GS74108ATP/J/X SOJ, TSOP, FP-BGA Commercial Temp Industrial Temp 512K x 8 4Mb Asynchronous SRAM Features 6, 7, 8, 10, 12 ns 3.3 V VDD Center VDD and VSS SOJ 512K x 8-Pin Configuration * Fast access time: 6, 7, 8, 10, 12 ns * CMOS low power operation: 155/135/120/95/85 mA at minimum cycle time * Single 3.3 V power supply * All inputs and outputs are TTL-compatible * Fully static operation * Industrial Temperature Option: -40 to 85C * Package line up J: 400 mil, 36-pin SOJ package TP: 400 mil, 44-pin TSOP Type II package X: 6 mm x 10 mm Fine Pitch Ball Grid Array package A4 1 36 NC A3 2 35 A5 A2 3 34 A6 A1 4 33 A7 A0 5 32 A8 CE 6 31 OE DQ1 7 30 DQ8 DQ2 8 29 DQ7 VDD 9 28 VSS 27 VDD 36-pin 400 mil SOJ VSS 10 DQ3 11 26 DQ6 Description DQ4 12 25 DQ5 WE 13 24 A9 The GS74108A is a high speed CMOS Static RAM organized as 524,288 words by 8 bits. Static design eliminates the need for external clocks or timing strobes. The GS74108A operates on a single 3.3 V power supply and all inputs and outputs are TTL-compatible. The GS74108A is available in 400 mil SOJ, 400 mil TSOP Type-II, and 6 mm x 10 mm FP-BGA packages. A17 14 23 A10 A16 15 22 A11 A15 16 21 A12 A14 17 20 A18 A13 18 19 NC FP-BGA 256K x 16 Bump Configuration (Package X) Pin Descriptions Symbol Description 1 2 3 4 5 6 A0-A18 Address input DQ1-DQ8 Data input/output A LB OE A0 A1 A2 NC CE Chip enable input B DQ16 UB A3 A4 CE DQ1 WE Write enable input C DQ14 DQ15 A5 A6 DQ2 DQ3 OE Output enable input VDD +3.3 V power supply D VSS DQ13 A17 A7 DQ4 VDD VSS Ground E VDD DQ12 NC A16 DQ5 VSS NC No connect F DQ11 DQ10 A8 A9 DQ7 DQ6 G DQ9 NC A10 A11 WE DQ8 H NC A12 A13 A14 A15 NC 6 x 10 mm Bump Pitch Rev: 1.02 3/2002 1/14 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. (c) 2001, Giga Semiconductor, Inc. GS74108ATP/J/X TSOP-II 512K x 8-Pin Configuration NC NC A4 A3 A2 A1 A0 CE DQ1 DQ2 VDD VSS DQ3 DQ4 WE A17 A16 A15 A14 A13 NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 NC NC NC A5 A6 A7 A8 OE DQ8 DQ7 VSS VDD DQ6 DQ5 A9 A10 A11 A12 A18 21 22 24 23 NC NC 44-pin 400 mil TSOP II NC Block Diagram A0 Address Input Buffer Row Decoder Column Decoder A18 CE WE OE Memory Array I/O Buffer Control DQ1 Rev: 1.02 3/2002 DQ8 2/14 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. (c) 2001, Giga Semiconductor, Inc. GS74108ATP/J/X Truth Table CE OE WE DQ1 to DQ8 VDD Current H X X Not Selected ISB1, ISB2 L L H Read L X L Write L H H High Z IDD Note: X: "H" or "L" Absolute Maximum Ratings Parameter Symbol Rating Unit Supply Voltage VDD -0.5 to +4.6 V Input Voltage VIN -0.5 to VDD +0.5 ( 4.6 V max.) V Output Voltage VOUT -0.5 to VDD +0.5 ( 4.6 V max.) V Allowable power dissipation PD 0.7 W Storage temperature TSTG -55 to 150 o C Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability. Rev: 1.02 3/2002 3/14 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. (c) 2001, Giga Semiconductor, Inc. GS74108ATP/J/X Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Supply Voltage for -7/-8/-10/-12 VDD 3.0 3.3 3.6 V Supply Voltage for -6 VDD 3.135 3.3 3.6 V Input High Voltage VIH 2.0 -- VDD +0.3 V Input Low Voltage VIL -0.3 -- 0.8 V Ambient Temperature, Commercial Range TAc 0 -- 70 o Ambient Temperature, Industrial Range TAI -40 -- 85 oC C Note: 1. Input overshoot voltage should be less than VDD +2 V and not exceed 20 ns. 2. Input undershoot voltage should be greater than -2 V and not exceed 20 ns. Capacitance Parameter Symbol Test Condition Max Unit Input Capacitance CIN VIN = 0 V 5 pF Output Capacitance COUT VOUT = 0 V 7 pF Notes: 1. Tested at TA = 25C, f = 1 MHz 2. These parameters are sampled and are not 100% tested. DC I/O Pin Characteristics Parameter Symbol Test Conditions Min Max Input Leakage Current IIL VIN = 0 to VDD - 1 uA 1 uA Output Leakage Current ILO Output High Z VOUT = 0 to VDD -1 uA 1 uA Output High Voltage VOH IOH = -4 mA 2.4 -- Output Low Voltage VOL ILO = +4 mA -- 0.4 V Rev: 1.02 3/2002 4/14 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. (c) 2001, Giga Semiconductor, Inc. GS74108ATP/J/X Power Supply Currents Parameter Symbol Test Conditions Operating Supply Current Standby Current Standby Current 0 to 70C 6 ns 7 ns 8 ns -40 to 85C 10 ns 12 ns 6 ns 7 ns 8 ns 10 ns 12 ns IDD CE VIL All other inputs VIH or VIL Min. cycle time IOUT = 0 mA 155 mA 135 mA 120 mA 95 mA 85 mA 165 mA 145 mA 130 mA 105 mA 95 mA ISB1 CE VIH All other inputs VIH or VIL Min. cycle time 40 mA 25 mA 22 mA 50 mA 32 mA ISB2 CE VDD - 0.2V All other inputs VDD - 0.2V or 0.2V 35 mA 30 mA 45 mA 10 mA 40 mA 35 mA 20 mA AC Test Conditions Output Load 1 Parameter Conditions Input high level VIH = 2.4 V Input low level VIL = 0.4 V 50 Input rise time tr = 1 V/ns VT = 1.4 V Input fall time tf = 1 V/ns Input reference level 1.4 V Output Load 2 Output reference level 1.4 V 3.3 V Output load Fig. 1& 2 DQ Rev: 1.02 3/2002 589 DQ Note: 1. Include scope and jig capacitance. 2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted. 3. Output load 2 for tLZ, tHZ, tOLZ and tOHZ 5/14 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. 30pF1 5pF1 434 (c) 2001, Giga Semiconductor, Inc. GS74108ATP/J/X AC Characteristics Read Cycle Parameter Symbol Read cycle time -6 -7 -8 -10 -12 Unit Min Max Min Max Min Max Min Max Min Max tRC 6 -- 7 -- 8 -- 10 -- 12 -- ns Address access time tAA -- 6 -- 7 -- 8 -- 10 -- 12 ns Chip enable access time (CE) tAC -- 6 -- 7 -- 8 -- 10 -- 12 ns Output enable to output valid (OE) tOE -- 3 -- 3 -- 3.5 -- 4 -- 5 ns Output hold from address change tOH 3 -- 3 -- 3 -- 3 -- 3 -- ns Chip enable to output in low Z (CE) tLZ* 3 -- 3 -- 3 -- 3 -- 3 -- ns Output enable to output in low Z (OE) tOLZ* 0 -- 0 -- 0 -- 0 -- 0 -- ns Chip disable to output in High Z (CE) tHZ* -- 3 -- 3.5 -- 4 -- 5 -- 6 ns Output disable to output in High Z (OE) tOHZ* -- 3 -- 3 -- 3.5 -- 4 -- 5 ns * These parameters are sampled and are not 100% tested. Read Cycle 1: CE = OE = VIL, WE = VIH tRC Address tAA tOH Data Out Rev: 1.02 3/2002 Previous Data Data valid 6/14 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. (c) 2001, Giga Semiconductor, Inc. GS74108ATP/J/X Read Cycle 2: WE = VIH tRC Address tAA CE tAC tHZ tLZ OE tOE Data Out tOHZ tOLZ DATA VALID High impedance Write Cycle Parameter Symbol Write cycle time -6 -7 -8 -10 -12 Unit Min Max Min Max Min Max Min Max Min Max tWC 6 -- 7 -- 8 -- 10 -- 12 -- ns Address valid to end of write tAW 5 -- 5 -- 5.5 -- 7 -- 8 -- ns Chip enable to end of write tCW 5 -- 5 -- 5.5 -- 7 -- 8 -- ns Data set up time tDW 3 -- 3.5 -- 4 -- 5 -- 6 -- ns Data hold time tDH 0 -- 0 -- 0 -- 0 -- 0 -- ns Write pulse width tWP 5 -- 5 -- 5.5 -- 7 -- 8 -- ns Address set up time tAS 0 -- 0 -- 0 -- 0 -- 0 -- ns Write recovery time (WE) tWR 0 -- 0 -- 0 -- 0 -- 0 -- ns Write recovery time (CE) tWR1 0 -- 0 -- 0 -- 0 -- 0 -- ns Output Low Z from end of write tWLZ* 3 -- 3 -- 3 -- 3 -- 3 -- ns Write to output in High Z tWHZ* -- 3 -- 3 -- 3.5 -- 4 -- 5 ns * These parameters are sampled and are not 100% tested. Rev: 1.02 3/2002 7/14 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. (c) 2001, Giga Semiconductor, Inc. GS74108ATP/J/X Write Cycle 1: WE control tWC Address tAW tWR OE tCW CE tAS tWP WE tDW Data In tDH DATA VALID tWHZ tWLZ Data Out HIGH IMPEDANCE Write Cycle 2: CE control tWC Address tAW tWR1 OE tAS tCW CE tWP WE tDW Data In DATA VALID Data Out Rev: 1.02 3/2002 tDH HIGH IMPEDANCE 8/14 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. (c) 2001, Giga Semiconductor, Inc. GS74108ATP/J/X 36-Pin SOJ, 400 mil Dimension in inch L D e A A1 A A2 1 GE E HE c y B B1 Detail A Q Dimension in mm Symbol min nom max min nom max A -- -- 0.146 -- -- 3.70 A1 0.026 -- -- 0.66 -- -- A2 0.105 0.110 0.115 2.67 2.80 2.92 B 0.013 0.017 0.021 0.33 0.43 0.53 B1 0.024 0.028 0.032 0.61 0.71 0.81 c 0.006 0.008 0.012 0.15 0.20 0.30 D 0.920 0.924 0.929 23.37 23.47 23.60 E 0.395 0.400 0.405 10.04 10.16 10.28 e -- 0.05 -- -- 1.27 -- HE 0.430 0.435 0.440 10.93 11.05 11.17 GE 0.354 0.366 0.378 9.00 9.30 9.60 L 0.082 -- -- 2.08 -- -- y -- -- 0.004 -- -- 0.10 Q 0o -- 10o 0o -- 10o Notes: 1. Dimension D& E do not include interlead flash. 2. Dimension B1 does not include dambar protrusion/intrusion. 3. Controlling dimension: inches Rev: 1.02 3/2002 9/14 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. (c) 2001, Giga Semiconductor, Inc. GS74108ATP/J/X 44-Pin, 400 mil TSOP-II D c 22 e B y L L1 A1 A A2 1 A HE 23 E 44 Dimension in inch Dimension in mm Symbol min nom max min nom max Detail A Rev: 1.02 3/2002 Q A -- -- 0.047 -- -- 1.20 A1 0.002 -- -- 0.05 -- -- A2 0.037 0.039 0.041 0.95 1.00 1.05 B 0.01 0.014 0.018 0.25 0.35 0.45 c -- 0.006 -- -- 0.15 -- D 0.721 0.725 0.729 18.31 18.41 18.51 E 0.396 0.400 0.404 10.06 10.16 10.26 e -- 0.031 -- -- 0.80 -- HE 0.455 0.463 0.471 11.56 11.76 11.96 L 0.016 0.020 0.024 0.40 0.50 0.60 L1 -- 0.031 -- -- 0.80 -- y -- -- 0.004 -- -- 0.10 Q 0o -- 5o 0o -- 5o Notes: 1. Dimension D& E do not include interlead flash. 2. Dimension B does not include dambar protrusion/intrusion. 3. Controlling dimension: mm 10/14 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. (c) 2001, Giga Semiconductor, Inc. GS74108ATP/J/X 6 mm x 10 mm FP-BGA Symbol D E Pin A1 Index Top View A Unit: mm A 1.100.10 A1 0.20~0.30 fb f0.30~0.40 c 0.36(TYP) D 10.00.05 D1 5.25 E 6.00.05 E1 3.75 e 0.75(TYP) aaa 0.10 c A1 Pin A1 Index Side View aaa A B C D E F G H 1 2 3 4 5 6 fb Solder Ball e E1 e D1 Bottom View Rev: 1.02 3/2002 11/14 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. (c) 2001, Giga Semiconductor, Inc. GS74108ATP/J/X Ordering Information Part Number* Package Access Time Temp. Range GS74108ATP-6 400 mil TSOP-II 6 ns Commercial GS74108ATP-7 400 mil TSOP-II 7 ns Commercial GS74108ATP-8 400 mil TSOP-II 8 ns Commercial GS74108ATP-10 400 mil TSOP-II 10 ns Commercial GS74108ATP-12 400 mil TSOP-II 12 ns Commercial GS74108ATP-6I 400 mil TSOP-II 6 ns Industrial GS74108ATP-7I 400 mil TSOP-II 7 ns Industrial GS74108ATP-8I 400 mil TSOP-II 8 ns Industrial GS74108ATP-10I 400 mil TSOP-II 10 ns Industrial GS74108ATP-12I 400 mil TSOP-II 12 ns Industrial GS74108AJ-6 400 mil SOJ 6 ns Commercial GS74108AJ-7 400 mil SOJ 7 ns Commercial GS74108AJ-8 400 mil SOJ 8 ns Commercial GS74108AJ-10 400 mil SOJ 10 ns Commercial GS74108AJ-12 400 mil SOJ 12 ns Commercial GS74108AJ-6I 400 mil SOJ 6 ns Industrial GS74108AJ-7I 400 mil SOJ 7 ns Industrial GS74108AJ-8I 400 mil SOJ 8 ns Industrial GS74108AJ-10I 400 mil SOJ 10 ns Industrial GS74108AJ-12I 400 mil SOJ 12 ns Industrial GS74108AX-6 6 mm x 10 mm FP-BGA 6 ns Commercial GS74108AX-7 6 mm x 10 mm FP-BGA 7 ns Commercial Rev: 1.02 3/2002 12/14 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Status (c) 2001, Giga Semiconductor, Inc. GS74108ATP/J/X Ordering Information Part Number* Package Access Time Temp. Range GS74108AX-8 6 mm x 10 mm FP-BGA 8 ns Commercial GS74108AX-10 6 mm x 10 mm FP-BGA 10 ns Commercial GS74108AX-12 6 mm x 10 mm FP-BGA 12 ns Commercial GS74108AX-6I 6 mm x 10 mm FP-BGA 6 ns Industrial GS74108AX-7I 6 mm x 10 mm FP-BGA 7 ns Industrial GS74108AX-8I 6 mm x 10 mm FP-BGA 8 ns Industrial GS74108AX-10I 6 mm x 10 mm FP-BGA 10 ns Industrial GS74108AX-12I 6 mm x 10 mm FP-BGA 12 ns Industrial Status * Customers requiring delivery in Tape and Reel should add the character "T" to the end of the part number. For example: GS74108ATP-8T Rev: 1.02 3/2002 13/14 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. (c) 2001, Giga Semiconductor, Inc. GS74108ATP/J/X 4 M Asynchronous Datasheet Revision History Rev. Code: Old; New Types of Changes Format or Content Page #/Revisions/Reason Format/Content * Creation of new datasheet 74108A_r1; 74108A_r1_01 Content * Added 6 ns speed bin * Updated all power numbers 74108A_r1_01; 74108A_r1_02 Content * Updated Recommended Operating Conditions table on page 4 * Added 7 ns bin to entire document * Added X package 74108A_r1 Rev: 1.02 3/2002 14/14 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. (c) 2001, Giga Semiconductor, Inc.