SCALE™-2 and SCALE™-2+ 2SC0108T
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SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
Dual Channel Ultra-compact Low-cost Driver Core
Abstract
The new low-cost SCALE™-2 and SCALE™-2+ dual-driver core 2SC0108T combines unrivalled compactness
with broad applicability. The driver was designed for universal applications requiring high reliability. The
2SC0108T drives all usual IGBT modules up to 600A/1200V or 450A/1700V. The embedded paralleling
capability allows easy inverter design covering higher power ratings. Multi-level topologies are also supported.
The 2SC0108T is the most compact driver core available for industrial applications, with a footprint of only
45mm x 34.3mm and an insertion height of max. 16mm. It allows even the most restricted insertion spaces to
be efficiently used.
Fig. 1 2SC0108T driver core
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
www.power.com/igbt-driver Page 2
Contents
Abstract .......................................................................................................................................... 1
Contents ......................................................................................................................................... 2
Driver Overview ............................................................................................................................. 4
Mechanical Dimensions .................................................................................................................. 5
Pin Designation .............................................................................................................................. 7
Recommended Interface Circuitry for the Primary Side Connector .............................................. 8
Description of Primary Side Interface ........................................................................................... 8
General ............................................................................................................................... 8
VCC terminal ....................................................................................................................... 8
MOD (mode selection) ......................................................................................................... 9
INA, INB (channel drive inputs, e.g. PWM) ........................................................................... 10
SO1, SO2 (status outputs) .................................................................................................. 10
TB (input for adjusting the blocking time Tb) ........................................................................ 10
Recommended Interface Circuitry for the Secondary Side Connectors ...................................... 11
Description of Secondary Side Interfaces .................................................................................... 11
General ............................................................................................................................. 11
Emitter terminal (VEx) ........................................................................................................ 11
Reference terminals (REFx) ................................................................................................ 12
Collector sense (VCEx) with resistors ................................................................................... 12
Desaturation protection with sense diodes ........................................................................... 13
Disabling the VCE,sat detection .............................................................................................. 15
Gate turn-on (GHx) and turn-off (GLx) terminals .................................................................. 15
Active clamping ................................................................................................................. 16
Soft Shut Down (SSD) ........................................................................................................ 16
How Do 2SC0108T SCALE-2 and SCALE-2+ Drivers Work in Detail? ........................................... 17
Power supply and electrical isolation ................................................................................... 17
Power-supply monitoring .................................................................................................... 17
Parallel connection of 2SC0108T ......................................................................................... 18
3-level or multilevel topologies ............................................................................................ 18
Additional application support for 2SC0108T ........................................................................ 18
Bibliography ................................................................................................................................. 18
The Information Source: SCALE-2 and SCALE-2+ Driver Data Sheets ........................................ 19
Quite Special: Customized SCALE-2 and SCALE-2+ Drivers ........................................................ 19
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
www.power.com/igbt-driver Page 3
Technical Support ........................................................................................................................ 19
Quality .......................................................................................................................................... 19
Legal Disclaimer ........................................................................................................................... 19
Ordering Information ................................................................................................................... 20
Information about Other Products .............................................................................................. 20
Manufacturer ................................................................................................................................ 20
Power Integrations Worldwide High Power Customer Support Locations .................................. 21
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
www.power.com/igbt-driver Page 4
Driver Overview
The 2SC0108T is a driver core equipped with Power Integrations' latest SCALE-2 or SCALE-2+ chipset /1/. The
SCALE-2 chipset is a set of application-specific integrated circuits (ASICs) that cover the main range of
functions needed to design intelligent gate drivers. The SCALE-2 driver chipset is a further development of the
proven SCALE technology /2/. The SCALE-2+ chipset further integrates the Soft Shut Down (SSD) feature
described in the paragraph “Soft Shut Down (SSD)” on page 16.
The 2SC0108T targets low- and medium-power, dual-channel IGBT applications such as general purpose
drives, UPS, solar converters and medical applications. The 2SC0108T comprises a complete dual-channel
IGBT driver core, fully equipped with an isolated DC/DC converter, short-circuit protection and supply-voltage
monitoring.
Fig. 2 Block diagram of the driver core 2SC0108T
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
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Mechanical Dimensions
Fig. 3 Interactive 3D drawing of 2SC0108T2A0-17
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
www.power.com/igbt-driver Page 6
Fig. 4 Mechanical drawing of 2SC0108T
The primary side and secondary side pin grid is 2.54mm (100mil) with a pin cross section of
0.64mm x 0.64mm. Total outline dimensions of the board are 34.3mm x 45mm. The total height of the
driver is max. 16mm measured from the bottom of the pin bodies to the top of the populated PCB.
Recommended diameter of solder pads: Ø 2mm (79 mil)
Recommended diameter of drill holes: Ø 1mm (39 mil)
X=2.54mm (100mil) for 2SC0108T2A0-17, 2SC0108T2B0-17, 2SC0108T2E0-17
2SC018T2H0-17
X=3.1mm (122mil) for 2SC0108T2G0-17
X=5.84mm (230mil) for 2SC0108T2C0-17, 2SC0108T2F0-17, 2SC0108T2F1-17
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
www.power.com/igbt-driver Page 7
Pin Designation
Pin No. and Name
Function
Primary Side
1
GND
Ground
2
INA
Signal input A; non-inverting input relative to GND
3
INB
Signal input B; non-inverting input relative to GND
4
VCC
Supply voltage; 15V supply for primary side
5
TB
Set blocking time
6
SO2
Status output channel 2; normally high-impedance, pulled down to low on fault
7
SO1
Status output channel 1; normally high-impedance, pulled down to low on fault
8
MOD
Mode selection (direct/half-bridge mode)
Secondary Sides
9
GH1
Gate high channel 1; pulls gate high through turn-on resistor
10
VE1
Emitter channel 1; connect to (auxiliary) emitter of power switch
11
GL1
Gate low channel 1; pulls gate low through turn-off resistor
12
REF1
Set VCE detection threshold voltage channel 1; resistor to VE1
13
14
15
16
VCE1
Free
Free
Free
VCE sense channel 1; connect to IGBT collector through resistor network
17
GH2
Gate high channel 2; pulls gate high through turn-on resistor
18
VE2
Emitter channel 2; connect to (auxiliary) emitter of power switch
19
GL2
Gate low channel 2; pulls gate low through turn-off resistor
20
REF2
Set VCE detection threshold voltage channel 2; resistor to VE2
21
VCE2
VCE sense channel 2; connect to IGBT collector through resistor network
Note: Pins with the designation “Free” are not physically present.
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
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Recommended Interface Circuitry for the Primary Side Connector
Fig. 5 Recommended user interface of 2SC0108T (primary side)
Description of Primary Side Interface
General
The primary side interface of the driver 2SC0108T is very simple and easy to use.
The driver primary side is equipped with an 8-pin interface connector with the following terminals:
1 x power-supply terminal
2 x drive signal inputs
2 x status outputs (fault returns)
1 x mode selection input (half-bridge mode / direct mode)
1 x input to set the blocking time
All inputs and outputs are ESD-protected. Moreover, all digital inputs have Schmitt-trigger characteristics.
VCC terminal
The driver has one VCC terminal on the interface connector. It supplies the primary side electronics as well as
the DC-DC converter to supply the secondary sides with 15V.
The driver limits the inrush current at startup and no external current limitation of the voltage source for VCC
is needed.
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
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MOD (mode selection)
The MOD input allows the operating mode to be selected with a resistor connected to GND.
Direct mode
If the MOD input is connected to GND, direct mode is selected. In this mode, there is no interdependence
between the two channels. Input INA directly influences channel 1 while INB influences channel 2. High level
at an input (INA or INB) always results in turn-on of the corresponding IGBT. In a half-bridge topology, this
mode should be selected only when the dead times are generated by the control circuitry so that each IGBT
receives its own drive signal.
Caution: Synchronous or overlapping timing of both switches of a half-bridge basically shorts the DC-link.
Half-bridge mode
If the MOD input is connected to GND with a resistor 71k<Rm<181k, half-bridge mode is selected. In this
mode, the inputs INA and INB have the following functions: INA is the drive signal input while INB acts as the
enable input (see Fig. 6). It is recommended to place a capacitor Cm=22nF in parallel to Rm in order to reduce
the deviation between the dead times at the rising and falling edges of INA respectively.
When input INB is low level, both channels are blocked. If it goes high, both channels are enabled and follow
the signal on the input INA. At the transition of INA from low to high, channel 2 turns off immediately and
channel 1 turns on after a dead time Td.
Fig. 6 Signals in half-bridge mode
The value of the dead time Td is determined by the value of the resistor Rm according to the following formula
(typical value):
4.56][33][ sTkR dm
with 0.5μs<Td<3.8μs and 73kΩ<Rm<182kΩ
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
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INA, INB (channel drive inputs, e.g. PWM)
INA and INB are basically drive inputs, but their function depends on the MOD input (see above). They safely
recognize signals in the whole logic-level range between 3.3V and 15V. Both input terminals feature Schmitt-
trigger characteristics (refer to the driver data sheet /3/). An input transition is triggered at any edge of an
incoming signal at INA or INB.
SO1, SO2 (status outputs)
The outputs SOx have open-drain transistors. When no fault condition is detected, the outputs have high
impedance. An internal current source of 500μA pulls the SOx outputs to a voltage of about 4V when leaved
open. When a fault condition (primary side supply undervoltage, secondary side supply undervoltage, IGBT
short-circuit or overcurrent) is detected, the corresponding status output SOx goes to low (connected to GND).
The diodes D1 and D2 must be Schottky diodes and must only be used when using 3.3V logic. For 5V…15V
logic, they can be omitted.
The maximum SOx current in a fault condition must not exceed the value specified in the driver data sheet
/3/.
Both SOx outputs can be connected together to provide a common fault signal (e.g. for one phase). However,
it is recommended to evaluate the status signals individually to allow fast and precise fault diagnosis.
How the status information is processed
a) A fault on the secondary side (detection of short-circuit of IGBT module or supply undervoltage) is
transmitted to the corresponding SOx output immediately. The SOx output is automatically reset
(returning to a high impedance state) after a blocking time Tb has elapsed (refer to “TB (input for
adjusting the blocking time Tb)” for timing information).
b) A supply undervoltage on the primary side is indicated to both SOx outputs at the same time. Both SOx
outputs are automatically reset (returning to a high impedance state) when the undervoltage on the
primary side disappears.
TB (input for adjusting the blocking time Tb)
The terminal TB allows the blocking time Tb to be set by connecting a resistor Rb to GND (see Fig. 5). The
following equation calculates the value of Rb connected between pins TB and GND in order to program the
desired blocking time Tb (typical value):
51][0.1][ msTkR bb
with 20ms<Tb<130ms and 71kΩ<Rb<181kΩ
The blocking time can also be set to a minimum of 9µs (typical) by selecting Rb=0Ω. The terminal TB must not
be left floating.
Note: It is also possible to apply a stabilized voltage at TB. The following equation is used to calculate the
voltage Vb between TB and GND in order to program the desired blocking time Tb (typical value):
02.1][02.0][ msTVV bb
with 20ms<Tb<130ms and 1.42<Vb<3.62V
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
www.power.com/igbt-driver Page 11
Recommended Interface Circuitry for the Secondary Side Connectors
Fig. 7 Recommended user interface of 2SC0108T (secondary sides)
Description of Secondary Side Interfaces
General
Each driver’s secondary side (driver channel) is equipped with a 5-pin interface connector with the following
terminals (x stands for the number of the drive channel 1 or 2):
1 x emitter terminal VEx
1 x reference terminal REFx for overcurrent or short-circuit protection
1 x collector sense terminal VCEx
1 x turn-on gate terminal GHx
1 x turn-off gate terminal GLx
All inputs and outputs are ESD-protected.
Emitter terminal (VEx)
The emitter terminal must be connected to the IGBT auxiliary emitter with the circuit shown in Fig. 7.
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
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Reference terminals (REFx)
The reference terminal REFx allows the threshold to be set for short-circuit and/or overcurrent protection with
a resistor placed between REFx and VEx. A constant current of 150µA is provided at pin REFx.
Collector sense (VCEx) with resistors
The collector sense of each channel of the 2SC0108T must be connected to the IGBT collector or MOSFET
drain with the circuit shown in Figs. 7 or 8 in order to detect an IGBT or MOSFET overcurrent or short-circuit.
In an IGBT off-state, the driver’s internal MOSFET connects pin VCEx to pin COMx. The capacitor Cax is then
precharged/discharged to the negative supply voltage, which is about -8V referred to VEx (red circle in Fig. 8
left). During this time, a current flows from the collector (blue circle in Fig. 8) via the resistor network and the
diode BAS416 to GHx. The current is limited by the resistor chain.
It is recommended to dimension the resistor value of Rvcex in order to obtain a current of about IRvcex=0.6-1mA
flowing through Rvcex (e.g. 1.2-1.8MΩ for VDC-LINK=1200V). The current through Rvcex must not exceed 1mA.
A high-voltage resistor as well as series-connected resistors may be used. In any case, the minimum creepage
distance required for the application must be considered.
The reference voltage is set by the resistor Rthx. It is calculated from the reference current (typically 150uA)
and the reference resistance Rthx (green circle in Fig. 8)
thxrefx RAV
150
Power Integrations recommends the use of Rthx=68kΩ. In this case the driver will safely protect the IGBT
against short-circuit, but not necessarily against overcurrent. Overcurrent protection has a lower timing priority
and is recommended to be realized within the host controller. Lower resistance values make the system more
sensitive and do not provide any advantages in the case of desaturated IGBTs (short-circuit).
Fig.
8
VCE desaturation protection with resistors
At IGBT turn-on and in the on-state, the driver’s internal MOSFET turns off. While VCE decreases (blue curve in
Fig. 8), Cax is charged from the COMx potential to the IGBT saturation voltage (red curve in Fig. 8). The time
required to charge Cax depends on the DC bus voltage, the value of the resistor Rax and the value of the
capacitor Cax. For 1200V and 1700V IGBTs it is recommended to set Rax=120kΩ. For 600V IGBTs the
recommended value is Rax=62kΩ.
During the response time, the VCE monitoring circuit is inactive. The response time is the time that elapses
after turn-on of the power semiconductor until the collector voltage is measured. It corresponds to the short-
circuit duration.
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
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The value of the response time capacitors Cax can be determined from the following table in order to set the
desired response time (Rvcex=1.8MΩ, Rax=120kΩ, DC-link voltage VDC-LINK>550V):
Rthx [kΩ]/Vthx [V]
Response time [μs]
43 / 6.45
1.2
43 / 6.45
3.2
43 / 6.45
4.2
43 / 6.45
5.8
43 / 6.45
7.8
68 / 10.2
1.5
68 / 10.2
4.9
68 / 10.2
6.5
68 / 10.2
8.9
68 / 10.2
12.2
Table 1 Typical response time as a function of the capacitance Cax and the resistance Rthx
As the parasitic capacitances on the host PCB may influence the response time, it is recommended to measure
it in the final design. It is important to define a response time which is shorter than the maximum permitted
short-circuit duration of the power semiconductor used.
Note that the response time increases at DC-link voltage values lower than 550V (Rax=120kΩ) and/or higher
threshold voltage values Vthx. The response time will decrease at lower threshold voltage values.
The diode D1x in Fig. 7 must have a very low leakage current and a blocking voltage >40V (e.g. BAS416).
Schottky diodes must be explicitly avoided.
The components Cax, Rax, Rthx and D1x must be placed as close as possible to the driver. A large collector-
emitter loop must also be avoided.
When a short-circuit/overcurrent fault is detected, the driver switches off the corresponding power
semiconductor. The fault status is immediately transferred to the corresponding SOx output of the affected
channel. The power semiconductor is kept in the off-state (non-conducting) and the fault is shown at pin SOx
as long as the blocking time Tb is active.
The blocking time Tb is applied independently to each channel. Tb starts as soon as a fault has been detected.
Desaturation protection with sense diodes
2SC0108T also provides desaturation protection with high-voltage diodes as shown in Fig. 9. However, the use
of high-voltage diodes has some disadvantages compared to the use of resistors:
Common-mode current relating to the rate of change dvce/dt of the collector-emitter voltage: High-
voltage diodes have large junction capacitances Cj. These capacitances in combination with the dvce/dt
generate a common-mode current Icom flowing in and out of the measurement circuit.
dt
dv
CI ce
jcom
Price: High-voltage diodes are more expensive than standard 0805/150V or 1206/200V SMD resistors.
Availability: Standard thick-film resistors are comparatively easier to source on the market.
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
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Limited ruggedness: The reaction time does not increase at lower VCE levels. Consequently, false
triggering may occur at higher IGBT temperatures, higher collector currents, resonant switching or
phase-shift PWM, particularly when the reference voltage Vthx is set below about 10V. The upper limit
of the reference voltage is restricted to about 10V, which may lead to limited IGBT utilization: the
collector current may be limited to values smaller than twice the nominal current, or the short-circuit
withstand capability may be reduced.
During the IGBT off-state, D4x (and Rax) sets the VCEx pin to COMx potential, thereby precharging/discharging
the capacitor Cax to the negative supply voltage, which is about -8V referred to VEx. At IGBT turn-on, the
capacitor Cax is charged via Rax. When the IGBT collector-emitter voltage drops below that limit, the voltage of
Cax is limited via the high-voltage diodes D1x and D2x. The voltage across Cax can be calculated by:
)
330
15
330()2()1(
)2()1(
ax
xDFxDFCEsat
xDFxDFCEsatCax R
VVVV
VVVV
The reference voltage Vrefx must be higher than Vcax. The reference voltage is set up by the resistor Rthx. The
reference voltage is calculated via the reference current (typically 150uA) and the reference resistance Rthx:
thxrefx RAV
150
Fig. 9 Recommended circuit for desaturation protection with sense diodes (one channel shown)
The value of the resistance Rax can be calculated with the following equation in order to program the desired
response time Tax at turn-on:
)
15
15
ln(][
][1000
≈][
refx
GLx
ax
ax
ax
VV
VV
pFC
sT
kR
Eq. 6
VGLx is the absolute value of the turn-off voltage at the driver output. It depends on the driver load and can be
found in the driver data sheet /3/.
Recommended components D1x/D2x/D3x/D4x and values for Rax and Cax are:
High-voltage diodes D1x/D2x: 2x 1N4007 for 1200V IGBT
3x 1N4007 for 1700V IGBT
D3x: Transient voltage suppressor of the voltage class 12V…15V with small junction capacitance as
CDDFN2-12C from Bourns.
D4x: High-speed diode as BAS316. Schottky diodes must be avoided.
Rax=24kΩ…62kΩ
Cax=100pF…560pF
SCALE™-2 and SCALE™-2+ 2SC0108T
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Note that Cax must include the parasitic capacitance of the transient voltage suppressor D3x and the PCB.
Note also that the instantaneous VCE threshold voltage is determined by the voltage at pin REFx (150μA
through Rthx) minus the voltage across the 330Ω resistor as well as the forward voltages across D1x and D2x.
The minimum off-state duration should not be shorter than about 1µs in order not to significantly reduce the
response time for the next turn-on pulse.
Example: A resistor of Rax≈46kΩ must be used to define a response time of 6μs with Cax=150pF, Rthx=33kΩ
and VGLx=9V.
Disabling the VCE,sat detection
To disable the VCE,sat measurement of 2SC0108T, a resistor with a minimum value of 33kΩ must be placed
between VCEx and VEx according to Fig. 10.
The reference resistor Rthx may be chosen between 33kΩ and infinity, i.e. the REFx pin may be left open.
Fig. 10 Disabling the VCE,sat detection
Gate turn-on (GHx) and turn-off (GLx) terminals
These terminals allow the turn-on (GHx) and turn-off (GLx) gate resistors to be connected to the gate of the
power semiconductor. The GHx and GLx pins are available as separated terminals in order to set the turn-on
and turn-off resistors independently without the use of an additional diode. Please refer to the driver data
sheet /3/ for the limit values of the gate resistors used.
A resistor between GLx and VEx of 22k (higher values are also possible) may be used in order to provide a
low-impedance path from the IGBT gate to the emitter even if the driver is not supplied with power. Lower
resistance values are not allowed.
A transient voltage suppressor device (D5x) may be used between gate and emitter (e.g. SMBJ13CA) if the
gate-emitter voltage becomes too high in the IGBT short-circuit condition, thus leading to excessive short-
circuit currents.
SCALE™-2 and SCALE™-2+ 2SC0108T
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Note however that it is not advisable to operate the power semiconductors within a half-bridge with a driver in
the event of a low supply voltage. Otherwise, a high rate of increase of VCE may cause partial turn-on of these
IGBTs.
Active clamping
Active clamping is a technique designed to partially turn on the power semiconductor as soon as the collector-
emitter (drain-source) voltage exceeds a predefined threshold. The power semiconductor is then kept in linear
operation.
Basic active clamping topologies implement a single feedback path from the IGBT’s collector through transient
voltage suppressor devices (TVS) to the IGBT gate. The 2SC0108T supports basic active clamping.
It is recommended to use the circuit shown in Fig. 7. The following parameters must be adapted to the
application:
TVS D2x, D3x and D4x. It is recommended to use:
- Six 80V TVS with 600V IGBTs with DC-link voltages up to 430V. Good clamping results can be
obtained with five unidirectional TVS P6SMBJ70A and one bidirectional TVS P6SMBJ70CA from
Semikron or with five unidirectional TVS SMBJ70A-E3 and one bidirectional TVS SMBJ70CA-E3 from
Vishay.
- Six 150V TVS with 1200V IGBTs with DC-link voltages up to 800V. Good clamping results can be
obtained with five unidirectional TVS SMBJ130A-E3 and one bidirectional TVS SMBJ130CA-E3 from
Vishay or five unidirectional TVS SMBJ130A-TR from ST and one bidirectional TVS P6SMBJ130CA
from Diotec.
- Six 220V TVS with 1700V IGBTs with DC-link voltages up to 1200V. Good clamping results can be
obtained with five unidirectional TVS P6SMB220A and one bidirectional TVS P6SMB220CA from
Diotec or five unidirectional TVS SMBJ188A-E3 and one bidirectional TVS SMBJ188CA-E3 from
Vishay.
At least one bidirectional TVS (D2x) per channel must be used in order to avoid negative current
flowing through the TVS chain during turn-on of the antiparallel diode of the IGBT module due to its
forward recovery behavior. Such a current could, depending on the application, lead to undervoltage
of the driver secondary voltage VISOx to VEx (15V).
Note that it is possible to modify the number of TVS in a chain. The active clamping efficiency can be
improved by increasing the number of TVS used in a chain if the total threshold voltage remains at the
same value. Note also that the active clamping efficiency is highly dependent on the type of TVS used
(e.g. manufacturer).
Note that the active clamping performance can be improved by increasing the value of the turn-off gate
resistors Rg,offx.
If active clamping is not used, the TVS D2x, D3x and D4x can be omitted.
Soft Shut Down (SSD)
The SSD function is implemented and cannot be deactivated on the following SCALE-2+ types of 2SC0108T
drivers: 2SC0108T2F1-17, 2SC0108T2G0-17 and 2SC0108T2H0-17 (refer to the driver data sheet /3/). All
other driver’s types do not feature the SSD function.
The SSD function reduces the turn-off di/dt to limit the Vce overvoltage as soon as a short-circuit condition is
detected. An excessive turn-off overvoltage is therefore avoided and the power semiconductor is turned off
within its safe operating area.
SCALE™-2 and SCALE™-2+ 2SC0108T
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The SSD function is realized with a closed loop scheme which is activated as soon as an IGBT short circuit is
detected. The driver then measures the gate-emitter voltage and adjusts it according to the three following
phases:
In a first step, the gate-emitter voltage is decreased to a defined level controlled with the closed loop
feedback.
The defined level of the gate-emitter voltage is held at the given level to ramp down the collector
current smoothly (e.g. with lower di/dt) until the gate charge profile of the power semiconductor has
reached the end of the Miller plateau. The end of the Miller plateau is detected by evaluating the gate
current.
The gate-emitter voltage is then reduced to its end value, following a given reference value.
The SSD function is only active when a short-circuit condition has been detected and not under normal
operating conditions (e.g. at nominal current or under over-current conditions). It may therefore be necessary
to increase the turn-off gate resistance or to take appropriate measures (e.g. lower DC-link stray inductance)
to avoid excessive turn-off overvoltages under normal operating conditions.
Note that the SSD function uses a closed-loop scheme. It may therefore not necessarily perform better with a
higher value of the turn-off gate resistor.
Even if the SSD function uses a closed-loop regulation scheme, it has performance limitations. Excessive DC-
link stray inductance values may therefore lead to excessive turn-off overvoltages in the short-circuit
condition. It is therefore necessary to characterize the short-circuit behavior of the IGBT under all application-
relevant conditions, especially over the full IGBT and driver ambient temperature range, and to consider
sufficient safety margins of the VCE peak voltage to achieve a rugged design.
If the VCE peak voltage is excessively high and cannot be lowered by other means, Power Integrations
additionally recommends using basic active clamping according to the paragraph “Active clamping”.
How Do 2SC0108T SCALE-2 and SCALE-2+ Drivers Work in Detail?
Power supply and electrical isolation
The driver is equipped with a DC/DC converter to provide an electrically insulated power supply to the gate
driver circuitry. All transformers (DC/DC and signal transformers) feature safe isolation to EN 50178,
protection class II between primary side and either secondary side.
Note that the driver requires a stabilized supply voltage.
Power-supply monitoring
The driver’s primary side as well as both secondary-side driver channels are equipped with a local
undervoltage monitoring circuit.
In the event of a primary-side supply undervoltage, the power semiconductors are driven with a negative gate
voltage to keep them in the off-state (the driver is blocked) and the fault is transmitted to both outputs SO1
and SO2 until the fault disappears.
In case of a secondary-side supply undervoltage, the corresponding power semiconductor is driven with a
negative gate voltage to keep it in the off-state (the channel is blocked) and a fault condition is transmitted to
the corresponding SOx output. The SOx output is automatically reset (returning to a high impedance state)
after the blocking time.
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
www.power.com/igbt-driver Page 18
Within a half-bridge, it is advised not to operate the IGBTs with an IGBT driver in the event of a
low supply voltage. Otherwise, a high rate of increase of VCE may cause partial turn-on of these
IGBTs.
Parallel connection of 2SC0108T
If parallel connection of 2SC0108T drivers is required, please refer to the application note
AN-0904 /5/ on www.power.com/igbt-driver/go/app-note.
3-level or multilevel topologies
If 2SC0108T drivers are to be used in 3-level or multilevel topologies, please refer to the application note
AN-0901 /6/ on www.power.com/igbt-driver/go/app-note.
Additional application support for 2SC0108T
For additional application support using 2SC0108T drivers, please refer to the application note AN-1101 /4/ on
www.power.com/igbt-driver/go/app-note.
Bibliography
/1/ Paper: Smart Power Chip Tuning, Bodo’s Power Systems, May 2007
/2/ “Description and Application Manual for SCALE™ Drivers”, Power Integrations
/3/ Data sheet SCALE™-2/SCALE™-2+ driver core 2SC0108T, Power Integrations
/4/ Application note AN-1101: Application with SCALE™-2 and SCALE™-2+ Gate Driver Cores, Power
Integrations
/5/ Application note AN-0904: Direct Paralleling of SCALE™-2 Gate Driver Cores, Power Integrations
/6/ Application note AN-0901: Methodology for Controlling Multi-Level Converter Topologies with
SCALE™-2 IGBT Drivers, Power Integrations
Note: The Application Notes are available on the Internet at www.power.com/igbt-driver/go/app-note and
the papers at www.power.com/igbt-driver/go/papers.
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
www.power.com/igbt-driver Page 19
The Information Source: SCALE-2 and SCALE-2+ Driver Data Sheets
Power Integrations offers the widest selection of gate drivers for power MOSFETs and IGBTs for almost any
application requirements. The largest website on gate-drive circuitry anywhere contains all data sheets,
application notes and manuals, technical information and support sections: www.power.com.
Quite Special: Customized SCALE-2 and SCALE-2+ Drivers
If you need an IGBT driver that is not included in the delivery range, please don’t hesitate to contact Power
Integrations or your Power Integrations sales partner.
Power Integrations has more than 25 years experience in the development and manufacture of intelligent gate
drivers for power MOSFETs and IGBTs and has already implemented a large number of customized solutions.
Technical Support
Power Integrations provides expert help with your questions and problems:
www.power.com/igbt-driver/go/support
Quality
The obligation to high quality is one of the central features laid down in the mission statement of Power
Integrations Switzerland GmbH.
Our total quality management system assures state-of-the-art processes
throughout all functions of the company, certified by ISO9001:2008 standards.
Legal Disclaimer
The statements, technical information and recommendations contained herein are believed to be accurate as
of the date hereof. All parameters, numbers, values and other technical data included in the technical
information were calculated and determined to our best knowledge in accordance with the relevant technical
norms (if any). They may base on assumptions or operational conditions that do not necessarily apply in
general. We exclude any representation or warranty, express or implied, in relation to the accuracy or
completeness of the statements, technical information and recommendations contained herein. No
responsibility is accepted for the accuracy or sufficiency of any of the statements, technical information,
recommendations or opinions communicated and any liability for any direct, indirect or consequential loss or
damage suffered by any person arising therefrom is expressly disclaimed.
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
www.power.com/igbt-driver Page 20
Ordering Information
The general terms and conditions of delivery of Power Integrations Switzerland GmbH apply.
Type Designation Description
2SC0108T2A0-17 SCALE-2 driver core (-20°C…85°C, connector pin length: 2.54mm)
2SC0108T2B0-17 SCALE-2 driver core (-40°C…85°C, connector pin length: 2.54mm)
2SC0108T2C0-17 SCALE-2 driver core (-40°C…85°C, connector pin length: 5.84mm)
2SC0108T2E0-17 SCALE-2 driver core (Lead free, -40°C…85°C, connector pin length: 2.54mm)
2SC0108T2F0-17 SCALE-2 driver core (Lead free, -40°C…85°C, connector pin length: 5.84mm)
2SC0108T2F1-17 SCALE-2+ driver core (Lead free, -40°C…85°C, connector pin length:
5.84mm, increased EMI capability, SSD)
2SC0108T2G0-17 SCALE-2+ driver core (Lead free, -40°C…85°C, connector pin length:
3.1mm, increased EMI capability, SSD)
2SC0108T2H0-17 SCALE-2+ driver core (Lead free, -40°C…85°C, connector pin length:
2.54mm, increased EMI capability, SSD)
Product home page: www.power.com/igbt-driver/go/2SC0108T
Refer to www.power.com/igbt-driver/go/nomenclature for information on driver nomenclature
Information about Other Products
For other driver cores:
Direct link: www.power.com/igbt-driver/go/cores
For other drivers, product documentation, evaluation systems and application support:
Please click onto: www.power.com
Manufacturer
Power Integrations Switzerland GmbH
Johann-Renfer-Strasse 15
2504 Biel-Bienne, Switzerland
Phone +41 32 344 47 47
Fax +41 32 344 47 40
Email igbt-driver.sales@power.com
Website www.power.com/igbt-driver
© 2009…2015 Power Integrations Switzerland GmbH. All rights reserved.
We reserve the right to make any technical modifications without prior notice. Version 2.1 from 2015-03-19
SCALE™-2 and SCALE™-2+ 2SC0108T
Preliminary Description & Application Manual
www.power.com/igbt-driver Page 21
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