.1
16.0±0.3
10.3±0.1
1.5
+0.1
–0
φ
254±2.0
80.0±1.0
2.0±0.5
φ
φ
15.9 to 19.4
Outer edge of
flange
21.5±1.0
17.5±1.0
Data Sheet PN10222EJ02V0DS
10
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
Tape Direction
Outline and Dimensions (Tape)
Outline and Dimensions (Reel)
PS2561AL-1-F3 PS2561AL-1-F4
1.55±0.1
2.0±0.1
4.0±0.1
1.75±0.1
4.5 MAX.
4.0±0.1
0.4
5.3±0.1
8.0±0.1
7.5±0.1
16.0±0.3
10.3±0.1
1.5
+0.1
–0
φ
Packing: 2 000 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
100±1.0
2.0±0.5
φ
φ
15.9 to 19.4
Outer edge of
flange
21.5±1.0
17.5±1.0
Data Sheet PN10222EJ02V0DS 11
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
Tape Direction
PS2561AL2-1-E3 PS2561AL2-1-E4
Outline and Dimensions (Tape)
2.05±0.1
2.0±0.1
4.0±0.1 1.55±0.1
1.75±0.1
4.4±0.2
12.35±0.15
0.38
11.5±0.1
24.0±0.3
6.6±0.2
12.0±0.1
Outline and Dimensions (Reel)
Packing: 1 000 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
φ
100±1.0
φ
2.0±0.5
29.5±1.0
25.5±1.0
23.9 to 27.4
Outer edge of
flange
Data Sheet PN10222EJ02V0DS
12
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260°C or below (package sur f ace temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mol d portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be h eated over 100°C.
Data Sheet PN10222EJ02V0DS 13
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
(4) Cautions
• Fluxes
Avoid rem oving the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute
maximum ratings.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10222EJ02V0DS
14
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
M8E 00. 4 - 0110
The information in this document is current as of May, 2004. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
•
•
•
•
•
•
Data Sheet PN10222EJ02V0DS 15
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
Caution GaAs Products This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
TEL: +852-3107-7303
TEL: +886-2-8712-0478
TEL: +82-2-558-2120
FAX: +852-3107-7309
FAX: +886-2-2545-3859
FAX: +82-2-558-5209
NEC Electronics (Europe) GmbH http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc. http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
0401
NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579
For further information, please contact
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
