FDWS9508L-F085 P-Channel PowerTrench® MOSFET
Publication Order Number:
FDWS9508LF085/D
© 2016 Semiconductor Components Industries, LLC.
November-2017, Rev. 2
FDWS9508LF085
P-Channel PowerTrench® MOSFET
-40 V, - 80 A, 4.9 mΩ
Features
Typical RDS(on) = 3.6 mΩ at VGS = - 10V, ID = - 80 A
Typical Qg(tot) = 82 nC at VGS = - 10V, ID = - 80 A
UIS Capability
RoHS Compliant
Qualified to AEC Q101
Wettable flanks for automatic optical inspection (AOI)
Applications
Automotive Engine Control
PowerTrain Management
Solenoid and Motor Drivers
Electrical Power Steering
Integrated Starter/Alternator
Distributed Power Architectures and VRM
Primary Switch for 12V Systems
MOSFET Maximum Ratings TJ = 25°C unless otherwise noted.
Symbol Parameter Ratings Units
VDSS Drain-to-Source Voltage -40 V
VGS Gate-to-Source Voltage ±16 V
ID
Drain Current - Continuous (VGS= -10) (Note 1) TC = 25°C -8 0 A
Pulsed Drain Current TC = 25°C See Figure 4
EAS Single Pulse Avalanche Energy (Note 2) 211 mJ
PD
Power Dissipation 214 W
Derate Above 25oC1.43W/
oC
TJ, TSTG Operating and Storage Temperature -55 to + 175 oC
RθJC Thermal Resistance, Junction to Case 0.7 oC/W
RθJA Maximum Thermal Resistance, Junction to Ambient (Note 3) 50 oC/W
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDWS9508L FDWS9508LF085 Power56 13” 12mm 3000 units
Notes:
1: Current is limited by wirebond configuration.
2: Starting TJ = 25°C, L = 0.1mH, IAS = -65A, VDD = -40V during inductor charging and VDD = 0V during time in avalanche.
3: RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance, where the case thermal reference is defined as the solder
mounting surface of the drain pins. RθJC is guaranteed by design, while RθJA is determined by the board design. The maximum rating
presented here is based on mounting on a 1 in2 pad of 2oz copper.
S
D
G
FDWS9508L-F085 P-Channel PowerTrench® MOSFET
2
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Electrical Characteristics TJ = 25°C unless otherwise noted.
Off Characteristics
On Characteristics
Dynamic Characteristics
Symbol Parameter Test Conditions Min. Typ. Max. Units
BVDSS Drain-to-Source Breakdown Voltage ID = -250μA, VGS = 0V -40 - - V
IDSS Drain-to-Source Leakage Current VDS = - 4 0 V , T J = 25oC ---1μA
VGS = 0V TJ = 175oC (Note 4) - - -1 mA
IGSS Gate-to-Source Leakage Current VGS = ±16V, VDS = 0V - - ±100 nA
VGS(th) Gate to Source Threshold Voltage VGS = VDS, ID = -250μA -1.0 -1.8 -3.0 V
RDS(on) Drain to Source On Resistance
ID = -80A, VGS= -4.5V, TJ = 25oC- 5.68.5mΩ
ID = -80A,
VGS= -10V
TJ = 25oC -3.64.9mΩ
TJ = 175oC (Note 4) - 5.9 8.0 mΩ
Ciss Input Capacitance VDS = -20V, VGS = 0V,
f = 1MHz
- 4840 - pF
Coss Output Capacitance - 2310 - pF
Crss Reverse Transfer Capacitance - 49 - pF
RgGate Resistance f = 1MHz - 24 - Ω
Qg(ToT) Total Gate Charge at 10V VGS = 0 to -10V VDD = -32V
ID = -80A
- 82 107 nC
Qg(th) Threshold Gate Charge VGS = 0 to -2V - 11 - nC
Qgs Gate-to-Source Gate Charge -20-nC
Qgd Gate-to-Drain “Miller“ Charge - 10 - nC
Switching Characteristics
Drain-Source Diode Characteristics
Note:
4: The maximum value is specified by design at TJ = 175°C. Product is not tested to this condition in production.
ton Turn-On Time
VDD = -20V, ID = -80A,
VGS = -10V, RGEN = 6Ω
--23ns
td(on) Turn-On Delay - 10 - ns
trRise Time - 5 - ns
td(off) Turn-Off Delay - 389 - ns
tfFall Time - 114 - ns
toff Turn-Off Time - - 780 ns
VSD Source-to-Drain Diode Voltage ISD = -80A, VGS = 0V - - -1.25 V
ISD = -40A, VGS = 0V - - -1.2 V
trr Reverse-Recovery Time ISD = -80A, dISD/dt = 100A/μs,
VDD= -32V
- 82 107 ns
Qrr Reverse-Recovery Charge - 95 124 nC
FDWS9508L-F085 P-Channel PowerTrench® MOSFET
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Typical Characteristics
Figure 1. Normalized Power Dissipation vs. Case
Temperature
0 25 50 75 100 125 150 175
0.0
0.2
0.4
0.6
0.8
1.0
1.2
POWER DISSIPATION MULTIPLIER
TC, CASE TEMPERATURE(oC)
Figure 2. Maximum Continuous Drain Current vs.
Case Temperature
25 50 75 100 125 150 175
0
30
60
90
120
150
180
VGS = -10V
-ID, DRAIN CURRENT (A)
TC, CASE TEMPERATURE(oC)
CURRENT LIMITED
BY PACKAGE
Figure 3.
10-5 10-4 10-3 10-2 10-1 100101
0.01
0.1
1
SINGLE PULSE
D = 0.50
0.20
0.10
0.05
0.02
0.01
NORMALIZED THERMAL
IMPEDANCE, ZθJC
t, RECTANGULAR PULSE DURATION(s)
DUTY CYCLE - DESCENDING ORDER
2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJA x RθJA + TC
PDM
t1
t2
Normalized Maximum Transient Thermal Impedance
Figure 4. Peak Current Capability
10-5 10-4 10-3 10-2 10-1 100101
10
100
1000
10000
VGS = -10V
SINGLE PULSE
-IDM, PEAK CURRENT (A)
t, RECTANGULAR PULSE DURATION(s)
T
C
= 25
o
C
I = I
25
175 - T
C
150
FOR TEMPERATURES
ABOVE 25
o
C DERATE PEAK
CURRENT AS FOLLOWS:
FDWS9508L-F085 P-Channel PowerTrench® MOSFET
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Figure 5.
110100
0.1
1
10
100
1000
LIMITED BY
PACKAGE
100us
1ms
10ms
-ID, DRAIN CURRENT (A)
-VDS, DRAIN TO SOURCE VOLTAGE (V)
OPERATION IN THIS
AREA MAY BE
LIMITED BY rDS(on)
SINGLE PULSE
TJ = MAX RATED
TC = 25oC
100ms
Forward Bias Safe Operating Area
1E-3 0.01 0.1 1 10 100 1000 10000
1
10
100
1000
STARTING TJ = 150oC
STARTING TJ = 25oC
-IAS, AVALANCHE CURRENT (A)
tAV, TIME IN AVALANCHE (ms)
t
AV
= (L)(I
AS
)/(1.3*RATED BV
DSS
- V
DD
)
If R = 0
If R
≠
0
t
AV
= (L/R)ln[(I
AS
*R)/(1.3*RATED BV
DSS
- V
DD
) +1]
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 6. Unclamped Inductive Switching
Capability
Figure 7.
2345
0
50
100
150
200
250
300
TJ = -55oC
TJ = 25oC
TJ = 175oC
PULSE DURATION = 250μs
DUTY CYCLE = 0.5% MAX
VDD = -5V
-ID, DRAIN CURRENT (A)
-VGS, GATE TO SOURCE VOLTAGE (V)
Transfer Characteristics Figure 8.
0.00.20.40.60.81.01.2
0.01
0.1
1
10
100
300
TJ = 25 oC
TJ = 175 oC
VGS = 0 V
-IS, REVERSE DRAIN CURRENT (A)
-VSD, BODY DIODE FORWARD VOLTAGE (V)
Forward Diode Characteristics
Figure 9.
012345
0
50
100
150
200
250
300
VGS
-10V Top
-7V
-5V
-4.5V
-4V
-3.5V Bottom
250μs PULSE WIDTH
Tj=25oC
-ID, DRAIN CURRENT (A)
-VDS, DRAIN TO SOURCE VOLTAGE (V)
Saturation Characteristics Figure 10.
012345
0
50
100
150
200
250
300
VGS
-10V Top
-7V
-5V
-4.5V
-4V
-3.5V Bottom
250μs PULSE WIDTH
Tj=175oC
-ID, DRAIN CURRENT (A)
-VDS, DRAIN TO SOURCE VOLTAGE (V)
Saturation Characteristics
Typical Characteristics
FDWS9508L-F085 P-Channel PowerTrench® MOSFET
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Figure 11.
2345678910
0
5
10
15
20
25
30
ID = -80A
PULSE DURATION = 250μs
DUTY CYCLE = 0.5% MAX
rDS(on), DRAIN TO SOURCE
ON-RESISTANCE (mΩ)
-VGS, GATE TO SOURCE VOLTAGE (V)
TJ = 25oC
TJ = 175oC
RDSON vs. Gate Voltage Figure 12. Normalized RDSON vs. Junction
Temperature
-80 -40 0 40 80 120 160 200
0.6
0.8
1.0
1.2
1.4
1.6
1.8
PULSE DURATION = 250μs
DUTY CYCLE = 0.5% MAX
ID = -80A
VGS = -10V
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
TJ, JUNCTION TEMPERATURE(oC)
Figure 13.
-80 -40 0 40 80 120 160 200
0.2
0.4
0.6
0.8
1.0
1.2
1.4
VGS = VDS
ID = -250μA
NORMALIZED GATE
THRESHOLD VOLTAGE
TJ, JUNCTION TEMPERATURE(oC)
Normalized Gate Threshold Voltage vs.
Temperature
Figure 14.
-80 -40 0 40 80 120 160 200
0.90
0.95
1.00
1.05
1.10
ID = -5mA
NORMALIZED DRAIN TO SOURCE
BREAKDOWN VOLTAGE
TJ, JUNCTION TEMPERATURE (oC)
Normalized Drain to Source
Breakdown Voltage vs. Junction Temperature
Figure 15.
0.1 1 10 40
10
100
1000
10000
100000
f = 1MHz
VGS = 0V Crss
Coss
Ciss
CAPACITANCE (pF)
-VDS, DRAIN TO SOURCE VOLTAGE (V)
Capacitance vs. Drain to Source
Voltage
Figure 16.
0 102030405060708090
0
2
4
6
8
10
ID = -80A
VDD = -16V
-20V
-24V
Qg, GATE CHARGE(nC)
-VGS, GATE TO SOURCE VOLTAGE(V)
Gate Charge vs. Gate to Source
Voltage
Typical Characteristics
FDWS9508L−F085
PACKAGE DIMENSIONS
PQFN8 5X6, 1.27P
CASE 483BJ
ISSUE B
6
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