General Features
Applications
Part Numbering
Tantalum Capacitor ( SCE Series )
Designed for very low ESR.
- Molded Case available in four case codes.
- Extended Range Values
- Compatible with automatic pick and place equipment.
- Meets or Exceeds EIA standard 535BAAC .
- Suitable for high frequency as high speed PC, Switching Regulators, DC/DC converter,and etc.
- General electronic equipment
- Smoothing Circuit of DC-DC Converters & Out put side of AC-DC Conv erters
- De-Coupling Circuit of High Speed ICs & MPUs
- Various Other High Frequency Circuit Applications
The products have inherently low ESR (equivalent series resistance) and are
capable of higher ripple current handling, producing lower ripple voltages,
less power and heat dissipation than standard product for the most efficient
use of circuit power. SCE series have been designed, manufactured, and
preconditioned for optimum performance in typical power supply applications
Abbreviation of Tantalum Capacitor Capacitance Tolerance
Type of Series Case size
Rated Voltage Packing
Capacitance Tolerance Packing Polarity
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
TC
TC SCE
SCE 1A
1A 107
107 M
MD
DA
AR
R0150
0150
9
9
0
ABBRIVIATION OF TANTALUM CAPACITOR
1
TYPE OF SERIES
2
The symbol shows the type of the capacitor.
SCE : Samsung Capacitor Normal - LOW ESR
RATED VOLTAGE
3
Symbol DC Rated Voltage Symbol DC Rated Voltage
0E 2.5 1C 16
0G 41D 20
0J 6.3 1E 25
1A 10 1V 35
CAPACITANCE
4
CAPACITANCE TOLERANCE
5
CASE SIZE
6
Symbol Capacitance ()Pico Farad ()
105 1.0 10×105
106 10.0 10×106
684 0.68 68×104
475 4.7 47×105
Symbol Tolerance (%)
K±10
M±20
7343D3528B
6032C3216A
EIA CodeCaseEIA CodeCase
PACKING
7
PACKING POLARITY
8
Symbol Inch
A7 inches
C13 inches
Taping and
Reel for Chip
Direction
of Feed
Tape
+ Polarit
y
Mark
RTaping and
Reel for Chip
Direction
of Feed
+ Polarity Mark
LBulk B
APPEARANCE AND DIMENSON
Maximum ESR in Milliohms
9
0
Code EIA Code DIMENSION (mm)
L W1W2H Z
A3216 3.2 ±0.2 1.6 ±0.2 1.2 ±0.1 1.6 ±0.2 0.8 ±0.3
B3528 3.5 ±0.2 2.8 ±0.2 2.2 ±0.1 1.9 ±0.2 0.8 ±0.3
C6032 6.0 ±0.3 3.2 ±0.3 2.2 ±0.1 2.5 ±0.3 1.3 ±0.3
D7343 7.3 ±0.3 4.3 ±0.3 2.4 ±0.1 2.8 ±0.3 1.3 ±0.3
W1 ZZ
W2
L
H
CARACTERISTIC LI NE UP
Standard value and Case size
RELIABILITY T ES T CONDITIO N
-55±2, 240±8hrsCapacitance change : within ±10%
Tan δ, LC : initial spec.
Storage at Low Temperature
85±2, Surge voltage
Charge 30±5s -> Discharge 5.5±0.5min
1000cycle
Charge discharge resiste r :33Ω
Capacitance change : within ±5 %
Tan δ, LC : initial spec.
Surge withstanding
Voltage
1 cycle condition
(Min. operating temperature 25
Max. operating temperature 25)
5 cycle test
Capacitance change : within ±5%
Tan δ, LC : initial spec
Temperature Cycling
With the rated voltage(85)
Max. operating temperature(125 )
2000/-0hrs
Capacitance change : within ±10%
Tan δ:initial spec
LC : 125% or less specified initial value
High Temperature Resistance
100k, maximum 1.0Vrms, maximum
1.5Volt D.C, at 25
Within specified valueImpedance (Z) & ESR
120, maximum 1.0Vrms, maximum
1.5Volt D.C, at 25
Within specified valueTan δ(DF)
120, maximum 1.0Vrms, maximum
1.5Volt D.C, at 25
Within specified toleranceCapacitance
19.6N, for 5±1 secNo peeling shall be occur on the terminal
electrode
Adhesion Strength
From -55to 125,"-55: C/C -10~0%
"+85: C/C 0~10%
"+125: C/C 0~15%
Temperature
Characteristics
The rated DC voltage shall be applied to
terminals across the test capacitor
charge Time: 5 min.
0.01CV or 0.5whichever is greaterLeakage current
Solder pot : 260±5, 10±1sec.Capacitance change : within ±15%
Tan δ, LC : initial spec.
Resistance to Soldering heat
SnAg3.0Cu0.5 solder
:245+/5, 3±0.3sec
(preheating : 80~120for 10~30sec.)
More than 95% of terminal surface is to be
soldered newly
Solderability
Bending to the limit (3mm)
with 1.0mm/sec.
Within specified tolerance
Tan δ, LC : initial spec.
Electrode Strength
40±2, 90~95%RH, 500+8/-0hrsCapacitance change : within ±10%
Tan δ, LC : initial spec.
Moisture Resistance
Amplitude : 1.5mm
From 10Hz to 55Hz (return : 1min.)
2hours ´3 direction (x, y, z)
Capacitance change : within ±5%
Tan δ, LC : initial spec.
Vibration Test
Test conditionPerformanceItem
Reliability Test and Judgment Condition 1
Reliability Test and Judgment Condition 1
RELIABILITY T ES T CONDITIO N
85±2, Surge voltage
Charge 30±5s -> Discharge 5.5±0.5min
1000cycle
Charge discharge resiste r :33Ω
Capacitance change : within ±5 %
Tan δ, LC : initial spec.
Surge withstanding
Voltage
-55±2, 240±8hrsCapacitance change : within ±10%
Tan δ, LC : initial spec.
Storage at Low Temperature
1 cycle condition
(Min. operating temperature 25
Max. operating temperature 25)
5 cycle test
Capacitance change : within ±5%
Tan δ, LC : initial spec
Temperature Cycling
With the rated voltage(85)
Max. operating temperature(125 )
2000/-0hrs
Capacitance change : within ±10%
Tan δ:initial spec
LC : 125% or less specified initial value
High Temperature Resistance
100k, maximum 1.0Vrms, maximum
1.5Volt D.C, at 25
Within specified valueImpedance (Z) & ESR
120, maximum 1.0Vrms, maximum
1.5Volt D.C, at 25
Within specified valueTan δ(DF)
120, maximum 1.0Vrms, maximum
1.5Volt D.C, at 25
Within specified toleranceCapacitance
19.6N, for 5±1 secNo peeling shall be occur on the terminal
electrode
Adhesion Strength
From -55to 125,"-55: C/C -15~0%
"+85: C/C 0~15%
"+125: C/C 0~20%
Temperature
Characteristics
The rated DC voltage shall be applied to
terminals across the test capacitor
charge Time: 5 min.
0.01CV or 0.5whichever is greaterLeakage current
Solder pot : 260±5, 10±1sec.Capacitance change : within ±15%
Tan δ, LC : initial spec.
Resistance to Soldering heat
SnAg3.0Cu0.5 solder
:245+/5, 3±0.3sec
(preheating : 80~120for 10~30sec.)
More than 95% of terminal surface is to be
soldered newly
Solderability
Bending to the limit (3mm)
with 1.0mm/sec.
Within specified tolerance
Tan δ, LC : initial spec.
Electrode Strength
40±2, 90~95%RH, 500+8/-0hrsCapacitance change : within ±10%
Tan δ, LC : initial spec.
Moisture Resistance
Amplitude : 1.5mm
From 10Hz to 55Hz (return : 1min.)
2hours ´3 direction (x, y, z)
Capacitance change : within ±5%
Tan δ, LC : initial spec.
Vibration Test
Test conditionPerformanceItem
Reliability Test and Judgment Condition 3
Reliability Test and Judgment Condition 3
RELIABILITY T ES T CONDITIO N
Table 1 : Maximum Dissipation Factor at Specified Temperatures
4030
2030
1513
1015
1715
1217
97
49
108
610
3627
1827
6045
3045
1210
812
+125(%)+85(%)
+25(%)-55(%)
Maximum Dissipation Factor, %
0.125CV or 6.25
whichever is greater
0.1CV or 5
whichever is greater
-
0.01CV or 0. 5
whichever is greater
+125()+85()-55()
Specified
initial value
Maximum DC Leakage Current,
Table 2 : Maximum DC Leakage Current at Specified Temperatures
PACKAGING
MARKING
A,S CASES
B,T CASES
C,D CASES
Polarity (White)
10
25V
Capacitance Code in ㎌
Rated Voltage
Rated Voltage
33
10V AA A336 33
10V
Capacitance Code in ㎌
Polarity (White)
[SCN,SCS,SCE series] [SCL series]
A336 AA
Polarity (White)
Rated Voltage
(G:4V J:6.3V A:10V C:16V D:20V E:25V V:35V)
Capacitance Code in ㎊
A336
[SCN,SCS,SCE series] [SCL, series]
EMBOSSED PLASTIC TAPE
Right hand
Orientation available
Embossed
Carrier
The tantalum chip capacitors shall be packaged
in tape and reel form for effective use.
- Tape : Semitransparent embossed plastic
- Cover tape : Attached with press, polyester
- The tension of removing the cover tape,
F=1070g
D1
Embossed
D2P0P1P2
B
A
K
t
F
E
W
Removal speed
50mm/sec
15˚
F
Cover Tape
REEL DIMENSION
Case Size
reference 180mm(7") reel 330mm(13") reel
J(Q),K 4,000pcs -
P(R) 3,000pcs -
A(S) , B(T) 2,000pcs 8,000pcs
C,D 500pcs 2,500pcs
Tape
Width A±2
(±0.079) NMin. C±0.5
(±0.020) D±0.5
(±0.020) B±051
(±0.020) t+0.5
(±0.020) R
8mm ø178
(7) ø50
(1.969) ø13
(0.512) ø21
(0.827) 2
(0.079)
10
(0.394) 2
(0.079) 0.99
(0.039)
12mm 14
(0.551)
8mm ø330
(13) ø80
(3.150) ø13
(0.512) ø21
(0.827) 2
(0.079)
10
(0.394) 2
(0.079) 0.99
(0.039)
12mm 14
(0.551)
t
G
C
N
A
DR
B
The voltage derating factor should be as great as possible. Under normal conditions, the operating
voltage should be reduced to 50% or less of the rating. It is recommended that the operating
voltage be 30% or less of the rating, particularly when the tantalum capacitors are used in a low-
impedance circuit (see Figs. 1, 2, and 3).
For circuits in which a switching, charging , discharging, or other momentary current flows, it is
recommended that the operating voltage be 30% or less of the rating, with a resistor connected in
series to limit the current to 300 mA o r less.
When the tantalum capacitors are to be used at an ambient temperature of higher than 85, the
recommended operating range shown in Fig. 3 should not be exceeded.
APPLICATION MANUAL
OPERATING VOLTAGE
The operational attentions to the use of the tantalum capacitors are as follows:
- Electrical
- Environmental
- Conditions for mounting on equipment and circuit boards
- Mechanical vibration, shock
If the tantalum capacitors are used without satisfying any one of these conditions, the probability of
short-circuiting, leakage current, ignition or other problems to occur increases. To avoid such
problems, observe the following precautions when using the tantalum capacitors.
-
Power
supply
circuit
~
+
+
Fig. 1
Power supply filter
IC
+
-
+
Fig. 2
Power supply bypass
OPERATING TEMPERATURE
-40-20020406085100125
-55
100
80
60
40
20
0
Fi
g
.3
RIPPLE
The maximum permissible ripple voltage and current are related to the ratings case size.
Please consult us detail in formations.
Ripple Current
The maximum permissible ripple current, IMAX, is calculated as follows :
ESR(f)
PMAX
IMAX =
where:
IMAX : Maximum permissible capacitor ripple current (Arms).
PMAX : Maximum permissible capacitor power loss (W).
Varies with the ambient temperature and case size.
Calculated according to Table
ESR(f): Capacitor equivalent series resistance ().
Since the ESR(f) value varies with the ripple frequency, however, the following correction must be
made in accordance with the operating frequency (see Fig. 4).
ESR(f) = K·ESR(120)
K : Coefficient for the operating frequency (Fig. 4).
ESR(120) = Tan δ·Xc = 2πfC
Tan δ
where:
ESR(120) : Equivalent series resistance at 120 Hz ().
Xc : Capacitive reactance at 120 Hz ().
C : Electrostatic capacitance at 120 Hz (μF).
f : Operating frequency (Hz).
Table.1 Maximum permissible power loss values (PMAX) by case size
Ambient
temperature ()PMAX
(W)
J P A B C D
25 0.015 0.015 0.030 0.030 0.030 0.050
55 0.010 0.010 0.019 0.019 0.019 0.032
85 0.005 0.005 0.010 0.010 0.010 0.018
Frequency K
120 1.0
400 0.8
1k 0.65
10k 0.50
20k 0.45
40k 0.43
100k 0.40
1M 0.35
10
0.01
0.1
1.0
100 1K 10K 100K 1M
FREQUENCY(Hz)
Fi
g
.4 Correction Coefficient
(
K
)
Table.2 Hz VS K
Ripple Voltage
If an excessive ripple voltage is applied to the tantalum capacitors, their internal temperature
rises due to Joule heat, resulting in the detriment of their reliability.
The tantalum capacitors must be used in such a conditions that the sum of the Working Voltage
and ripple voltage peak values does not exceed the rated voltage (Fig. 5)
Ensure that an reverse voltage due to superimposed voltages is not applied to the capacitors.
The maximum permissible ripple voltage varies with the rated voltage. Ensure that ripple voltage does
not exceed the values shown in Figs 6 and 7. If, however, the capacitors are used at a high
temperature, the maximum permissible ripple voltage must be calculated as follows:
Vrms(at 55) = 0.7 x Vrms(at 25)
Vrms(at 85) = 0.5 x Vrms(at 25)
Vrms(at 125) = 0.3 x Vrms(at 25)
Fig.7 Maximum permissible ripple voltage
(
C,D
)
Frequency(Hz)
100
10
100
100
100
110 100
50V
35V
25V
20V
16V
10V
6.3/7V
4V
2.5V
Fig.6 Maximum permissible ripple voltage
(P,A,B)
Frequency(Hz)
100
10
100
100
100
110 100
50V
35V
25V
20V
16V
10V
6.3/7V
4V
2.5V
Solid tantalum capacitors are polarized device and may be permanently damaged or destroyed, if
connected with the wrong polarity.
The tantalum capacitors must not be operated and changed in reverse mode. And also the
capacitors must not be used in an only AC circuit.
The tantalum capacitor dielectric has a rectifying characteristics. Therefore, when a reverse
voltage is applied to it, a large current flows even at a low reverse voltage.As a result,it may
spontaneously generate heat and lead to shorting.
Make sure that the polarity and voltage is correct when applying a multi-meter or similar testing
instrument to the capacitors because a reverse voltage or overvoltage can be accidentally
applied.
When using the capacitors in a circuit in which a reverse voltage is applied, consult your local
SAMSUNG ELECTRO-MECHANICS agent. If the application of an reverse voltage is
unavoidable, it must not exceed the following values.
At 20°C: 10% of the rated voltage of 1 V, whichever smaller.
At 85°C: 5% of the rated voltage or 0.5 V, whichever smaller.
REVERSE VOLTAGE
RELIABILITY O F T ANTALUM CAPACITORS
General
The failure rate of the tantalum capacitor varies with the digression ratio, ambient temperature, circuit
resistance, circuit application, etc.
Therefore, when proper selectio ns are made so as to afford additional margins, higher reliability can
be derived from the tantalum capacitors. Some examples of actual failure rates are presented below
for your reference.
Failure Rate Cal culation Formula
The tantalum capacitors are designed to work at their basic failure
rates shown in Table 3 that prevail when the rated voltage is applied for 1000 hours at 85.
Table 3 B asic f ailure rat e
Failure rate calculation f ormula
λuse = λ85 x KVxK
R
λuse : Estimated capacitor failure rate under the operating conditions.
λ85 : Basic failure rate (Table 3)
KV : Failure rate correction coefficient by the ambient temperature and derating factor.
KR : Failure rate correction coefficient by the circuit resistance,
which is the series-connected resistance divided by the voltage applied to the capacitor.
This resistance is connected in series when the power supply side is viewed from the capacitor side.
K(derating factor)=operating voltage/rated voltage
Standard typeSCN
Small typeSCS
Low profile typeSCL
Ultra-Miniature type(0603)SCM
Low ESR typeSCE
1%/1000h
Face-down typeSCF
Basic failure rateClassificationTYPE
RELIABILITY PREDICTION
Solid tantalum capacitors exhibit no degration failure mode during shelf storage and show a constantly
decreasing failure rate(i.e. , absence of wearout mechanism) during life tests. this failure rate is
dependent up on three important application conditions:DCvoltage, temperature, and circuit impedance.
Estimates of these respective effects are provided by the reliability nomograph.(Figure 8.)
The nomograph relates failure rate to voltage and temperature while the table relates failure rate to
impedance. These estimates apply to steady-state DC condition, and they assume usage within all
other rated conditions.
Standard conditions, which produce a unity failure rate factor, are rated voltage, +85, and 0.1 ohm-
per-volt impedance.
While voltage and temperature are straight-forward, there is sometimes difficulty in determining
impedance. What is required is the circuit impedance seen by the capacitor. If several capacitors are
connected in parallel, the impedance seen by each is lowered by the source of energy stored in the
other capacitors. Energy is similarly stored in series inductors.
Voltage "de-rating" is a common and useful approach to improved reliability. It can be persued too far,
however , when it leads to installation of higher voltage capacitors of much larger size.
It is possible to lose more via higher
inherent failure rate than is gained by
voltage derating. SAMSUNG typically
recommends 50% derating, especially in
low impedance circuits.
Failure rate is conventionally expressed in
units of percent per thousand hours. As a
sample calculation, suppose a particular
batch of capacitors has a failure rate of
0.5% / Khr under standard conditions.
What would b e t he p re dict ed f ailure rate at
0.7times rated voltage, 60and 0.6/V?
The nomgraph gives a factor of 7 ×10-2 and
the tabl e giv e s a fa ct or of 0 .4 .
The failure rate estimate is then :
0.5 ×7 ×10-2 ×0.4
= 1.4 ×10-2 or 0.014%/Khr
TFV
Connect the temperature
and applied voltage ratio
of interest with a straight
edge. The multiplier of
failure rate is given at the
inersection of this
line with the model scale.
Given T1&v1 Read Failure
Rate Multiplier F1
Given T, & F2
Read Reguired Voltage V2
Given F3 & V3
Read Allowable Temp T3
120
110
100
90
80
70
60
50
40
30
20
10
2
10
1
10
0
10
-1
10
-2
10
-3
10
-4
10
-5
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Fig.8 Reliability Nomograph
MOUNTING PRECAUTIONS
Circuit Impedance
(ohms/volt) Failure Rate Impedance
(multiplying factor)
0.1 1.0
0.2 0.8
0.4 0.6
0.6 0.4
0.8 0.3
1.0 0.2
2.0 0.1
3orgreater 0.07
Table 4 Circuit Impedance Reliability Factors
Limit Pressure on Capacitor Installation with Mounter
A capacitor that has been damaged should be discarded to avoid later problems resulting from
mechanical stress.
Pressure must not exceed 4.9 N with a tool end diameter of 1.5mm when applied to the
capacitors using an absorber, centering tweezers, or the like. An excessively low absorber setting
position would result in not only the application of undue force to the capacitors but capacitor and
other component scattering,circuit board wiring breakage, and / or cracking as well, particularly
when the capacitors are mounted together with other chips having a height of 1 mm or less.
Flux
Select a flux that contains a minimum of chlorine and amine.
After flux use, the chlorine and amine in the flux remain and must therefore be removed.
Recommended Soldering Pattern Dimensions
Pattern
y
xz
L
Capacitor
x
W
Fig. 9
Table 4 Recommended soldering pattern dimensions(mm)
Chip Soldering Temperature and Time
Capacitors are capable of withstanding the following soldering temperatures and conditions;
Waved soldering
Capacitor body temperature : 230℃∼ 260
Time : 5 seconds or less
Reflow solderin g see figures
100
200
100 200 300
Time(sec)
Cooling
260Max
Temp.
Pre-heating
Heating
400
3.82.62.34.37.3D,W
2.42.42.33.25.8C,V
1.42.21.62.83.5B,T
1.21.21.61.63.2A,S
0.81.11.21.252.0P,R
0.71.00.90.851.6J,Q,K
zyxWL
Pattern dimensions
Capacitors size
Dimensions
Case
Recommend Temperature : 235~ 245
(With Pb-free products, if used under 235, the quality confirmation must be needed.)
Soldering with a soldering iron
The use of a soldering iron should be avoided wherever possible. If it is
unavoidable, follow the instructions set forth in Table 5. The time of soldering with an iron
should be one.
Table 5
Cleaning afte r Mounting
The following solvents are usable when cleaning the capacitors after mounting. Never use
a highly active solve nt .
- Halogen organic solvent (HCFC225, etc.)
- Alcoholic solvent (IPA, ethanol, etc.)
- Petroleum solvent, alkali saponifying agent, water, etc.
Circuit board cleaning must be conducted at a temperature of not higher than 50°C and for
an immersion time of not longer than 30 minutes. When an ultrasonic cleaning method is
used, cleaning must be conducted at a frequency of 48 kHz or lower, at an vibrator output
of 0.02 W/cm3, at a temperature of not higher than 40°C, and for a time of 5 minutes or shorter.
NOTE 1: Care must be exercised in cleaning process so that the mounted capacitor will not come
into contact with any cleaned object or the like or will not get rubbed by a stiff brush or
the like. If such precautions are not taken particularly when the ultrasonic cleaning
method is employed, terminal breakage may occur.
NOTE 2: When performing ultrasonic cleaning under conditions other than stated above, conduct
adequate advance checkout.
OTHER
For further details, refer to EIAJ RCR-2368, Precautions and Guidelines for Using Electronic Device
Tantalum Capacitors.
If you have any questions, feel free to contact your local SAMSUNG ELECTRO-MECHANICS agent.
30 W MAX
Solderi n g-iro n p ow er
3 sec MAX
Time
350MAX
Solderi ng-iro n tip t emp erat ure
All case
Type