DATA SHEET PHOTOCOUPLER PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 HIGH ISOLATION VOLTAGE SINGLE TRANSISTOR TYPE MULTI PHOTOCOUPLER SERIES -NEPOC Series- DESCRIPTION The PS2561A-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon phototransistor to realize an excellent cost performance. The PS2561A-1 is in a plastic DIP (Dual In-line Package) and the PS2561AL-1 is lead bending type (Gull-wing) for surface mount. The PS2561AL1-1 is lead bending L1 type and the PS2561AL2-1 is lead bending L2 type (Gull-wing). FEATURES * Lead-free product : Solder plating specification Sn-Bi PIN CONNECTION (Top View) * High isolation voltage (BV = 5 000 Vr.m.s.) * Ordering number of taping product: PS2561AL-1-E3, E4, F3, F4 4 3 1. Anode 2. Cathode 3. Emitter 4. Collector : PS2561AL2-1-E3, E4 * Safety standards * UL, BSI, CSA, NEMKO, DEMKO, SEMKO, FIMKO, approved * DIN EN60747-5-2 (VDE0884 Part2) approved (option) 1 2 APPLICATIONS * Power supply * Telephone/FAX. * FA/OA equipment * Programmable logic controller The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PN10222EJ02V0DS (2nd edition) Date Published May 2004 CP(K) Printed in Japan The mark shows major revised points. NEC Compound Semiconductor Devices 2003, 2004 PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 PACKAGE DIMENSIONS (UNIT : mm) DIP Type Long Creepage Distance PS2561A-1 PS2561AL1-1 4.60.35 4.60.35 7.62 3 1 2 1 2 0 to 15 +0.1 0.25 -0.05 1.250.15 0.500.10 0.25 M 10.16 3.5 0.3 3.15 3.85 0.35 0.4 3.50.3 3.20.4 4.150.4 4 6.50.5 6.50.5 4 3 0.500.1 0.25 M 1.250.15 +0.1 0.25-0.05 2.54 0 to 15 2.54 Lead Bending Type Long Creepage Distance (Gull-Wing) PS2561AL-1 PS2561AL2-1 4.60.35 4.60.35 3 1 2 3 1 2 0.25 M 2.54 0.25 1.250.15 0.25 M +0.1 0.25-0.05 0.250.2 3.50.3 0.1 +0.1 -0.05 0.25 +0.1 -0.05 6.50.5 3.50.3 0.90.25 9.600.4 1.250.15 2 4 6.50.5 4 0.90.25 10.16 +0.2 2.54 0.15 Data Sheet PN10222EJ02V0DS 11.8-0.5 PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 MARKING EXAMPLE No. 1 pin Mark 2561A N 301 N Assembly Lot 3 01 Week Assembled Year Assembled (Last 1 Digit) In-house Code CTR Rank Code Package New PKG Solder plating Made in Japan Made in Taiwan specification Sn-Pb E H Sn-Bi J K Data Sheet PN10222EJ02V0DS 3 PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 ORDERING INFORMATION (1/2) Part Number PS2561A-1 Package 4-pin DIP Packing Style Magazine case 100 pcs Safety Standard Approval Standard products PS2561AL-1 (UL, CSA, BSI, PS2561AL1-1 NEMKO, DEMKO, PS2561AL2-1 SEMKO, FIMKO PS2561AL-1-E3 Embossed Tape 1 000 pcs/reel Solder plating Specification Sn-Pb approved) PS2561AL-1-E4 PS2561AL2-1-E3 Embossed Tape 1 000 pcs/reel PS2561AL2-1-E4 PS2561AL-1-F3 Embossed Tape 2 000 pcs/reel PS2561AL-1-F4 PS2561A-1-V Magazine case 100 pcs DIN EN60747-5-2 PS2561AL-1-V (VDE0884 Part2) PS2561AL1-1-V Approved products PS2561AL2-1-V (option) PS2561AL-1-V-E3 Embossed Tape 1 000 pcs/reel PS2561AL-1-V-E4 PS2561AL2-1-V-E3 Embossed Tape 1 000 pcs/reel PS2561AL2-1-V-E4 PS2561AL-1-V-F3 Embossed Tape 2 000 pcs/reel PS2561AL-1-V-F4 PS2561A-1-A Magazine case 100 pcs Standard products PS2561AL-1-A (UL, CSA, BSI, PS2561AL1-1-A NEMKO, DEMKO, PS2561AL2-1-A SEMKO, FIMKO PS2561AL-1-E3-A Embossed Tape 1 000 pcs/reel Sn-Bi approved) PS2561AL-1-E4-A PS2561AL2-1-E3-A Embossed Tape 1 000 pcs/reel PS2561AL2-1-E4-A PS2561AL-1-F3-A Embossed Tape 2 000 pcs/reel PS2561AL-1-F4-A *1 For the application of the Safety Standard, following part number should be used. 4 Data Sheet PN10222EJ02V0DS Application Part *1 Number PS2561A-1 PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 ORDERING INFORMATION (2/2) Part Number PS2561A-1-V-A Package 4-pin DIP Packing Style Magazine case 100 pcs Safety Standard Approval DIN EN60747-5-2 PS2561AL-1-V-A (VDE0884 Part2) PS2561AL1-1-V-A Approved products PS2561AL2-1-V-A (option) PS2561AL-1-V-E3-A Solder plating Specification Sn-Bi Application Part *1 Number PS2561A-1 Embossed Tape 1 000 pcs/reel PS2561AL-1-V-E4-A PS2561AL2-1-V-E3-A Embossed Tape 1 000 pcs/reel PS2561AL2-1-V-E4-A PS2561AL-1-V-F3-A Embossed Tape 2 000 pcs/reel PS2561AL-1-V-F4-A *1 For the application of the Safety Standard, following part number should be used. Data Sheet PN10222EJ02V0DS 5 PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified) Parameter Symbol Ratings Unit Reverse Voltage VR 6 V Forward Current (DC) IF 30 mA PD/C 1.5 mW/C PD 150 mW IFP 0.5 A Collector to Emitter Voltage VCEO 70 V Emitter to Collector Voltage VECO 5 V IC 30 mA PC/C 1.5 mW/C PC 150 mW BV 5 000 Vr.m.s. Operating Ambient Temperature TA -55 to +100 C Storage Temperature Tstg -55 to +150 C Diode Power Dissipation Derating Power Dissipation *1 Peak Forward Current Transistor Collector Current Power Dissipation Delay Power Dissipation Isolation Voltage *2 *1 PW = 100 s, Duty Cycle = 1% *2 AC voltage for 1 minute at TA = 25C, RH = 60% between input and output 6 Data Sheet PN10222EJ02V0DS PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 ELECTRICAL CHARACTERISTICS (TA = 25C) Parameter Diode Transistor Symbol Conditions Forward Voltage VF IF = 10 mA Reverse Current IR VR = 5 V Terminal Capacitance Ct V = 0 V, f = 1.0 MHz ICEO VCE = 70 V, IF = 0 mA CTR IF = 5 mA, VCE = 5 V Collector Saturation Voltage VCE (sat) IF = 10 mA, IC = 2 mA Isolation Resistance RI-O VI-O = 1.0 kVDC Isolation Capacitance CI-O V = 0 V, f = 1.0 MHz *2 Rise Time tr *2 tf Collector to Emitter Dark MIN. TYP. MAX. Unit 1.2 1.4 V 5 A 10 pF 100 nA 300 % 0.3 V Current Coupled Current Transfer Ratio 50 *1 (IC/IF) Fall Time VCC = 10 V, IC = 2 mA, RL = 100 0.13 10 11 0.4 pF 5 s 7 *1 CTR rank N : 50 to 300 (%) H : 80 to 160 (%) Q : 100 to 200 (%) W : 130 to 260 (%) *2 Test circuit for switching time Pulse Input VCC PW = 100 s Duty Cycle = 1/10 IF 50 VOUT RL = 100 Data Sheet PN10222EJ02V0DS 7 PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 TYPICAL CHARACTERISTICS (TA = 25 C, unless otherwise specified) TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE Transistor Power Dissipation PC (mW) Diode Power Dissipation PD (mW) 200 1.5 mW/C 150 100 50 0 25 50 75 100 200 1.5 mW/C 150 100 50 0 125 25 100 TA = +100C +60C +25C Collector Current IC (mA) IF = 10 mA 5 0C -25C -55C 1 0.5 20 15 IF = 5 mA 10 5 IF = 2 mA IF = 1 mA 0.1 0.9 1.0 1.1 1.2 1.3 1.4 0 1.5 2 4 6 8 10 Forward Voltage VF (V) Collector to Emitter Voltage VCE (V) COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATURE COLLECTOR CURRENT vs. COLLECTOR SATURATION VOLTAGE 10 10 000 IF = 10mA 1 000 VCE = 70 V 100 VCE = 24 V 10 1 0 25 50 75 100 Collector Current IC (mA) Collector to Emitter Dark Current ICEO (nA) 0.8 IF = 5mA IF = 2mA 1 0.1 0 Ambient Temperature TA (C) Remark 8 125 25 10 0.05 0.7 100 COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE FORWARD CURRENT vs. FORWARD VOLTAGE Forward Current IF (mA) 75 Ambient Temperature TA (C) Ambient Temperature TA (C) 50 50 IF = 1mA 0.2 0.4 0.6 0.8 Collector Saturation Voltage VCE(sat) (V) The graphs indicate nominal characteristics. Data Sheet PN10222EJ02V0DS 1.0 PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 CURRENT TRANSFER RATIO vs. FORWARD CURRENT 300 1.4 Current Transfer Ratio CTR (%) Normalized Current Transfer Ratio CTR NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE 1.2 1.0 0.8 0.6 Normalized to 1.0 at TA = 25C, IF = 5 mA, VCE = 5 V CTR:130% CTR:270% 0.4 0.2 0 -50 -25 0 25 50 75 250 VCE = 5 V, n=2 200 Sample A B 150 100 50 0 0.01 100 Ambient Temperature TA (C) 1 10 100 Forward Current IF (mA) SWITCHING TIME vs. LOAD RESISTANCE SWITCHING TIME vs. LOAD RESISTANCE 1 000 100 IC = 2 mA, VCC = 10 V, CTR = 216% IF = 5 mA, VCC = 5 V, CTR = 216% tf tr Switching Time t ( s) Switching Time t ( s) 0.1 10 td ts 1 tf 100 ts 10 tr 0.1 10 100 1 000 td 1 1 10 000 Load Resistance RL () 10 100 Load Resistance RL (k) FREQUENCY RESPONSE LONG TERM CTR DEGRADATION 5 1.2 0 1.0 -5 100 -10 300 -15 -20 RL = 1 k CTR (Relative Value) Normalized Gain GV IF = 5 mA (TYP.) 0.8 TA = 25C 0.6 TA = 60C 0.4 0.2 IF = 5 mA, VCE = 5 V -25 0.1 1 10 100 1 000 0 10 Frequency f (kHz) Remark 102 103 104 105 Time (Hr) The graphs indicate nominal characteristics. Data Sheet PN10222EJ02V0DS 9 PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 TAPING SPECIFICATIONS (UNIT : mm) 1.550.1 4.5 MAX. 10.30.1 7.50.1 1.5 +0.1 -0 16.00.3 2.00.1 4.00.1 1.750.1 Outline and Dimensions (Tape) 4.00.1 5.30.1 8.00.1 0.4 Tape Direction PS2561AL-1-E3 PS2561AL-1-E4 Outline and Dimensions (Reel) 2.00.5 21.00.8 80.01.0 R 1.0 2542.0 2.00.5 13.00.2 17.51.0 21.51.0 Packing: 1 000 pcs/reel 10 Data Sheet PN10222EJ02V0DS 15.9 to 19.4 Outer edge of flange PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 1.550.1 4.5 MAX. 10.30.1 7.50.1 1.5 +0.1 -0 16.00.3 2.00.1 4.00.1 1.750.1 Outline and Dimensions (Tape) 4.00.1 5.30.1 8.00.1 0.4 Tape Direction PS2561AL-1-F3 PS2561AL-1-F4 Outline and Dimensions (Reel) 2.00.5 21.00.8 1001.0 R 1.0 3302.0 2.00.5 13.00.2 17.51.0 21.51.0 Packing: 2 000 pcs/reel Data Sheet PN10222EJ02V0DS 15.9 to 19.4 Outer edge of flange 11 PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 2.050.1 4.40.2 12.350.15 11.50.1 1.550.1 24.00.3 2.00.1 4.00.1 1.750.1 Outline and Dimensions (Tape) 0.38 6.60.2 12.00.1 Tape Direction PS2561AL2-1-E3 PS2561AL2-1-E4 Outline and Dimensions (Reel) R 1.0 21.00.8 1001.0 2.00.5 13.00.2 3302.0 2.00.5 25.51.0 29.51.0 Packing: 1 000 pcs/reel 12 Data Sheet PN10222EJ02V0DS 23.9 to 27.4 Outer edge of flange PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering * Peak reflow temperature 260C or below (package surface temperature) * Time of peak reflow temperature 10 seconds or less * Time of temperature higher than 220C 60 seconds or less * Time to preheat temperature from 120 to 180C 12030 s * Number of reflows Three * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating) Time (s) (2) Wave soldering * Temperature 260C or below (molten solder temperature) * Time 10 seconds or less * Preheating conditions 120C or below (package surface temperature) * Number of times One (Allowed to be dipped in solder including plastic mold portion.) * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by soldering iron * Peak temperature (lead part temperature) 350C or below * Time (each pins) 3 seconds or less * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100C. Data Sheet PN10222EJ02V0DS 13 PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 (4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler's input and output or between collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute maximum ratings. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. 14 Data Sheet PN10222EJ02V0DS PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 * The information in this document is current as of May, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 Data Sheet PN10222EJ02V0DS 15 PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1 Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) 5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0401