Intel® Celeron® Processor on
0.13 Micron Process in the
478-Pin Package Datasheet
The Intel® Celeron® processor on 0.13 micron process in the 478-pin package expands Intel’s
processor family into the value-priced PC market segment. Celeron processors provide the value
customer the capability to get onto the Internet affordably, and utilize educational programs,
home-office software and productivity applications. All of the Celeron processors include an
integrated L2 cache, and are built on Intel's advanced CMOS process technology. The Celeron
processor is backed by over 30 years of Intel experience in manufacturing high-quality, reliable
microprocessors.
■Available at 2 GHz, 2.10 GHz, 2.20 GHz,
2.30 GHz, 2.40 GHz, 2.50 GHz, and
2.60 GHz
■Binary compatible with applications
running on previous members of the Intel
microprocessor line
■System bus frequency at 400 MHz
■Rapid Execution Engine: Arithmetic Logic
Units (ALUs) run at twice the processor
core frequency
■Hyper Pipelined Technology
■Advanced Dynamic Execution
—Very deep out-of-order execution
—Enhanced branch prediction
■8-KB Level 1 data cache
■Level 1 Execution Trace Cache stores 12K
micro-ops and removes decoder latency
from main execution loops
■128-KB Advanced Transfer Cache (on-die,
full speed Level 2 (L2) cache) with Error
Correct i on Cod e (ECC)
■144 Streaming SIMD Extensions 2 (SSE2)
Instructions
■Power Management capabilities
—System Management mode
—Multiple low-power states
■Optimized for 32-bit applications running
on advanced 32-bit operating systems
August 2003
Document Number: 251748-005
2 Datasheet
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRO DUCTS. NO LI CENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITI ONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO L IABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/ OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR W ARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PA TENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reser ves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel® Celeron® processor may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Celeron, Pentium, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and
other countries.
*Other names and brands may b e claimed as the property of others.
Copyright © 2002–2003, Intel Corporation
Datasheet 3
Contents
1.0 Introduction..................................................................................................................9
1.1 Terminology...........................................................................................................9
1.1.1 Processor Packaging Terminology.........................................................10
1.2 References..........................................................................................................11
2.0 Electrical Spec if ica ti ons........................................................................................13
2.1 System Bus and GTLREF...................................................................................13
2.2 Power and Ground Pins......................................................................................13
2.3 Decoupling Guidelines ........................................................................................13
2.3.1 VCC Decoupling.....................................................................................14
2.3.2 System Bus AGTL+ Decoupling.............................................................14
2.3.3 System Bus Clock (BCLK[1:0]) and Processor Clocking .......................14
2.4 Voltage Identification...........................................................................................15
2.4.1 Phase Lock Loop (PLL) Power and Filter...............................................16
2.5 Reserved, Unused Pins, and TESTHI[12:0]........................................................18
2.6 System Bus Signal Groups .................................................................................19
2.7 Asynchronous GTL+ Signals...............................................................................20
2.8 Test Access Port (TAP) Connection....................................................................20
2.9 System Bus Frequency Select Signals (BSEL[1:0])............................................20
2.10 Maximum Ratings................................................................................................21
2.11 Processor DC Specifications...............................................................................21
2.11.1 Flexible Motherboard Guidelines (FMB).................................................22
2.12 AGTL+ System Bus Specifications .....................................................................28
2.13 System Bus AC Specifications............................................................................29
2.14 Processor AC Timing Waveforms.......................................................................32
3.0 System Bus Signal Quality Specifications....................................................41
3.1 System Bus Clock (BCLK) Signal Quality Specifications....................................41
3.2 System Bus Signal Quality Specifications and Measurement Guidelines...........42
3.3 System Bus Signal Quality Specifications and Measurement Guidelines...........45
3.3.1 Overshoot/Undershoot Guidelines .........................................................45
3.3.2 Overshoot/Undershoot Magnitude .........................................................45
3.3.3 Overshoot/Undershoot Pulse Duration...................................................45
3.3.4 Activity Factor.........................................................................................46
3.3.5 Reading Overshoot/Undershoot Specification Tables............................46
3.3.6 Conformance Determination to Overshoot/Undershoot
Specifications .........................................................................................47
4.0 Package Mechanical Specifications.................................................................51
4.1 Package Load Specifications..............................................................................54
4.2 Processor Insertion Specifications......................................................................55
4.3 Processor Mass Specifications ...........................................................................55
4.4 Processor Materials.............................................................................................55
4.5 Processor Markings.............................................................................................55
5.0 Pin Listing and Signal Definitions.....................................................................59
5.1 Processor Pin Assignments ................................................................................59
4 Datasheet
5.2 Alphabetical Signals Reference ..........................................................................72
6.0 Thermal Specifications and Design Considerations.................................81
6.1 Processo r Thermal Specif ic ati ons...... ...... ....................................... ...... ....... ...... .82
6.1.1 Thermal Specifications...........................................................................82
6.1.2 Thermal Metrology .................................................................................83
6.1.2.1 Processor Case Temperature Measurement............................83
7.0 Features.......................................................................................................................85
7.1 Power-On Confi gu ratio n Options ................... ....... ...... ....... ...... ....... ...... ....... ...... .85
7.2 Clock Control and Low Power States..................................................................85
7.2.1 Normal State—State 1 ...........................................................................85
7.2.2 AutoHALT Powerdown State—State 2 ..................................................86
7.2.3 Stop-Grant State—State 3 .....................................................................87
7.2.4 HALT/Grant Snoop State—State 4 ........................................................87
7.2.5 Sleep Sta te—Stat e 5...... ................... ....... ...... ....... ...... ....... ...... ....... ...... .88
7.3 Thermal Monitor..................................................................................................88
7.3.1 Thermal Diode........................................................................................90
8.0 Boxed Processor Specifications.......................................................................91
8.1 Introduction .........................................................................................................91
8.2 Mechanical Specifications...................................................................................92
8.2.1 Boxed Processor Cooling Solution Dimensions.....................................92
8.2.2 Boxed Processor Fan Heatsink Weight..................................................93
8.2.3 Boxed Processor Retention Mechanism and Heatsink Assembly..........93
8.3 Electrical Requirements......................................................................................94
8.3.1 Fan Heatsink Power Supply...................................................................94
8.4 Thermal Specifications........................................................................................96
8.4.1 Boxed Processor Cooling Requirements ...............................................96
8.4.2 Variable Speed Fan ...............................................................................97
9.0 D ebug Tools Specifications.................................................................................99
9.1 Logic Analyzer Interface (LAI).............................................................................99
9.1.1 Mechanical Considerations....................................................................99
9.1.2 Electrical Considerations........................................................................99
Datasheet 5
Figures 1 VCCVID Pin Voltage and Current Requirements................................................15
2 Typical VCCIOPLL, VCCA and VSSA Power Distribution ..................................17
3 Phase Lock Loop (PLL) Filter Requirements ......................................................17
4 VCC Static and Transient Tolerance...................................................................24
5 ITPCLKOUT[1:0] Output Buffer Diagram ............................................................27
6 AC Test Circuit....................................................................................................32
7 TCK Clock Waveform..........................................................................................33
8 Differential Clock Waveform................................................................................33
9 Differential Clock Crosspoint Specification..........................................................34
10 System Bus Common Clock Valid Delay Timings...............................................34
11 System Bus Reset and Configuration Timings....................................................35
12 Source Synchronous 2X (Address) Timings .......................................................35
13 Source Synchronous 4X Timings........................................................................36
14 Power Up Sequence ...........................................................................................37
15 Power Down Sequence.......................................................................................37
16 Test Reset Timings .............................................................................................38
17 THERMTRIP# Power Down Sequence...............................................................38
18 ITPCLKOUT Valid Delay Timing.........................................................................38
19 FERR#/PBE# Valid Delay Timing .......................................................................39
20 TAP Valid Delay Timing ......................................................................................39
21 BCLK Signal Integrity Waveform.........................................................................41
22 Low-to-High System Bus Receiver Ringback Tolerance.....................................43
23 High-to-Low System Bus Receiver Ringback Tolerance.....................................43
24 Low-to-High System Bus Receiver Ringback Tolerance for PWRGOOD
and TAP Buffers..................................................................................................44
25 High-to-Low System Bus Receiver Ringback Tolerance for PWRGOOD
and TAP Buffers..................................................................................................44
26 Maximum Acceptable Overshoot/Undershoot Waveform ...................................49
27 Exploded View of Processor Components on a System Board ..........................51
28 Processor Package.............................................................................................52
29 Processor Cross-Section and Keep-In................................................................53
30 Processor Pin Detail............................................................................................53
31 IHS Flatness Specification ..................................................................................54
32 Processor Markings.............................................................................................55
33 Processor Pinout Coordinates (Top View, Left Side)..........................................56
34 Processor Pinout Coordinates (Top View, Right Side)........................................57
35 Example Thermal Solution (Not to Scale)...........................................................81
36 Guideline Locations for Case Temperature (TC) Thermocouple Placement ......83
37 Stop Clock State Machi ne.. ...... ....... ...... ...... ....... ................... ....... ...... ....... ...... ....86
38 Mechanical Representation of the Boxed Processor ..........................................91
39 Side View Space Requirements for the Boxed Processor..................................92
40 Top View Space Requirements for the Boxed Processor...................................93
41 Boxed Processor Fan Heatsink Power Cable Connector Description.................94
42 MotherBoard Power Header Placement Relative to Processor Socket ..............95
43 Boxed Processor Fan Heatsink Airspace Keep-Out Requirements
(Side 1 View).......................................................................................................96
44 Boxed Processor Fan Heatsink Airspace Keep-Out Requirements
(Side 2 View).......................................................................................................97
45 Boxed Processor Fan Heatsink Set Points .........................................................97
6 Datasheet
Tables 1 References..........................................................................................................11
2 VCCVID Pin Voltage Requirements....................................................................15
3 Voltage Identification Definition...........................................................................16
4 System Bus Pin Groups......................................................................................19
5 BSEL[1:0] Frequency Table for BCLK[1:0] .........................................................20
6 Processor DC Absolute Maximum Ratings.........................................................21
7 Voltage and Current Specifications.....................................................................22
8 VCC Static and Transient Tolerance...................................................................23
9 System Bus Differential BCLK Specifications .....................................................25
10 AGTL+ Signal Group DC Specifications .............................................................25
11 Asynchronous GTL+ Signal Group DC Specifications........................................26
12 PWRGOOD and TAP Signal Group DC Specifications ......................................26
13 ITPCLKOUT[1:0] DC Specifications....................................................................27
14 BSEL [1:0] and VID[4:0] DC Specifications.........................................................27
15 AGTL+ Bus Voltage Definitions...........................................................................28
16 System Bus Differential Clock Specifications......................................................29
17 System Bus Common Clock AC Specifications ..................................................29
18 System Bus Source Synch AC Specifications AGTL+ Signal Group..................30
19 Miscellaneous Signals AC Specifications ...........................................................31
20 System Bus AC Specifications (Reset Conditions).............................................31
21 TAP Signals AC Specifications...........................................................................31
22 ITPCLKOUT[1:0] AC Specifications....................................................................32
23 BCLK Signal Quality Specifications ....................................................................41
24 Ringback Specifications for AGTL+ and Asynchronous GTL+ Signals Groups..42
25 Ringback Specifications for PWRGOOD Input and TAP Signal Group ..............42
26 1.525V VID Source Synchronous (400 MHz) AGTL+ Signal Group Overshoot/
Undershoot Tolerance.........................................................................................47
27 1.525 V VID Source Synchronous (200 MHz) AGTL+ Signal Group Overshoot/
Undershoot Tolerance.........................................................................................48
28 1.525 V VID Common Clock (100 MHz) AGTL+ Signal Group Overshoot/
Undershoot Tolerance.........................................................................................48
29 1.525 V VID Asynchronous GTL+, PWRGOOD Input, and TAP Signal Group
Overshoo t/Und ershoot To le ranc e......................... ...... ....... ...... ....... ...... ....... ...... .48
30 Description Table for Processor Dimensions......................................................52
31 Package Dynamic and Static Load Specifications..............................................54
32 Proces sor Mass ..................................................................................................55
33 Proces sor Material Propertie s............ ...... ...... ....... ...... ....... ...... ....... ...... ..............55
34 Pin Listing by Pin Name......................................................................................60
35 Pin Listing by Pin Number...................................................................................66
36 Signal Description ...............................................................................................72
37 Processor Thermal Design Power ......................................................................83
38 Power-On Configu ra tio n Option Pins............. ....... ...... ....... ...... ....... ...... ....... .......85
39 Thermal Diode Parameters.................................................................................90
40 Thermal Diode Interface......................................................................................90
41 Fan Heatsink Power and Signal Specifications...................................................95
42 Boxed Processor Fan Heatsink Set Points.........................................................98
Datasheet 7
Revision History
Revision Description Date
-002 U pdated document with 2.10 GHz and 2.20 GHz specifications. November 2002
-003 Added 2.30 GHz and 2.40 GHz specifications. March 2003
-004 Added 2.50 GHz and 2.60 GHz specifications. Updated thermal
specifications and thermal monitor sections. Updated PROCHOT# pin
definition. June 2003
-005 U pdated title page. August 2003
8 Datasheet
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Datasheet 9
Introduction
1.0 Introduction
The Intel® Celeron® processor on 0.13 micron process and in the 478-pin package utilizes Flip-
Chip Pin Grid Array (FC-PGA2) package technology, and plugs into a 478-pin surface mount,
Zero Insertio n For ce (ZI F) s ocket, refer red to as the mPGA478 B sock et. Th e Ce leron pro cessor on
0.13 micron process maintains the tradition of compatibility with IA-32 software. In this document,
the Celeron processor on 0.13 micron process may be referred to as the “Celeron processor” or
simply “the processor.”
The Celeron processor on 0.13 micron process is designed for uni-processor based Value PC
desktop systems. Features of th e pro cessor include hy per p ipelined tech nolog y, a 400 MHz system
bus, and an execution trace cache. The 400 MHz system bus is a quad-pumped bus running off a
100 MHz system clo ck making 3.2 GB/s d ata transfer rates po ssible. The exe cution trace cach e is a
first level cache that stores approximately 12k decoded micro-operations, which removes the
decoder from the main execution path.
Additional features include advanced dynamic execution, advanced transfer cache, enhanced
floating point and multi-media unit, and Streaming SIMD Extensions 2 (SSE2). The advanced
dynamic execution impro ves speculative execution and bran ch prediction internal to the pro cessor.
The advanced transfer cache is a 128 KB, on-die level 2 (L2) cache. The floating point and multi-
media units have 128-bit wide registers with a separate register for data movement. SSE2 support
includes in structions f or double-precisi on fl o atin g p oi nt, SIMD int eger, and memory management .
Power management capabilities such as AutoHALT, Stop-Grant, and Sleep have been retained.
The Celeron processor on 0.13 micron process 400 MHz system bus utilizes a split-transaction,
deferred reply protocol. This system bus is not compatible with the P6 processor family bus. The
400 MHz system bus uses Source-Synchronous Transfer (SST) of address and data to improve
throughput by transferring data four times per bus clock (4X data transfer rate, as in AGP 4X).
Along with the 4X data bus, the address bus can deliver addresses two times per bus clock, and is
referred to as a “double-clocked” or 2X address bus. Working together, the 4X data bus and 2X
address bus provide a data bus bandwidth of up to 3.2 GB/s.
Intel will be enabling support components for the Celeron processor on 0.13 micron process
including a heatsink, heatsink retention mechanism, and socket. Manufacturability is a high
priority; hence, mechanical assembly can be completed fr om the top o f the motherboard and should
not require any special tooling. The processor system bus uses a variant of GTL+ signalling
technology called Assisted Gunning Transceiver Logic (AGTL+) signalling technology.
The processor includes an address bus powerdown capability wh ich removes p ower from the
address and data pins when the system bus is not in use. This feature is always enabled on the
processor.
1.1 Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating that the signal is in the
active state when driven to a low level. For example, when RESET# is low, a reset has been
requested. Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of
signals where the name d oes not imply an activ e state but describes part of a bin ary sequence ( such
as address or data), the ‘#’ symbol implies that the si gnal is in v ert ed. For exampl e,
D[3:0] = ‘HLHL’ refers to a hex ‘A’, and D[3:0] # = ‘LHLH’ also refers to a hex ‘A’ (H= High logic
level, L= Low logic level).
“System Bus” refers to the interface between the processor and system core logic (the chipset
components). The system bus is a multiprocessing interface to processo rs, memory, and I/O.
10 Datasheet
Introduction
1.1.1 Processor Packaging Terminology
The following are commonly used terms:
•Intel® Celeron® processor on 0.13 micron process and in the 478-pin package (also
referred as the Intel® Celeron® processor on 0.13 micron process or processor) —
0.13 micron processor core in the 478-pin FC-PGA2 package with a 128-KB L2 cache.
•Intel Celeron processor in the 478-pin package — 0.18 micron processor core in the
478-pin FC-PGA2 package with a 128-KB L2 cache.
•Intel Pentium 4 processor with 512-KB L2 cache on 0.13 micron process —
0.13 micron process version of Pentium 4 processor in the 478-pin FC-PGA2 package with a
512-KB L2 cache.
•Processor — For this document, the term processor means Celeron processor on 0.13 micron
process.
•Keep-Out Zone — The area on or near the processor that system design can not utili ze. This
area must be kept free of all components to make room for the processor package, retention
mechanism, heatsink, and heatsink clips.
•Intel® 850 chipset — Chipset that supports RDRAM* memory technology for Celeron
processor on 0.13 micron process.
•Intel® 845 chipset — Chipset that supports PC133 and DDR memory technology for the
Celeron processor on 0.13 micron process.
•Intel® 845G chipset — Chipset with embedded graphics that supports DDR memory
technology for the Cel eron processor on 0.13 micron pr ocess.
•Intel® 845E chipset — Chipset th at supports DDR memory technology for the Celeron
processor on 0.13 micron process.
•Processor core — Celeron processor on 0.13 micron process core die with integrated
L2 cache.
•FC-PGA2 package — Flip -Chip Pin Grid Array pa ckage with 50-mil pin pitch and Integrated
Heat Spreader.
•mPGA478B socket — Surface mou nt, 478 p in, Zero In sertion Force (ZIF) sock et with 50-mil
pin pitch. The socket mates the processor to the system board.
•Integrated heat spreader — The surface used to make contact between a heatsink or other
thermal solutio n and the processor. Abbreviated IHS.
•Retention m echanism — The structure mounted on the system board that provides support
and retention of the processor heatsink.
Datasheet 11
Introduction
1.2 References
The following documents should be referenced for additional information:
Table 1. References
Document Document Number/Source
Intel® Pentium® 4 Process or in the 478 Pin Package and
Intel® 850 Chipset Platform Design Guide http://developer.intel.com/design/
pentium4/guides/249888.htm
Intel® Pentium® 4 Process or in the 478 Pin Package and
Intel® 845 Chipset Plat form for DDR Design Guide http://developer.intel.com/design/
chipsets/designex/298605.htm
Intel® Pentium® 4 Process or in the 478 Pin Package and
Intel® 845 Chipset Plat form for SDR Design Guide http://developer.intel.com/design/
pentium4/guides/298354.htm
Intel® Pentium® 4 Process or in the 478 Pin Package and
Intel® 845E Chipset Platform for DDR Design Guide http://developer.intel.com/design/
chipsets/designex/298653.htm
Intel® Pentium® 4 Process or in 478-pin Package and
Intel® 845G/845GL Chipset Platform Design Guide http://developer.intel.com/design/
chipsets/designex/298654.htm
Intel® Pentium® 4 Process or in the 478-pin Package Thermal Design
Guidelines http://developer.intel.com/design/
pentium4/guides/249889.htm
Intel® Pentium® 4 Process or VR-Down Design Guidelines http://developer.intel.com/design/
Pentium4/guides/249891.htm
Intel® Pentium® 4 Processor 478-pin Socket (mPGA478B) Design
Guidelines http://developer.intel.com/design/
pentium4/guides/249890.htm
Intel® Pentium® 4 Process or CK00 Clock Synt hesiz er/Dr iver D esign
Guidelines http://developer.intel.com/design/
pentium4/guides/249206.htm
CK408 Clock Design Guidelines Contact Intel field representative.
IA-32 Int el® Architecture Software Developer’s Manual,
Volum e 1: Basic Ar chi tecture http://developer.intel.com/design/
pentium4/manuals/245470.htm
IA-32 Int el® Architecture Software Developer’s Manual,
V olume 2: Instruction Set Reference http://developer.intel.com/design/
pentium4/manuals/245471.htm
IA-32 Int el® Architecture Software Developer’s Manual,
V olume 3: System Programming Guide http://developer.intel.com/design/
pentium4/manuals/245472.htm
ITP700 Debug Port Design Guide http://developer.intel.com/design/
Xeon/guides/249679.htm
AP-485 Intel® Processor Identification and the CPUID Instruction http://developer.intel.com/design/
xeon/applnots/241618.htm
12 Datasheet
Introduction
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Datasheet 13
Electrical Specifications
2.0 Electrical Specifications
2.1 System Bus and GTLREF
Most Celeron processor on 0.13 micron process system bus signals use Assisted Gunning
Transceiver Logic (AGTL+) signalling technology. As with the P6 family of microprocessors, this
signalling technology provides improved noise margins and reduced ringing through low voltage
swings and controlled edge rates. Like the Intel Pentium 4 processor, the termination voltag e
level for the Celeron processor on 0.13 micron process AGTL+ signals is VCC, which is the
operating voltage of the processor core. The use of a termination voltage that is determined by the
processor core allows better voltage scaling on the system bus for Celeron processor on
0.13 micron process. Because of the speed improvements to data and address bus, signal integrity
and platform design methods hav e become mo re critical than with previous pr ocessor families.
Design guidelines fo r the Celeron pro cessor on 0.1 3 micron proces s system bus are described in the
appropriate Platform Design Guide (refer to Table 1).
The AGTL+ inputs require a reference voltage (GTLREF) that is used by the receivers to d etermine
whether a signal is a logical 0 or a logical 1. GTLREF must be generated on the system board.
Termination resistors are provided on the processor silicon , and are terminated to the processo r
core voltage (VCC). Intel chipsets also provide on-die termination, thus eliminating the need to
terminate most AGTL+ signals on the system board.
Some AGTL+ signals do not include on-die termination and must be terminated on the system
board. See Table 4 for detail s regarding these signals.
The AGTL+ bus depends on incident wave switching. Therefore, timing calculations for AGTL+
signals are based on flight time as opposed to capacitive deratings. Analog signal simulation of the
system bus, including trace lengths, is highly recommended when designing a system.
2.2 Power and Ground Pins
For clean on-chip power distribution, the Celeron processor on 0.13 micron process has 85 VCC
(power) and 181 VSS (groun d) inputs. All pow er pins must be connected to VCC, and all VSS pins
must be connected to a system ground plane.The processor VCC pins must be supplied with the
voltage defined by the VID (Voltage ID) pins and the loadline specifications (see Figure 4).
2.3 Decoupling Guidelines
Because of the large number of transistors and high internal clock speeds, the processor is capable
of generating large average current swings between low and full power states. This may cause
voltages on power planes to sag below their minimum values if bulk decoupling is not adequate.
Care must be take n in the board desi gn to ens ure t hat the vol tage pr ovided t o the pro cessor remains
within the specifications listed in Table 7. Failure to do so can result in timing violations and/or
affect th e long term reliability of the pr ocessor. For further information and design guidelines, refer
to Table 1 for the appropriate Platform Design Guide, and the Intel
Pentium
4 Processor
VR-Down Design Guidelines.
14 Datasheet
Electrical Specifications
2.3.1 VCC Decoupling
Regulator solutions must provide bulk capacitance with a low Effective Series Resistance (ESR)
and keep a low interconnect resistance from the regulator to the socket. Bulk decoupling for the
large current swings when the part is powering on or is entering or exiting low power states must
be provided by the voltage regulator solution (VR). For design guidelines, refer to Table 1 for the
appropriate Platform Design Guide, and to the Intel
Pentium
4 Pr oces sor VR-Down Design
Guidelines.
2.3.2 System Bus AGTL+ Decoupling
The Celeron processor on 0.13 micron process integrates signal termination on the die and
incorporates high frequency decoupling capacitance on the processor package. Decoupling must
also be provided by the system motherboard for proper AGTL+ bus operation. For more
information, refer to the appropriate platform design guide listed in Table 1.
2.3.3 System Bus Clock (BCLK[1:0]) and Processor Clocking
BCLK[1:0] directly control the system bus interface speed as well as the core frequency of the
processor. As in previous gen eration processor s, the Celeron processo r on 0.13 micron process core
frequency is a multiple of the BCLK[1:0] frequency.
Like the Celeron processor in the 478-pin package, the Celeron processor on 0.13 micron process
uses a differentia l cloc ki ng imp l ement ati on. For more infor matio n on cl ocking , refer to the CK408
Clock Design Guidelines and also the CK00 Clock Synthesizer/Driver Design Guidelines.
Datasheet 15
Electrical Specifications
2.4 Voltage Identification
The VID specification for Celeron processor on 0.13 micron process is supported by the Intel
Pentium
4 Processor VR-Down Design Guidelines. The voltage set by the VID pins is the
maximum voltage allowed by the processor. A minimum voltage is provided in Table 7 and
changes with frequency. This allows processors running at a higher frequency to have a relaxed
minimum voltage specification. The specifications have been set such that one voltage regulator
can work with all supported frequencies.
The Celeron processor on 0.13 micron process uses five voltage identification pins, VID[4:0], to
support automatic selection of power supply voltages. The VID pins for the Celeron processor on
0.13 micron process a re open drain outputs driven by the proce ssor VID circuitry. The VID signals
rely on pull-up resistors tied to a 3.3V (max) supply to set the signal to a logic high level. These
pull-up resistors may be either external logic on the motherboard, or internal to the Voltage
Regulator. Table 3 specifies the voltage levels corresponding to the states of VID[4:0]. A 1 in this
table refers to a high voltage level, and a 0 refers to low voltage level. The definition provided in
Table 3 is not related in any way to previous P6 processors or VRs, but is compatible with the
Pentium 4 processor in the 478-pin package. If the proces sor socket is emp ty (VID[4:0] = 1 1111) or
the voltage regulation circuit cannot supply the voltag e that is request e d, it must disable itself. See
the Intel
Pentium
4 Processor VR-Down Design Guidelines for more details.
Power source characteristics must be stable whenever the supply to the voltage regulator is stable.
Refer to the Figure 14 for timing details of the power up sequence. Also refer to the appropriate
platform design guide listed in Table 1 for implementation details.
The Voltage Identification circuit requires an independent 1.2V supply. This voltage must be routed
to the processor VCCVID pin. Table 2 and Figure 1 describe the volta ge and current requirement s
of the VCCVID pin.
NOTES:
1. This specification applies to both static and transient components. The rising edge of VCCVID must be
monotonic from 0 to 1.1 V. See Figure 1 for current requirements. In this case, monotonic is defined as
continuously increasing with less than 50 mV of peak to peak noise for any width greater than 2 ns
superimpose d on the rising edge.
Table 2. VCCVID Pin Voltage Requirements
Symbol Parameter Min Typ Max Unit Notes
VCCVID VCC for voltage identification circuit. –5% 1.2 +10% V 1
Figure 1. VCCVID Pin Voltage and Curren t Requirements
VCCVID
1. 2 V + 10%
1.2 V - 5%
4 ns
VIDs latched
30 m A
1.0 V
1 mA
16 Datasheet
Electrical Specifications
2.4.1 Phase Lock Loop (PLL) Power and Filter
VCCA and VCCIOPLL are power sources required by the PLL clock generators on the Celeron
processor on 0.13 micron process. Since these PLLs are analog in nature, they require quiet power
supplies for minimum jitter . Jitter is detrimental to the system—it degrades external I/O timings, as
well as internal core timings (i.e., maximum frequency). To pr event this deg radation, these supplies
must be low pass filtered from VCC. A typical filter topology is shown in Figure 2.
The AC low-pass requirements, with input at VCC and output measured across the capacitor (CA
or CIO in Figure 2), is as follows:
•< 0.2 dB gain in pass band
•< 0.5 dB attenuation in pass band < 1 Hz
•> 34 dB attenuation from 1 MHz to 66 MHz
•> 28 dB attenuation from 66 MHz to core frequency
The filter requirements are illustrated in F igure 3. For recommendations on implementing the filter,
refer to the appropriate Platform Design Guide listed in Table 1.
Table 3. Voltage Identification Definition
Processor Pins VCC_MAX
VID4 VID3 VID2 VID1 VID0
11111VRM output of f
111101.100
111011.125
111001.150
110111.175
110101.200
110011.225
110001.250
101111.275
101101.300
101011.325
101001.350
100111.375
100101.400
100011.425
100001.450
011111.475
011101.500
011011.525
011001.550
Datasheet 17
Electrical Specifications
.
NOTES:
1. Diagram not to scale.
2. No specification for frequencies beyond fcore (core frequency).
3. fpeak, if existent, should be less than 0.05 MHz.
Figure 2. Typical VCCIOPLL, VCCA and VSSA Power Dist ribution
Figure 3. Phase Lock Loop (PLL) Filter Requirements
VCC VCCA
VSSA
VCCIOPLL
L
L
Processor
Core
PLL
CA
CIO
0 dB
–28 dB
–34 dB
0.2 dB
–0.5 dB
1 MHz 66 MHz fcorefpeak1 HzDC
Passband High
Frequency
Band Filter_Spec
Forbidden
Zone
Forbidden
Zone
18 Datasheet
Electrical Specifications
2.5 Reserved, Unused Pins, and TESTHI[12:0]
All RESERVED pins must remain unconnected. Connection of these pins to VCC, VSS, or to any
other signal (including each other) can result in component malfunction or incompatibility with
future processors. See Chapter 5.0 for a processor pin listin g, and the location of all R E SERVED
pins.
For reliable operation, always con nect unused inputs or bidirectional signals that are not terminated
on the die to an appropriate signal level. Note that on-die termination has been included on the
Celeron processor on 0.13 micron process to allow signals to be terminated with in the processor
silicon. Unused active low AGTL+ inputs may be left as no connects if AGTL+ termination is
provided on the process or silicon. Table 4 lists details on AGTL+ signals that do not include on-die
termination. Unused active high inputs should be connected through a resistor to ground (VSS).
Refer to the appropriate platform design guide in Table 1 for the appropriate resistor values.
Unused outputs can be left unconnected. However, this may interfere with some TAP fu nctions,
may complicate debug probing, and may prevent boundary scan testing. A resistor must be used
when tying bidirectional signals to power or ground. When tying any signal to power or ground, a
resistor will allow for system testability. For unused AGTL+ input or I/O signals that do not have
on-die termination, use pull-up resistors of the same value in place of the on-die termination
resistors (RTT). See Table 15.
The TAP, Asynchronous GTL+ inputs, and Asynchronous GTL+ outputs do not include on-die
termination. Inputs and used outputs must be terminated on the system board. Unused outputs can
be terminated on the system board or can be left unconnected. Signal termination for these signal
types is discussed in the appropriate Platform Design Guide listed in Table 1, and the
ITP700 Debug Port Design Guide.
The TESTHI pins should be tied to the processor VCC using a matched resistor with a resistance
value within ± 20% of the impedance of the board transmission line traces. For example, if the
trace impedance is 50 Ω, then a value between 40 Ω and 60 Ω is required.
The TESTHI pins may use individual pull-up resistors, or may be grouped together as follows. A
matched resistor should be used for each group:
1. TESTHI[1:0]
2. TESTHI[5:2]
3. TESTHI[10:8]
4. TESTHI[12:11]
Additionally, if the ITPCLKOUT[1:0] pins are not used (refer to Section 5.2), they can be
connected indi viduall y to V CC using matched re sistors , or can be grouped wit h TESTHI[5: 2] with
a single matched resistor. If they are being used, individual termination with 1 kΩ resistors is
required. Tying ITPCLKOUT[1:0] directly to VCC or sharing a pull-up resistor to VCC will
prevent use of debug interposers. This implementation is strongly discouraged for system boards
that do not implement an inboard debug port.
As an alternative, group2 (TESTHI[5:2]), and the ITPCLKOUT[1:0] pins may be tied directly to
the processor VCC. Th is has no impact on s yst em f unct ionality. TESTHI[0 ] an d TESTHI[12] may
also be tied directly to the processor VCC if resistor termination is a problem, but matched resistor
termination is recommended. In the case of the ITPCLKOUT[1:0] pins, a direct tie to VCC is
strongly discouraged for system boards that do not implement an onboard debug port.
Datasheet 19
Electrical Specifications
2.6 System Bus Signal Groups
To simplify the following discussion, the system bus signals have been combined into groups by
buffer type. AGTL+ input signals have differential input buffers that use GTLREF as a reference
level. In this document, the term “AGTL+ Input” refers to the AGTL+ in put g roup as well as the
AGTL+ I/O group when receiving. Similarly, “AGTL+ Output” refers to the AGTL+ output group
as well as the AGTL+ I/O group when driving.
With the implementation of a source synchronous data bus, there is a need to specify two sets of
timing parameters. One set is for common clock signals which are dependent upon the rising edge
of BCLK0 (ADS#, HIT#, HITM#, etc.), and the second set is for the source synchronous signals
that are relative to their respective strobe lines (data and address) as well as the rising edge of
BCLK0. Asychronous signals are still present (A20M#, IGNNE#, etc.) and can become active at
any time during the clock cycle. Table 4 identifies which signals are common clock, source
synchronous, and asynchronous.
NOTES:
1. Refer to Section 5.2 for signal descriptio ns.
2. These AGT L+ signals do not have on-die termination. Refer to Section 2.5 and the appropriate Platform
Design Guide listed in Table 1 for termination requirements and further details.
3. In processor systems where there is no debug port implemented on the system board, these signals are used
to support a debug port interposer. In systems with the debug port implemented on the system board, these
signals are no connects.
4. These signal groups are not terminated by the processor. Refe r to Section 2.5, the ITP700 Debug Port
Design Guide, and the appropriate Platform Design Guide listed in Table 1 for termination requirements and
further details.
5. The value of these pins during the active-to-inac tive edge of RESET# defines the processor configuration
options. See Section 7.1 for details.
Table 4. System Bus Pin Groups
Signal Group Type Signals1
AGTL+ Common Clock Input Common Clock BPRI#, DEFER #, RESET#2, RS[2:0]#, RSP#, TRDY#
AGTL+ Common Clock I/O Synchronous AP [ 1 :0 ] # , AD S#, BINIT #, BNR#, BP M[5:0]#2, BR 0 #2,
DBSY#, DP[3:0]#, DRDY#, HIT#, HITM#, LOCK#, MCERR#
AGTL+ Source Synchronous
I/O Source
Synchronous
Signals Associated Strobe
REQ[4:0]#, A[16:3]#5ADSTB0#
A[35:17]#5ADSTB1#
D[15:0]#, DBI0# DS TBP0#, DSTBN0#
D[31:16]#, DBI1# DSTBP1#, DSTBN1#
D[47:32]#, DBI2# DSTBP2#, DSTBN2#
D[63:48]#, DBI3# DSTBP3#, DSTBN3#
AGT L+ Strobes Common Clock ADSTB[1:0]#, DSTBP[3:0]#, DSTBN[3:0]#
Asynchronous G TL+ Input 4, 5 Asynchronous A20M#, IGNNE#, INIT#, LINT0/INTR , LINT1/NMI, SMI#,
SLP# , STPCLK#
Asynchronous GTL+ Output 4 Asynchronous FERR# , IERR#, THERMTRIP#, PROCHOT#
TAP Input 4 Synchronous
to TCK TCK, TDI, TMS, TRST#
TAP Output 4 Synchronous
to TCK TDO
Syst em Bus Cl ock N/A BCLK[1:0], ITP_CLK[1:0]3
Power/Other N/A
VCC, VCCA, VCCIOPLL, VCCVID, VID[4:0], VSS, VSSA,
GTLREF[ 3 :0 ] , C O MP[1:0 ], RE SERVED, TE STHI[5: 0 , 1 2 : 8 ],
ITPCLKOUT[1:0], THERMDA, THERMDC, PWRGOOD,
SKTOCC#, VCC_SENSE, VSS_SENSE, BSEL[1:0], DBR#3
20 Datasheet
Electrical Specifications
2.7 Asynchronous GTL+ Signals
The Celeron processor on 0.13 micron process does not utilize CMOS v ol tage levels fo r any
signals that connect to the processor. As a result, legacy input signals such as A20M#, IGNNE#,
INIT#, LINT0/INTR, LINT1/NMI, SMI#, SLP#, and STPCLK# utilize GTL+ input buffers.
Legacy output FERR# and other non-AGTL+ sign als (THERMTRIP# and PROCHOT#) utilize
GTL+ output buffers. All of these signals follow the sam e DC req uiremen ts as AGTL+ signals.
However, the outputs are not actively driven high (during a logical 0 to 1 transition) by the
processor (the major difference between GTL+ and AGTL+). These signals do not have setup or
hold time spe cificatio ns in relation to BC LK[1:0]. Howe ver , all of the Asynchr onous GTL+ signals
must be asserted for at least two BCLKs for the processor to recognize them. See Section 2.11 and
Section 2.13 for the DC and AC specifications for the Asynchronous GTL+ signal groups. See
Section 7.2 for additional timing requirements for entering and leaving the low power states.
2.8 Test Access Port (TAP) Connection
Because of the voltage levels supported by other components in the Test Access Port (TAP) logic,
it is recommended that the Celeron process or on 0.13 micron pro cess be firs t in the TAP chain and
be followed by any other components within the system. A translation buffer should be used to
connect to the res t o f the chain unless one of the other compon ents is capable of accepting an input
of the appropri at e volta ge le vel. S i mil ar cons i derati o ns mu st be made for TCK, TMS, and TR ST#.
Two copies of each signal may be required, with each driving a different voltage level.
2.9 System Bus Frequency Select Signal s (BSEL[1:0])
The BSEL[1:0] are outp ut signals that are us ed to se lect the frequency of th e pro cessor input clock
(BCLK[1:0]). Table 5 defines the possible combinations of the signals, and the frequency
associated with each combination. The required frequency is determined by the pro cessor, chipset,
and clock synthesizer. All agents must operate at the same frequency.
The Celeron processor on 0.13 micron process currently operates at a 400 MHz system bus
frequency (selected by a 100 MHz BCLK[1:0] frequency). Individual processors will operate only
at their specified system bus frequency.
For more information about these pins, refer to Section 5.2 and the appropriate Platform Design
Guidelines.
Table 5. BSEL[1:0] Frequency Table for BCLK[1:0]
BSEL1 BSEL0 Function
L L 100 MHz
L H RESERVED
H L RESERVED
H H RESERVED
Datasheet 21
Electrical Specifications
2.10 Maxi mum Ra tings
Table 6 lists the processor’s maxim um environmental stress ratings. The processor should not
receive a clock while subjected to these conditions. Functional operating parameters are listed in
the AC and DC tables. Extended exposure to the maximum ratings may affect device reliability.
Furthermore, although the processor contains protective circuitry to resist damage from Electro
Static Dischar ge (ESD), one s hould always take precautions to avoid high static voltages or electric
fields.
NOTES:
1. This rating applies to any processor pin.
2. Contact Intel for storage requirements in excess of one year.
2.11 Processor DC Specifications
The processor DC specifications in this section are defined at the processor core silicon unless
noted otherwise. See Chapt er 5.0 for t he pin signal definitions and signal pin assignmen ts. Most o f
the signals on the processor system bus are in the AGTL+ signal group. The DC specifications for
these signals are listed in Table 10.
Previously, legacy signals and Test Access Port (TAP) signals to the processor used low-voltage
CMOS buffer types. However , these interfaces now follow DC specifications similar to GTL+. The
DC specifications for these signal groups are listed in Table 11.
Table 7 through Table 11 list the DC specifications for the Celeron processor on 0.13 micron
process and are valid only while meeting specifications for case temperature, clock frequ ency, and
input voltages. Care should be taken to read all notes associated with each parameter.
Table 6. Processor DC Absolute Maximum Ratings
Symbol Parameter Min Max Unit Notes
TSTORAGE Processor storage temperature -40 85 °C 2
VCC Any processor supply voltage with respect to VSS -0.3 1.75 V 1
VinAGTL+ AGTL+ buffer DC input voltage with respect to
VSS -0.1 1.75 V
VinAsynch_GTL+ Asynch GTL+ buffer DC input voltage with
respect to VSS -0.1 1.75 V
IVID Max VID pin current 5mA
22 Datasheet
Electrical Specifications
2.11.1 Flexible Motherboard Guidelines (FMB)
The FMB guidelines are an estimation of the maximum value the Celeron processor on
0.13 micron process will have over a certain time period. The value is only an estimate, and actual
specifications for future processors may differ.
Multiple VID processors will be shipped either at VID=1.475 V, VID=1.500 V, or VID=1.525 V.
Processors with multiple VID have Icc_max of the highest VID for the specified frequency. For
example for the processors through 2.40 GHz, the Icc-max would be the one at VID=1.525 V.
Table 7. Voltage and Current Specifications
Symbol Parameter Min Typ Max Unit Notes11
VCC
VCC for Processor at
VID=1.475 V:
2 GHz
2.10 GHz
2.20 GHz
2.30 GHz
2.40 GHz
2.50 GHz
2.60 GHz
1.315
1.310
1.310
1.305
1.300
1.300
1.295
Re fe r to Table 8 and
Figure 4 V2, 3, 4, 5, 7
VCC for Processor at
VID=1.500 V:
2 GHz
2.10 GHz
2.20 GHz
2.30 GHz
2.40 GHz
2.50 GHz
2.60 GHz
1.340
1.335
1.335
1.330
1.325
1.325
1.320
VCC for Processor at
VID=1.525 V:
2 GHz
2.10 GHz
2.20 GHz
2.30 GHz
2.40 GHz
2.50 GHz
2.60 GHz
1.370
1.360
1.360
1.355
1.355
1.350
1.345
ICC
ICC for Processor
with Multiple VIDs:
2 GHz 12
2.10 GHz
2.20 GHz
2.30 GHz
2.40 GHz
2.50 GHz
2.60 GHz
43.8
46.4
47.9
49.2
50.7
52.0
53.5
A4, 5, 7, 8, 9,
11
Datasheet 23
Electrical Specifications
NOTES:
1. Unless otherwise noted, all specifications in this table are based on the latest silicon measurement s available
at time of publication.
2. These voltages are targets only. A variable voltage source should exist on systems in the event that a
different voltage is required. See Section 2.4 and Table 3 for more information. The VID bits will set the
maximum VCC with the minimum being defined according to current consumption at that voltage.
3. The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE pins at the
socket with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1 MΩ minimum
impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure that
external noise from the system is not coupled in the scope probe.
4. Refer to Table 8 and Figure 4 for the minimum, typical, and maximum VCC allowed for a given current. The
processor should not be subjected to any VCC and ICC combination wherein VCC exceeds VCC_MAX for a
given current. Moreover, VCC should never exceed the VID volt age. Failure to adhere to this specification
can affect the long term reliability of the processor.
5. VCC_MIN is defined at ICC_MAX.
6. The current specified is also for the AutoHALT State and applies to all frequencies.
7. FMB is the flexible motherboard guideline. These guidelines are estimates based on the data avail able at the
time of publication. FMB2 Guideline is calculated at VID of 1.525V.
8. FMB1 guidelines intend to support both the Celeron processor on 0.13 micron process, and the Celeron
processor in the 478-pin package.
9. The maximum instantaneous current the processor will draw while the thermal control circuit is active as
indicated by the assertion of PROCHOT# is the same as the maximum ICC for the processor.
10.ICC Stop-Grant and ICC Sleep are specif ied at VCC_MAX.
11.These specifications apply to processor with maximum VID setting 1.525 V.
12.Also applies to processors with fixed VID=1.525 V
ISGNT
Islp
ICC Stop-Grant
2 GHz
2.10 GHz
2.20 GHz
2.30 GHz
2.40 GHz
2.50 GHz
2.60 GHz
18
23
23
23
23
23
23
A6, 10, 11
ITCC ICC TCC active ICC A9, 11
ICC PLL ICC for PLL pins 60 mA 11
Table 7. Voltage and Current Specifications
Symbol Parameter Min Typ Max Unit Notes11
Table 8. VCC Static and Transient Tolerance (Sheet 1 of 2)
ICC (A) Vo ltage Deviation from VID Setting (V)1, 2, 3, 4
Maximum Typical Minimum
00.000 –0.025 –0.050
5–0.010 –0.036 –0.062
10 –0.019 –0.047 –0.075
15 –0.029 –0.058 –0.087
20 –0.038 –0.069 –0.099
25 –0.048 –0.079 –0.111
30 –0.057 –0.090 –0.124
35 –0.067 –0.101 –0.136
40 –0.076 –0.112 –0.148
45 –0.085 –0.123 –0.160
24 Datasheet
Electrical Specifications
NOTES:
1. The loadline specifications include both static and transient limits.
2. This table is intended to aid in reading discrete points on the following loadline figure and applies to any VID
setting.
3. The loadlines specify voltage limits at the die measured at VCC_SENSE and VSS_SENSE pins. V oltage
regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS pins. Refer to
the Intel
Pentium
4 Processor VR-Down Design Guidelines for VCC and VSSsocket loadline
specifications and VR implementation details.
4. Adherence to this loadline specification for the Celeron processor on 0.13 micron process is required to
ensure reliable processor operation.
NOTES:
1. The loadline specification includes both static and transient limits.
2. This loadline figure applies to any VID setting. Refer to Table 8 for the specific offsets from VID voltage.
3. The loadlines specify voltage limits at the die measured at VCC_SENSE and VSS_SENSE pins. V oltage
regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS pins. Refer to
the Intel
Pentium
4 Processor VR-Down Design Guidelines, VCC and VSS socket loadline specifications,
and VR implementat ion det ails.
4. Adherence to this loadline specification for the Celeron processor on 0.13 micron process is required to
ensure reliable processor operation.
50 –0.095 –0.134 –0.173
55 –0.105 –0.145 –0.185
60 –0.114 –0.156 –0.197
65 –0.124 –0.166 –0.209
70 –0.133 –0.177 –0.222
Table 8. VCC Static and Transient Tolerance (Sheet 2 of 2)
ICC (A) Voltag e Deviation from VID Setting (V)1, 2, 3, 4
Maximum Typical Minimum
Figure 4. VCC Static and Transient Tolerance
70
60
50
40
ICC (A)
3020100
VID -250 mV
VID -200 m V
VID -150 mV
VID -50 mV
VID -100 m V
VID
VID +50 mV
VCC (V)
VCC
Maximum
VCC
Typical
VCC
Minimum
Datasheet 25
Electrical Specifications
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. Crossing voltage is defined as the instantaneous voltage value when the rising edge of BCLK0 equals the
falling edge of BCLK1.
3. VHavg is the statistical average of the VH measured by the oscilloscope.
4. Overshoot is defined as the absolute value of the maximum voltage.
5. Undershoot is defined as the absolute value of the minimum voltage.
6. Ringback Margin is defined as the absolute voltage difference between the maximum Rising Edge Ringback
and the maximum Falling Edge Ringback.
7. Threshold Region is defined as a region entered around the crossing point voltage in which the differential
receiver switches. It includes input threshold hysteresis.
8. The crossing point must meet the absolute and relative crossing point specifications simult aneously.
9. VHavg can be measured directly using “Vtop” on Agilent scopes and “High” on Tektronix scopes.
10.∆VCROSS is defined as the total variation of all crossing voltages as defined in note 2.
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. VIL is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low value.
3. VIH is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high
value.
4. VIH and VOH may experience excursions above VCC. However, input signal drivers must comply with the
signal quality specifications in this chapter.
5. Refer to processor I/O Buffer Models for I/V characteristics.
6. The VCC referred to in these specifications is the instantaneous VCC.
7. Vol max of 0.450 Volts is guaranteed when driving into a test load of 50 Ω as indicated in Figure 6.
8. Leakage to VSS with pin held at VCC.
9. Leakage to VCC with Pin held at 300 mV.
Table 9. System Bus Differential BCLK Specifications
Symbol Parameter Min Typ Max Unit Fig Notes1
VLInput Low Voltage –0.150 0.000 N/A V8
VHInput High Voltage 0.660 0.710 0.850 V8
VCROSS(abs) Absolute Crossing
Point 0.250 N/A 0.550 V8, 92, 3, 8
VCROSS(rel) Relative Crossing
Point 0.250 +
0.5(VHavg–0.710) N/A 0.550 +
0.5(VHavg–0.710) V8, 92, 3, 8, 9
∆VCROSS Range of Crossing
Points N/A N/A 0.140 V8, 92, 10
VOV Overshoot N/A N/A VH + 0.3 V84
VUS Undershoot –0.300 N/A N/A V85
VRBM Ringb ack Margin 0.200 N/A N/A V86
VTM Threshold Margin VCROSS – 0.100 N/A VCROSS + 0.100 V87
Table 10. AGTL+ Signal Group DC Specifications
Symbol Parameter Min Max Unit Notes1
GTLREF Reference Voltage 2/3 VCC – 2% 2/3 VCC + 2% V
VIH Input High Voltage 1.10*GTLREF VCC V2, 6
VIL Input Low Voltage 0.0 0.9*GTLREF V3, 4, 6
VOH Output High Voltage N/A VCC V 7
IOL Output Low Current N/A 50 mA 6
IHI Pin Leakage High N/A 100 µA 8
ILO Pin Leakage Low N/A 500 µA 9
RON Buffer On Resistance 711 Ω5
26 Datasheet
Electrical Specifications
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. All outputs are open-drain.
3. VIH and VOH may experience excursions above VCC. However, input signal drivers must comply with the
signal quality specifications in Chapter 3.0, “System Bus Signal Quality Specifications”.
4. The VCC referred to in these specifications refers to instantaneous VCC.
5. This specification applies to the asynchronous GTL+ signal group.
6. The maximum output current is based on maximum current handling capability of the buffer and is not
specified into the test load shown in Figure 6.
7. Refer to the processor I/O Buffer Models for I/V characteristics.
8. Vol max of 0.270 Volts is guaranteed when driving into a test load of 50 Ω as indicated in Figure 6 for the
Asynchronous GTL+ signals.
9. Leakage to VSS with pin held at VCC.
10.L eakage to VCC with pin held at 300 mV.
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. All outputs are open-drain.
3. The TAP signal group must comply with the signal quality specifications in Chapter 3.0, “System Bus Signal
Quality Specifications”.
4. Refer to I/O Buffer Models for I/V characteristics.
5. The VCC referred to in these specifications refers to instantaneous VCC.
6. The maximum output current is based on maximum current handling capability of the buffer and is not
specified into the test load shown in Figure 6.
7. V ol max of 0.320 V olts is guaranteed when driving into a test load of 50 Ω as indicated in Figure 6 for the T A P
Signals.
8. VHYS represents the amount of hysteresis, nominally centered about 1/2 VCC for all TAP inputs.
9. Leakage to VSS with pin held at VCC.
10.L eakage to VCC with pin held at 300 mV.
Table 11. Asynchronous GTL+ Signal Group DC Specifications
Symbol Parameter Min Max Unit Notes1
VIH Input High Voltage Asynch GTL+ 1.10*GTLREF VCC V3, 4, 5
VIL Input Low Voltage Asynch. GTL+ 00.9*GTLREF V 5
VOH Output High Voltage N/A VCC V2, 3, 4
IOL Output Low Current N/A 50 mA 6, 8
IHI Pin Leakage High N/A 100 µA 9
ILO Pin Leakage Low N/A 500 µA 10
Ron Buffer On Resistance Asynch GTL+ 711 Ω5, 7
Table 12. PWRGOOD and TAP Signal Group DC Specifications
Symbol Parameter Min Max Unit Notes1
VHYS Input Hysteresis 200 300 mV 8
VT+ Input Low to High
Threshold Vo ltage 1/2*(VCC + VHYS_MIN)1/2*( VCC + VHYS_MAX) V 5
VT- Input High to Low
Threshold Vo ltage 1/2*(VCC – VHYS_MAX)1/2*(VCC – VHYS_MIN) V 5
VOH Output High Voltage N/A VCC V2, 3, 5
IOL Output Low Current N/A 40 mA 6, 7
IHI Pin Leakage High N/A 100 µA 9
ILO Pin Leakage Low N/A 500 µA 10
RON Buffer On Res i stan ce 8.75 13.75 Ω4
Datasheet 27
Electrical Specifications
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. These parameters are not tested and are based on design simulations.
3. See Figure 5 for ITPCLKOUT[1:0] output buffer diagram.
Figure 5. ITPCLKOUT[1:0] Output Buffer Diagram
NOTES:
1. See Table 13 for range of RON.
2. The VCC referred to in this figure is the instantaneous VCC.
3. Refer to the ITP700 Debug Port Design Guide and the Platform Design Guide for the value of Rext.
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. These parameters are not tested and are based on design simulations.
3. Leakage to VSS with pin held at 2.50 V.
Table 13. ITPCLKOUT[1:0] DC Specifications
Symbol Parameter Min Max Unit Notes1
Ron Buffer On Resistance 27 46 Ω2, 3
RON
VCC
Processor Package RTEXT
To Debug Port
Table 14. BSEL [1:0] and VID[4:0] DC Specifications
Symbol Parameter Min Max Unit Notes1
Ron (BSEL) Buffer On Resistance 9.2 14.3 Ω2
Ron (VID) Buffer On Resistance 7.8 12.8 Ω2
IHI Pin Leakage Hi N/A 100 µA 3
28 Datasheet
Electrical Specifications
2.12 AGTL+ System Bus Specifications
Routing topology recommendations can be found in the appropriate Platform Design Guide listed
in Table 1. Termination resistors are not required for most AGTL+ signals because termination
resistors are integrated into th e processo r silico n.
Valid high and low levels are determin ed by the in put b uffers which compare a signal’s voltage
with a reference voltage called GTLREF (known as VREF in previous do cumen tation).
Table 15 lists the GTLREF specifications. The AGTL+ reference voltage (GTLREF) should be
generated on the s ystem board usi n g hi gh precis ion vo ltag e divider ci rcu i ts. It i s impo rtant that t he
system board impedance be held to the specified tolerance, and that the intrinsic trace capacitance
for the AGTL+ signal group traces is known and is well-controlled. For more details on platform
design, see the appropriate Platform Design Guide listed in Table 1.
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. The tolerances for this specification have been stated generically to enable the system designer to calculate
the minimum and maximum values across the range of VCC.
3. GTLREF should be generated from VCC by a voltage divider of 1% tolerance resistors, or 1% tolerance
matched resistors. Refer to the appropriate Platform Design Guide listed in Table 1 for implementation
details.
4. RTT is the on-die termination resistance measured at VOL of the AGTL+ output driver. Refer to processor I/O
buffer models for I/V characteristics.
5. COMP resistance must be provided on the system board with 1% tolerance resistors. See the appropriate
Platform Design Guide for implementation details.
6. The VCC referred to in these specifications is the instantaneous VCC.
Table 15. AGTL+ Bus Voltage Definitions
Symbol Parameter Min Typ Max Units Notes1
GTLREF Bus Reference V olt age 2/3 VCC – 2% 2/3 VCC 2/3 VCC + 2% V2, 3, 6
RTT Termination Resistance 45 50 55 Ω4
COMP[1:0] COMP Resistance 50.49 51 51.51 Ω5
Datasheet 29
Electrical Specifications
2.13 System Bus AC Specifications
The processor system bus timings specified in this section are defined at the processor silicon.
See Chapter 5.0 for the Celeron processor on 0.13 micron process pin signal definitions.
Table 16 through Table 21 list the AC specifications associated with the processor system bus. All
AGTL+ t imings are referenced to GTLREF for both ‘0 ’ and ‘1’ log ic leve ls unl ess otherwi se
specified.
AGTL+ layout guidelines are available in the appropriate Platform Design Guide (see Table 1).
Care should be taken to read all notes associated with a particular timing parameter.
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. The period specified here is the average period. A given period may vary from this specification as governed
by the period stability specification (T2).
3. For the clock jitter specification, refer to the CK408 Clock Design Guidelines.
4. In this context, period stability is defined as the worst case timing diff erence between successive crossover
voltages. In other words, the largest absolute difference between adjacent clock periods must be less than
the period stability.
5. Slew rate is measured between the 35% and 65% point s of the clock swing (VL to VH).
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. Not 100% tested. Specified by design characterization.
3. All common clock AC timings for AGTL+ signals are referenced to the Crossing Voltage (VCROSS) of the
BCLK[1:0] at rising edge of BCLK0. All common clock AG TL+ signal timings are referenced at G TLREF at the
processor core.
4. Valid delay timings for these signals are specified into the test circuit described in Figure 6 and with GTLREF
at 2/3 VCC ± 2%.
5. S pecification is for a minimum swing defined between AG TL+ VIL_MAX to VIH_MIN. This assumes an edge rate
of 0.4 V/ns to 4.0 V/ns.
6. RESET# can be asserted asynchronously, but must be deasserted synchronously.
7. This should be measured after VCC and BCLK[1:0] become stable
8. Maximum specification applies only while PWRGOOD is asserted.
.
Table 16. System Bus Differential Clock Specifications
T# Parameter Min Nom Max Unit Figure Notes1
System Bus Frequency 100 MHz
T1: BCLK [1 :0] Perio d 10.0 10.2 ns 82
T2: BCLK[1:0] Period Stability 200 ps 3, 4
T3: BCLK [1 :0] High Time 3.94 56.12 ns 8
T4: BCLK [1 :0] Low Time 3.94 56.12 ns 8
T5: BCLK [1:0] Ri se Time 175 700 ps 85
T6: BCLK[1 :0] Fall Time 175 700 ps 85
Table 17. System Bus Common Clock AC Specifications
T# Parameter Min Max Unit Figure Notes1,2,3
T10: Common Clock Output Valid Delay 0.12 1.27 ns 10 4
T11: Common Clock Input Setup Time 0.65 ns 10 5
T12: Common Clock Input Hold Time 0.40 ns 10 5
T13: RESET# Pulse Width 110 ms 11 6, 7, 8
30 Datasheet
Electrical Specifications
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies and cache sizes.
2. Not 100% tested. Specified by design characterization.
3. All source synchronous AC timings are referenced to their associated strobe at GTLREF. Source
synchronous data signals are referenced to the falling edge of their associated data strobe. Source
synchronous address signals are referenced to the rising and falling edge of their associated address strobe.
All source synchronous AGTL+ signal timings are referenced to GTLREF at the processor core.
4. Unless otherwise noted, these specifications apply to both data and address timings.
5. Valid delay timings for these signals are specified into the test circuit described in Figure 6 and with GTLREF.
6. S pecification is for a minimum swing defined between AG TL+ VIL_MAX to VIH_MIN. This assumes an edge rate
of 0.3 V/ ns to 4.0 V/ns.
7. All source synchronous signals must meet the specified setup time to BCLK as well as the setup time to each
respective str obe.
8. This specification represents the minimum time the data or address will be valid before its strobe. Refer to the
appropriate Platform Design Guide listed in Table 1 for more information on the definitions and use of these
specifications.
9. This specification represents the minimum time the data or address will be valid after its strobe. Refer to the
appropriate Platform Design Guide listed in Table 1.
10.The rising edge of ADSTB# must come approximat ely 1/2 BCLK period (5 ns) after the falling edge of
ADSTB#.
11.For this timing parameter , n = 1, 2, and 3 for the second, third, and last data strobes respectively.
12.The second data strobe (falling edge of DSTBn#) must come approximately 1/4 BCLK period (2.5 ns) after
the first falling edge of DSTBp#. The third data strobe (falling edge of DSTBp#) must come approximately
2/4 BCLK period (5 ns) after the first falling edge of DSTBp#. The last data strobe (falling edge of DSTBn#)
must come approximately 3/4 BCLK period (7.5 ns) after the first falling edge of DSTBp#.
13.This spec ificat ion applies only to DSTBN[3:0]# and is measured to the second falling edge of the strobe.
Table 18. System Bus Source Synch AC Specifications AGTL+ Signal Group
T# Parameter Min Typ Max Unit Figure Notes1, 2, 3, 4
T20: Source Synchronous Data Output
Valid Delay (first data/address
only) 0.20 1.20 ns 12, 13 5
T21: TVBD: Source Synchronous Data
Output Valid Before Strobe 0.85 ns 13 5, 8
T22: TVAD: Source Synchronous Data
Output Valid Af ter Strobe 0.85 ns 13 5, 8
T23: TVBA: Source Synchronous
Address Output Valid Before
Strobe 1.88 ns 12 5, 8
T24: TVAA: Source Synchronous
Address Output Valid After Strobe 1.88 ns 12 5, 9
T25: TSUSS: Source Synchronous Input
Setup Time to Strobe 0.21 ns 12, 13 6
T26: THSS: Source Synchronous Input
Hold Time to Strobe 0.21 ns 12, 13 6
T27: TSUCC: Source Synchronous Input
Setup Time to BCLK[1:0] 0.65 ns 12, 13 7
T28: TFASS: First Address Strobe to
Second Address Strobe 1/2 BCLK 12 10
T29: TFDSS: First Data Strobe to
Subsequent Strobes n/4 BCLK 13 11, 12
T30: Data Strobe ‘n’ (DSTBN#) Output
valid Delay 8.80 10.20 ns 13 13
T31: Address Strobe Output Valid
Delay 2.27 4.23 ns 12
Datasheet 31
Electrical Specifications
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. All AC timings for the Asynch GTL+ signals are referenced to the BCLK0 rising edge at Crossing Voltage. All
Asynch GTL+ signal timings are referenced at GTLREF. PWRGOOD is referenced to the BCLK0 rising edge
at 0.5 * VCC.
3. These signals may be driven asynchronously.
4. Refer to the PWRGOOD definition for more details regarding the behavior of this signal.
5. Length of assertion for PROCHOT# does not equal internal clock modulation time. Time is allocated aft er the
assertion and before the deassertion of PROCHOT# for the processor to complete current instruction
execution.
6. See Section 7.2 for additional timing requirements for entering and leaving the low power states.
NOTES:
1. Before the deassertion of RESET#.
2. After clock that deasserts RESET#.
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. Not 100% tested. Specified by design characterization.
3. All AC timings for the TAP signals are referenced to the TCK signal at 0.5*VCC at the processor pins. All TAP
signal timings (TMS, TDI, etc) are referenced at 0.5*VCC at the processor pins.
4. Rise and fall times are measured from the 20% to 80% points of the signal swing.
5. Referenced to the rising edge of TCK.
6. Referenced to the falling edge of TCK.
7. Specifications for a minimum swing defined between TAP VT- to VT+. This assumes a minimum edge rate of
0.5 V/ns.
8. TRST# must be held asserted for 2 TCK periods to be guaranteed that it is recognized by the processor.
9. It is recommended that TMS be asserted while TRST# is being deasserted.
Table 19. Miscellaneous Signals AC Specifications
T# Parameter Min Max Unit Figure Notes1, 2, 3, 6
T35: Asynch GTL+ Input Pulse Width 2BCLKs
T36: PWRGOOD to RESET# deassertion time 110 ms 14
T37: PWRGOOD Inactive Pulse Width 10 BCLKs 14 4
T38: PROCHOT# pulse widt h 500 µs15 5
T39: THERMTRIP# to VCC Removal 0.5 s17
T40: FERR# Valid Delay from STPCLK# deassert ion 0 5 BCLKs Section 3.0
Table 20. System Bus AC Specifications (Reset Conditions)
T# Parameter Min Max Unit Figure Notes
T45: Reset Configuration Signals (A[31:3]#,
BR0#, INIT#, SMI#) Setup Time 4BCLKs 11 1
T46: Reset Configuration Signals (A[31:3]#,
BR0#, INIT#, SMI#) Hold Time 220 BCLKs 11 2
Table 21. TAP Signals AC Specifications
Parameter Min Max Unit Figure Notes1, 2, 3
T55: TCK Period 60.0 ns 7
T56: TCK Rise Time 10.0 ns 74
T57: TCK Fall Time 10.0 ns 74
T58: TMS Rise Time 8.5 ns 74
T59: TMS Fall Time 8.5 ns 74, 9
T61: TDI Setup Time 0ns 20 5, 7
T62: TDI Hold Time 3ns 20 5, 7
T63: TDO Clock to Output Delay 3.5 ns 20 6
T64: TRST# Assert Time 2TCK 16 8, 9
32 Datasheet
Electrical Specifications
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. These parameters are not tested and are based on design simulations.
3. This delay is from rising edge of BCLK0 to the falling edge of ITPCLK0.
2.14 Processor AC Timing Waveforms
The following figures are used in conjunction with the AC timing tables, Table 16 through
Table 21.
Note: For Figure 7 through Figure 16, the following apply:
1. All common clock AC timings for AGTL+ signals are referenced to the Crossing Voltage
(VCROSS) of the BCLK[1:0] at rising edge of BCLK0. All common clock AGTL+ signal
timings are referenced at GTLR EF at the processor core.
2. All source synchronous AC timings for AGTL+ signals are referenced to their associated
strobe (address or data) at GTLREF. Source synchronous data signals are referenced to the
falling edge of their associated data strobe. Source synchronous add ress signals are referenced
to the rising and falling edge of their associated address strobe. All source synchronous
AGTL+ signal timings are referenced at GTLREF at the processor core silicon.
3. All AC timings for AGTL+ strobe signals are referenced to BCLK[1:0] at VCROSS. All
AGTL+ strobe signal timings are referenced at GTLREF at the processor core silicon.
4. All AC timings for the TAP signals are referenced to the TCK signal at 0.5*VCC at the
processor pins. All TAP signal timings (TMS, TDI, etc) are referenced at 0.5*VCC at the
processor pins .
The circuit used to test the AC specifications is shown in Figure 6.
Table 22. ITPCLKOUT[1:0] AC Specifications
Parameter Min Typ Max Unit Figure Notes 1, 2
T65: ITPCLKOUT Delay 400 560 ps 3
T66: Slew Rate 2 8 V/ns
T67: ITPCLKOUT[1:0] High Time 3.89 56.17 ns
T68: ITPCLKOUT[1:0] Low Time 3.89 56.17 ns
Figure 6. AC Test Circuit
420 mils, 50 Ω, 169 ps/in. 2.4 nH
1.2 pF
Rload = 50 Ω
AC Timings test measurements
made here.
VCC
VCC
Datasheet 33
Electrical Specifications
Figure 7. TCK Clock Waveform
tr = T56, T58 (Rise Time)
tf = T57, T59 (Fall Time)
tp = T55 (TCK Period)
80% 50%
20%
Figure 8. Differential Clock Waveform
Crossing
Voltage
Threshold
Region
VH
VL
Overshoot
Undershoot
Ringback
Margin
Rising Edge
Ringback
Falling Edge
Ringback,
BCLK0
BCLK1
Crossing
Voltage
Tph
Tpl
Tp
Tp = T1 (BCLK[1:0] period)
T2 = BCLK[1:0] Period stability (not shown)
Tph =T3 (BCLK[1:0] pulse high time)
Tpl = T4 (BCLK[1:0] pulse low time)
T5 = BCLK[1:0] rise time through the threshold region
T6 = BCLK[1:0] fall time through the threshold region
34 Datasheet
Electrical Specifications
Figure 9. Differential Clock Crosspoint Specification
660 670 680 690 700 710 720 730 740 750 760 770 780 790 800 810 820 830 840 850
Vhavg (mV)
250 + 0. 5(VHavg – 710 )
250 m V
200
250
300
350
400
450
500
550
600
650
Cross ing Point (mV)
550 + 0.5(VHavg – 710)
550 mV
Figure 10. System Bus Common Clock Valid Delay Timings
BCLK0
BCLK1
Common Clock
Signal (@ driver)
Common Clock
Signal (@ receiver)
T0 T1 T2
T
Q
T
R
valid valid
valid
T
P
TP = T10: TCO (Data Valid Output Delay)
TQ = T11: TSU (Common Clock Setup)
TR = T12: TH (Common Clock Hold Time)
Datasheet 35
Electrical Specifications
Figure 11. System Bus Reset and Configuration Timings
Figure 12. Sou rce Synchronous 2X (Address) T imings
BCLK
Reset
Configuration
A[31:3], SMI#,
INIT#, BR[3:0]#
Valid
Tv = T13 (RESET# Pulse Width)
Tw = T45 (Reset Configuration Signals Setup TIme)
Tx = T46 (Reset Configuration Signals Hold TIme)
Tx
Tv
Tt
Tw
T
J
BCLK0
BCLK1
ADSTB# (@ driver)
A# (@ driver)
A# (@ receiver)
ADSTB# (@ receiver)
T1 T2
2.5 ns 5.0 ns 7.5 ns
T
H
T
H
T
J
T
N
T
K
T
M
valid valid
valid
valid
T
H
= T23: Source Sync. Address Output Valid Before Address Strobe
T
J
= T24: Source Sync. Address Output Valid After Address Strobe
T
K
= T27: Source Sync. Input Setup to BCLK
T
M
= T26: Source Sync. Input Hold Time
T
N
= T25: Source Sync. Input Setup Time
T
P
= T28: First Address Strobe to Second Address Strobe
T
S
= T20: Source Sync. Output Valid Delay
T
R
= T31: Address Strobe Output Valid Delay
T
P
T
R
T
S
36 Datasheet
Electrical Specifications
Figure 13. Source Synchronous 4X Timings
BCLK0
BCLK1
DSTBp# (@ driver)
DSTBn# (@ driver)
D# (@ driver)
D# (@ receiver)
DSTBn# (@ receiver)
DSTBp# (@ receiver)
T0 T1 T2
2.5 ns 5.0 ns 7.5 ns
T
A
T
A
T
B
T
C
T
E
T
E
T
G
T
G
T
D
T
A
= T21: Source Sync. Data Output Valid Delay Before Data Strobe
T
B
= T22: Source Sync. Data Output Valid Delay After Data Strobe
T
C
= T27: Source Sync. Setup Time to BCLK
T
D
= T30: Sour ce Sync. Data Strobe 'N' (DSTBN#) Outpu t Valid Delay
T
E
= T25: Source Sync. Input Setup T ime
T
G
= T26: Source Sync. Input Ho ld Time
T
H
= T29: First Data Strobe to Subsequ ent Strobes
T
J
= T20: Source Sync. Data Output Valid Delay
T
J
T
H
Datasheet 37
Electrical Specifications
NOTE: VID_GOOD is not a processor signal. This signal is routed to the output enable pin of the voltage
regulator control silicon. For more information on implementation refer to the Processor Platform Design
Guide.
NOTES:
1. This timing diagram is not intended to show specific times. Instead a general ordering of events with respect
to time should be observed.
2. When VCCVID is less than 1V, VID_GOOD must be low.
3. Vcc must be disabled before VID[4:0] becomes invalid.
NOTE: VID_GOOD is not a processor signal. This signal is routed to the output enable pin of the voltage
regulator control silicon. For more information on implementation refer to the Processor Platform Design
Guide.
Figure 14. Power Up Sequence
BCLK
Vcc
PWRGOOD
RESET#
VCCVID
VID_GOOD
VID[4:0]
Tc Td
Ta= 1ms minimum (VCCVID > 1V to VID_GOOD high)
Tb= 50ms maximum (VID_GOOD to Vcc valid maximum time)
Tc= T37 (PWRGOOD inactive pulse width)
Td= T36 ( PWRGOOD to RESET# de-assertion time)
Ta Tb
Figure 15. Power Down Sequence
Vcc
PWRGOOD
VCCVID
VID_GOOD
VID[4:0]
38 Datasheet
Electrical Specifications
Figure 16. Tes t Reset Timings
V
T
q
TqT64 (TRST# Pulse Width), V=0.5*Vcc
T38 (PROCHOT# Pulse Width), V=GTLREF
=
Figure 17. THERMTRIP# Power Down Sequence
Figure 18. ITPCLKOUT Valid Delay Timing
THERMTRIP#
Vcc
T39
T39 < 0.5 seconds
Note: THERMTRIP# driver is inactive when RESET# is active
BCLK
ITPCLKOUT
Tx = T65 = BCLK input to ITPCLKOUT output delay
Tx
Datasheet 39
Electrical Specifications
Figure 19. FERR#/PBE# Valid Delay Timing
BCLK
STPCLK#
system bus
FERR#/PBE#
SG
Ack
FERR# undefined FERR#
Ta
PBE# undefined
Ta = T40 (FERR# Valid Delay from STPCLK# Deassertion)
Note: FERR# / PBE# is undefined from STPCLK# assertion until the stop grant acknowledge is driven on the processor system bus.
FERR# / PBE# is also undefined for a period of Ta from STPCLK# deassertion. Inside these undefined regions the PBE# signal
is driven. FERR# is driven at all other times.
Figure 20. TAP Valid Delay Timing
V Valid
Signal
TCK
ThTs
Tx
Tx = T 63 (Valid Time)
Ts = T61 (Setup Time)
Th = T62 (H old Time)
V = 0.5 * Vcc
V
40 Datasheet
Electrical Specifications
This page is intentionally left blank.
Datasheet 41
System Bus Signal Quality Specifications
3.0 System Bus Signal Quality Specifications
Source synchronous data transfer requires the clean reception of data signals and their associated
strobes. Ringing below receiver thresholds, non -mon oton ic signal edges, and excessive voltage
swing will adversely affect system timings. Ringback and signal non-monotinicity cannot be
tolerated since these phenomena may inadvertently advance receiver state machines. Excessive
signal swings (overshoot and undershoot) are detrimental to silicon gate oxide integrity, and can
cause device failure if absolute voltage limits are exceeded. Additio nal ly, overshoot and
undershoot can cause timing degradation due to the build up of inter-symbol interference (ISI)
effects. For these reasons, it is important that the designer work to achieve a solution that provides
acceptable signal quality across all systematic variations encountered in volume manufacturing.
This section documents sig nal quality metrics used to derive topology and routing guidelines
through simulation and for interpreting results for signal quality measurements of actual designs .
3.1 System Bus Clock (BCLK) Signal Quality Specificati o ns
Table 23 describes the signal quality specifications at the processor core silicon for the processor
system bus clock (BCLK) signals. Figure 21 describes the signal quality waveform for the system
bus clock at the processor core silicon.
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Celeron processor on 0.13 micron process
frequencies.
2. The rising and falling edge ringback voltage specified is the minimum (rising) or maximum (falling) absolute
voltage the BCLK signal can dip back to after passing the VIH (rising) or VIL (falli ng) voltage limit s. This
specification is an absolute value.
Table 23. BCLK Signal Quality Specifications
Parameter Min Max Unit Figure Notes1
BCL K [1 :0] Oversh oot N/A 0.30 V21
BCLK[1:0] Undersh oot N/A 0.30 V21
BCLK[1:0] Ringback Ma rgin 0.20 N/A V21 2
BCLK[1:0] Threshold Region N/A 0.10 V21
Figure 21. BCLK Signal Integrity Waveform
Crossing
Voltage
Threshold
Region
VH
VL
Overshoot
Undershoot
Ringback
Margin
Rising Edge
Ringback
Falling Edge
Ringback,
BCLK0
BCLK1
Crossing
Voltage
42 Datasheet
System Bus Signal Quality Specifications
3.2 System Bus Signal Qualit y Specifications and
Measurement Guidelines
Various scenarios have been simulated to generate a set of AGTL+ layout guidelines that are
available in the Platform Design Guideline.
Table 24 provides the signal quality specifications for all processor signals for use in simulating
signal quality at the processor core silicon. The Celeron processor on 0.13 micron process
maximum allowable overshoot and undershoot specifications are provided in Table 26 through
Table 29. Figure 22 shows the system bus ringback tolerance for low-to-high transitions, and
Figure 23 shows ringback tolerance for high-to-low transitions.
NOTES:
1. All signal integrity specifications are measured at the processor silicon.
2. Unless otherwise noted, all specifications in this table apply to all Celeron processor on 0.13 micron process
frequencies.
3. Specifications are for the edge rate of 0.3 – 4.0 V/ns.
4. All values specified by design characterization.
5. See Section 3.3 for maximum allowable overshoot duration.
6. Ringback between GTLREF + 10% and GTLREF – 10% is not supported.
7. Intel recomm ends that simulations not exceed a ringback value of GTLREF ± 200 mV to allow margin for
other sources of system noise.
NOTES:
1. All signal integrity specifications are measured at the processor silicon.
2. Unless otherwise noted, all specifications in this table apply to all Celeron processor on 0.13 micron process
frequencies.
3. See Section 3.3 for maximum allowable overshoot.
4. See Section 2.11 for the DC specifications.
Table 24. Ringback Specifications for AGTL+ and Asynchronous GTL+ Signals Groups
Signal Group Transition Maximum Ringback
(with Input Diodes Present) Unit Figure Notes
All Signals 0 → 1 GTLREF + 10% V22 1, 2, 3, 4, 5, 6, 7
All Signals 1 → 0 GTLREF – 10% V23 1, 2, 3, 4, 5, 6, 7
Table 25. Ringback Specifications for PWRGOOD Input and TAP Signal Group
Signal Group Transition Maximum Ringback
(with Input Diodes Present) Unit Figure Notes
TAP and PWRGOOD 0 → 1 Vt+(max) TO Vt-(max) V24 1, 2, 3, 4
TAP and PWRGOOD 1 → 0 Vt-(min) TO Vt+(min) V25 1, 2, 3, 4
Datasheet 43
System Bus Signal Quality Specifications
Figure 22. Low-to-High System Bus Receiver Ringback Tolerance
GTLREF
VCC
Noise
Margin
+10% GTLREF
-10% GTLREF
VSS
Figure 23. High-to-Low System Bus Receiver Ringback Tolerance
Noise
Margin
GTLREF
+10% GTLREF
-10% GTLREF
VCC
VSS
44 Datasheet
System Bus Signal Quality Specifications
Figure 24. Low-to-High System Bus Receiver Ringback Tolerance for PWRGOOD
and TAP Buffers
0.5 * Vcc
Vt+ (min)
Vt+ (max)
Vt- (max)
Vcc
Allowable Ringback
Vss
Threshold Region to switch
receiver to a logic 1.
Figure 25. High-to-Low System Bus Receiver Ringback Tolerance for PWRGOOD
and TAP Buffers
0.5 * Vcc
Vt+ (min)
Vt- (max)
Vcc
Vss
Vt- (min)
Threshold Region to switch
receiver to a logic 0.
Allow a ble Ri ng ba ck
Datasheet 45
System Bus Signal Quality Specifications
3.3 System Bus Signal Quality Specifications and
Measurement Guidelines
3.3.1 Overshoot/Undershoot Guidelines
Overshoot (or undershoot) is the absolute value of the maximum voltage above the nominal high
voltage (or below VSS) as shown in Figure 26. The overshoot guideline lim its transitions beyond
VCC or VSS because of the fast signal edge rates. The processor can be damaged by repeated
overshoot or undershoot events on any input, output, or I/O buffer if the charge is large enough
(i.e., if the over/undershoot is great enough). Determining the impact of an overshoot/undershoot
condition requires knowledge of the magnitu de, the pulse direction, and the activity factor (AF).
Permanent damage to the processor is the likely result of excessive overshoot/undershoot.
When performi n g si mu la tio ns to deter mi ne impact of overs ho ot and undershoot, ESD dio des must
be properly char acterized. ESD protection diod es do not act as voltage clamps an d will not provide
overshoot or undershoot protection. ESD diodes modeled within Intel I/O buffer models do not
clamp undershoot or overshoot, and will yield correct simulation results. If other I/O buffer m odels
are being used to ch aracterize the Celero n pr oces so r on 0.1 3 micr on pro cess system bus, car e mus t
be taken to ensure that ESD models do not clamp extreme voltage levels. Intel I/O buffer models
also contain I/O capacitance characterization. Therefore, removing the ESD diodes from an I/O
buffer model will impact results and may yield excessive overshoot/undershoot.
3.3.2 Overshoot/Undershoot Magnitude
Magnitude describes the maximum potential difference between a signal and its voltage reference
level. For the Celeron processor on 0.13 micro n process, both are referenced to VSS. It is import ant
to note that overshoot and undershoot conditions are separate, and their impact must be determined
independently.
Overshoot/undershoot magnitude levels must observe the absolute maximum specifications listed
in Table 26 through Table 29. These specifications must not be violated at any time regardless of
bus activity or system state. Within these specifications are threshold levels that define different
allowed pulse durations. Provided that the magnitude of the overshoot/undershoot is within the
absolute maximum specifications, the pulse magnitude, duration and activity factor must all be
used to determine whether the overshoot/undershoot pulse is within specifications.
3.3.3 Overshoot/Undershoot Pulse Duration
Pulse duration describes the total time an overshoot/undershoot event exceeds the overshoot/
undershoot reference voltage (maximum overshoot = 1.800 V, maximum undershoot = -0.335 V).
The total time could encompass several oscillations above the reference voltage. Multiple
overshoot/undershoot pulses within a single overshoot/undershoot event may have to be measured
to determine the total pulse duration.
Note: Oscillations below the reference voltage can not be subtracted from the total overshoot/undershoot
pulse dur ation.
46 Datasheet
System Bus Signal Quality Specifications
3.3.4 Activity Factor
Activity Factor (AF) describes the frequency of overshoot (or undershoot) occurrence relative to a
clock. Since the highest frequency of assertion of any signal is every other clock, an AF = 1
indicates that the specific overshoot (or undershoot) waveform occurs EVERY OTHER clock
cycle. Thus, an AF = 0.01 indicates that the specific overshoot (or undershoot) waveform occurs
one time in every 200 clock cycles.
For source synchronous signals (address, data, and associated strobes), the activity factor is in
reference to the strobe edge because the highest frequency of assertion of any source synchronous
signal is every active edge of its associated strobe. An AF = 1 indicates that the specific overshoot
(undershoot) waveform occurs every strobe cycle.
The specifications provided in Table 26 through Table 29 show the maximum pulse duration
allowed for a giv en overshoot/undershoo t magnitude at a specific activity factor. Each table entry is
independent of all others, meaning that the pulse duration reflects the existence of overshoot/
undershoot events of that magnitu de ONLY. A platform with an overshoot/undershoot that just
meets the pulse duration for a specific magnitude where the AF < 1, means that there can be no
other overshoot/undershoot events, even of lesser magnitude (note that if AF = 1, then the event
occurs at all times and no other events can occur).
Notes:
1. Activity factor for AGTL+ signals is referenced to BCLK[1:0] frequency.
2. Activity factor for source synchronous (2X) signals is referenced to ADSTB[1:0]#.
3. Activity factor for source synchronous (4X) signals is referenced to DSTBP[3:0]# and
DSTBN[3:0]#.
3.3.5 Reading Overshoot/Undershoot Specification Tables
The overshoot/undershoot specification for the Celeron processor on 0.13 micron process is not a
simple single value. Many factors are needed to determine what the over/undershoot specification
is. In addition to the magnitude of the overshoot, the following parameters must also be known: the
width of the overshoot (as measured above VCC), and the activity factor (AF). To determine the
allowed overshoot for a particular overshoot event, the following must be done:
1. Determine the VID voltage, System Bus speed, and signa l group that a particular signal falls
into and use the appropriate table.
2. Determine the magnitude of the overshoot (relative to VSS).
3. Determine the acti v it y fact or (how often does this overshoot occur?).
4. Next, from the appropriate specification table, determine the maximum pulse duration (in
nanoseconds) allowed.
5. Compare the specified maximum pulse duration to the signal being measured. If the pulse
duration measured is les s th an the p uls e duration sh own in the table, then the signal meets the
specifications.
The above procedure is similar for undershoot after the undershoot waveform has been converted
to look like an overshoot. Undershoot events must be analyzed separately from overshoot events
because the two are mutually exclusive.
Datasheet 47
System Bus Signal Quality Specifications
3.3.6 Conformance Determination to Overshoot/Undershoot
Specifications
The overshoot/undershoot specifications listed in the following tables specify the allowable
overshoot/undershoot for a single overshoot/undershoot event. However, most systems will have
multiple overshoot and/or undershoot events, and each has its own set of parameters (duration, AF
and magnitude). While each overshoot on its own may meet the overshoot specification, when you
add the total impact of all overshoot events, the system may fail. The following are guidelines to
ensure that a system passes the overshoot and undershoot specifications:.
1. Ensure no signal ever exceeds VCC or –0.25 V
– OR –
2. If only one ov ershoot/ under shoot ev ent mag nitude occurs, ensure it meets the ov er/unders hoot
specifications in the following tables
– OR –
3. If multiple overshoots and/or multiple undershoots occur, measure the worst case pulse
duration for each magn itude and co mpare the results agains t the AF = 1 specifications . If all of
these worst case overshoot or undershoot events meet the specifications
(measured time < specifications) in the table (where AF=1), then the system passes.
The following notes apply to Table 26 through Table 29.
1. Absolute Maximum Overshoot magnitude of 1.80 V must never be exceeded.
2. Absolute Maximum Overshoot is measured relative to VSS, and Pulse Duration of overshoot
is measured relative to VCC.
3. Absolute Maximum Undershoot and Pulse Duration of undershoot is measured relative to
VSS.
4. Ringback below VCC can not be subtracted from overshoots/undershoots.
Lesser undershoot does not allocate longer or larger overshoot.
5. OEMs are strongly encouraged to follow the Intel provided layout guidelines.
6. All values are specified by design characterization.
NOTES:
1. These specifications are measured at the processor core silicon.
2. BCLK period is 10 ns.
Table 26. 1.525V VID Source Synchronous (400 MHz) AGTL+ Signal Group Overshoot/
Undershoot Tolerance
Absolute
Maximum
Overshoot
(V)
Absolute
Maximum
Undershoot
(V)
Pulse
Duration (ns)
AF = 1
Pulse
Duration (ns)
AF = 0.1
Pulse
Dura tion (ns)
AF = 0.01 Notes 1, 2
1.800 –0.310 0.01 0.15 1.59
1.750 –0.260 0.01 0.43 4.59
1.700 –0.210 0.02 1.22 5.00
1.650 –0.160 0.05 3.56 5.00
1.600 –0.110 0.14 5.00 5.00
1.550 –0.06 0.63 5.00 5.00
48 Datasheet
System Bus Signal Quality Specifications
NOTES:
1. These specifications are measured at the processor core silicon.
2. BCLK period is 10 ns.
NOTES:
1. These specifications are measured at the processor core silicon.
2. BCLK period is 10 ns.
NOTES:
1. These specifications are measured at the processor core silicon.
2. BCLK period is 10 ns.
Table 27. 1.525 V VID Source Synchronous (200 MHz) AGTL+ Signal Group Overshoot/
Undershoot Tolerance
Absolute
Maximum
Overshoot
(V)
Absolute
Maximum
Undershoot
(V)
Pulse
Duration (ns)
AF = 1
Pulse
Duration (ns)
AF = 0.1
Pulse
Duration (ns)
AF = 0.01 Notes 1,2
1.800 –0.310 0.02 0.24 2.44
1.750 –0.260 0.03 0.26 2.63
1.700 –0.210 0.03 0.32 3.19
1.650 –0.160 0.11 1.05 10.00
1.600 –0.110 0.28 10.00 10.00
1.550 –0.060 1.25 10.00 10.00
Table 28. 1.525 V VID Common Clock (100 MHz) AGTL+ Signal Group Overshoot/
Undershoot Tolerance
Absolute
Maximum
Overshoot
(V)
Absolute
Maximum
Undershoot
(V)
Pulse
Duration (ns)
AF = 1
Pulse
Duration (ns)
AF = 0.1
Pulse
Duration (ns)
AF = 0.01 Notes 1, 2
1.800 –0.310 0.05 0.49 4.89
1.750 –0.260 0.05 0.53 5.26
1.700 –0.210 0.06 0.64 6.38
1.650 –0.160 .21 2.09 20.00
1.600 –0.110 0.56 20.00 20.00
1.550 –0.060 2.49 20.00 20.00
Table 29. 1.525 V VID Asynchronous GTL+, PWRGOOD Input, and TAP Signal Group
Overshoot/Undershoot Tolerance
Absolute
Maximum
Overshoot
(V)
Absolute
Maximum
Undershoot
(V)
Pulse
Duration (ns)
AF = 1
Pulse
Duration (ns)
AF = 0.1
Pulse
Duration (ns)
AF = 0.01 Notes 1, 2
1.800 –0.310 0.15 1.47 14.67
1.750 –0.260 0.16 1.58 15.79
1.700 –0.210 0.19 1.91 19.14
1.650 –0.160 0.63 6.27 60.00
1.600 –0.110 1.67 60.00 60.00
1.550 –0.060 7.48 60.00 60.00
Datasheet 49
System Bus Signal Quality Specifications
Figure 26. Maximum Acceptable Overshoot/Undershoot Waveform
Maximum
Absolute
Undershoot
Time-dependent
Overshoot
Maximum
Absolute
Overshoot
GTLREF
VMAX
VCC
VOL
VSS
VMIN
50 Datasheet
System Bus Signal Quality Specifications
This page is intentionally left blank.
Datasheet 51
Package Mechanical Specifications
4.0 Package Mechanical Specifications
The Celeron processor on 0.13 micron process is packaged in a Flip-Chip Pin Grid Array (FC-
PGA2) package. Components of the package include an integrated heat spreader (IHS), processor
die, and the substrate that is th e pin carrier. Mechanical specif ications for the proces sor are given in
this section. See Section 1.1. for a listing of terminology. The processor socket that accepts the
Celeron processor on 0.13 micron process is referred to as a 478-Pin micro PGA (mPGA478B)
socket. See the Intel
Pentium
4 Processor 478-pin Socket (mPGA478B) Design Guidelines for
complete details on the mPG A478 B socket.
Note: The following notes apply to F igure 27 through Figure 34:
1. Unless otherwise specified, the following drawings are dimensioned in millimeters.
2. Figures and drawings labeled as “Reference Dimensions” are provided for informational
purposes only. Reference dimensions are extracted from the mechanical design database and
are nominal dimensions with no tolerance information applied. Reference dimensions are not
checked as part of the processor manufacturing process. Unless noted as such, dimensions in
parentheses without tolerances are reference dimensions.
3. Drawings are not to scale.
Note: Figure 27 is not to scale and is for reference only. The socket and system board are supplied as a
reference only.
Figure 27. Exploded View of Processor Components on a System Board
S
y
stem board mPGA478B
31 mm
Heat Spreader
Substrate
35mm square
3.5mm 2.0mm
478 p ins
Socket
52 Datasheet
Package Mechanical Specifications
Figure 28. Processor Package
Table 30. Description Table for Processor Dimensions
Code Letter Dimension (mm) Notes
Min Nominal Max
A1 2.266 2.378 2.490
A2 0.980 1.080 1.180 Processors with CPUID = 0xF29 have
a nominal dimension of 0.990 mm
(± 0.10 mm)
B1 30.800 31.000 31.200
B2 30.800 31.000 31.200
C1 33.000 Includes Placement Tolerance
C2 33.000 Includes Placement Tolerance
D34.900 35.000 35.100
D1 31.500 31.750 32.000
G1 13.970 Keep-In Zone Dimension
G2 13.970 Keep-In Zone Dimension
G3 1.250 Keep-In Zone Dimension
H1.270
L1.950 2.030 2.110
φP0.280 0.305 0.330
PIN TP 0.254 Diamet ric True Position (Pin-to-Pin)
IHS Flatness 0.05
Datasheet 53
Package Mechanical Specifications
Figure 29 shows the keep-in specification for pin-side components. The Celeron processor on
0.13 micron process may contain pin side capacitors mounted to the processor package.
Figure 31 shows the flatness and tilt specifications for the IHS. Tilt is m easu red with the reference
datum set to the bottom of the processo r subs trat e.
NOTES:
1. Pin plating consist s of 0.2 micrometers Au over 2.0 micrometer Ni.
2. 0.254 mm diametric true position, pin to pin.
Figure 29. Processor Cross-Section and Keep-In
Figure 30. Proc essor Pin Detail
13.97mm 1.25mm
IHS
FCPGA
Component Keepin
Socket m ust allo w clearance
for pin shoulders and m ate
flu s h with t his surface
Substrate
13.97mm 1.25mm
IHS
FCPGA
Component Keepin
Socket m ust allo w clearance
for pin shoulders and m ate
flu s h with t his surface
Substrate
2
PINHEAD DIAMETER
Ø 0.65 MAX
KEEP OUT Z ON E
Ø 1.032 MAX
2.03±0.08
SOLDER FILLET HEIGHT
0.3 MAX
ALL DIMENSIONS ARE IN MILIMETERS
Ø 0.305±0.025
54 Datasheet
Package Mechanical Specifications
NOTES:
1. Flatness is specified as overall, not per unit of length.
2. All Dimensions are in millimeters.
4.1 Package Load Specifications
Table 31 provides dynamic and static load specifications for the processor IHS. These mechanical
load limits should no t be exceeded du ring heats ink assembly, mechanical stress testing, or standard
drop and shipping conditions. The heatsink attach solutions must not induce continuous stress onto
the processor with the exception of a uniform load to maintain the heatsink-to-processor thermal
interface contact. It is not recommended to use any portion of the processor substrate as a
mechanical reference or load bearing surface for thermal solutions.
NOTES:
1. This specification applies to a uniform compressive load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
processor inte rf ace.
3. Dynamic loading specifications are defined assuming a maximum duration of 11 ms and 200 lbf is achieved
by superimposing a 100 lbf dynamic load (1 lbm at 50 g) on the static compressive load.
Figure 31. IHS Flatness Specification
SUBSTRATE
IHS
SUBSTRATE
IHSIHS
Table 31. Package Dynamic and Static Load Speci fications
Parameter Max Unit Notes
Static 100 lbf 1, 2
Dynamic 200 lbf 1, 3
Datasheet 55
Package Mechanical Specifications
4.2 Processor Insertion Specifications
The Celeron processor on 0.13 micron process can be inserted and removed 15 times from a
mPGA478B socket meeting the Intel
Pentium
4 Pr ocessor 478- pin Socket (mPGA478B) Design
Guidelines document.
4.3 Processor Mass Specifications
Table 32 specifies the processor’s mass. This includes all components that make up the entire
processo r product.
4.4 Processor Materials
The Celeron processor on 0.13 micron process is assembled from several components. The basic
material properties are described in Table 33.
4.5 Processor Markings
Figure 32 details the processor top-side markings and is provided to aid in the identification of the
Celeron processor on 0.13 micron process.
Table 32. Processor Mass
Processor Mass (grams)
Intel® Celeron® processor on 0.13 micron process 19
Table 33. Processor Material Propert ies
Component Material
Integrated Heat Spreader Nickel over copper
Substrate Fiber-reinforced resin
Substrate pins Gold over nickel
Figure 32. Processor Markings
2A GHZ/512/400/1.50V
SYYYY XXXXXX
FFFFFFFF -NNNN
i m©‘01
Frequency/Cache/Bus/Voltage
S - Spec/Country of Assy
FPO - Serial #
2 GHZ/128/400/1.525V
FFFFFFFF-NNNN
i
m©‘02 Frequency/Cache/Bus/Voltage
S - Spec/Country of Assy
FPO - Serial # SYYYY XXXXXX
CELERON®
2 - D Mat rix Mark 2 - D Mat rix Mark
56 Datasheet
Package Mechanical Specifications
Figure 33. Processor Pinout Coordinates (Top View, Left Side)
26 25 24 23 22 21 20 19 18 17 16 15 14
AF SKTOCC# RESERVED RESERVED BCLK1 BCLK0 VCC VSS VCC VSS VCC VSS VCC VSS
AE VSS DBR# VSS VCCIOPLL VSS RESERVED VCC VSS VCC VSS VCC VSS VCC
AD ITP_CLK1 TESTHI12 TESTHI0 VSS VSSA VSS VCCA VCC VSS VCC VSS VCC VSS
AC ITP_CLK0 VSS TESTHI4 TESTHI5 VSS TESTHI2 TESTHI3 VSS VCC VSS VCC VSS VCC
AB SLP# RESET# VSS PWRGOOD ITPCLKOUT1 VSS VSS VCC VSS VCC VSS VCC VSS
AA VSS D61# D63# VSS D62# GTLREF ITPCLKOUT0 VSS VCC VSS VCC VSS VCC
YD56# VSS D59# D58# VSS D60#
WD55# D57# VSS DSTBP3# DSTBN3# VSS
VVSS D51# D54# VSS D53# DBI3#
UD48# VSS D49# D50# VSS D52#
TD44# D45# VSS D47# D46# VSS
RVSS D42# D43# VSS DSTBN2# D40#
PDBI2# VSS D41# DSTBP2# VSS D34#
ND38# D39# VSS D36# D33# VSS
MD37# VSS D35# D32# VSS D27#
LVSS DP3# COMP0 VSS D28# D24#
KDP2# DP1# VSS D30# DSTBN1# VSS
JDP0# VSS D29# DSTBP1# VSS D14#
HVSS D31# D26# VSS D16# D11#
GD25# DBI1# VSS D18# D10# VSS
FD22# VSS D20# D19# VSS DSTBP0# GTLREF VCC VSS VCC VSS VCC VSS
EVSS D21# D17# VSS DSTBN0# DBI0# VCC VSS VCC VSS VCC VSS VCC
DD23# D15# VSS D13# D5# VSS VSS VCC VSS VCC VSS VCC VSS
CD12# VSS D8# D7# VSS D4# VCC VSS VCC VSS VCC VSS VCC
BVSS D9# D6# VSS D1# D0# VSS VCC VSS VCC VSS VCC VSS
AVSS D3# VSS D2# RESERVED VSS VCC VSS VCC VSS VCC VSS VCC
26 25 24 23 22 21 20 19 18 17 16 15 14
Datasheet 57
Package Mechanical Specifications
Figure 34. Proc essor Pinout Coordinates (Top View, Right Side)
13 12 11 10 987654321
VCC VSS VCC VSS VCC VSS VCC VSS VCC VCCVID RESERVED VCC VSS AF
VSS VCC VSS VCC VSS VCC VSS VCC VID0 VID1 VID2 VID3 VID4 AE
VCC VSS VCC VSS VCC VSS VCC BSEL0 BSEL1 VSS RESERVED RESERVED VSS AD
VSS VCC VSS VCC VSS VCC VSS BPM0# VSS BPM2# IERR# VSS AP0# AC
VCC VSS VCC VSS VCC VSS VCC VSS BPM1# BPM5# VSS RSP# A35# AB
VSS VCC VSS VCC VSS VCC VSS GTLREF BPM4# VSS BINIT# TESTHI1 VSS AA
BPM3# VSS STPCLK# TESTHI10 VSS A34# Y
VSS INIT# TESTHI9 VSS A33# A29# W
MCERR# AP1# VSS A32# A27# VSS V
TESTHI8 VSS A31# A25# VSS A23# U
VSS A30# A26# VSS A22# A17# T
A28# ADSTB1# VSS A21# A18# VSS R
A24# VSS A20# A19# VSS COMP1 P
VSS A16# A15# VSS A14# A12# N
A8# VSS A11# A10# VSS A13# M
A5# ADSTB0# VSS A7# A9# VSS L
VSS REQ1# A4# VSS A3# A6# K
TRDY# VSS REQ2# REQ3# VSS REQ0# J
BR0# DBSY# VSS REQ4# DRDY# VSS H
VSS RS1# LOCK# VSS BNR# ADS# G
VCC VSS VCC VSS VCC VSS TMS GTLREF VSS RS2# HIT# VSS RS0# F
VSS VCC VSS VCC VSS VCC VSS TRST# LINT1 VSS HITM# DEFER# VSS E
VCC VSS VCC VSS VCC VSS VCC VSS TDO TCK VSS BPRI# LINT0 D
VSS VCC VSS VCC VSS VCC VSS A20M# VSS THERMDC PROCHOT# VSS TDI C
VCC VSS VCC VSS VCC VSS VCC FERR# SMI# VSS THERMDA IGNNE# B
VSS VCC VSS VCC VSS VCC RESERVED TESTHI11 VCC_SENSE VSS_SENSE VSS THERMTRIP# A
13 12 11 10 987654321
58 Datasheet
Package Mechanical Specifications
This page is intentionally left blank.
Datasheet 59
Pin Listing and Signal Definitions
5.0 Pin Listing and Signal Definitions
5.1 Processor Pin Assignments
Section 5.1 contains the pinlist for the Celeron processor on 0.13 micron process in Table 34 and
Table 35. Table 34 is a listing of all processor pins ord ered alp hab etically by pin name. Table 35 is
a listing of all processor pins ordered by pin number.
60 Datasheet
Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package
Table 34. Pin Listing by Pin Name
Pin Name Pin # Signal Buffer
Type Direction
A3# K2 Source Synch Input/Output
A4# K4 Source Synch Input/Output
A5# L6 Source Synch Input/Output
A6# K1 Source Synch Input/Output
A7# L3 Source Synch Input/Output
A8# M6 Source Synch Input/Output
A9# L2 Source Synch Input/Output
A10# M3 Source Synch Input/Output
A11# M4 Source Synch Input/Output
A12# N1 Source Synch Input/Output
A13# M1 Source Synch Input/Output
A14# N2 Source Synch Input/Output
A15# N4 Source Synch Input/Output
A16# N5 Source Synch Input/Output
A17# T1 Source Synch Input/Output
A18# R2 Source Synch Input/Output
A19# P3 Source Synch Input/Output
A20# P4 Source Synch Input/Output
A21# R3 Source Synch Input/Output
A22# T2 Source Synch Input/Output
A23# U1 Source Synch Input/Output
A24# P6 Source Synch Input/Output
A25# U3 Source Synch Input/Output
A26# T4 Source Synch Input/Output
A27# V2 Source Synch Input/Output
A28# R6 Source Synch Input/Output
A29# W1 Source Synch Input/Output
A30# T5 Source Synch Input/Output
A31# U4 Source Synch Input/Output
A32# V3 Source Synch Input/Output
A33# W2 Source Synch Input/Output
A34# Y1 Source Synch Input/Output
A35# AB1 Source Synch Input/Output
A20M# C6 Asynch GTL+ Input
ADS# G1 Common Clk Input/Output
ADSTB0# L5 Source Synch Input/Output
ADSTB1# R5 Source Synch Input/Output
AP0# AC1 Common Clk Input/Output
AP1# V5 Common Clk Input/Output
BCLK0 AF22 Bus Clk Input
BCLK1 AF23 Bus Clk Input
BINIT# AA3 Comm on Clk Input/Output
BNR# G2 Common Clk Input/Output
BPM0# AC6 Comm on Clk Input/Output
BPM1# AB5 Common Clk Input/Output
BPM2# AC4 Common Clk Input/Output
BPM3# Y6 Common Clk Input/Output
BPM4# AA5 Common Clk Input/Output
BPM5# AB4 Common Clk Input/Output
BPRI# D2 Common Clk Input
BR0# H6 Common Clk Input/Output
BSEL0 AD6 Power/Other Output
BSEL1 AD5 Power/Other Output
COMP0 L24 Power/Other Input/Output
COMP1 P1 Power/Other Input/Output
D0# B21 Source Synch Input/Output
D1# B22 Source Synch Input/Output
D2# A23 Source Synch Input/Output
D3# A25 Source Synch Input/Output
D4# C21 Source Synch Input/Output
D5# D22 Source Synch Input/Output
D6# B24 Source Synch Input/Output
D7# C23 Source Synch Input/Output
D8# C24 Source Synch Input/Output
D9# B25 Source Synch Input/Output
D10# G22 Source Synch Input/Output
D11# H21 Source Synch Input/Output
D12# C26 Source Synch Input/Output
D13v D23 Source Synch Input/Output
D14# J21 Source Synch Input/Output
D15# D25 Source Synch Input/Output
D16# H22 Source Synch Input/Output
D17# E24 Source Synch Input/Output
D18# G23 Source Synch Input/Output
D19# F23 Source Synch Input/Output
D20# F24 Source Synch Input/Output
D21# E25 Source Synch Input/Output
D22# F26 Source Synch Input/Output
D23# D26 Source Synch Input/Output
D24# L21 Source Synch Input/Output
D25# G26 Source Synch Input/Output
D26# H24 Source Synch Input/Output
D27# M21 Source Synch Input/Output
D28# L22 Source Synch Input/Output
D29# J24 Source Synch Input/Output
D30# K23 Source Synch Input/Output
D31# H25 Source Synch Input/Output
D32# M23 Source Synch Input/Output
Table 34. Pin Listing by Pin Name
Pin Name Pin # Sign al Buffer
Type Direction
Datasheet 61
Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package
D33# N22 Source Synch Input/Output
D34# P21 Source Synch Input/Output
D35# M24 Source Synch Input/Output
D36# N23 Source Synch Input/Output
D37# M26 Source Synch Input/Output
D38# N26 Source Synch Input/Output
D39# N25 Source Synch Input/Output
D40# R21 Source Synch Input/Output
D41# P24 Source Synch Input/Output
D42# R25 Source Synch Input/Output
D43# R24 Source Synch Input/Output
D44# T26 Source Synch Input/Output
D45# T25 Source Synch Input/Output
D46# T22 Source Synch Input/Output
D47# T23 Source Synch Input/Output
D48# U26 Source Synch Input/Output
D49# U24 Source Synch Input/Output
D50# U23 Source Synch Input/Output
D51# V25 Source Synch Input/Output
D52# U21 Source Synch Input/Output
D53# V22 Source Synch Input/Output
D54# V24 Source Synch Input/Output
D55# W26 Source Synch Input/Output
D#56 Y26 Source Synch Input/Output
D#57 W25 Source Synch Input/Output
D#58 Y23 Source Synch Input/Output
D59# Y24 Source Synch Input/Output
D60# Y21 Source Synch Input/Output
D61# AA25 Source Synch Input/Output
D62# AA22 Source Synch Input/Output
D63# AA24 Source Synch Input/Output
DBI0# E21 Source Synch Input/Output
DBI1# G25 Source Synch Input/Output
DBI2# P26 Source Synch Input/Output
DBI3# V21 Source Synch Input/Output
DBR# AE25 Power/Other Output
DBSY# H5 Co mmo n Clk Input/Output
DEFER# E2 Common Clk Input
DP0# J26 Common Clk Input/Output
DP1# K25 Common Clk Input/Output
DP2# K26 Common Clk Input/Output
DP3# L25 Comm on Clk Input/Output
DRDY# H2 Common Clk Input/Output
DSTBN0# E22 Source Synch Input/Output
Table 34. Pin Listing by Pin Name
Pin Name Pin # Signal Buffer
Type Direction
DSTBN1# K22 Source Synch Input/Output
DSTBN2# R22 Source Synch Input/Output
DSTBN3# W22 Source Synch Input/Output
DSTBP0# F21 Source Synch Input/Output
DSTBP1# J23 Source Synch Input/Output
DSTBP2# P23 Source Synch Input/Output
DSTBP3# W23 Source Synch Input/Output
FERR# B6 Asynch AGL+ Output
GTLREF AA21 Power/Other Input
GTLREF AA6 Power/Other Input
GTLREF F20 Power/Other Input
GTLREF F6 Power/Other Input
HIT# F3 Common Clk Input/Output
HITM# E3 Common Clk Input/Output
IERR# AC3 Common Clk Output
IGNNE# B2 Asynch GTL+ Input
INIT# W5 Asynch GTL+ Input
ITPCLKOUT0 AA20 Power/Other Output
ITPCLKOUT1 AB22 Power/Other Output
ITP_CLK0 AC26 TAP input
ITP_CLK1 AD26 TAP input
LINT0 D1 Asynch GTL+ Input
LINT1 E5 Asynch GTL+ Input
LOCK# G4 Common Clk Input/Output
MCERR# V6 Common Clk Input/Output
PROCHOT# C3 Asynch GTL+ Input/Output1
PWRGOOD AB23 Power/Other Input
REQ0# J1 Source Synch Input/Output
REQ1# K5 Source Synch Input/Output
REQ2# J4 Source Synch Input/Output
REQ3# J3 Source Synch Input/Output
REQ4# H3 Source Synch Input/Output
RESERVED A22
RESERVED A7
RESERVED AD2
RESERVED AD3
RESERVED AE21
RESERVED AF3
RESERVED AF24
RESERVED AF25
RESET# AB25 Common Clk Input
RS0# F1 Common Clk Input
RS1# G5 Common Clk Input
RS2# F4 Common Clk Input
Table 34. Pin Listing by Pin Name
Pin Name Pin # Sign al Buffer
Type Direction
62 Datasheet
Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package
RSP# AB2 Co mmon Cl k Input
SKTOCC# AF26 Power/Other Output
SLP# AB26 Asynch GTL+ Input
SMI# B5 Asynch GTL+ Input
STPCLK# Y4 Asynch GTL+ Input
TCK D4 TAP Input
TDI C1 TAP Input
TDO D5 TAP Output
TESTHI0 AD24 Power/Other Input
TESTHI1 AA2 Power/Other Input
TESTHI2 AC21 Power/Other Input
TESTHI3 AC20 Power/Other Input
TESTHI4 AC24 Power/Other Input
TESTHI5 AC23 Power/Other Input
TESTHI8 U6 Power/Other Input
TESTHI9 W4 Power/Other Input
TESTHI10 Y3 Power/Other Input
TESTHI11 A6 Power/Other Input
TESTHI12 AD25 Power/Other Input
THERMDA B3 Power/Other
THERMDC C4 Power/Other
THERMTRIP# A2 Asynch GTL+ Output
TMS F7 TAP Input
TRDY# J6 Common Clk Input
TRST# E6 TAP Input
VCC A10 Power/Other
VCC A12 Power/Other
VCC A14 Power/Other
VCC A16 Power/Other
VCC A18 Power/Other
VCC A20 Power/Other
VCC A8 Power/Other
VCC AA10 Power/Other
VCC AA12 Power/Other
VCC AA14 Power/Other
VCC AA16 Power/Other
VCC AA18 Power/Other
VCC AA8 Power/Other
VCC AB11 Power/Other
VCC AB13 Power/Other
VCC AB15 Power/Other
VCC AB17 Power/Other
VCC AB19 Power/Other
VCC AB7 Power/Other
Table 34. Pin Listing by Pin Name
Pin Name Pin # Signal Buffer
Type Direction
VCC AB9 Power/Other
VCC AC10 Power/Other
VCC AC12 Power/Other
VCC AC14 Power/Other
VCC AC16 Power/Other
VCC AC18 Power/Other
VCC AC8 Power/Other
VCC AD11 Power/Other
VCC AD13 Power/Other
VCC AD15 Power/Other
VCC AD17 Power/Other
VCC AD19 Power/Other
VCC AD7 Power/Other
VCC AD9 Power/Other
VCC AE10 Power/Other
VCC AE12 Power/Other
VCC AE14 Power/Other
VCC AE16 Power/Other
VCC AE18 Power/Other
VCC AE20 Power/Other
VCC AE6 Power/Other
VCC AE8 Power/Other
VCC AF11 Power/Other
VCC AF13 Power/Other
VCC AF15 Power/Other
VCC AF17 Power/Other
VCC AF19 Power/Other
VCC AF2 Power/Other
VCC AF21 Power/Other
VCC AF5 Power/Other
VCC AF7 Power/Other
VCC AF9 Power/Other
VCC B11 Power/Other
VCC B13 Power/Other
VCC B15 Power/Other
VCC B17 Power/Other
VCC B19 Power/Other
VCC B7 Power/Other
VCC B9 Power/Other
VCC C10 Power/Other
VCC C12 Power/Other
VCC C14 Power/Other
VCC C16 Power/Other
VCC C18 Power/Other
Table 34. Pin Listing by Pin Name
Pin Name Pin # Sign al Buffer
Type Direction
Datasheet 63
Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package
VCC C20 Power/Other
VCC C8 Power/Other
VCC D11 Power/Other
VCC D13 Power/Other
VCC D15 Power/Other
VCC D17 Power/Other
VCC D19 Power/Other
VCC D7 Power/Other
VCC D9 Power/Other
VCC E10 Power/Other
VCC E12 Power/Other
VCC E14 Power/Other
VCC E16 Power/Other
VCC E18 Power/Other
VCC E20 Power/Other
VCC E8 Power/Other
VCC F11 Power/Other
VCC F13 Power/Other
VCC F15 Power/Other
VCC F17 Power/Other
VCC F19 Power/Other
VCC F9 Power/Other
VCCA AD20 Power/Other
VCCIOPLL AE23 Power/Other
VCC_SENSE A5 Power/Other Output
VCCVID AF4 Power/Other Input
VID0 AE5 Power/Other Output
VID1 AE4 Power/Other Output
VID2 AE3 Power/Other Output
VID3 AE2 Power/Other Output
VID4 AE1 Power/Other Output
VSS D10 Power/Other
VSS A11 Power/Other
VSS A13 Power/Other
VSS A15 Power/Other
VSS A17 Power/Other
VSS A19 Power/Other
VSS A21 Power/Other
VSS A24 Power/Other
VSS A26 Power/Other
VSS A3 Power/Other
VSS A9 Power/Other
VSS AA1 Power/Other
VSS AA11 Power/Other
Table 34. Pin Listing by Pin Name
Pin Name Pin # Signal Buffer
Type Direction
VSS AA13 Power/Other
VSS AA15 Power/Other
VSS AA17 Power/Other
VSS AA19 Power/Other
VSS AA23 Power/Other
VSS AA26 Power/Other
VSS AA4 Power/Other
VSS AA7 Power/Other
VSS AA9 Power/Other
VSS AB10 Power/Other
VSS AB12 Power/Other
VSS AB14 Power/Other
VSS AB16 Power/Other
VSS AB18 Power/Other
VSS AB20 Power/Other
VSS AB21 Power/Other
VSS AB24 Power/Other
VSS AB3 Power/Other
VSS AB6 Power/Other
VSS AB8 Power/Other
VSS AC11 Power/Other
VSS AC13 Power/Other
VSS AC15 Power/Other
VSS AC17 Power/Other
VSS AC19 Power/Other
VSS AC2 Power/Other
VSS AC22 Power/Other
VSS AC25 Power/Other
VSS AC5 Power/Other
VSS AC7 Power/Other
VSS AC9 Power/Other
VSS AD1 Power/Other
VSS AD10 Power/Other
VSS AD12 Power/Other
VSS AD14 Power/Other
VSS AD16 Power/Other
VSS AD18 Power/Other
VSS AD21 Power/Other
VSS AD23 Power/Other
VSS AD4 Power/Other
VSS AD8 Power/Other
VSS AE11 Power/Other
VSS AE13 Power/Other
VSS AE15 Power/Other
Table 34. Pin Listing by Pin Name
Pin Name Pin # Sign al Buffer
Type Direction
64 Datasheet
Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package
VSS AE17 Power/Other
VSS AE19 Power/Other
VSS AE22 Power/Other
VSS AE24 Power/Other
VSS AE26 Power/Other
VSS AE7 Power/Other
VSS AE9 Power/Other
VSS AF1 Power/Other
VSS AF10 Power/Other
VSS AF12 Power/Other
VSS AF14 Power/Other
VSS AF16 Power/Other
VSS AF18 Power/Other
VSS AF20 Power/Other
VSS AF6 Power/Other
VSS AF8 Power/Other
VSS B10 Power/Other
VSS B12 Power/Other
VSS B14 Power/Other
VSS B16 Power/Other
VSS B18 Power/Other
VSS B20 Power/Other
VSS B23 Power/Other
VSS B26 Power/Other
VSS B4 Power/Other
VSS B8 Power/Other
VSS C11 Power/Other
VSS C13 Power/Other
VSS C15 Power/Other
VSS C17 Power/Other
VSS C19 Power/Other
VSS C2 Power/Other
VSS C22 Power/Other
VSS C25 Power/Other
VSS C5 Power/Other
VSS C7 Power/Other
VSS C9 Power/Other
VSS D12 Power/Other
VSS D14 Power/Other
VSS D16 Power/Other
VSS D18 Power/Other
VSS D20 Power/Other
VSS D21 Power/Other
VSS D24 Power/Other
Table 34. Pin Listing by Pin Name
Pin Name Pin # Signal Buffer
Type Direction
VSS D3 Power/Other
VSS D6 Power/Other
VSS D8 Power/Other
VSS E1 Power/Other
VSS E11 Power/Other
VSS E13 Power/Other
VSS E15 Power/Other
VSS E17 Power/Other
VSS E19 Power/Other
VSS E23 Power/Other
VSS E26 Power/Other
VSS E4 Power/Other
VSS E7 Power/Other
VSS E9 Power/Other
VSS F10 Power/Other
VSS F12 Power/Other
VSS F14 Power/Other
VSS F16 Power/Other
VSS F18 Power/Other
VSS F2 Power/Other
VSS F22 Power/Other
VSS F25 Power/Other
VSS F5 Power/Other
VSS F8 Power/Other
VSS G21 Power/Other
VSS G24 Power/Other
VSS G3 Power/Other
VSS G6 Power/Other
VSS H1 Power/Other
VSS H23 Power/Other
VSS H26 Power/Other
VSS H4 Power/Other
VSS J2 Power/Other
VSS J22 Power/Other
VSS J25 Power/Other
VSS J5 Power/Other
VSS K21 Power/Other
VSS K24 Power/Other
VSS K3 Power/Other
VSS K6 Power/Other
VSS L1 Power/Other
VSS L23 Power/Other
VSS L26 Power/Other
VSS L4 Power/Other
Table 34. Pin Listing by Pin Name
Pin Name Pin # Sign al Buffer
Type Direction
Datasheet 65
Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package
NOTE:
1. The PROCHOT# signal is input/output only on
CPUID 0xF27 and beyond; otherwise, it is an
output signal.
VSS M2 Power/Other
VSS M22 Power/Other
VSS M25 Power/Other
VSS M5 Power/Other
VSS N21 Power/Other
VSS N24 Power/Other
VSS N3 Power/Other
VSS N6 Power/Other
VSS P2 Power/Other
VSS P22 Power/Other
VSS P25 Power/Other
VSS P5 Power/Other
VSS R1 Power/Other
VSS R23 Power/Other
VSS R26 Power/Other
VSS R4 Power/Other
VSS T21 Power/Other
VSS T24 Power/Other
VSS T3 Power/Other
Table 34. Pin Listing by Pin Name
Pin Name Pin # Signal Buffer
Type Direction
VSS T6 Power/Other
VSS U2 Power/Other
VSS U22 Power/Other
VSS U25 Power/Other
VSS U5 Power/Other
VSS V1 Power/Other
VSS V23 Power/Other
VSS V26 Power/Other
VSS V4 Power/Other
VSS W21 Power/Other
VSS W24 Power/Other
VSS W3 Power/Other
VSS W6 Power/Other
VSS Y2 Power/Other
VSS Y22 Power/Other
VSS Y25 Power/Other
VSS Y5 Power/Other
VSSA AD22 Power/Other
VSS_SENSE A4 Power/Other Output
Table 34. Pin Listing by Pin Name
Pin Name Pin # Sign al Buffer
Type Direction
66 Datasheet
Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package
Table 35. Pin Listing by Pin Number
Pin # Pin Name Signal Buffer
Type Direction
A2 THERMTRIP# Asynch GTL+ Output
A3 VSS Power/Other
A4 VSS_SENSE Power/Other Output
A5 VCC_SENSE Power/Other Output
A6 TESTHI11 Power/Other Input
A7 RESERVED
A8 VCC Power/Other
A9 VSS Power/Other
A10 VCC Power/Other
A11 VSS Power/Other
A12 VCC Power/Other
A13 VSS Power/Other
A14 VCC Power/Other
A15 VSS Power/Other
A16 VCC Power/Other
A17 VSS Power/Other
A18 VCC Power/Other
A19 VSS Power/Other
A20 VCC Power/Other
A21 VSS Power/Other
A22 RESERVED
A23 D2# Sour ce Syn c h Input/Output
A24 VSS Power/Other
A25 D3# Sour ce Syn c h Input/Output
A26 VSS Power/Other
AA1 VSS Power/Other
AA2 TESTHI1 Power/Other Input
AA3 BINIT# Common Clk Input/Output
AA4 VSS Power/Other
AA5 BPM4# Common Clk Input/Output
AA6 GTLREF Power/Other Input
AA7 VSS Power/Other
AA8 VCC Power/Other
AA9 VSS Power/Other
AA10 VCC Power/Other
AA11 VSS Power/Other
AA12 VCC Power/Other
AA13 VSS Power/Other
AA14 VCC Power/Other
AA15 VSS Power/Other
AA16 VCC Power/Other
AA17 VSS Power/Other
AA18 VCC Power/Other
AA19 VSS Power/Other
AA20 ITPCLK0 Power/Other Output
AA21 GTLREF Power/Other Input
AA22 D62# Source Synch Input/Output
AA23 VSS Power/Other
AA24 D63# Source Synch Input/Output
AA25 D61# Source Synch Input/Output
AA26 VSS Power/Other
AB1 A35# Source Synch Input/Output
AB2 RSP# Common Clk Input
AB3 VSS Power/Other
AB4 BPM5# Common Clk Input/Output
AB5 BPM1# Common Clk Input/Output
AB6 VSS Power/Other
AB7 VCC Power/Other
AB8 VSS Power/Other
AB9 VCC Power/Other
AB10 VSS Power/Other
AB11 VCC Power/Other
AB12 VSS Power/Other
AB13 VCC Power/Other
AB14 VSS Power/Other
AB15 VCC Power/Other
AB16 VSS Power/Other
AB17 VCC Power/Other
AB18 VSS Power/Other
AB19 VCC Power/Other
AB20 VSS Power/Other
AB21 VSS Power/Other
AB22 ITPCLK1 Power/Other Output
AB23 PWRGOOD Power/Other Input
AB24 VSS Power/Other
AB25 RESET# Common
Clock Input
AB26 SLP# Asynch GTL+ Input
AC1 AP0# Common Clk Input/Output
AC2 VSS Power/Other
AC3 IERR# Common Clk Output
AC4 BPM2# Common Clk Input/Output
AC5 VSS Power/Other
AC6 BPM0# Common
Clock Input/Output
AC7 VSS Power/Other
AC8 VCC Power/Other
AC9 VSS Power/Other
AC10 VCC Power/Other
Table 35. Pin Listing by Pin Number
Pin # Pin Name Signal Buffer
Type Direction
Datasheet 67
Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package
AC11 VSS Power/Other
AC12 VCC Power/Other
AC13 VSS Power/Other
AC14 VCC Power/Other
AC15 VSS Power/Other
AC16 VCC Power/Other
AC17 VSS Power/Other
AC18 VCC Power/Other
AC19 VSS Power/Other
AC20 TESTHI3 Power/Other Input
AC21 TESTHI2 Power/Other Input
AC22 VSS Power/Other
AC23 TESTHI5 Power/Other Input
AC24 TESTHI4 Power/Other Input
AC25 VSS Power/Other
AC26 ITP_CLK0 TAP input
AD1 VSS Power/Other
AD2 RESERVED
AD3 RESERVED
AD4 VSS Power/Other
AD5 BSEL1 Power/Other Output
AD6 BSEL0 Power/Other Output
AD7 VCC Power/Other
AD8 VSS Power/Other
AD9 VCC Power/Other
AD10 VSS Power/Other
AD11 VCC Power/Other
AD12 VSS Power/Other
AD13 VCC Power/Other
AD14 VSS Power/Other
AD15 VCC Power/Other
AD16 VSS Power/Other
AD17 VCC Power/Other
AD18 VSS Power/Other
AD19 VCC Power/Other
AD20 VCCA Power/Other
AD21 VSS Power/Other
AD22 VSSA Power/Other
AD23 VSS Power/Other
AD24 TESTHI0 Power/Other Input
AD25 TESTHI12 Power/Other Input
AD26 ITP_CLK1 TAP input
AE1 VID4 Power/Other Output
AE2 VID3 Power/Other Output
Table 35. Pin Listing by Pin Number
Pin # Pin Name Signal Buffer
Type Direction
AE3 VID2 Power/Other Output
AE4 VID1 Power/Other Output
AE5 VID0 Power/Other Output
AE6 VCC Power/Other
AE7 VSS Power/Other
AE8 VCC Power/Other
AE9 VSS Power/Other
AE10 VCC Power/Other
AE11 VSS Power/Other
AE12 VCC Power/Other
AE13 VSS Power/Other
AE14 VCC Power/Other
AE15 VSS Power/Other
AE16 VCC Power/Other
AE17 VSS Power/Other
AE18 VCC Power/Other
AE19 VSS Power/Other
AE20 VCC Power/Other
AE21 RESERVED
AE22 VSS Power/Other
AE23 VCCIOPLL Power/Other
AE24 VSS Power/Other
AE25 DBR# Asynch GTL+ Output
AE26 VSS Power/Other
AF1 VSS Power/Other
AF2 VCC Power/Other
AF3 RESERVED
AF4 VCCVID Power/Other Input
AF5 VCC Power/Other
AF6 VSS Power/Other
AF7 VCC Power/Other
AF8 VSS Power/Other
AF9 VCC Power/Other
AF10 VSS Power/Other
AF11 VCC Power/Other
AF12 VSS Power/Other
AF13 VCC Power/Other
AF14 VSS Power/Other
AF15 VCC Power/Other
AF16 VSS Power/Other
AF17 VCC Power/Other
AF18 VSS Power/Other
AF19 VCC Power/Other
AF20 VSS Power/Other
Table 35. Pin Listing by Pin Number
Pin # Pin Name Signal Buffer
Type Direction
68 Datasheet
Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package
AF21 VCC Power/Other
AF22 BCLK0 Bus Clock Input
AF23 BCLK1 Bus Clock Input
AF24 RESERVED
AF25 RESERVED
AF26 SKTOCC# Power/Other Output
B2 IGNNE# Asynch GTL+ Input
B3 THERMDA Power/Other
B4 VSS Power/Other
B5 SMI# Asynch GTL+ Input
B6 FERR# Asynch AGL+ Output
B7 VCC Power/Other
B8 VSS Power/Other
B9 VCC Power/Other
B10 VSS Power/Other
B11 VCC Power/Other
B12 VSS Power/Other
B13 VCC Power/Other
B14 VSS Power/Other
B15 VCC Power/Other
B16 VSS Power/Other
B17 VCC Power/Other
B18 VSS Power/Other
B19 VCC Power/Other
B20 VSS Power/Other
B21 D0# Sour ce Syn c h Input/Output
B22 D1# Sour ce Syn c h Input/Output
B23 VSS Power/Other
B24 D6# Sour ce Syn c h Input/Output
B25 D9# Sour ce Syn c h Input/Output
B26 VSS Power/Other
C1 TDI TAP Input
C2 VSS Power/Other
C3 PROCHOT# Asynch GTL+ Input/Output1
C4 THERMDC Power/Other
C5 VSS Power/Other
C6 A20M# Asynch GTL+ Input
C7 VSS Power/Other
C8 VCC Power/Other
C9 VSS Power/Other
C10 VCC Power/Other
C11 VSS Power/Other
C12 VCC Power/Other
C13 VSS Power/Other
Table 35. Pin Listing by Pin Number
Pin # Pin Name Signal Buffer
Type Direction
C14 VCC Power/Other
C15 VSS Power/Other
C16 VCC Power/Other
C17 VSS Power/Other
C18 VCC Power/Other
C19 VSS Power/Other
C20 VCC Power/Other
C21 D4# Source Synch Input/Output
C22 VSS Power/Other
C23 D7# Source Synch Input/Output
C24 D8# Source Synch Input/Output
C25 VSS Power/Other
C26 D12# Source Synch Input/Output
D1 LINT0 Asynch GTL+ Input
D2 BPRI# Common Clk Input
D3 VSS Power/Other
D4 TCK TAP Input
D5 TDO TAP Output
D6 VSS Power/Other
D7 VCC Power/Other
D8 VSS Power/Other
D9 VCC Power/Other
D10 VSS Power/Other
D11 VCC Power/Other
D12 VSS Power/Other
D13 VCC Power/Other
D14 VSS Power/Other
D15 VCC Power/Other
D16 VSS Power/Other
D17 VCC Power/Other
D18 VSS Power/Other
D19 VCC Power/Other
D20 VSS Power/Other
D21 VSS Power/Other
D22 D5# Source Synch Input/Output
D23 D13# Source Synch Input/Output
D24 VSS Power/Other
D25 D15# Source Synch Input/Output
D26 D23# Source Synch Input/Output
E1 VSS Power/Other
E2 DEFER# Common Cl k Input
E3 HITM# Common Cl k Input/Output
E4 VSS Power/Other
E5 LINT1 Asynch GTL+ Input
Table 35. Pin Listing by Pin Number
Pin # Pin Name Signal Buffer
Type Direction
Datasheet 69
Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package
E6 TRST# TAP Input
E7 VSS Power/Other
E8 VCC Power/Other
E9 VSS Power/Other
E10 VCC Power/Other
E11 VSS Power/Other
E12 VCC Power/Other
E13 VSS Power/Other
E14 VCC Power/Other
E15 VSS Power/Other
E16 VCC Power/Other
E17 VSS Power/Other
E18 VCC Power/Other
E19 VSS Power/Other
E20 VCC Power/Other
E21 DBI0# Source Synch Input/Output
E22 DSTBN0# Source Synch Input/Output
E23 VSS Power/Other
E24 D17# Source Synch Input/Output
E25 D21# Source Synch Input/Output
E26 VSS Power/Other
F1 RS0# Common Clk Input
F2 VSS Power/Other
F3 HIT# Common Clk Input/Output
F4 RS2v Common Clk Input
F5 VSS Power/Other
F6 GTLREF Power/Other Input
F7 TMS TAP Input
F8 VSS Power/Other
F9 VCC Power/Other
F10 VSS Power/Other
F11 VCC Power/Other
F12 VSS Power/Other
F13 VCC Power/Other
F14 VSS Power/Other
F15 VCC Power/Other
F16 VSS Power/Other
F17 VCC Power/Other
F18 VSS Power/Other
F19 VCC Power/Other
F20 GTLREF Power/Other Input
F21 DSTBP0# Source Synch Input/Output
F22 VSS Power/Other
F23 D19# Source Synch Input/Output
Table 35. Pin Listing by Pin Number
Pin # Pin Name Signal Buffer
Type Direction
F24 D20# Source Synch Input/Output
F25 VSS Power/Other
F26 D22# Source Synch Input/Output
G1 ADS# Common Clk Input/Output
G2 BNR# Common Clk Input/Output
G3 VSS Power/Other
G4 LOCK# Common Cl k Input/Output
G5 RS1# Common Clk Input
G6 VSS Power/Other
G21 VSS Power/Other
G22 D10# Source Synch Input/Output
G23 D18# Source Synch Input/Output
G24 VSS Power/Other
G25 DBI1# Source Synch Input/Output
G26 D25# Source Synch Input/Output
H1 VSS Power/Other
H2 DRDY# Common Clk Input/Output
H3 REQ4# Source Synch Input/Output
H4 VSS Power/Other
H5 DBSY# Common Clk Input/Output
H6 BR0# Common Clk Input/Output
H21 D11# Source Synch Input/Output
H22 D16# Source Synch Input/Output
H23 VSS Power/Other
H24 D26# Source Synch Input/Output
H25 D31# Source Synch Input/Output
H26 VSS Power/Other
J1 REQ0# Source Synch Input/Output
J2 VSS Power/Other
J3 REQ3# Source Synch Input/Output
J4 REQ2# Source Synch Input/Output
J5 VSS Power/Other
J6 TRDY# Common Clk Input
J21 D14# Source Synch Input/Output
J22 VSS Power/Other
J23 DSTBP1# Source Synch Input/Output
J24 D29# Source Synch Input/Output
J25 VSS Power/Other
J26 DP0# Common Clk Input/Output
K1 A6# Source Synch Input/Output
K2 A3# Source Synch Input/Output
K3 VSS Power/Other
K4 A4# Source Synch Input/Output
K5 REQ1# Source Synch Input/Output
Table 35. Pin Listing by Pin Number
Pin # Pin Name Signal Buffer
Type Direction
70 Datasheet
Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package
K6 VSS Power/Other
K21 VSS Power/Other
K22 DSTBN1# Sour c e Syn ch Input/Output
K23 D30# Source Synch Input/Output
K24 VSS Power/Other
K25 DP1# Common
Clock Input/Output
K26 DP2# Common
Clock Input/Output
L1 VSS Power/Other
L2 A9# Source Syn ch Input/Output
L3 A7# Source Syn ch Input/Output
L4 VSS Power/Other
L5 ADSTB0# Source Synch Input/Output
L6 A5# Source Syn ch Input/Output
L21 D24# Source Syn c h Input/Output
L22 D28# Source Syn c h Input/Output
L23 VSS Power/Other
L24 COMP0 Power/Other Input/Output
L25 DP3# Common Clk Input/Output
L26 VSS Power/Other
M1 A13# Sour ce Syn c h Input/Output
M2 VSS Power/Other
M3 A10# Sour ce Syn c h Input/Output
M4 A11# Sour c e Syn ch Input/Output
M5 VSS Power/Other
M6 A8# Source Syn ch Input/Output
M21 D27# Source Synch Input/Output
M22 VSS Power/Other
M23 D32# Source Synch Input/Output
M24 D35# Source Synch Input/Output
M25 VSS Power/Other
M26 D37# Source Synch Input/Output
N1 A12# Sour ce Syn c h Input/Output
N2 A14# Sour ce Syn c h Input/Output
N3 VSS Power/Other
N4 A15# Sour ce Syn c h Input/Output
N5 A16# Sour ce Syn c h Input/Output
N6 VSS Power/Other
N21 VSS Power/Other
N22 D33# Source Syn ch Input/Output
N23 D36# Source Syn ch Input/Output
N24 VSS Power/Other
N25 D39# Source Syn ch Input/Output
N26 D38# Source Syn ch Input/Output
Table 35. Pin Listing by Pin Number
Pin # Pin Name Signal Buffer
Type Direction
P1 COMP1 Power/Other Input/Output
P2 VSS Power/Other
P3 A19# Source Synch Input/Output
P4 A20# Source Synch Input/Output
P5 VSS Power/Other
P6 A24# Source Synch Input/Output
P21 D34# Source Synch Input/Output
P22 VSS Power/Other
P23 DSTBP2# Source Synch Input/Output
P24 D41# Source Synch Input/Output
P25 VSS Power/Other
P26 DBI2# Source Synch Input/Output
R1 VSS Power/Other
R2 A18# Source Synch Input/Output
R3 A21# Source Synch Input/Output
R4 VSS Power/Other
R5 ADSTB1# Source Synch Input/Output
R6 A28# Source Synch Input/Output
R21 D40# Source Synch Input/Output
R22 DSTBN2# Source Synch Input/Output
R23 VSS Power/Other
R24 D43# Source Synch Input/Output
R25 D42# Source Synch Input/Output
R26 VSS Power/Other
T1 A17# Source Synch Input/Output
T2 A22# Source Synch Input/Output
T3 VSS Power/Other
T4 A26# Source Synch Input/Output
T5 A30# Source Synch Input/Output
T6 VSS Power/Other
T21 VSS Power/Other
T22 D46# Source Synch Input/Output
T23 D47# Source Synch Input/Output
T24 VSS Power/Other
T25 D45# Source Synch Input/Output
T26 D44# Source Synch Input/Output
U1 A23# Source Synch Input/Output
U2 VSS Power/Other
U3 A25# Source Synch Input/Output
U4 A31# Source Synch Input/Output
U5 VSS Power/Other
U6 TESTHI8 Power/Other Input
U21 D52# Source Synch Input/Output
U22 VSS Power/Other
Table 35. Pin Listing by Pin Number
Pin # Pin Name Signal Buffer
Type Direction
Datasheet 71
Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package
NOTE:
1. The PROCHOT# signal is input/output only on
CPUID 0xF27 and beyond; otherwise, it is an
output signal.
U23 D50# Source Synch Input/Output
U24 D49# Source Synch Input/Output
U25 VSS Power/Other
U26 D48# Source Synch Input/Output
V1 VSS Power/Other
V2 A27# Source Synch Input/Output
V3 A32# Source Synch Input/Output
V4 VSS Power/Other
V5 AP1# Common Clk Input/Output
V6 MCERR# Common Clk Input/Output
V21 DBI3# Source Synch Input/Output
V22 D53# Source Synch Input/Output
V23 VSS Power/Other
V24 D54# Source Synch Input/Output
V25 D51# Source Synch Input/Output
V26 VSS Power/Other
W1 A29# Source Synch Input/Output
W2 A33# Source Synch Input/Output
W3 VSS Power/Other
W4 TESTHI9 Power/Other Input
Table 35. Pin Listing by Pin Number
Pin # Pin Name Signal Buffer
Type Direction
W5 INIT# Asynch GTL+ Input
W6 VSS Power/Other
W21 VSS Power/Other
W22 DSTBN3# Source Synch Input/Output
W23 DSTBP3# Source Synch Input/Output
W24 VSS Power/Other
W25 D57# Source Synch Input/Output
W26 D55# Source Synch Input/Output
Y1 A34# Source Synch Input/Output
Y2 VSS Power/Other
Y3 TESTHI10 Power/Other Input
Y4 STPCLK# Asynch GTL+ Input
Y5 VSS Power/Other
Y6 BPM3# Common Clk Input/Output
Y21 D60# Source Synch Input/Output
Y22 VSS Power/Other
Y23 D58# Source Synch Input/Output
Y24 D59# Source Synch Input/Output
Y25 VSS Power/Other
Y26 D56# Source Synch Input/Output
Table 35. Pin Listing by Pin Number
Pin # Pin Name Signal Buffer
Type Direction
72 Datasheet
Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package
5.2 Alphabetical Si gnals Reference
Table 36. Signal Description (S heet 1 of 8)
Name Type Description
A[35:3]# Input/
Output
A[35:3]# (Address) define a 236-byte physical memory address space. In sub-
phase 1 of the address phase, these pins transmit the address of a transaction.
In sub-phase 2, these pins transmit transaction type information. These signals
must connect the appropriate pins of all agents on the Intel® Celeron® processor
on 0.13 micron process. A[35:3]# are protected by parity signals AP[1:0]#.
A[35:3]# are source synchronous signals and are latched into the receiving
buffers by ADSTB[1:0]#.
On the active-to-inactive transition of RESET#, the processor samples a subset
of the A[35:3]# pins to determine power-on configuration. See Section 7.1 for
more details.
A20M# Input
If A20M# (Address-20 Mask) is asserted, the processor masks physical address
bit 20 (A20#) before looking up a line in any internal cache and before driving a
read/write transaction on the bus. Asserting A20M# emulates the 8086
processor's address wrap-around at the 1-Mbyte boundary. Assertio n of A20M#
is supported only in real mode.
A20M# is an asynchronous signal. However, to ensure recognition of this signal
following an Input/Output write instruction, it must be valid along with the TRDY#
assertion of the corresponding Input/Output Write bus transaction.
ADS# Input/
Output
ADS# (Address Strobe) is assert ed to indicate the validity of the transaction
address on the A[35:3]# and REQ[4:0]# pins. All bus agents observe the ADS#
activation to begin parity checking, protocol checking, address decode, internal
snoop, or deferred reply ID match operations associated with the new
transaction.
ADSTB[1:0]# Input/
Output
Address strobes are used to latch A[35:3]# and REQ[4:0]# on their rising and
falling edges. Strobes are associated with signals as follows:
AP[1:0]# Input/
Output
AP[1:0]# (Address Parity) are driven by the request initiator along with ADS#,
A[35:3]#, and the transaction type on the REQ[4:0]#. A correct parity signal is
high if an even number of covered signals are low, and low if an odd number of
covered signals are low. This allows parity to be high when all the covered
signals are high. AP[1:0]# should connect the appropriate pins of all Celeron
processor on 0.13 micron process system bus agents. The following table
defines the coverage model of these signals.
BCLK[1:0] Input
The differential pair BCLK (Bus Clock) determines the system bus frequency. All
processor system bus agents must receive these signals to drive their outputs
and latch their inputs.
All external timing parameters are specified with respect to the rising edge of
BCLK0 crossing VCROSS.
Signals Associated Strobe
REQ[4:0]#, A[16:3]# ADSTB0#
A[35:17]# ADSTB1#
Request Signals Subphase 1 Subphase 2
A[35:24]# AP0# AP1#
A[23:3]# AP1# AP0#
REQ[4:0]# AP1# AP0#
Datasheet 73
Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package
BINIT# Input/
Output
BINIT# (Bus Initialization) may be observed and driven by all processor system
bus agents and if used, must connect the appropriate pins of all such agents. If
the BINIT# driver is enabled during power-on configuration, BINIT# is asserted to
signal any bus condition that prevents reliable future operation.
If BINIT# observation is enabled during power-on configuration and BINIT# is
sampled asserted, symmet ric agents reset their bus LOCK# activity and bus
request arbitration state machines. The bus agents do not reset their IOQ and
transaction tracking state machines upon observation of BINIT# activation. Once
the BINIT# assertion has been observed, the bus agents will re-arbitrate for the
system bus and attempt completion of their bus queue and IOQ entries.
If BINIT# observation is disabled during power-on configuration, a central agent
may handle an assertion of BINIT# as appropriate to the error handling
architecture of the system.
BNR# Input/
Output
BNR# (Block Next Request) is used to assert a bus st all by any bus agent that is
unable to accept new bus transactions. During a bus stall , the current bus owner
cannot issue any new transactions.
BPM[5:0]# Input/
Output
BPM[5:0]# (Breakpoint Monitor) are breakpoint and performance monitor signals.
They are outputs from the processor that indicate the status of breakpoints and
programmable counters used for monitoring processor perfor manc e. BPM[ 5:0]#
should connect the appropriate pins of all Celeron processor on 0.13 micron
process system bus agents.
BPM4# provides PRDY# (Probe Ready) functionality for the TAP port. PRDY# is
a processor output used by debug tools to determine processor debug
readiness.
BPM5# provides PREQ# (Probe Request) functionality for the TAP port. PREQ#
is used by debug tools to request debug operation of the processor.
Refer to Table 1 for the appropriate Platform Design Guide, and to the ITP700
Debug Port Design Guide for more detailed information.
NOTE: These signals do not have on-die termination. Refer to the appropriate
Platform Design Guide for termination requirements.
BPRI# Input
BPRI# (Bus Priority Request) is used to arbitrate for ownership of the processor
system bus. It must connect the appropriate pins of all processor system bus
agents. Observing BPRI# active (as asserted by the priority agent) causes all
other agents to stop issuing new requests unless such requests are part of an
ongoing locked operation. The priority agent keeps BPRI# asserted until all of its
requests are completed, then releases the bus by deasserting BPRI#.
BR0# Input/
Output
BR0# drives the BREQ0# signal in the system and is used by the processor to
request the bus. During power-on configuration this pin is sampled to determine
the agent ID = 0.
NOTE: This signal does not have on-die termination and must be terminated.
BSEL[1:0] Input/
Output
BSEL[1:0] (Bus Select) are used to select the processor input clock frequency.
Table 5 defines the possible combinations of the signals and the frequency
associated with each combination. The required frequency is determined by the
processor , chipset and clock synthesizer . All agents must operate at the same
frequency. The Celeron processor on 0.13 micron proces s operate s at a
400 MHz system bus frequency (100 MHz BCLK[1:0] frequency). For more
information about these pins including termination recommendations, refer to
Section 2.9 and the appropriate platform design guidelines.
COMP[1:0] Analog COMP[1:0] must be terminated on the system board using precision resistors.
Refer to Table 1 for the appropriate Platform Design Guide for details on
implementation.
Table 36. Signal Description (Sheet 2 of 8)
Name Type Description
74 Datasheet
Pin Listing and Signal Definitions
D[63:0]# Input/
Output
D[63:0]# (Data) are the data signals. These signals provide a 64-bit data path
between the processor system bus agents, and must connect the appropriate
pins on all such agents. The data driver asserts DRDY# to indicate a valid data
transfer.
D[63:0]# are quad-pumped signals and will thus be driven four times in a
common clock period. D[63:0]# are latched off the falling edge of both
DSTBP[3:0]# and DSTBN[3:0]#. Each group of 16 data signals correspond to a
pair of one DSTBP# and one DSTBN#. The following table shows the grouping of
data signals to data strobes and DBI#.
The DBI# pins determine the polarity of the data signals. Each group of 16 data
signals corresponds to one DBI# signal. When the DBI# signal is active, the
corresponding data group is inverted and therefore sampled active high.
DBI[3:0]# Input/
Output
DBI[3:0]# (Data Bus Inversion) are source synchronous and indicate the polarity
of the D[63:0]# signals. The DBI[3:0]# signals are activated when the data on the
data bus is inverted. If more than half the data bit s within a 16-bit group would
have been asserted electrically low, the bus agent may invert the data bus
signals for that particular sub-phase for that 16-bit group.
DBR# Output
DBR# (Data Bus Reset) is used only in processor systems in which no debug
port is implemented on the system board. DBR# is used by a debug port
interposer so that an in-target probe can drive system reset. If a debug port is
implemented in the system, DBR# is a not connect in the system. DBR # is not a
processor signal.
DBSY# Input/
Output
DBSY# (Data Bus Busy) is asserted by the agent responsible for driving data on
the processor system bus to indicate that the data bus is in use. The data bus is
released after DBSY# is deasserted. This signal must connect the appropriate
pins on all processor system bus agents.
DEFER# Input
DEFER# is asserted by an agent to indicate that a transaction cannot be
guaranteed in-order completion. Assertion of DEFER# is normally the
responsibility of the addressed memory or Input/Output agent. This signal must
connect the appropriate pins of all processor system bus agents.
DP[3:0]# Input/
Output
DP[3:0]# (Data parity) provide parity prot ection for the D[63:0]# signals. They are
driven by the agent responsible for driving D[63:0]#, and must connect the
appropriate pins of all Celeron processor on 0.13 micron process system bus
agents.
Table 36. Signal Description (S heet 3 of 8)
Name Type Description
Quad-Pumped Signal Groups
Dat a Group DSTBN#/
DSTBP# DBI#
D[15:0]# 0 0
D[31:16]# 1 1
D[47:32]# 2 2
D[63:48]# 3 3
DBI[3:0]# Assignment To Data Bus
Bus Signal Data Bus Signals
DBI3# D[63:48]#
DBI2# D[47:32]#
DBI1# D[31:16]#
DBI0# D[15:0]#
Datasheet 75
Pin Listing and Signal Definitions
DRDY# Input/
Output
DRDY# (Data Ready) is asserted by the data driver on each data transfer,
indicating valid data on the data bus. In a multi-common clock data transfer,
DRDY# may be deasserted to insert idle clocks. This signal must connect the
appropriate pins of all processor system bus agents.
DSTBN[3:0]# Input/
Output
Data strobe used to latch in D[63:0]#.
DSTBP[3:0]# Input/
Output
Data strobe used to latch in D[63:0]#.
FERR#/PBE# Output
FERR#/PBE# (floating point error/pending break event) is a multiplexed signal
that is qualified by STPCLK#. When STPCLK# is not asserted, FERR# indicates
a floating-point error and will be asserted when the processor detects an
unmasked floating-point error. When STPCLK# is not asserted, FERR#/PBE# is
similar to the ERROR# signal on the Intel 387 coprocessor , and is included for
compatibility with systems using MS-DOS*-type floating-point error reporting.
When STPCLK# is asserted, an assertion of FERR#/PBE# indicates that the
processor has a pending break event waiting for service. The assertion of
FERR#/PBE# indicates that the processor should be returned to the Normal
state. When FERR#/PBE# is asserted, indicating a break event, it will remain
asserted until STPCLK# is deasserted. For addition information on the pending
break event functionality, including the identification of support of the feature and
enable/disable information, refer to the Intel Architecture Software Developer ’s
Manual and the Intel Processor Identification and the CPUID Instruction
application note.
GTLREF Input GTLREF determines the signal reference level for AGTL+ input pins. GTLREF
should be set at 2/3 VCC. GTLREF is used by the AGTL+ receivers to determine
if a signal is a logical 0 or a logical 1. Refer to Table 1 for the appropriate Platform
Design Guide for details on implementation.
HIT#
HITM#
Input/
Output
Input/
Output
HIT# (Snoop Hit) and HITM# (Hit Modified) convey transaction snoop operation
results. Any system bus agent may assert both HIT# and HITM# together to
indicate that it requires a snoop stall, which can be continued by reasserting
HIT# and HITM# together.
IERR# Output
IERR# (Internal Error) is asserted by a processor as the result of an internal
error. Assertion of IERR# is usually accompanied by a SHUTDOWN transaction
on the processor system bus. This transaction may optionally be converted to an
external error signal (e.g., NMI) by system core logic. The processor will keep
IERR# asserted until the assertion of RESET#.
NOTE: This signal does not have on-die termination and must be terminated on
the system board.
Table 36. Signal Description (Sheet 4 of 8)
Name Type Description
Signals Associated Strobe
D[15:0]#, DBI0# DSTBN0#
D[31:16]#, DBI1# DSTBN1#
D[47:32]#, DBI2# DSTBN2#
D[63:48]#, DBI3# DSTBN3#
Signals Associated Strobe
D[15:0]#, DBI0# DSTBP0#
D[31:16]#, DBI1# DSTBP1#
D[47:32]#, DBI2# DSTBP2#
D[63:48]#, DBI3# DSTBP3#
76 Datasheet
Pin Listing and Signal Definitions
IGNNE# Input
IGNNE# (Ignore Numeric Error) is assert ed to force the processo r to ignore a
numeric error and continue to execute noncontrol floating-point instructions. If
IGNNE# is deasserted, the processor generates an exception on a noncontrol
floating-point instruction if a previous floating-point instruction caused an error.
IGNNE# has no effect when the NE bit in control register 0 (CR0) is set.
IGNNE# is an asynchronous signal. However, to ensure recognition of this signal
following an Input/Output write instruction, it must be valid along with the TRDY#
assertion of the corresponding Input/Output Write bus transaction.
INIT# Input
INIT# (Initialization), when asserted, resets integer registers inside the processor
without affecting its internal caches or floating-point registers. The processor
then begins execution at the power-on Reset vector configured during power-on
configuration. The processor continues to handle snoop requests during INIT#
assertion. INIT# is an asynchronous signal and must connect the appropriate
pins of all processor system bus agents.
If INIT# is sampled active on the active to inactive transition of RESET#, the
processor executes its Built-in Self-Test (BIST).
ITPCLKOUT[1:0] Output
ITPCLKOUT[1:0] is an uncompensated dif ferential clock output that is a delayed
copy of BCLK[1:0], which is an input to the processor. This clock output can be
used as the differential clock into the ITP port that is designed onto the
motherboard. If ITPCLKOUT[1:0] outputs are not used, they must be termin ated
properly . Refer to Section 2.5 for additional details and termination requirements.
Refer to the ITP700 Debug Port Design Guide for details on implementing a
debug port.
ITP_CLK[1:0] Input
ITP_CLK[1:0] are copies of BCLK that are used only in processor systems where
no debug port is implemented on the system board. ITP_CLK[1:0] are used as
BCLK[1:0] references for a debug port implemented on an interposer. If a debug
port is implemented in the system, ITP_CLK[1:0] are no connects in the system .
These are not processor signals.
LINT[1:0] Input
LINT[1:0] (Local APIC Interrupt) must connect the appropriate pins of all APIC
Bus agents. When the APIC is disabled, the LINT0 signal becomes INTR, a
maskable interrupt request signal, and LINT1 becomes NMI, a nonmaskable
interrupt. INTR and NMI are backward compatible with the signals of those
names on the Intel® Pentium® processor. Both signals are asynchronous.
Both of these signals must be software configured via BIOS programming of the
APIC register space to be used either as NMI/INTR or LINT[1:0]. Because the
APIC is enabled by default after Reset, operation of these pins as LINT[1:0] is
the default configuration.
LOCK# Input/
Output
LOCK# indicates to the system that a transaction must occur atomically. This
signal must connect the appropriate pins of all processor system bus agent s. For
a locked sequence of transactions, LOCK# is asserted from the beginning of the
first transaction to the end of the last transaction.
When the priority agent asserts BPRI# to arbitrate for ownership of the processor
system bus, it will wait until it observes LOCK# deasserted. This enables
symmetric agents to retain ownership of the processor system bus throughout
the bus locked operation and ensure the atomicity of lock.
MCERR# Input/
Output
MCERR# (Machine Check Error) is assert ed to indicate an unrecoverable error
without a bus protocol violation. It may be driven by all processor syst em bus
agents.
MCERR# assertion conditions are configurable at a system level. Assertion
options are defined by the following options:
• Enabled or disabled.
• Asserted, if configured, for internal errors along with IERR#.
• Asserted, if configured, by the request initiator of a bus transaction after it
observes an error.
• Asserted by any bus agent when it observes an error in a bus transaction.
For more details regarding machine check architecture, Refer to the IA-32
Software Developer’s Manual, Volume 3: System Programming Guide.
Table 36. Signal Description (S heet 5 of 8)
Name Type Description
Datasheet 77
Pin Listing and Signal Definitions
PROCHOT# Input/
Output
As an output, PROCHOT# (Processor Hot) will go active when the processor
temperature monitoring sensor detects that the processor has reached its
maximum safe operating temperature. This indicates that the processor Thermal
Control Circuit has been activated, if enabled. As an input, assertion of
PROCHOT# by the system will activate the TCC, if enabled. The TCC will remain
active until the system deasserts PROCHOT#. See Section 7.3 for more details.
NOTE: The PROCHOT# signal is input/output only on CPUID 0xF27 and
beyond; otherwise, it is an output signal.
PWRGOOD Input
PWRGOOD (Power Good) is a processor input. The processor requires this
signal to be a clean indication that the clocks and power supplies are stable and
within their specifications. ‘ Clean’ im plies that the signal will remain low (capable
of sinking leakage current), without anomalies, from the time that the power
supplies are turned on until they come within specification. The signal must then
transition monotonically to a high state. Figure 14 illustrates the relationship of
PWRGOOD to the RESET# signal. PWRGOOD can be driven inactive at any
time, but clocks and power must again be stable before a subsequent rising edge
of PWRGOOD. It must also meet the minimum pulse width specification in
Table 19, and be followed by a 1 to 10 ms RESET# pulse.
The PWRGOOD signal must be supplied to the processor; it is used to protect
internal circuits against voltage sequencing issues. It should be driven high
throughout boundary scan operation.
REQ[4:0]# Input/
Output
REQ[4:0]# (Request Command) must connect the appropriate pins of all
processor system bus agents. They are asserted by the current bus owner to
define the currently active transaction type. These signals are source
synchronous to ADSTB0#. Refer to the AP[1:0]# signal description for details on
parity checking of these signals.
RESET# Input
Asserting the RESET# signal resets the processor to a known state and
invalidates its internal caches without writing back any of their contents. For a
power-on Reset, RESET# must stay active for at least one millisecond after VCC
and BCLK have reached their proper specifications. On observing active
RESET#, all system bus agents will deassert their outputs within two clocks.
RESET# must not be kept asserted for more than 10 ms while PWRGOOD is
asserted.
A number of bus signals are sampled at the active-to-inactive transition of
RESET# for power-on configuration. These configuration options are described
in the Section 7.1.
NOTE: This signal does not have on-die termination and must be terminated on
the system board.
RS[2:0]# Input RS[2:0]# (Response Status) are driven by the response agent (the agent
responsible for completion of the current transaction), and must connect the
appropriate pins of all processor system bus agents.
RSP# Input
RSP# (Response Parity) is driven by the response agent (the agent responsible
for completion of the current transaction) during assertion of RS[2:0]#, the
signals for which RSP# provides parity protection. It must connect to the
appropriate pins of all processor system bus agents.
A correct parity signal is high if an even number of covered signals are low, and
low if an odd number of covered signals are low. While RS[2:0]# = 000, RSP# is
also high, since this indicates it is not being driven by any agent guaranteeing
correct parity.
SKTOCC# Output SKTOCC# (Socket Occupied) will be pulled to ground by the processor. System
board designers may use this pin to determine if the processor is present.
Table 36. Signal Description (Sheet 6 of 8)
Name Type Description
78 Datasheet
Pin Listing and Signal Definitions
SLP# Input
SLP# (Sleep), when asserted in Stop-Grant state, causes the processor to enter
the Sleep state. During Sleep state, the processor stops providing internal clock
signals to all units, leaving only the Phase-Locked Loop (PLL) still operating.
Processors in this state will not recognize snoops or interrupts. The processor
will only recognize the assertion of the RESET# signal, deassertion of SLP#, and
removal of the BCLK input while in Sleep state. If SLP# is deasserted, the
processor exits Sleep state and returns to Stop-Grant state, restarting its internal
clock signals to the bus and processor core units.
SMI# Input
SMI# (System Management Interrupt) is asserted asynchronously by system
logic. On accepting a System Management Interrupt, the processor saves the
current state and enters System Management Mode (SMM). An SMI
Acknowledge t ransaction is issued, and the processor begins program execution
from the SMM handler.
If SMI# is asserted during the deassertion of RESET#, the processor will tristate
its outputs.
STPCLK# Input
Assertion of STPCLK# (S top Clock) causes the processor to enter a low power
S t op-Grant state. The processor issues a S top-Grant Acknowledge transaction
and stops providing internal clock signals to all processor core units except the
system bus and APIC units. The processor continues to snoop bus transactions
and service interrupts while in Stop-Grant state. When STPCLK# is deasserted,
the processor restarts its internal clock to all units and resumes execution. The
assertion of STPCLK# has no effect on the bus clock; STPCLK# is an
asynchronous input.
TCK Input TCK (Test Clock) provides the clock input for the processor Test Bus (also known
as the Test Access Port).
TDI Input TDI (Test Data In) transfers serial test data into the processor. TDI provides the
serial input needed for JTAG specification support.
TDO Output TDO (Test Data Out) transfers serial test data out of the processor . TDO provides
the serial output needed for JTAG specification support.
TESTHI[12:8]
TESTHI[5:0] Input T ES THI[12:8] and TESTH I[5:0] must be connected to a VCC power source
through a resistor for proper processor operation . See Section 2.5 for more
details.
THERMDA Other Thermal Diode Anode. See Section 7.3.1.
THERMDC Other Thermal Diode Cathode. See Section 7.3.1.
THERMTRIP# Output
Assertion of THERMTRIP# (Therm al Trip) indicates that the process or junction
temperature has reached a level where permanent silicon damage may occur .
Measurement of the temperature is accomplished through an internal thermal
sensor that is configured to trip at approximately 135 °C. Upon assertion of
THERMTRIP#, the processor will shut of f its internal clocks (thus halting program
execution) in an attempt to reduce the processor junction temperature. To protect
the processor, its core volt age (VCC) must be removed following the assertion of
THERMTRIP#. See Figure 17 and Table 19 for the appropriate power down
sequence and timing requirements.
For processors with CPUID of 0xF27 and beyond:
• Driving of the THERMTRIP# signal is enabled within 10 µs of the assertion
of PWRGOOD, and is disabled on de-assertion of PWRGOOD. Once
activated, THERMTRIP# remains latched until PWRGOOD is de-asserted.
While the de-assertion of the PWRGOOD signal will de-assert
THERMTRI P#, if the processor’s junction temperature remains at or above
the trip level, THERMTRIP# will again be asserted within 10 µs of the
assertion of PWRGOOD.
TMS Input TMS (Test Mode Select) is a JTAG specification support signal used by debug
tools.
TRDY# Input TRDY# (Target Ready) is asserted by the target to indicate that it is ready to
receive a write or implicit writeback data transfer. TRDY# must connect the
appropriate pins of all system bus agents.
Table 36. Signal Description (S heet 7 of 8)
Name Type Description
Datasheet 79
Pin Listing and Signal Definitions
TRST# Input TRST# (Test Reset) resets the Test Access Port (TAP) logic. TRST# must be
driven low during power on Reset. This can be done with a 680 Ω pull-down
resistor.
VCCA Input VCCA provides isolate d power for the internal processor core PLLs. Refer to
Table 1 for the appropriate Platform Design Guide for details on implementation.
VCCIOPLL Input VCCIOPLL provides isolated power for internal processor system bus PLLs.
Follow the guidelines for VCCA, and refer to the appropriate Plat f orm Design
Guide for details on implementation.
VCC_SENSE Output VCC_SENSE is an isolated low impedance connection to processor core power
(VCC). It can be used to sense or measure power near the silicon with little
noise.
VCCVID Input An independent 1.2 V supply must be routed to VCCVID pin for the Celeron
processor on 0.13 micron process Voltage Identification circuit.
VID[4:0] Output
VID[4:0] (Voltage ID) pins are used to support automatic selection of power
supply voltages (VCC). Unlike previous generations of processors, these are
open drain signals that are driven by the Celeron processor on 0.13 micron
process and must be pulled up to 3.3 V (max.) with 1 kΩ resistors. The voltage
supply for these pins must be valid before the VR can supply VCC to the
processor . Conversely, the VR output must be disabled until the voltage supply
for the VID pins becomes valid. The VID pins are needed to support the
processor voltage specification variations. See Table 3 for definitions of these
pins. The VR must supply the voltage that is requested by the pins, or disable
itself.
VSSA Input VSSA is the isolated ground for internal PLLs.
VSS_SENSE Output V SS_SENSE is an i solated low impedance connection to processor core VSS. It
can be used to sense or measure ground near the silicon with little noise.
Table 36. Signal Description (Sheet 8 of 8)
Name Type Description
80 Datasheet
Pin Listing and Signal Definitions
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Datasheet 81
Thermal Specifications and Design Considerations
6.0 Thermal Specifications and Design Considerations
The Celeron processor on 0.13 micron process has an integrated heat spreader (IHS) for heatsink
attachment that is intended to provide for multiple types of thermal solutions. This section provides
information necessary for development of a thermal solution. See Figure 35 for an exploded view
of an example Celeron processor on 0.13 micron process thermal solution. This is for illustration
purposes. For further thermal solution design details, refer to the Intel® Pentium® 4 Processor in
the 478-pin Package Thermal Design Guidelines.
Note: The processor is shipped either by itself or with a heatsink for boxed processors. See Chap ter 8.0
for details on box ed proces so rs .
Figure 35. Exam ple Thermal Solution (Not to Scale)
Clip Assembly
Fan / Shroud
Heatsink
Reten tion Mec h anis m
Processor
mPGA478B 478-pin Socket
82 Datasheet
Thermal Specifications and Design Considerations
6.1 Processor Thermal Specifications
The Celeron processor 0.13 micron process requires a thermal solution to maintain tem peratur es
within the operating limit s as set forth in Section 6.1.1 . Any attempt to operate the processor
outside these operating limits may result in permanent dama ge to the pr ocessor and potentially
other components in the system. As processor technology changes, thermal management becomes
increasingly crucial when building computer systems. Maintaining the proper thermal environment
is key to reliable, long-term system operation.
A complete thermal solution includes both component and system level thermal management
features. Componen t-level thermal solutions can include active or passive heatsink s attached to the
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of
system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to Intel® Pentium® 4
Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guide.
6.1.1 Thermal Specifications
To allow for the optimal operation and long-term reliabil ity of Intel processor-based sy stem s, the
system/processor thermal solution should be designed such that the processor remains wi thin th e
minimum and maximum case temperature (TC) specifications when operating at or below the
Thermal Design Power (TDP) value listed per frequency in Table 37. Thermal solutions not
designed to provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, refer to the appropriate
processor thermal design guidelines.
The case temperature is defined at the geometric top center of the processor IHS. Analysis
indicates that real applications are unlikely to cause the processor to consume maximum power
dissipation for sustained periods of time. Intel recommends that complete thermal solution designs
target the Thermal Design Power (TDP) indicated in Table 37 instead of the maximum processor
power consumption. The Thermal Monitor feature is intended to help protect the processor in the
unlikely event that an application exceed s the TDP recommendation for a sustained period of time.
For more details on the usage of this feature, refer to Section 7.3. To ensure maximum flexibility
for future requirements, systems should be designed to the Flexible Motherboard (FMB)
guidelines, even if a processor with a lower thermal dissipation is currently planned. In all cases,
the Thermal Monitor feature must be enabled for the processor to remain within
specification.
Multiple VID processors will be shipped either at VID=1.475 V, VID=1.500 V, or VID=1.525 V.
Processors with multiple VIDs have TDP _max of the highest VID for the specified frequency. For
example, for the processors through 2.40 GHz, the TDP would be the one at VID=1.525 V of
57.1 W.
Datasheet 83
Thermal Specifications and Design Considerations
NOTES:
1. These values are specified at VCC_MAX for the processor . Systems must be designed to ensure that the
processor is not subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at
specified ICC. Refer to loadline specifications in Chapter 2.
2. The numbers in this column reflect Intel’s recommended design point and are not indicative of the maximum
power the processor can dissipate under worst case conditions. For more details refer to the
Intel® Pentium
4 Processor in the 478-pin Package Thermal Design Guidelines.
3. Also applies to processors with fixed VID=1.525 V
6.1.2 Thermal Metrology
6.1.2.1 Processor Case Temperature Measurement
The maximum and minimum case temperature (TC) for the Celeron processor on 0.13 micron
process is specified in Table 37. This temperature specification is meant to ensure correct and
reliable operation of the processor. Figur e 36 illustrates where Intel recommends TC thermal
measurements s hould be mad e. For det ailed gui del ines on tem perature measu rement methodol ogy,
refer to the Intel® Pentium® Processor with 512-KB L2 Cache on 0.13 Micron Processor Thermal
Design Guidelines.
Table 37. Processor Thermal Design Power
Processor and Core
Frequency Thermal Design
Power 1,2 (W) Minimum TC
(°C) Maximum TC
(°C) Notes
For Processor with
multip le VIDs:
2 GHz 3
2.10 GHz
2.20 GHz
2.30 GHz
2.40 GHz
2.50 GHz
2.60 GHz
52.8
55.5
57.1
58.3
59.8
61.0
62.6
5
5
5
5
5
5
5
68
69
70
70
71
72
72
Figure 36. Guideline Locations for Case Temperature (TC) Thermocouple Placement
Measure From Edge of Processor
Measure T
at this point.
C
Thermal interfac e material
should cover the entire s urface
of the Integrated Heat Spreader
0.689”
17.5 mm
0.689”
17.5 mm
35 mm x 35 mm Package
84 Datasheet
Thermal Specifications and Design Considerations
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Datasheet 85
Features
7.0 Features
7.1 Power-On Configuration Options
Several configuration options can be configured by hardware. Celeron processor on 0.13 micron
process sample their hardware configuratio n at reset, on the activ e-to-inactive transition of
RESET#. For specifica tio ns on these options, refer to Table 38.
The sampled information configures the processor for subsequent operation. These configuration
options cannot be changed except by another reset. All resets reconfigure the processor. For reset
purposes, the processor does not distinguish between a “warm” reset and a “power-on” reset.
NOTE:
1. Asserting this signal during RESET# will select the corresponding option.
7.2 Clock Control and Low Power States
The use of AutoHALT, Stop-Grant, and Sleep states is allowed in Celeron processor on 0.13
micron process based systems to reduce power consumption by stopping the clock to internal
sections of the processor, depending on each particular state. See Fi gure 37 for a visual
representation of the processor low power states.
7.2.1 Normal State—State 1
This is the normal operating state for the processor.
Table 38. Power-On Configuration Option Pins
Configuration Option Pin1
Output tristate SMI#
Execute BIST INIT#
In Order Queue pipelining (set IOQ depth to 1) A7#
Disable MCERR# observation A9#
Disable BINIT# observation A10#
APIC Cl u ster ID (0-3) A[12:11]#
Disable bus parking A15#
Symmetric agent arbitration ID BR0#
86 Datasheet
Features
7.2.2 AutoHALT Powerdown State—State 2
AutoHALT is a low power state entered when the processor executes the HALT instruction. The
processor will transition to the Normal state upon the occurrence of SMI#, BINIT#, INIT#, or
LINT[1:0] (NMI, INTR). RESET# will cause the processor to immediately initialize its elf.
The return from a System Management Interrupt (SMI) handler can be to either Normal Mode or
the AutoHALT Power Down state. See the Intel® Architecture Software Developer's Manual,
Volume III: System Pr o grammer's Guide for more information.
The system can generate a STPCLK# while the processor is in the AutoHALT Power Down state.
When the system d easserts the STPCLK# interrupt, the processor will return execution to the
HALT state.
While in AutoHALT Power Down state, the processor will process bus snoops and interrupts.
Figure 37. Stop Clock State Machine
2. Auto HALT Power Down State
BCLK ru nning.
Snoops and i nterrupts allowed.
4. HALT/Grant Snoop State
BCLK ru nning.
Service Sno ops to caches.
Snoop
Event
Occurs
Snoop
Event
Serviced
HALT Instruc tion and
HALT B us Cycle generated
INIT#, BINIT#, INTR, NMI,
SMI#, RESET#
Snoop event occurs
Snoop event serviced
1. Normal Sta t e
Normal execution.
3. Stop Grant State
BCLK r unning.
Snoops and interrupts allow ed.
STPCLK#
Asserted STPCLK#
Deasserted
5. Sleep State
BCLK r unning.
No Snoops and i nterr u pts
allowed.
SLP#
Asserted SLP# Deasserted
STPCLK# Asserted
ST PC LK# Deasserted
Datasheet 87
Features
7.2.3 Stop-Grant State—State 3
When the STPCLK# pin is asserted, the Stop-Grant state of the processor is entered 20 bus clocks
after the response phase of the processor-issued Stop-Grant Acknowledge special bus cycle.
Since the AGTL+ signal pins receive power from the system bus, these pins should not be driven
(allowing the level to return to VCC) for minimum power drawn by the termination resistors in this
state. In addition, all other input pins on the system bus should be driven to the inactive state.
BINIT# will not be serviced while the processor is in Stop-Grant state. The event will be latched
and can be serviced by software upon exit from the Stop-Grant state.
RESET# will cause the processor to immediately in itialize itself, but the processor will stay in
Stop-Grant state. A transition back to the Normal state will occur with the de-assertion of the
STPCLK# signal. When re-entering the Stop-Grant state from the Sleep state, STPCLK# should
only be de-asserted one or more bus clocks after the de-assertion of SLP#.
A transition to the HALT/Grant Snoop state will occur when the processor detects a snoop on the
system bus (see Section 7.2 .4). A transition to the Sleep state (s ee Section 7.2.5) will occur with the
assertion of the SLP# signal.
While in the Stop-Grant State, SMI#, INIT#, BINIT# and LINT[1:0] will be latched by the
processor, and only serviced when the processor returns to the Normal State. Only one occurrence
of each event will be recognized upon return to the Normal state.
While in Stop-Grant state, the processor will process snoops on the system bus and it will latch
interrupts delivered on the system b us .
The PBE# signal can be driven when the processor is in Stop-Grant state. PBE# will be asserted if
there is any pending interrupt latched within the processor. Pending interrupts that are blocked by
the EFLAGS.IF bit being clear will sti ll caus e assertio n of PBE#. Assertion of PBE# indicates to
system logic that it should return the processor to the Normal state.
7.2.4 HALT/Grant Snoop State—State 4
The processor will res pond to snoop or interrupt t ransactions on the syst em bus while in Stop-Gran t
state or in AutoHALT Power Down state. During a snoop or interrupt transaction, the processor
enters the HALT/Grant Snoop state. The processor will stay in this state until the snoop on the
system bus has been serviced (whether by the process or or ano ther agent on the system bus) or the
interrupt has been latched. After the snoop is serviced or the interrupt is latched, the processor will
return to the Stop-Grant state or AutoHALT Power Down state, as appropriate.
88 Datasheet
Features
7.2.5 Sleep State—State 5
The Sleep state is a very low power state in which the processor maintains its context, maintains
the phase-locked loop (PLL), and has stopped all internal clocks. The Sleep state can only be
entered from Stop-Grant state. Once in the S top-Grant state, the processor will enter the Sleep state
upon the ass erti on of th e SL P# s i gnal. The SLP# pin s hould be assert ed onl y when the processo r i s
in the Stop Grant state. SLP# assertions while the processor is not in the Stop-Grant state is out of
sp ecification and may result in unapproved opera tion.
Snoop events that occur while in Sleep State or during a transition into or out of Sleep state will
cause unpredictable behavior.
In the Sleep state, the processor is incapable of responding to snoop transactions or latching
interrupt signals. No transitions or assertions of signals (with the exception of SLP# or RESET#)
are allowed on the system bus while the processor is in Sleep state. Any transition on an input
signal before the processor has returned to Stop-Grant state will result in unpredictable behavior.
If RESET# is driven active while the processor is in the Sleep state and held active as specified in
the RESET# pin specification, the processor will reset itself, ignoring the transition through Stop-
Grant State. If RESET# is driven active while the processor is in the Sleep State, the SLP# and
STPCLK# signals should be deasserted immediately after RESET# is asserted to ensure the
processor correctly executes the Reset sequence.
Once in the Sleep state, the SLP# pin must be de-asserted if another asynchronous system bus
event must occur. The SLP# pin has a minimum assertion of one BCLK period.
When the processor is in Sleep state, it will not respond to interrupts or snoop transactions.
7.3 Thermal Monitor
The Thermal Monitor feature helps control the processor temperature by activating the Thermal
Control Circuit (TCC) when the processor silicon reaches its maximum operating temperature. The
TCC reduces processor power consumption by modulating (starting and stopping) the internal
processor core clocks. The Thermal Monitor feature must be enabled for the processor to be
operating within specifications. The temperature at which Thermal Monitor activates the thermal
control circuit is not user configurable and is not software visible. Bus traffic is snooped in the
normal manner, and interrupt requests are latched (and serviced during the time that the clocks are
on) while the TCC is activ e.
When the Thermal Monitor feature is enabled, an d a high temperatu re situation exists (i.e., TCC is
active), the clocks will be modulated by alternately turning the clocks off and on at a duty cycle
specific to the processor (typically 30–50%). Clock s often will no t be off for more than 3.0 µs
when the TCC is active. Cycle times are processor speed dependent and will decrease as processor
core frequencies increase. A small amount of hysteresis has been included to prevent rapid active/
inactive transitions of the TCC when the processor temperature is near its maximum operating
temperature. Once the temperature has dropped below the maximum operating temperature, and
the hysteresis timer has expired, the TCC goes inactive and clock modulation ceases.
With a properly designed and characterized thermal solution, it is anticipated that the TCC would
only be activated for very short periods of time when running the most power intensive
applications. The processor performance impact due to these brief periods of TCC activation is
expected to be so minor that it would be immeasurable. An under -designed thermal solution that is
not able to prevent excessive activation of the TCC in the anticipated ambient environment may
cause a noticeable performance loss, and in some cases may result in a TC that exceeds the
specified maximum temperature and may affect the long-term reliability of the processor. In
Datasheet 89
Features
addition, a thermal solutio n that is significantly under-designed may not be capable of cooling the
processor even when the TCC is active continuously. Refer to the Intel® Pentium® 4 Processor
with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guide for information on
designing a thermal solution.
The duty cycle for the TCC, when activated by the Thermal Monitor, is factory configured and
cannot be modified. The Thermal Monitor does not require any additional hardware, software
drivers, or interrupt handling routines.
The TCC may also be activated via On-Demand mode. If bit 4 of the ACPI Thermal Monitor
Control Register is written to a 1 the TCC will be activated imm e diately, independent of the
processor temperature. When using On-Demand mode to activate the TCC, the duty cycle of the
clock modulation is programmable via bits 3:1 of the same ACPI Thermal Monitor Control
Register. In automatic mode, the duty cycle is fixed, however in On-Demand mode, the duty cycle
can be programmed from 12.5% on/ 87.5% off, to 87.5% on/12.5% off in 12.5% increments. On-
Demand mode may be used while Automatic mode is en abled. However, if the system tries to
enable the TCC via On-Demand mode while automatic mode is enabled and a high temperature
condition exists, the duty cycle of the automatic mode will override the duty cycle selected by the
On-Demand mode.
An external signal, PROCHOT# (processor hot) is asserted when the processor detects that its
temperature is at the thermal trip point. Bus snooping and interrupt latching are also active while
the TCC is active. The temperature at which the thermal control circuit activates is not user
configurable and is not software visible.
Besides the thermal sen sor and TCC, th e Thermal Monitor feature also includes one ACPI re gister,
performance monitoring logic, bits in three model specific registers (MSR), and one I/O pin
(PROCHOT#). All are available to monitor and control the state of the Thermal Monitor feature.
Thermal Monitor can be configured to generate an interrupt upon the assertion or de-assertion of
PROCHOT#.
If automatic mode is disabled, the process or will be operatin g out of sp ecification. Regardless of
enabling of the automatic or On-Demand modes, in the event of a catastrophic cooling failure, the
processor will automatically shut down when the silico n has reached a temperature of
approximately 135 °C. At this point the system bus signal THERMTRIP# will go activ e and stay
active until RESET# has been initiated. THERMTRIP# activation is independent of processor
activity and does not generate any bus cycles. If THERMTRIP# is asserted, processor core voltage
(VCC) must be removed within the time frame defined in Table 19.
90 Datasheet
Features
7.3.1 Thermal Diode
The Celeron processor on 0.13 micron process incorporates an on-die thermal diode. A thermal
sensor located on the system board may monitor the die temperature of the processor for thermal
management/long term die temperature change purposes. Table 39 and Table 40 provi de the diode
parameter and interface specifications. This thermal diode is separate from the Thermal Monitor’s
thermal sensor and cannot be used to predict the behavior of the Thermal Monitor.
NOTES:
1. Intel does not support or recommend operation of the thermal diode under reverse bias.
2. Characterized at 75 °C.
3. Not 100% tested. Specified by design characterization.
4. The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode
equation:
IFW=Is *(e(qVD/nkT) -1)
Where IS = saturation current, q = electronic charge, VD = voltage across the diode, k = Boltzmann Constant,
and T = absolute temperature (Kelvin).
5. The series resistance, RT, is provided to allow for a more accurate measurement of the diode junction
temperature. RT as defined includes the pins of the processor but does not include any socket resistance or
board trace resistance between the socket and the external remote diode thermal sensor. R T can be used by
remote diode thermal sensors with automatic series resistance cancellation to calibrate out this error term.
Another application is that a temperature of fset can be manually calculated and programmed into an offset
register in the remote diode thermal sensors as exemplified by the equation:
Terror = [RT*(N-1)*IFWmin]/[(nk /q )*ln N]
Where Terror = sensor temperature error, N = sensor current ration, k = Boltzmann Constant, q = electronic
charge.
Table 39. Thermal Diode Parameters
Symbol Parameter Min Typ Max Unit Notes1
IFW Forward Bias Current 5300 µA 1
nDiode Ideality Factor 1.0011 1.0021 1.0030 2, 3, 4
RTSeries Resistance 3.64 2, 3, 4
Table 40. Thermal Diode Interface
Pin Name Pin Number Pin Description
THERMDA B3 Diode anode
THERMDC C4 Diode cathode
Datasheet 91
Boxed Processor Specifications
8.0 Boxed Processor Specifications
8.1 Introduction
The Celeron processor on 0.13 micron process will also be offered as an Intel boxed processor.
Intel boxed processors are intended for system integrators that build systems from motherboards
and standard components. The boxed Celeron processor on 0.13 micron process will be supplied
with a cooling solution. This chapter documents motherboard and system requirements for the
cooling solutio n that will be supplied with the boxed Celeron proces sor on 0.13 micron process.
This chapter is particularly important for OEMs that manufacture motherboards for system
integrators. Unless otherwise n oted, all figures in this chapter are dimensioned in millimeters and
inches [in brackets]. F igure 38 shows a mechanical rep resentation of a boxed Celeron process or on
0.13 micron process.
Note: Drawings in this section reflect only the specifications on the Intel boxed processor product. These
dimensions should not be used as a gen eric keep- out zo ne fo r all cooling solutions. It is th e system
designer's responsib ility to consider their proprietary cooling solution wh en designing to the
required keep-out zone on their system platform and chassis. Refer to the Intel
Pentium
4
Processor in the 478-pin Package Thermal Design Guidelines for further guidance.
NOTE: The airflow is into the center and out of the sides of the fan heatsink.
Figure 38. Mechanical Representation of the Boxed Processor
92 Datasheet
Boxed Processor Specifications
8.2 Mechanical Specifications
8.2.1 Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed Celeron processor on
0.13 micron process. The boxed processor will be shipped with an unattached fan heatsink. Figure
38 shows a mechanical representation of the boxed Celeron processor on 0.13 micron process.
Clearance is required aroun d the fan heatsin k to ens ur e unimp eded airf low for pro per coo ling. Th e
physical space requirements and dimensions for the boxed processor with assembled fan heatsink
are shown in F igure 39 (Side Views), and Fi gu re 40 (Top View). The airspace requirements for the
boxed processor fan heat sink mus t also be incorp orated into new mother boar d and system des igns.
Airspace requirements are shown in Figure 43 and Figure 44. Note that some figures have center
lines shown (marked with alphabetic desi gnatio ns) to clarify relative dimensioning.
Figure 39. Side View Space Requirements for the Boxed Processor
Datasheet 93
Boxed Processor Specifications
8.2.2 Boxed Proce ssor Fan Heatsink Weight
The boxed processor fan heatsink will not weigh more than 450 grams. See the Intel
Pentium
4
Processor in the 478-pin Package Thermal Design Guidelines for details on the processor weight
and heatsink requirements.
8.2.3 Boxed Processor Retention Mechanism and Heatsink Assembly
The boxed processor thermal solution requires a processor retention mechanism and a heatsink
attach clip assembly to secure the processor and fan heatsink in the baseboard socket. The boxed
processor will not ship with retention mechanisms but will ship with the heat sink attach clip
assembly. Motherboards designed for use by system integrators should include the retention
mechanism that supports the boxed Celeron processor on 0.13 micron process. Motherboard
documentation shoul d include appropriate retention mechanism installation instructio n s.
Note: The processor retention mechanism based on the Intel reference design should be used to ensure
compatibility with the heatsink attach clip assembly and the boxed processor thermal solution. The
heatsink attach clip assembly is latched to the retention tab features at each corner of the retention
mechanism.
The target load applied by the clips to the processor heat spreader for Intel’s reference design is
75 ±15 lbf (maximum load is constrained by the package load capability). It is normal to observe a
bow or bend in the board due to this compressive load on the processor package and the socket.
Figure 40. Top View Space Requirements for the Boxed Processor
94 Datasheet
Boxed Processor Specifications
The level of bow or bend depends on the motherboard material properties and component layout.
Any additional board stif fening devices (like plates) are not necessary and s hould not be used along
with the reference mechanical components and boxed processor. Using such devices increases the
compressive load on the processor package and socket, likely beyond the maximum load that is
specified for those components. See the Pentium
4 Processor in the 478-pin Package in the
478-pin Package Thermal Design Guidelines for details on the Intel reference design.
Chassis that have adequate clearance between the motherboard and chassis wall (minimum
0.250 inch) should be selected to ensure that the board's underside bend does not contact the
chassis.
8.3 Electrical Requirements
8.3.1 Fan Heatsink Power Supply
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable will be
shipped with the boxed processor to draw power from a power header on the motherboard. The
power cable connector and pinout are shown in Figure 41. Motherboards must provide a matched
power header to support the boxed processor. Table 41 contains specifications for the input and
output signals at the fan heatsink connector. The fan heatsink outputs a SENSE signal, which is an
open-collector output that pulses at a rate of two pulses per fan revolution. A motherboard pull-up
resistor prov i des V OH to match the system board-mounted fan speed monitor requirements, if
applicable. Use of the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the
connector should be tied to GND. Note: The motherboard must supply a constant +12V to the
processor’s power header to ensure proper operation of the variable speed fan for the boxed
processor.
The power header on the baseboard must be positioned to allow the fan heatsink power cable to
reach it. The power header identification and location should be documented in the platform
documentation or on the system board itself. Figure 42 shows the location of the fan power
connector relative to the processo r socket. The motherboard power header should be positioned
within 4.33 inches from the center of the processor socket.
Figure 41. Boxed Processor Fan Heatsink Power Cable Connector Description
Pin Signal
Straight square pin, 3-pi n terminal housing with
polarizing ribs and fri ction locking ramp.
0.100" pi n pi tch, 0.025" square pin width.
Waldom/Molex P/ N 22-01-3037 or equivalent .
Match with straight pin, f ri ction l ock header on motherboard
Waldom/Molex P/N 22-23-2031, AM P P/N 640456-3,
or equiv al ent.
1
2
3
GND
+12 V
SENSE
123
Datasheet 95
Boxed Processor Specifications
NOTE:
1. Motherboard should pull this pin up to VCC with a resistor.
Table 41. Fan Heatsink Power and Signal Specifications
Description Min Typ Max Unit Notes
+12V : 12 volt fan power supply 10.2 12 13.8 V
IC: Fan current draw 740 mA
SENSE: SENSE frequency 2pulses per fan revolution 1
Figure 42. MotherBoard Power Header Placement Relative to Processor Socket
96 Datasheet
Boxed Processor Specifications
8.4 Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution utilized by the boxed
processor.
8.4.1 Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's
temperature specification is also a function of the thermal design of the entire system and is
ultimately the responsib ility of the system integrator. The processor temperature is specified in
Chapte r 6. 0 . Th e bo xed processor fan h eatsink is able to k eep the processor temperatu re within the
specifications (see Table 37) in chassis that provide good thermal management. For the boxed
processor fan heats ink to op erate p rop erly, it is critical that the airflow pro vided to th e fan heatsi nk
is unimpeded. Airflow is into the center and out of the sides of the fan heatsink. Airspace is
required around t he fan to ensur e that the airflo w through t he fan heatsink i s not blocked . Blocking
the airflow to the fan heatsink reduces the cooling efficiency and decreases fan life. Figure 43 and
Figure 44 illustrate an acceptable airspace clearance for the fan heatsink. The air temperature
entering the fan should be kept below 40 °C. Again, meeting the processor's temperature
specification is the responsibility of the system integrator.
Figure 43. Boxed Processor Fan Heatsink Airspace Keep-Out Requirements
(Side 1 View)
Datasheet 97
Boxed Processor Specifications
8.4.2 Variable Speed Fan
The boxed processo r fan will oper ate at different speeds over a short range of internal chass is
temperatures. This allows the processor fan to operate at a lower speed and noise level while
internal chassis temperatures are low. If internal chassis temperature increases beyond a lower set
point, the fan speed will rise lin earl y wit h the internal temperature until the higher set point is
reached. At that point, the fan speed is at its maximum. As fan speed increases, so does fan noise
levels. Systems should be designed to provide adequate air around the boxed processor fan
heatsink that remains below the lower set point. These set points, represented in Figure 45 and
Table 42, can vary by a few degrees from fan heatsink to fan heatsink. The internal chassis
temperature should be kept below 40ºC. Meeting the processor’s temperature specification (see
Chapter 6.0) is the responsibility of the system integrator.
Note: The motherboard must supply a constant +12 V to the processor’s power header to ensure proper
operation of the variable speed fan for the boxed processor.
Figure 44. Boxed Processor Fan Heatsink Airspace Keep-Out Requirements
(Side 2 View)
Figure 45. Boxed Processor Fan Heatsink Set Points
98 Datasheet
Boxed Processor Specifications
NOTE:
1. Set point variance is approximately ±1°C from fan heatsink to fan heatsink
Table 42. Boxed Processor Fan Heatsink Set Points
Boxed Processor Fan
Heatsink Set Point (ºC) Boxed Processor Fan Speed Notes
33 When the internal chassis temperature is below or equal to this set point,
the fan operates at its lowest speed. Recommended maximum internal
chassis temperature for nominal operating environment . 1
40 When the internal chassis temperature is at this point, the fan operates
between its lowest and highest speeds. Recommended maximum
internal chassis temperature for worst-case operating environm ent.
43 When the internal chassis temperature is above or equal to this set point,
the fan operates at its highest speed. 1
Datasheet 99
Debug Tools Specifications
9.0 Debug Tools Specifications
Refer to the ITP700 Debug Port Design Guide and the appropriate Platform Design Guide for
more detailed information regarding debug tools specifications.
9.1 Logic Analyzer Interface (LAI)
Intel is working with two logic analyzer vendors to provide logic analyzer interf aces (LAIs) for use
in debugging Celeron processor on 0.13 micron process systems. Tektronix and Agilent should be
contacted to get specific information about their logic analyzer interfaces. The following
information is general in nature. Specific information must be obtained from the logic analyzer
vendor.
Because of the complexity of Celeron pro cessor on 0.13 micron p rocess systems, the LAI is critical
in providing the ability to probe and capture system bus signals. There are two sets of
considerations to keep in mind when d esigning a Celeron p rocessor o n 0.13 micron process system
that can make use of an LAI: mechanical and electrical.
9.1.1 Mec hanical Considerations
The LAI is installed between the processor socket and the processor. The LAI pins plug into the
socket, while the processor pins plug into a socket on the LAI. Cabling that is part of the LAI
egresses the system to allow an electrical connection between the processor and a logic analyzer.
The maximum volume occupied by the LAI, known as the keep-out volume, as well as the cable
egress restrictions, should be obtained from the logic analyzer vendor. System designers must
make sure that the keep-out volume remains unobstructed inside the system. Note that it is possible
that the keep-out volume reser ved for the LAI may differ from the s pace normally o ccupied b y the
Celeron processor on 0.13 micron process heatsink. If this is the case, the logic analyzer vendor
will provide a cooling solution as part of the LAI.
9.1.2 Elect ric al Considerat ions
The LAI will also affect the electrical performance of the system bus; therefore, it is critical to
obtain electrical load models from each of the logic analyzer vendo rs to allow running system level
simulations to prove that their tool will work in th e system. Contact the logic analyzer vendor for
electrical specifications and load models for the LAI solution they provide.
