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notice_e-01
Notice for TAIYO YUDEN products　
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called “TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’ s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to “Foreign Exchange and For-
eign Trade Control Law” of Japan, “U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
26
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mlcc06_e-01
■ FEATURES
■ PART NUMBER
■ STANDARD EXTERNAL DIMENSIONS/STANDARD QUANTITY
■ AVAILABLE CAPACITANCE RANGE
■ APPLICATIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
⓫Packaging
Tφ178mm Taping
（4mm pitch）
◦The use of nickel as electrode material prevents migration and pro-
vides high reliability.
◦Small case sizes with high rated voltage.
◦General telephone exchange
◦Inverter
◦Wireless and Telecommunication base
◦For DC/DC Converter
MEDIUM-HIGH VOLTAGE MULTILAYER CERAMIC CAPACITORS
REFLOW
H M K 3 1 6 △B J 1 0 4 K L －T△
❶ ❷ ❸ ❹ ❺ ❻ ❼ ❽ ❾ ❿ ⓫ ⓬
❶Rated
voltage〔VDC〕
H 100
Q 250
S 630
❾Thickness
〔mm〕
A 0.8
D 0.85
G 1.25
F 1.15
L 1.6
N 1.9
M 2.5
❿Special code
－Standard
⓬Internal code
△Standard
△＝Blank space
❽Special code
K±10%
M±20%
❷Series name
MMultilayer ceramic
capacitor
❻Temperature
characteristics code
BJ B
X5R
C7 X7S
B7 X7R
❹Dimension
Type （inch）L×W ［mm］
107 （0603）1.6×0.8
212 （0805）2.0×1.25
316 （1206）3.2×1.6
325 （1210）3.2×2.5
432 （1812）4.5×3.2 ❺Dimension
tolerance
△Standard
△＝Blank space
❸End
termination
K Plated
❼Nominal
capacitance〔pF〕
example
104 100,000
105 1,000,000
Type Dimension [mm] Standard quantity [pcs]
L W T e Paper tape Embossed tape
□MK107
（0603 inch）1.6±0.10 0.8±0.10 0.8±0.10 A 0.35±0.25 4000 －
□MK212
（0805 inch）2.0±0.10 1.25±0.10 0.85±0.10 D 0.5±0.25 4000 －
1.25±0.10 G －3000
□MK316
（1206 inch）3.2±0.15 1.6±0.15 1.15±0.10 F 0.5 ＋0.35/ー0.25 －3000
1.6±0.20 L 2000
□MK325
（1210 inch）3.2±0.3 2.5±0.20 1.15±0.10 F 0.6±0.3 －2000
1.9±0.20 N
□MK432
（1812 inch）4.5±0.4 3.2±0.30 2.5±0.20 M 0.9±0.6 －500
Cap
[μF]
Type 107 212 316 325 432
X7R X7S
B/X5R
X7R B/X5R X7R B/X5R X7R B/X5R X7R B/X5R
VDC 100 100 100 100 250 100 250 100 250 630 100 250 630 100 250 630 100 250 630 100 250 630 100 250 630
[3-digit]
0.001 102 A A D D F F
0.0015 152 A A D D F F
0.0022 222 A A D D F F
0.0033 332 A A D D F F
0.0047 472 A A G G F F
0.0068 682 A A G G F F
0.01 103 A A G G G G F F
0.015 153 A A G G G G L L
0.022 223 A A G G G G L L N N
0.033 333 A A G G L L N N
0.047 473 G G L L L L N N N N M M
0.068 683 G G L L L L M M
0.1 104 A A G G L L L L F N F N M M M M
0.15 154 L L N N N N
0.22 224 G G L L N N N N M M
0.33 334 L L N N M M
0.47 474 L L N N M M M M
0.68 684 N N
1.0 105 L L N N M M
1.5 155 M M
2.2 225 N N M M
※Letters in the table indicate thickness.
27
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CAPACITORS
mlcc06_e-01
■ REPRESENTATIVE PART NUMBERS
■ AVAILABLE CAPACITANCE RANGE
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Temp.char.Code Temperature characteristics Capacitance tolerance
〔％〕
Applicable standard Temperature range〔℃〕Ref. Temp.〔℃〕
Capacitance change
〔％〕
BJ JIS B －25～＋85 20 ±10
±10（K）
±20（M）
EIA X5R －55～＋85 25 ±15
C7 EIA X7S －55～＋125 25 ±22
B7 EIA X7R －55～＋125 25 ±15
●107TYPE
【Temperature Characteristic BJ:B/X5R】
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
100V HMK107 BJ102□A B/X5R*11000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ152□A B/X5R*11500 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ222□A B/X5R*12200 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ332□A B/X5R*13300 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ472□A B/X5R*14700 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ682□A B/X5R*16800 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ103□A B/X5R*110000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ153□A B/X5R*115000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ223□A B/X5R*122000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ333□A B/X5R*133000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ104□A B/X5R*1100000 ±10, ±20 3.5 0.8±0.1 R 200%
Capacitance tolerance code is applied to □ of part number.
*1　We may provide X7R for some itemes according to the individual specification.
●212TYPE
【Temperature Characteristic　BJ：B/X5R】
・1.25mm thickness（G）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
100V HMK212 BJ103□G B/X5R*110000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 BJ153□G B/X5R*115000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 BJ223□G B/X5R*122000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 BJ333□G B/X5R*133000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 BJ473□G B/X5R*147000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 BJ683□G B/X5R*168000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 BJ104□G B/X5R*1100000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 BJ224□G B/X5R*1220000 ±10, ±20 3.5 1.25±0.1 R 200%
250V QMK212 BJ472□G B/X5R*14700 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 BJ682□G B/X5R*16800 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 BJ103□G B/X5R*110000 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 BJ153□G B/X5R*115000 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 BJ223□G B/X5R*122000 ±10, ±20 2.5 1.25±0.1 R 150%
【Temperature Characteristic　B7：X7R, C7：X7S】
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
100V HMK107 B7102□A X7R 1000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7152□A X7R 1500 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7222□A X7R 2200 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7332□A X7R 3300 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7472□A X7R 4700 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7682□A X7R 6800 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7103□A X7R 10000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7153□A X7R 15000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7223□A X7R 22000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7333□A X7R 33000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 C7104□A X7S 100000 ±10, ±20 3.5 0.8±0.1 R 200%
Capacitance tolerance code is applied to □ of part number.
・0.85mm thickness（D）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
250V QMK212 BJ102□D B/X5R*11000 ±10, ±20 2.5 0.85±0.1 R 150%
QMK212 BJ152□D B/X5R*11500 ±10, ±20 2.5 0.85±0.1 R 150%
QMK212 BJ222□D B/X5R*12200 ±10, ±20 2.5 0.85±0.1 R 150%
QMK212 BJ332□D B/X5R*13300 ±10, ±20 2.5 0.85±0.1 R 150%
Capacitance tolerance code is applied to □ of part number.
*1　We may provide X7R for some itemes according to the individual specification.
28
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mlcc06_e-01
■ REPRESENTATIVE PART NUMBERS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
【Temperature Characteristic　B7：X7R】
・1.25mm thickness（G）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
100V HMK212 B7103□G X7R 10000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 B7153□G X7R 15000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 B7223□G X7R 22000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 B7333□G X7R 33000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 B7473□G X7R 47000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 B7683□G X7R 68000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 B7104□G X7R 100000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 B7224□G X7R 220000 ±10, ±20 3.5 1.25±0.1 R 200%
250V QMK212 B7472□G X7R 4700 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 B7682□G X7R 6800 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 B7103□G X7R 10000 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 B7153□G X7R 15000 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 B7223□G X7R 22000 ±10, ±20 2.5 1.25±0.1 R 150%
【Temperature Characteristic　B7：X7R】
・1.6mm thickness（L）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
100V HMK316 B7473□L X7R 47000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 B7683□L X7R 68000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 B7104□L X7R 100000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 B7154□L X7R 150000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 B7224□L X7R 220000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 B7334□L X7R 330000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 B7474□L X7R 470000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 B7105□L X7R 1000000 ±10, ±20 3.5 1.6±0.2 R 200%
250V QMK316 B7333□L X7R 33000 ±10, ±20 2.5 1.6±0.2 R 150%
QMK316 B7473□L X7R 47000 ±10, ±20 2.5 1.6±0.2 R 150%
QMK316 B7683□L X7R 68000 ±10, ±20 2.5 1.6±0.2 R 150%
QMK316 B7104□L X7R 100000 ±10, ±20 2.5 1.6±0.2 R 150%
630V SMK316 B7153□L X7R 15000 ±10, ±20 2.5 1.6±0.2 R 120%
SMK316 B7223□L X7R 22000 ±10, ±20 2.5 1.6±0.2 R 120%
・0.85mm thickness（D）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
250V QMK212 B7102□D X7R 1000 ±10, ±20 2.5 0.85±0.1 R 150%
QMK212 B7152□D X7R 1500 ±10, ±20 2.5 0.85±0.1 R 150%
QMK212 B7222□D X7R 2200 ±10, ±20 2.5 0.85±0.1 R 150%
QMK212 B7332□D X7R 3300 ±10, ±20 2.5 0.85±0.1 R 150%
Capacitance tolerance code is applied to □ of part number.
●316TYPE
【Temperature Characteristic　BJ：B/X5R】
・1.6mm thickness（L）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
100V HMK316 BJ473□L B/X5R*147000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 BJ683□L B/X5R*168000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 BJ104□L B/X5R*1100000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 BJ154□L B/X5R*1150000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 BJ224□L B/X5R*1220000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 BJ334□L B/X5R*1330000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 BJ474□L B/X5R*1470000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 BJ105□L B/X5R*11000000 ±10, ±20 3.5 1.6±0.2 R 200%
250V QMK316 BJ333□L B/X5R*133000 ±10, ±20 2.5 1.6±0.2 R 150%
QMK316 BJ473□L B/X5R*147000 ±10, ±20 2.5 1.6±0.2 R 150%
QMK316 BJ683□L B/X5R*168000 ±10, ±20 2.5 1.6±0.2 R 150%
QMK316 BJ104□L B/X5R*1100000 ±10, ±20 2.5 1.6±0.2 R 150%
630V SMK316 BJ153□L B/X5R*115000 ±10, ±20 2.5 1.6±0.2 R 120%
SMK316 BJ223□L B/X5R*122000 ±10, ±20 2.5 1.6±0.2 R 120%
・1.15mm thickness（F）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
630V SMK316 BJ102□F B/X5R*11000 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 BJ152□F B/X5R*11500 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 BJ222□F B/X5R*12200 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 BJ332□F B/X5R*13300 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 BJ472□F B/X5R*14700 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 BJ682□F B/X5R*16800 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 BJ103□F B/X5R*110000 ±10, ±20 2.5 1.15±0.1 R 120%
Capacitance tolerance code is applied to □ of part number.
*1　We may provide X7R for some itemes according to the individual specification.
29
1
2
CAPACITORS
mlcc06_e-01
■ REPRESENTATIVE PART NUMBERS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
●325TYPE
【Temperature Characteristic　BJ：B/X5R】
・1.9mm thickness（N）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
100V HMK325 BJ154□N B/X5R*1150000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 BJ224□N B/X5R*1220000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 BJ334□N B/X5R*1330000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 BJ474□N B/X5R*1470000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 BJ684□N B/X5R*1680000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 BJ105□N B/X5R*11000000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 BJ225□N B/X5R*12200000 ±10, ±20 3.5 1.9±0.2 R 200%
250V QMK325 BJ473□N B/X5R*147000 ±10, ±20 2.5 1.9±0.2 R 150%
QMK325 BJ104□N B/X5R*1100000 ±10, ±20 2.5 1.9±0.2 R 150%
QMK325 BJ154□N B/X5R*1150000 ±10, ±20 2.5 1.9±0.2 R 150%
QMK325 BJ224□N B/X5R*1220000 ±10, ±20 2.5 1.9±0.2 R 150%
630V SMK325 BJ223□NB/X5R*122000 ±10, ±20 2.5 1.9±0.2 R 120%
SMK325 BJ333□N B/X5R*133000 ±10, ±20 2.5 1.9±0.2 R 120%
SMK325 BJ473□N B/X5R*147000 ±10, ±20 2.5 1.9±0.2 R 120%
【Temperature Characteristic　B7：X7R】
・1.9mm thickness（N）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
100V HMK325 B7154□N X7R 150000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 B7224□N X7R 220000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 B7334□N X7R 330000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 B7474□N X7R 470000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 B7684□N X7R 680000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 B7105□N X7R 1000000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 B7225□N X7R 2200000 ±10, ±20 3.5 1.9±0.2 R 200%
250V QMK325 B7473□N X7R 47000 ±10, ±20 2.5 1.9±0.2 R 150%
QMK325 B7104□N X7R 100000 ±10, ±20 2.5 1.9±0.2 R 150%
QMK325 B7154□N X7R 150000 ±10, ±20 2.5 1.9±0.2 R 150%
QMK325 B7224□N X7R 220000 ±10, ±20 2.5 1.9±0.2 R 150%
630V SMK325 B7223□N X7R 22000 ±10, ±20 2.5 1.9±0.2 R 120%
SMK325 B7333□N X7R 33000 ±10, ±20 2.5 1.9±0.2 R 120%
SMK325 B7473□N X7R 47000 ±10, ±20 2.5 1.9±0.2 R 120%
・1.15mm thickness（F）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
630V SMK316 B7102□F X7R 1000 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 B7152□F X7R 1500 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 B7222□F X7R 2200 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 B7332□F X7R 3300 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 B7472□F X7R 4700 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 B7682□F X7R 6800 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 B7103□F X7R 10000 ±10, ±20 2.5 1.15±0.1 R 120%
Capacitance tolerance code is applied to □ of part number.
・1.15mm thickness（F）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
100V HMK325 BJ104□F B/X5R*1100000 ±10, ±20 3.5 1.15±0.1 R 200%
Capacitance tolerance code is applied to □ of part number.
*1　We may provide X7R for some itemes according to the individual specification.
・1.15mm thickness（F）
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
100V HMK325 B7104□F X7R 100000 ±10, ±20 3.5 1.15±0.1 R 200%
Capacitance tolerance code is applied to □ of part number.
30
1
2
mlcc06_e-01
■ ELECTRICAL CHARACTERISTICS
■ REPRESENTATIVE PART NUMBERS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
●Temperature characteristics
●432TYPE
【Temperature Characteristic　BJ：B/X5R】
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
100V HMK432 BJ474□M B/X5R*1470000 ±10, ±20 3.5 2.5±0.2 R 200%
HMK432 BJ105□M B/X5R*11000000 ±10, ±20 3.5 2.5±0.2 R 200%
HMK432 BJ155□M B/X5R*11500000 ±10, ±20 3.5 2.5±0.2 R 200%
HMK432 BJ225□M B/X5R*12200000 ±10, ±20 3.5 2.5±0.2 R 200%
250V QMK432 BJ104□M B/X5R*1100000 ±10, ±20 2.5 2.5±0.2 R 150%
QMK432 BJ224□M B/X5R*1220000 ±10, ±20 2.5 2.5±0.2 R 150%
QMK432 BJ334□M B/X5R*1330000 ±10, ±20 2.5 2.5±0.2 R 150%
QMK432 BJ474□M B/X5R*1470000 ±10, ±20 2.5 2.5±0.2 R 150%
630V SMK432 BJ473□M B/X5R*147000 ±10, ±20 2.5 2.5±0.2 R 120%
SMK432 BJ683□M B/X5R*168000 ±10, ±20 2.5 2.5±0.2 R 120%
SMK432 BJ104□M B/X5R*1100000 ±10, ±20 2.5 2.5±0.2 R 120%
Capacitance tolerance code is applied to □ of part number.
*1　We may provide X7R for some itemes according to the individual specification.
【Temperature Characteristic　B7：X7R】
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔pF〕
Capacitance
tolerance
〔%〕
tanδ
〔%〕
Thickness
〔mm〕
Soldering
R:Reflow
W:Wave
HALT Internal
code
（P/N 1）
Note
% Rated
voltage
100V HMK432 B7474□M X7R 470000 ±10, ±20 3.5 2.5±0.2 R 200%
HMK432 B7105□M X7R 1000000 ±10, ±20 3.5 2.5±0.2 R 200%
HMK432 B7155□M X7R 1500000 ±10, ±20 3.5 2.5±0.2 R 200%
HMK432 B7225□M X7R 2200000 ±10, ±20 3.5 2.5±0.2 R 200%
250V QMK432 B7104□M X7R 100000 ±10, ±20 2.5 2.5±0.2 R 150%
QMK432 B7224□M X7R 220000 ±10, ±20 2.5 2.5±0.2 R 150%
QMK432 B7334□M X7R 330000 ±10, ±20 2.5 2.5±0.2 R 150%
QMK432 B7474□M X7R 470000 ±10, ±20 2.5 2.5±0.2 R 150%
630V SMK432 B7473□M X7R 47000 ±10, ±20 2.5 2.5±0.2 R 120%
SMK432 B7683□M X7R 68000 ±10, ±20 2.5 2.5±0.2 R 120%
SMK432 B7104□M X7R 100000 ±10, ±20 2.5 2.5±0.2 R 120%
Capacitance tolerance code is applied to □ of part number.
HMK212 BJ104KG / HMK212 B7104KG
SMK432 BJ104KM / SMK432 B7104KM
QMK325 BJ224KN / QMK325 B7224KN
SMK316 BJ223KL / SMK316 B7223KL
QMK432 BJ474KM / QMK432 B7474KM
HMK325 BJ105KN / HMK325 B7105KN
HMK325 BJ105KN / HMK325 B7105KN
■
Taiyo Yuden medium-high voltage ceramic capacitor
●Example of Impedance ESR vs. Frequency characteristics
31
1
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CAPACITORS
mlcc06_e-01
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1
2
mlcc_pack-P1 mlcc_pack_e-01
■ PACKAGING
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
◦Taped package
①Minimum Quantity
②Taping material
※No bottom tape for pressed carrier tape
③Representative taping dimensions
　◦Paper Tape（8mm wide）
　◦Pressed carrier tape （2mm pitch）
T1
㧗0.1/−0
◦Paper tape
◦Embossed tape Type Chip Cavity Insertion Pitch Tape Thickness
A B F T
□MK107
□WK107 1.0 1.8
4.0±0.1
1.1max.
□2K110 1.15 1.55 1.0max.
□MK212
□WK212 1.65 2.4 1.1max.□4K212
□2K212
□MK316 2.0 3.6
Type Chip Cavity Insertion Pitch Tape Thickness
A B F T
□2K096 0.72 1.02
52.0±0.05
0.6max.
□MK105
□VK105 0.65 1.15 0.8max.
㧗0.1/−0
㧗0.1/−0
◦Punched carrier tape （4mm pitch）
Note：Taping size might be different depending on the size of the product.
◦Punched carrier tape （2mm pitch）
◦Chip filled
Type
Thickness Standard quantity [pcs]
mm code Paper tape Embossed
tape
□
MK042
0.2 C,D —40000
□MK063 0.3 P,T 15000
—
□2K096 0.3 P
100000.45 K
□WK105 0.3 P
□MK105
0.2 C 20000
0.3 P 15000
0.5 V, W 10000
□VK105 0.5 W
□MK107
□WK107
0.45 K 4000
0.5 V —4000
0.8 A
4000 —
□2K110
0.5 V
0.6 B
0.8 A
□MK212
□WK212
0.45 K
0.85 D
1.25 G —3000
□4K212 0.85 D
4000 —□2K212 0.85 D
□MK316
0.85 D
1.15 F
—3000
1.25 G
1.6 L
2000
□MK325
0.85 D
—
1.15 F
1.9 N
2.0max Y
2.5 M
500（T）, 1000（P）
□MK432 2.5 M —500
Unit：mm
Unit：mm
Unit：mm
Type Chip Cavity
Insertion Pitch
Tape Thickness
Ａ Ｂ Ｆ Ｔ T1
□MK063 0.37 0.67
2.0±0.05
0.45max. 0.42max.□2K096 0.65 1.02
□WK105
0.65 1.15MK105（*1C）0.4max. 0.3max.
MK105（*1P）0.45max. 0.42max.
*1 Thickness, C：0.2mm、P：0.3mm
1
2
mlcc_pack-P2
mlcc_pack_e-01
■ PACKAGING
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
◦Embossed tape（8mm wide）
◦Embossed tape（12mm wide）
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
□WK107 1.0 1.8
4.0±0.1
1.3max 0.25±0.1
□MK212 1.65 2.4
3.4max. 0.6max.□MK316 2.0 3.6
□MK325 2.8 3.6
④Trailer and Leader
⑤Reel size
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow
as illustrated below.
The exchange of individual specification is necessary.
Please contact Taiyo Yuden sales channels.
㧗0.1/−0
㧗0.1/−0
2.0±0.1
F
36＋0/−0.2
110±0.7
12±0.1
＋0.2/−0
＋0/−0.2
12.0±0.1
8.8±0.1
6.8±0.1
1.0＋0/−0.1 2.0＋0/−0.1 1.5＋0.1/−0
Unit：mm
⑦Bulk Cassette
1.0±0.02
0.8±0.04 0.9±0.05
1.8±0.02
4.0±0.05
Ｆ2.0±0.04
◦Embossed tape（4mm wide）
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
□MK042 0.23 0.43 1.0±0.02 0.5max. 0.25max.
A B C
φ178±2.0 φ50min.
φ13.0±0.2
D E R
φ21.0±0.8 2.0±0.5
1.0
t W
4mm wide tape 1.5max.
5±1.0
8mm wide tape 2.5max.
10±1.5
12mm wide tape 2.5max.
14±1.5
Unit：mm
Unit：mm
Unit：mm
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
□MK432 3.7 4.9 8.0±0.1 4.0max. 0.6max.
Unit：mm
E
W
C
RDB
t
A
E
W
C
RDB
t
A
1
2
mlcc06_reli-R1 mlcc06_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
MediumーHigh Voltage Multilayer Ceramic Capacitor
1. Operating Temperature Range
Specified Value X7R, X7S：－55～＋125℃ X5R：－55～＋85℃ B：－25～＋85℃
2. Storage Temperature Range
Specified Value X7R, X7S：－55～＋125℃ X5R：－55～＋85℃ B：－25～＋85℃
3. Rated Voltage
Specified Value 100VDC, 250VDC, 630VDC
4. Withstanding Voltage（Between terminals）
Specified Value No breakdown or damage
【Test Methods and Remarks】
Applied voltage:Rated voltage×2.5（HMK）, Rated voltage×2（QMK）, Rated voltage×1.2（SMK）
Duration：1 to 5sec.
Charge/discharge current：50mA max.
５．Insulation Resistance
Specified Value 100MΩμF or 10GΩ, whichever is smaller.
【Test Methods and Remarks】
Applied voltage:Rated voltage（HMK, QMK）, 500V（SMK）
Duration：60±5sec.
Charge/discharge current：50mA max.
6．Capacitance（Tolerance）
Specified Value ±10％、±20％
【Test Methods and Remarks】
Measuring frequency:1kHz±10%
Measuring voltage:1±0.2Vrms
Bias application:None
７
．Dissipation Factor
Specified Value 3.5%max（HMK）
2.5%max（QMK, SMK）
【Test Methods and Remarks】
Measuring frequency:1kHz±10%
Measuring voltage:1±0.2Vrms
Bias application:None
8．Temperature Characteristic of Capacitance
Specified Value
B： ±10％
（－25～＋85℃）
X5R： ±15％（－55～＋85℃）
X7R： ±15％（－55～＋125℃）
X7S： ±22％（－55～＋125℃）
【Test Methods and Remarks】
Capacitance value at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation.
（C－C2） ×100（％）
　C2
C ：Capacitance value in Step 1 or Step 3
C2 ：Capacitance value in Step 2
Step B X5R、X7R、X7S
1 Minimum operating temperature
2 20℃25℃
3 Maximum operating temperature
9．Deflection
Specified Value Appearance:No abnormality
Capacitance change:Within±10%
【Test Methods and Remarks】
Warp:1mm
Duration:10sec.
Test board:glass epoxy-resin substrate
Thickness:1.6mm
Capacitance measurement shall be conducted with the board bent.
R-230
10．Adhesive Strength of Terminal Electrodes
Specified Value No terminal separation or its indication.
【Test Methods and Remarks】
Applied force:5N
Duration:30±5sec.
　　　
11．Solderability
Specified Value At least 95% of terminal electrode is covered by new solder
【Test Methods and Remarks】
Solder type Solder temperature Duration
Eutectic solder H60A or H63A 230±5℃4±1 sec.
Lead-free solder Snー3.0Agー0.5Cu 245±3℃
Multilayer Ceramic Capacitors and Super Low Distortion Multilayer Ceramic
Capacitors are noted separately.
1
2
mlcc06_reli-R2
mlcc06_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
12．Resistance to Soldering
Specified Value
Appearance: No abnormality
Capacitance change: Within±15%（HMK）, ±10%（QMK, SMK）
Dissipation factor : Initial value
Insulation resistance: Initial value
Withstanding voltage（between terminals）: No abnormality
【Test Methods and Remarks】
Preconditioning:Thermal treatment（at 150℃ for 1hr） Note1
Solder temperature:270±5℃
Duration:3±0.5sec.
Preheating conditions: 80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5min.
Recovery : 24±2hrs under the standard condition Note3
13．Temperature Cycle（Thermal Shock）
Specified Value
Appearance: No abnormality
Capacitance change: Within±15%（HMK）, ±7.5%（QMK, SMK）
Dissipation factor: Initial value
Insulation resistance: Initial value
【Test Methods and Remarks】
Preconditioning:Thermal treatment（at 150℃ for 1hr） Note1
Conditions for 1 cycle／ Step 1: Minimum operating temperature ＋0
－3℃ 30±3min.
Step 2: Normal temperature 2 to 3min.
Step 3: Maximum operating temperature ＋0
－3℃ 30±3min.
Step 4: Normal temperature 2 to 3min.
Number of cycles:5 times
Recovery : 24±2hrs under the standard condition Note3
14．Humidity（Steady state）
Specified Value
Appearance: No abnormality
Capacitance change: Within±15%
Dissipation factor : 7%max（HMK）, 5%max（QMK, SMK）.
Insulation resistance: 25MΩ
μF or 1000MΩ, whichever is smaller.
【Test Methods and Remarks】
Preconditioning:Thermal treatment（at 150℃ for 1hr） Note1
Temperature:40±2℃
Humidity：90 to 95%RH
Duration: 500 ＋24
－0hrs
Recovery : 24±2hrs under the standard condition Note3
15．Humidity Loading
Specified Value
Appearance: No abnormality
Capacitance change: Within±15%
Dissipation factor: 7%max（HMK）, 5%max（QMK, SMK）.
Insulation resistance: 10MΩ
μF or 500MΩ, whichever is smaller.
【Test Methods and Remarks】
According to JIS 5102 clause 9.9.
Preconditioning:Voltage treatment Note2
Temperature:40±2℃
Humidity：90 to 95%RH
Applied voltage:Rated voltage
Charge/discharge current：50mA max.
Duration: 500 ＋24
－0hrs
Recovery : 24±2hrs under the standard condition Note3
16．High Temperature Loading
Specified Value
Appearance: No abnormality
Capacitance change: Within±15%
Dissipation factor: 7%max（HMK）, 5%max（QMK, SMK）.
Insulation resistance: 50MΩ
μF or 1000MΩ, whichever is smaller.
【Test Methods and Remarks】
According to JIS 5102 clause 9.10.
Preconditioning:Voltage treatment Note2
Temperature:125±3℃ （B7, C7）, 85±2℃（BJ）
Applied voltage:Rated voltage×2（HMK）
Rated voltage×1.5（QMK）
Rated voltage×1.2（SMK）
Charge/discharge current：50mA max.
Duration: 1000 ＋24
－0hrs
Recovery : 24±2hrs under the standard condition Note3
Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for 24±2hours.
Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and
kept at room temperature for 24±2hours.
Note3 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condi-
tion.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
1
2
mlcc_prec-P1 mlcc_prec_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-
pose applications.
◆Operating Voltage （Verification of Rated voltage）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage
having rapid rise time is used in a circuit.
2. PCB Design
Precautions
◆Pattern configurations （Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance. Therefore, the following items must
be carefully considered in the design of land patterns:
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper
amount of solder.
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist.
◆Pattern configurations（Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land pattern configurations and positions of capacitors
shall be carefully considered to minimize stresses.
Technical
consider-
ations
◆Pattern configurations （Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
●Multilayer Ceramic Capacitors : Recommended land dimensions （unit: mm）
　Wave-soldering Land patterns for PCBs
Type 107 212 316 325
Size L 1.6 2.0 3.2 3.2
W 0.8 51.25 1.6 2.5
A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5
B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7
C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5
Solder-resist
Chip capacitor
L
L
W
B
C
B
A
W
LWDC
Land
Chip capacitor
Reflow-soldering
Type 042 063 105 107 212 316 325 432
Size L 0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5
W 0.2 0.3 0.5 0.8 51.25 1.6 2.5 3.2
A
0.15 to 0.25 0.20 to 0.30 0.45 to 0.55
0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5
B
0.15 to 0.20 0.20 to 0.30 0.40 to 0.50
0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8
C
0.15 to 0.30 0.25 to 0.40 0.45 to 0.55
0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5
Note：Recommended land size might be different according to the allowance of the size of the product.
●LWDC: Recommended land dimensions for reflow-soldering（unit: mm）
Type 105 107 212
Size L 0.52 50.8 1.25
W 1.0 1.6 2.0
A 0.18 to 0.22 0.25 to 0.3 0.5 to 0.7
B 0.2 to 0.25 0.3 to 0.4 0.4 to 0.5
C 0.9 to 1.1 1.5 to 1.7 1.9 to 2.1
●Array type: Recommended land dimensions for reflow-soldering （unit: mm）
2 circuits 4 circuits
Type 096（2 circuits）110（2 circuits）212（2 circuits）212（4 circuits）
Size L 0.9 1.37 2.0 2.0
W 0.6 1.0 1.25 1.25
a 0.25 to 0.35 0.35 to 0.45 0.5 to 0.6 0.5 to 0.6
b 0.15 to 0.25 0.55 to 0.65 0.5 to 0.6 0.5 to 0.6
c 0.15 to 0.25 0.3 to 0.4 0.5 to 0.6 0.2 to 0.3
d 0.45 0.64 1.0 0.5
Chip capacitor
a
a
b
d
c
Land
c
d
a
a
b
（2）Examples of good and bad solder application
Items Not recommended Recommended
Mixed mounting of
SMD and leaded
components
Component
placement close to
the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Precautions on the use of Multilayer Ceramic Capacitors
To next page
1
2
mlcc_prec-P2
mlcc_prec_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
2. PCB Design
Technical
consider-
ations
◆Pattern configurations（Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or de-
flection.
Items Not recommended Recommended
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from
least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2.Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appro-
priately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further
information.
Technical
consider-
ations
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points
shall be considerable.
（1） The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2） The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the
PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement:
Items Not recommended Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted
periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capaci-
tors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions
shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f . The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
［Recommended condition］
Figure 212/316 case sizes as examples
a 0.3mm min
b 100 to 120 μm
c Adhesives shall not contact land 　　
1
2
mlcc_prec-P3 mlcc_prec_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
4. Soldering
Precautions
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt% （in CI equivalent） of halogenated content. Flux having a strong acidity content shall not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
Technical
consider-
ations
◆Selection of Flux
1-1. When too much halogenated substance （Chlorine, etc.） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec-（Chlorine, etc.） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec-Chlorine, etc.） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec-） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec- content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal elec-
trodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect
the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause
a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be
considered carefully when water-soluble flux is used.
◆Soldering
• Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
• Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.
• Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130℃.
• Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
［Reflow soldering］
【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】
Temperature（℃）
0
100
200
300
230℃
Within 10 sec.
60sec.
Min.
60sec.
Min.
Slow cooling
Preheating
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Caution
①The ideal condition is to have solder mass （fillet） controlled to 1/2 to 1/3 of the thickness of a capacitor.
Capacitor
PC board
T
Solder
②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as
close to recommended times as possible.
［Wave soldering］
【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
［Hand soldering］
【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
⊿T
316type or less
⊿T≦150℃
⊿T
325type or more
⊿T≦130℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
1
2
mlcc_prec-P4
mlcc_prec_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
5. Cleaning
Precautions
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning.（e.g. to
remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics.
Technical
consider-
ations
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in
a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions （insufficient or excessive cleaning） may adversely affect the performance of the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered
portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked;
Ultrasonic output : 20 W/ℓ or less
Ultrasonic frequency : 40 kHz or less
Ultrasonic washing period : 5 min. or less
6. Resin coating and mold
Precautions
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal stor-
age conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or
destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
Precautions
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
（2）Please be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
Precautions
◆Storage
1.
To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in
the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity : Below 70% RH
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capaci-
tors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2.
The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, ｓo care shall be taken to design circuits . Even if
capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for 1hour.
Technical
consider-
ations
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/
packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability be-
fore using the capacitors.
※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.
　Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.