
Integrated Silicon Solution, Inc. 1
Rev. 00B
06/23/09
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-
est version of this device specification before relying on any published information and before placing orders for products.
IS43LR16160D, IS43LR32800D
ADVANCED INFORMATION
JULY 2009
FEATURES:
• Double-dataratearchitecture;twodatatransfers
per clock cycle
• Bidirectional,datastrobe(DQS)istransmitted/
received with data, to be used in capturing data
at the receiver
• DQSisedge-alignedwithdataforREADsand
centre-alignedwithdataforWRITEs
• Differentialclockinputs(CKandCK)
• CommandsenteredoneachpositiveCKedge;
data and data mask referenced to both edges of
DQS
• Fourinternalbanksforconcurrentoperation
• DataMaskforwritedata.DMmaskswritedata
at both rising and falling edges of data strobe
• BurstLength:2,4,and8
• BurstType:SequentialandInterleavemode
• ProgrammableCASlatency:2and3
• AutoRefreshandSelfRefreshModes
• AutoPrecharge
MOBILE FEATURES:
• Vd d andVd d q :1.8V+0.1V
• LVCMOScompatibleinputs
• TemperatureCompensatedSelfRefresh(TCSR)
controlled by on-chip temperature sensor
• PartialArraySelfRefresh(PASR)
• SelectableOutputDriveStrength(DS)
• ClockStop,PowerDownandDeepPowerDown
(DPD)modes
OPTIONS:
• Dierevision:D
• Conguration(s):8Mx32,16Mx16
• Package(s):90BallBGA(x32),
60BallBGA(x16)
• Lead-freepackageavailable
• TemperatureRange:Commercial(0°Cto+70°C)
andIndustrial(-40°Cto+85°C)
8Mx32, 16Mx16
256Mb Mobile DDR SDRAM
DESCRIPTION
ISSI’s256-MbitMobileDDRSDRAMachieveshigh-
speed data transfer using pipeline architecture and two
datawordaccessesperclockcycle.The268,435,456-
bit memory array is internally organized as four banks
of64Mbtoallowconcurrentoperations.Thepipeline
allowsReadandWriteburstaccessestobevirtually
continuous, with the option to concatenate or truncate
thebursts.Theprogrammablefeaturesofburstlength,
burstsequenceandCASlatencyenablefurther
advantages.Thedeviceisavailablein16-bitand32-bit
datawordsizeInputdataisregisteredontheI/Opins
onbothedgesofDataStrobesignal(s),whileoutput
dataisreferencedtobothedgesofDataStrobeand
bothedgesofCLK.Commandsareregisteredonthe
positiveedgesofCLK.
AnAutoRefreshmodeisprovided,alongwithapower
savingPower-downmode.SelfRefreshmodesinclude
TemperatureCompensatedSelfRefresh(TCSR)and
PartialArraySelfRefresh(PASR)options,whichallow
userstoachieveadditionalpowersaving.TheTCSR
andPASRoptionscanbeprogrammedviatheextended
moderegister.AllinputsareLVCMOScompatible.
ADDRESS TABLE
Parameter 8Mx32 16Mx16
Configuration
2Mx32x4
banks
4Mx16x4
banks
BankAddress
Pins
BA0,BA1 BA0,BA1
Autoprecharge
Pins
A10/AP A10/AP
RowAddresses
4K/(A0–A11) 8K/(A0–A12)
Column
Addresses
512(A0–A8) 512(A0–A8)
RefreshCount 8K/64ms 8K/64ms
KEY TIMING PARAMETERS
SpeedGrade -5 -6 -75 Units
Fc k MAXCL=3 200 166 133 MHz
Fc k MAXCL=2 83.3 83.3 83.3 MHz