Approval sheet
Page 7 of 9 ASC_MR_V07 Jan.2013
TEST AND REQUIREMENTS
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 60068-1, sub-clause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
REQUIREMENTS
TEST PROCEDURE / TEST METHOD Resistance 0Ω
ΩΩ
Ω
Electrical Characteristics
JISC5201-1: 1998
Clause 4.8
-
DC resistance values measurement
-
Temperature Coefficient of Resistance (T.C.R)
Natural resistance change per change in degree centigrade.
( )
6
121
12 10×
−
ttR RR
(ppm/°C) t
1
: 20°C+5°C-1°C
R
1
: Resistance at reference temperature
R
2
: Resistance at test temperature
Within the specified tolerance
Refer to “QUICK REFERENCE DATA”
Resistance to soldering
heat (R.S.H)
MIL-STD-202
method 210
Un-mounted chips completely immersed for 10±1second in a
SAC solder bath at 270℃±5ºC ∆R/R max. ±(0.5%+0.05Ω)
No visible damage <50mΩ
Solderability
J-STD-002
a) Bake the sample for 155 ℃dwell time 4hrs/ solder dipping
235℃/ 5sec.
b) Steam the sample dwell time 1 hour/ solder dipping
260℃/ 7sec.
95% coverage min., good tinning and
no visible damage
Temperature cycling
JESD22
method JA-104
1000 cycles, -55℃ ~ +155℃, dwell time 5~10min ∆R/R max. ±(0.5%+0.05Ω)
No visible damage <50mΩ
Moisture Resistance
MIL-STD-202
method 106
65±2°C, 80~100% RH, 10 cycles, 24 hours/ cycle
∆R/R max. ±(0.5%+0.05Ω)
No visible damage <50mΩ
Bias Humidity
MIL-STD-202
method 103
1000+48/-0 hours; 85°C, 85% RH, 10% of operation power ∆R/R max. ±(1%+0.05Ω)
No visible damage <50mΩ
Operational Life
MIL-STD-202 method
108
1000+48/-0 hours; 35% of operation power, 125±2°C ∆R/R max. ±(1%+0.05Ω)
No visible damage <50mΩ