(1,27mm) .050"
CLP SERIES
High reliability
Tiger Claw™ contacts
CLP–110–02–F–D–P
CLP–130–02–L–D CLP–116–02–F–DH
CLP–116–02–L–D
Surface
Mount
Low Profi le
(2,21mm)
.087"
(1,27mm x 1,27mm)
.050" x .050"
micro pitch
Suitable for pass-through
applications
WWW.SAMTEC.COM
1OTHER
OPTION
PLATING
OPTION
02 thru 50
NO. PINS
PER ROW
CLP 02
–BE
= Bottom Entry
(Required for bottom entry
applications)
–A
= Alignment Pin
(Not available with –PA option)
(5, 10, 25 position only)
(–DH option and other sizes.
Call Samtec)
–K
= (4,00mm) .157" DIA Polyimide
fi lm Pick & Place Pad
(5 positions min.)
–P
= Pick & Place Pad
(5 positions min. –D only)
(Not always necessary
for auto placement.
See Flex Processing.)
–PA
= Pick & Place Pad
with Alignment Pin
(–D only)
(Not Available with –A option)
–TR
= Tape & Reel
Mates with:
FTSH, FTS,
FW, FFDL2
ROW
OPTION
–D
= Double
Row
–DH
= Double
Horizontal
(Requires
FTSH or
FSH –01
lead style)
Single row available.
(Mates with FTS Series)
Call Samtec.
Single row options available.
Call Samtec.
APPLICATION
SPECIFIC OPTION
ALSO
AVAILABLE
No. of Positions
x (1,27) .050 + (0,43) .017
(1,27)
.050
(1,27)
.050 (0,41)
.016
(3,05)
.120
(4,57)
.180
(4,32)
.170
(2,44)
.096
(6,35)
.250
x
(3,18)
.125
99
100
01
02
(2,26)
.089
(3,43)
.135
(0,89)
.035 DIA
(7,00)
.275
(3,00)
.118
(1,40)
.055
(8,25)
.325
A
A
(3,56) .140
(7,11) .280
PIN/ROW
04-15
16-50
For complete specifi cations and
recommended PCB layouts
see www.samtec.com?CLP
Insulator Material:
Black Liquid Crystal
Polymer
Contact Material:
Phosphor Bronze
Plating: Sn or Au over
50µ" (1,27µm) Ni
Current Rating:
1.75A @ 80°C ambient
Operating Temp Range:
-55°C to +125°C
Contact Resistance:
10 mΩ max
Insertion Depth:
Top Entry = (1,40mm) .055"
minimum, Bottom Entry =
(2,41mm) .095" minimum
plus board thickness
DH Entry = (2,31mm) .091"
to (2,67mm) .105"
Insertion Force:
(Single contact only)
3.8oz (1,05N) average
Normal Force:
60 grams (0,59N) average
Withdrawal Force:
(Single contact only)
2oz (0,56N) average
Max Cycles:
100 with 10µ" (0,25µm) Au
RoHS Compliant:
Ye s
Processing:
Lead-Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10mm) .004" max (02-35)
(0,15mm) .006" max (36-50)
–DH
–PA OPTION
–D
–P OPTION
F-211
If odd pins/row, alignment
pins are on middle position
on centerline of the part.
If even pins/row, then
alignment pins are between
middle two positions.
–F
= Gold fl ash on
contact, Matte
Tin on tail
–L
= 10µ" (0,25µm)
Gold on contact,
Matte Tin on tail
–G
= 10µ" (0,25µm)
Gold
(–D only)
Note: Some sizes, styles and
options are non-standard,
non-returnable.
SPECIFICATIONS
5,13mm Stack Height
Single-Ended Signaling 7.0 GHz / 14 Gbps
Differential Pair Signaling 8.5 GHz / 17 Gbps
Performance data for other stack heights and complete
test data available at www.samtec.com?CLP
or contact sig@samtec.com
Rated @ 3dB Insertion Loss
1,27mm FTSH/CLP
17,7mm Stack Height
Single-Ended Signaling 3.0 GHz / 6.0 Gbps
Differential Pair Signaling 4.0 GHz / 8.0 Gbps
Performance data for other stack heights and complete
test data available at www.samtec.com?CLP
or contact sig@samtec.com
Rated @ 3dB Insertion Loss
1,27mm FW/CLP
LOW PROFILE DUAL WIPE SOCKET
PASS-THRU
APPLICATIONS
HORIZONTAL
CLP FTSH
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 30µ" Gold
TM
Call Samtec for maximum cycles
Note: Other Gold plating
options available.
Contact Samtec.
