1
Product Family Data Sheet Rev. 2.4 2018. 10.1
High Voltage LED Series
Chip on Board
LC013D – Gen.1
High efficacy COB LED package
well-suited for use in spotlight applications
Featur
es & Benefits
Chip on Board (COB) solution makes it easy to design in
Simple assembly reduces manufacturing cost
Low thermal resistance
InGaN/GaN MQW LED with long time reliability
Applications
Spotlight / Downlight
LED Retrofit Bulbs
Outdoor Illumination
2
Table of Contents
1.
Characteristics
-----------------------
3
2.
Product Code Information
-----------------------
5
3.
Typical Characteristics Graphs
-----------------------
9
4.
Outline Drawing & Dimension
-----------------------
12
5.
Reliability Test Items & Conditions
-----------------------
13
6.
Label Structure
-----------------------
14
7.
Packing Structure
-----------------------
15
8.
Precautions in Handling & Use
-----------------------
17
3
1. Characteristics
a) Absolute Maximum Rating
Item
Symbol
Rating
Condition
Ambient / Operating Temperature
Ta
-40 ~ +105
-
Storage Temperature
Tstg
-40 ~ +120
-
LED Junction Temperature
TJ
140
-
Case Temperature
Tc
105
Forward Current
IF
920
-
Power Dissipation
PD
34.5
-
ESD (HBM)
-
±2
-
ESD (MM)
-
±0.5
-
b) Electro-optical Characteristics (IF = 360 mA, TJ = 85 ºC)
Item
Unit
Rank
Min.
Typ.
Max.
Forward Voltage (VF)
V
YZ
31.8
34.6
37.5
Color Rendering Index (Ra)
-
5
80
-
-
7
90
Thermal Resistance (junction to chip point)
ºC/W
-
1.4
-
Beam Angle
º
-
115
-
Nominal Power
W
13.5
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = Ta = 85 °C)
2) Samsung maintains measurement tolerance of: forward voltage = ±5 %, CRI = ±1
3) Refer to the derating curve, ‘3. Typical Characteristics Graph’ designed within the range.
4
c) Luminous Flux Characteristics (IF = 360 mA)
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux @ TJ = 85 °C (lm)
Min.
Typ.
Max.
80
2700
H5
1510
1589
-
D1
1589
1669
-
3000
H5
1589
1673
-
D1
1673
1757
-
3500
H6
1639
1725
-
D1
1725
1812
-
4000
H6
1669
1757
-
D1
1757
1844
-
5000
H6
1684
1772
-
D1
1772
1861
-
5700
H6
1684
1772
-
D1
1772
1861
-
6500
H6
1659
1746
-
D1
1746
1834
-
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux @ TJ = 85 °C (lm)
Min.
Typ.
Max.
90
2700
H2
1291
1359
-
D1
1359
1427
-
3000
H3
1352
1423
-
D1
1423
1494
-
3500
H4
1400
1473
-
D1
1473
1547
-
4000
H4
1429
1505
-
D1
1505
1580
-
5000
H4
1433
1508
-
D1
1508
1584
-
Notes:
5
1) The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature
(TJ = TC = 85 °C).
2) Samsung maintains measurement tolerance of: Luminous flux = ±7 %, CRI = ±1
6
2. Product Code Information
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
S
P
H
W
H
A
H
D
N
D
2
5
Y
Z
W
3
H
5
Digit
PKG Information
Code
Specification
1 2 3
Samsung Package High Power
SPH
4 5
Color
WH
White
6
Product Version
A
7 8
Form Factor
HD
COB
9
Lens Type
N
No lens
10
Wattage or Model
D
LC013D
11
Internal Code
2
12
CRI & Sorting Temperature
5
Min. 80 (85℃)
7
Min. 90 (85℃)
13 14
Forward Voltage (V)
YZ
31.8~37.5
15
CCT (K)
W
2700K
V
3000K
U
3500K
T
4000K
R
5000K
Q
5700K
P
6500K
16
MacAdam Step
2
MacAdam 2-step
3
MacAdam 3-step
17 18
Luminous Flux (Lm)
H2
Min. 1200
H3
Min. 1300
H4
Min. 1400
H5
Min. 1500
H6
D1
Min. 1600
Add rank
7
a) Binning Structure (IF = 360 mA, TJ = 85 ºC)
CRI (Ra)
Min.
Nominal
CCT (K)
Product Code
VF
Rank
Color
Rank
Flux
Rank
Flux Range
(Φv, lm)
80
2700
SPHWHAHDND25YZW2H5
YZ
W2
H5
1510 ~
SPHWHAHDND25YZW3H5
W3
SPHWHAHDND25YZW2D1
W2
D1
1589 ~
SPHWHAHDND25YZW3D1
W3
3000
SPHWHAHDND25YZV2H5
YZ
V2
H5
1589 ~
SPHWHAHDND25YZV3H5
V3
SPHWHAHDND25YZV2D1
V2
D1
1673 ~
SPHWHAHDND25YZV3D1
V3
3500
SPHWHAHDND25YZU2H6
YZ
U2
H6
1639 ~
SPHWHAHDND25YZU3H6
U3
SPHWHAHDND25YZU2D1
U2
D1
1725 ~
SPHWHAHDND25YZU3D1
U3
4000
SPHWHAHDND25YZT2H6
YZ
T2
H6
1669 ~
SPHWHAHDND25YZT3H6
T3
SPHWHAHDND25YZT2D1
T2
D1
1757 ~
SPHWHAHDND25YZT3D1
T3
5000
SPHWHAHDND25YZR3H6
YZ
R3
H6
1684 ~
SPHWHAHDND25YZR3D1
D1
1772 ~
5700
SPHWHAHDND25YZQ3H6
YZ
Q3
H6
1684 ~
SPHWHAHDND25YZQ3D1
D1
1772 ~
6500
SPHWHAHDND25YZP3H6
YZ
P3
H6
1659 ~
SPHWHAHDND25YZP3D1
D1
1746 ~
8
CRI (Ra)
Min.
Nominal
CCT (K)
Product Code
VF
Rank
Color
Rank
Flux
Rank
Flux Range
(Φv, lm)
90
2700
SPHWHAHDND27YZW2H2
YZ
W2
H2
1291 ~
SPHWHAHDND27YZW3H2
W3
SPHWHAHDND27YZW2D1
W2
D1
1359 ~
SPHWHAHDND27YZW3D2
W3
3000
SPHWHAHDND27YZV2H3
YZ
V2
H3
1352 ~
SPHWHAHDND27YZV3H3
V3
SPHWHAHDND27YZV2D1
V2
D1
1423 ~
SPHWHAHDND27YZV3D1
V3
3500
SPHWHAHDND27YZU2H4
YZ
U2
H4
1400 ~
SPHWHAHDND27YZU3H4
U3
SPHWHAHDND27YZU2D1
U2
D1
1473 ~
SPHWHAHDND27YZU3D1
U3
4000
SPHWHAHDND27YZT2H4
YZ
T2
H4
1429 ~
SPHWHAHDND27YZT3H4
T3
SPHWHAHDND27YZT2D1
T2
D1
1505 ~
SPHWHAHDND27YZT3D1
T3
5000
SPHWHAHDND27YZR3H4
YZ
R3
H4
1433 ~
SPHWHAHDND27YZR3D1
R3
D1
1508 ~
9
b) Chromaticity Region & Coordinates (IF = 360 mA, TJ = 85 ºC)
MacAdam Ellipse (W2, W3)
MacAdam Ellipse (V2, V3)
Step
CIE x
CIE y
a
b
Step
CIE x
CIE y
a
b
2-step
0.4578
0.4101
53.70
0.0054
0.0028
2-step
0.4338
0.403
53.22
0.0056
0.0027
3-step
0.4578
0.4101
53.70
0.0081
0.0042
3-step
0.4338
0.4030
53.22
0.0083
0.0041
MacAdam Ellipse (U2, U3)
MacAdam Ellipse (T2, T3)
Step
CIE x
CIE y
a
b
Step
CIE x
CIE y
a
b
2-step
0.4073
0.3917
54.00
0.0062
0.0028
2-step
0.3818
0.3797
53.72
0.0063
0.0027
3-step
0.4073
0.3917
54.00
0.0093
0.0041
3-step
0.3818
0.3797
53.72
0.0094
0.0040
MacAdam Ellipse (R3)
MacAdam Ellipse (Q3)
Step
CIE x
CIE y
a
b
Step
CIE x
CIE y
a
b
3-step
0.3447
0.3553
59.62
0.0082
0.0035
3-step
0.3287
0.3417
59.0950
0.0075
0.0032
MacAdam Ellipse (P3)
Step
CIE x
CIE y
a
b
3-step
0.3123
0.3282
58.5700
0.0067
0.0029
Note:
Samsung maintains measurement tolerance of: Cx, Cy = ±0.005
CIE x,y
10
3. Typical Characteristics Graphs
a) Spectrum Distribution (IF = 360, TJ = 85 ºC)
CCT: 2700 K (80 CRI) CCT: 3000 K (80 CRI)
CCT: 3500 K (80 CRI) CCT: 4000 K (80 CRI)
CCT: 5000 K (80 CRI) CCT: 5700 K (80 CRI)
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength(nm)
Relative Intensity vs. Wavelength
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
11
CCT: 6500 K (80 CRI)
b) Forward Current Characteristics (TJ = 85 ºC)
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
12
C) Temperature Characteristics (IF = 360mA)
d) Color Shift Characteristics (TJ = 25 ºC, IF = 360mA, CRI80+)
0
50
100
150
200
250
0 0.2 0.4 0.6 0.8 1
Relative Luminous Flux(%)
Forward Current(A)
Relative luminous Flux vs. Forward Current
30
32.5
35
37.5
40
42.5
0 0.2 0.4 0.6 0.8 1
Forward Voltage(%)
Forward Current(A)
Forward Voltage vs. Forward Current
90
95
100
105
110
115
120
20 35 50 65 80 95 110
Relative Luminous Flux(%)
Tc(℃)
Relative Luminous Flux vs. Temperature
34.0
34.5
35.0
35.5
36.0
20 40 60 80 100
Forward Voltage(V)
Tc(℃)
Forward Voltage vs. Temperature
13
e) Beam Angle Characteristics (IF = 360 mA, Ta = 25 ºC)
f) Derating Characteristics
-0.05
-0.04
-0.03
-0.02
-0.01
0
0.00 0.20 0.40 0.60 0.80
△CIE x,△ CIE y
Forward Current(A)
△CIE x,△CIE y vs. Forward Current
△CIE
x
-0.05
-0.04
-0.03
-0.02
-0.01
0
20 40 60 80 100
△CIE x,△ CIE y
Tc(℃)
△CIEx,△CIEy vs. Temperature
ΔCIE x
ΔCIE y
0
0.2
0.4
0.6
0.8
1
1.2
-100 -80 -60 -40 -20 0 20 40 60 80 100
Relative Luminous Intensity
Angle(°)
0
200
400
600
800
1000
020 40 60 80 100 120
If [ mA ]
Tc [ ℃ ]
Derating Curve
14
4. Outline Drawing & Dimension
Item
Dimension
Tolerance
Unit
Length
13.5
±0.15
mm
Width
13.5
±0.15
mm
Height
1.50
±0.20
mm
1. Unit: mm
2. Tolerance: ± 0.30 mm
TC
Model
Description
LOT No.
SAMSUNG
LC013D18030
XXX.....XXXX
1727
Internal Code
15
Light Emitting Surface (LES) Diameter
9.8
±0.30
mm
Note: Denoted product information above is only an example
( LC013D18030 : LC013D, CRI80+, 3000K )
16
5. Reliability Test Items & Conditions
a) Test Items
Test Item
Test Condition
Test Hour / Cycle
High Temperature
Humidity Life Test
60 ºC, 90 % RH,, DC Derating, IF
1000 h
High Temperature
Life Test
85 ºC, DC Derating, IF
1000 h
Low Temperature
Life Test
-40 ºC, DC , IF = 700 mA
1000 h
Pulsed Operating Life Test
55 ℃, Pulse width 100 ㎲, duty cycle 3 %
1000 h
High Temperature
Storage
120 ºC
1000 h
Low Temperature
Storage
-40 ºC
1000 h
Temperature Humidity
Storage
60 ºC, 90% RH
1000h
Temperature Cycle
On/Off Test
-40 ºC / 85 ºC each 20 min, 30 min transfer
power on/off each 5 min, DC Derating, IF = max
100 cycles
ESD (HBM)
R1: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
V: ±2 kV
5 times
ESD (MM)
R1: 10 MΩ
R2: 0 kΩ
C: 200 pF
V: ±0.2 kV
5 times
Vibration Test
20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g)
80 ~ 2 kHz (max. 20 g)
min. frequency ↔ max. frequency 4 min transfer
4 times
Mechanical Shock Test
1500 g, 0.5 ms
each of the 6 surfaces (3 axis x 2 sides)
5 times
Sulfur Resistance
25 °C, 75%, H2S 15 ppm
504h
b) Criteria for Judging the Damage
Item
Symbol
Test Condition
(Tc = 25 ºC)
Limit
Min.
Max.
Forward Voltage
VF
IF = 360 mA
L.S.L. * 0.9
U.S.L. * 1.1
Luminous Flux
Φv
IF = 360 mA
L.S.L * 0.7
U.S.L * 1.3
17
YZW3H5
SPHWHAHDND25YZW3H5 YZW3H5 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
G4AZC4001 / 1001 / xxxx pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
YZW3H5
SPHWHAHDND25YZW3H5 YZW3H5 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑨
/1ⓐⓑⓒ/ xxxx pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Bin Code
Lot Number
Product Code
6. Label Structure
a) Label Structure
Note: Denoted bin code and product code above is only an example (see description on page 5)
Bin Code:
ⓐⓑ: Forward Voltage bin (refer to page 11)
ⓒⓓ: Chromaticity bin (refer to page 9-10)
ⓔⓕ: Luminous Flux bin (refer to page 6)
b) Lot Number
The lot number is composed of the following characters:
① ③④⑤⑥⑦⑧⑨ / 1ⓐⓑⓒ / xxxx pcs
①
: Production site (S: Giheung, Korea, G: Tianjin, China)
②
: 4 (LED)
③
: Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
④
: Year (Z: 2015, A: 2016, B: 2017…)
⑤
: Month (1~9, A, B, C)
⑥⑦⑧⑨
: Day (1~9, A, B~V)
ⓐⓑⓒ
: Product serial number (001 ~ 999)
ⓐⓑⓒⓓⓔⓕ
LC013D RA80 2700K
LC013D RA80 2700K
18
7. Packing Structure
Packing material
Max. quantity
in pcs of COB
Dimension(mm)
Length
Width
Height
Tolerance
Tray
30
160
180
10
1.0
Aluminum Bag
60(2 trays)
210
241
10
Inner Box
240
230
84
260
2
Outer Box
2400
476
445
272
5
a) Packing Structure
Label
Label
19
b) Tray
① Cover ② Body
c) Aluminum Vinyl Packing Bag
20
8. Precautions in Handling & Use
1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA
is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the
device.
2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at
temperature 0~40 ºC, 0~90 % RH).
3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
5) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-
electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may
cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as
increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
8) The thermal management is one of the most critical factors for the LED lighting system. Especially the LED junction
temperature should not exceed the absolute maximum rating while operation of LED lighting system.
For more information, please refer to Application Note ‘Mechanical & Thermal Guide for COB’.
9) In case of driving LEDs around the minimum current level (If_min), chips might exhibit different brightness due to the
variation in I-V characteristics of each one. This is normal and does not adversely affect the performance of product.
10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a
discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light
emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical
properties of materials used in luminaires and they must be carefully selected.
11) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead,
please pick at the handling area as indicated below.
Legal and additional information.
About Samsung Electronics Co., Ltd.
Samsung Electronics Co., Ltd. inspires the world and shapes the future
with transformative ideas and technologies, redefining the worlds of TVs,
smartphones, wearable devices, tablets, cameras, digital appliances,
printers, medical equipment, network systems and semiconductors.
We are also leading in the Internet of Things space through, among others,
our Digital Health and Smart Home initiatives. We employ 307,000 people
across 84 countries. To discover more, please visit our official website at
www.samsung.com and our official blog at global.samsungtomorrow.com.
Copyright © 2015 Samsung Electronics Co., Ltd. All rights reserved.
Samsung is a registered trademark of Samsung Electronics Co., Ltd.
Specifications and designs are subject to change without notice. Non-metric
weights and measurements are approximate. All data were deemed correct
at time of creation. Samsung is not liable for errors or omissions. All brand,
product, service names and logos are trademarks and/or registered trademarks
of their respective owners and are hereby recognized and acknowledged.
Samsung Electronics Co., Ltd.
95, Samsung 2-ro
Giheung-gu
Yongin-si, Gyeonggi-do, 446-711
KOREA
www.samsungled.com