MIL-M-38510/16A
21 April 2005____
SUPERSEDING
MIL-M-38510/16(USAF)
15 May 1973
MILITARY SPECIFICATION
MICROCIRCUITS, DIGITAL, TTL, AND GATES, MONOLITHIC SILICON
This specification is approved for use by all Depart-
ments and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic, silicon, TTL, positive AND logic gating
microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided for each
type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been
superseded by MIL-PRF-38535, (see 6.4).
1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.
1.2.1 Device types. The device types are as follows:
Device type Circuit
01 Quadruple, 2-input positive AND gate
02 Quadruple, 2-input positive AND gate (open collector output)
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
A GDFP5-F14 or CDFP6-F14 14 Flat pack
B GDFP4-F14 14 Flat pack
C GDIP1-T14 or CDIP2-T14 14 Dual-in-line
D GDFP1-F14 or CDFP2-F14 14 Flat pack
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43218-3990, or emailed to
bipolar@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at http://assist.daps.dla.mil.
AMSC N/A FSC 5962
Inactive for new design after 7 September 1995.
INCH-POUND
MIL-M-38510/16A
2
1.3 Absolute maximum ratings.
Supply voltage range ...................................................... -0.5 V dc to +7.0 V dc
Input voltage range ......................................................... -1.5 V dc at -12 mA to +5.5 V dc
Storage temperature range ............................................ -65°C to +150°C
Maximum power dissipation per gate, (PD) 1/ ............. 50 mW dc
Lead temperature (soldering 10 seconds) ...................... 300°C
Thermal resistance, junction-to-case (θJC)...................... (See MIL-STD-1835)
Junction temperature (TJ ) 2/ .......................................... 175°C
1.4 Recommended operating conditions.
Supply voltage ................................................................ 4.5 V dc minimum to 5.5 V dc maximum
Maximum high level input voltage .................................. 5.0 V dc
Minimum high level input voltage ................................... 2.0 V dc
Maximum low level input voltage .................................... 0.8 V dc
Minimum low level input voltage ..................................... 0.0 V dc
Normalized fanout (each output) 3/ ................................ 10 maximum
Case operating temperature range (TC ) ......................... -55°C to 125°C
2.0 APPLICABLE DOCUMENT
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification.
This section does not include documents cited in other sections of this specification or recommended for
additional information or as examples. While every effort has been made to ensure the completeness of this
list, document users are cautioned that they must meet all specified requirements of documents cited in
sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and standards. The following specifications and standards form a part of this specification to
the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard for Microelectronics.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or
http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
_______
1/ Must withstand the added PD due to short circuit condition (e.g. IOS) at one output for 5 seconds duration.
2/ Maximum junction temperature should not be exceeded except in accordance with allowable short
duration burn-in screening condition in accordance with MIL-PRF-38535.
3/ Device will fanout in both high and low levels to the specified number of inputs of the same device type
as that being tested.
MIL-M-38510/16A
3
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract award (see 4.3 and 6.3).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be
as specified in MIL-PRF-38535 and herein.
3.3.1 Logic diagram and terminal connections. The logic diagram and terminal connections shall be as specified
on figure 1.
3.3.2 Truth tables and logic equations. The truth tables and logic equations shall be as specified on figure 2.
3.3.3 Schematic circuit. The schematic circuit shall be maintained by the manufacturer and made available to the
qualifying activity and the preparing activity upon request.
3.3.4 Case outlines. Case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. Lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table 1
and apply over the full recommended case operating temperature range, unless otherwise specified.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group
number 1 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535
or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall
not effect the form, fit, or function as described herein.
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.3 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior
to qualification and conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test
circuit shall be maintained under document control by the device manufacturer's Technology Review
Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or
preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical
parameters test prior to burn-in is optional at the discretion of the manufacturer.
c. Additional screening for space level product shall be as specified in MIL-PRF-38535.
MIL-M-38510/16A
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TABLE I. Electrical performance characteristics.
Limits Units
Test Symbol Conditions
-55°C ≤ TC ≤ +125°C
unless otherwise specified
Device
type Min Max
High-level output voltage VOH VCC = 4.5 V, VIN = 2.0 V
IOH = -800 µA for all inputs
of gate under test 1/
01 2.4 V
Low-level output voltage VOL VCC = 4.5 V, IOL = 16 mA
VIN = 0.8 V for all inputs
of gate under test 1/
All 0.4 V
Input clamp voltage VIC VCC = 4.5 V, IIN = -12 mA
TC = 25°C
All -1.5 V
Maximum collector
cut-off current
ICEX VCC = 4.5 V, VIN = 2.0 V
VOH = 5.5 V
02 250
µA
High-level input current
IIH1 V
CC = 5.5 V, VIN = 2.4 V 2/ All 40 µA
High-level input current
IIH2 VCC = 5.5 V, VIN = 5.5 V 2/ All 100 µA
Low-level input current
IIL VCC = 5.5 V, VIN = 0.4 V 1/ All -0.7 -1.6 mA
Short-circuit output current
IOS VCC = 5.5 V 1/ 3/ 01 -20 -55 mA
High-level supply current ICCH VCC = 5.5 V 1/
VIN = 5.5 V
All 21 mA
Low-level supply current ICCL VCC = 5.5 V 2/
VIN = 0 V
All 33 mA
01 3 32 ns Propagation delay time,
high-to-low-level
tPHL CL = 50 pF, RL = 390 Ω
02 3 38 ns
01 3 40 ns Propagation delay time,
low-to-high-level
tPLH CL = 50 pF, RL = 390 Ω
02 3 49 ns
1
/ All unspecified inputs at 5.5 V.
2
/ All unspecified inputs grounded.
3
/ Not more than one output should be shorted at a time.
MIL-M-38510/16A
5
TABLE II. Electrical test requirements.
Subgroups (see table III)
MIL-PRF-38535
Test requirement
Class S
Devices
Class B
Devices
Interim electrical parameters
1 1
Final electrical test parameters
1*, 2, 3, 9 1*, 2, 3, 9
Group A test requirements
1, 2, 3, 9,
10, 11
1, 2, 3, 9,
Group B electrical test parameters
when using the method 5005 QCI option
1, 2, 3 N/A
Groups C end point electrical parameters 1, 2, 3
1, 2, 3
Additional electrical subgroups for
Group C periodic inspections
None 10, 11
Group D end point electrical parameters 1, 2, 3 1, 2, 3
*PDA applies to subgroup 1.
4.4 Technology Conformance Inspection (TCI). Technology conformance inspection shall be in accordance with
MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as
follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 4, 5, 6, 7, and 8 shall be omitted.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as
follows:
a. End point electrical parameters shall be as specified in table II herein.
b. Subgroups 3 and 4 shall be added to the group C inspection requirements for class B devices and shall
consist of the tests, conditions, and limits specified for subgroups 10 and 11 of group A.
c. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit
shall be maintained under document control by the device manufacturer's Technology Review Board (TRB)
in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon
request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in
accordance with the intent specified in test method 1005 of MIL-STD-883.
4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End-point
electrical parameters shall be as specified in table II herein.
4.5 Methods inspection. Methods of inspection shall be as specified in the appropriate tables and as follows:
4.5.1 Voltage and current. All voltages given are referenced to the microcircuit ground terminal. Currents given
are conventional current and positive when flowing into the referenced terminal.
MIL-M-38510/16A
6
FIGURE 1. Logic diagram and terminal connections (top view).
Device types 01 and 02
Truth table (each gate)
Input Output
A B Y
L L L
H L L
L H L
H H H
Positive logic Y = AB
FIGURE 2. Truth table and logic equations.
MIL-M-38510/16A
7
FIGURE 3. Schematic circuits for device type 01.
MIL-M-38510/16A
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FIGURE 3. Schematic circuits for device type 02.
MIL-M-38510/16A
9
FIGURE 3. Schematic circuits for device type 02- Continued.
MIL-M-38510/16A
10
NOTES:
1. The generator has the following characteristics: tP = 0.5 µs, PRR = 1 MHz and ZOUT ≈ 50 Ω.
2. CL includes probe and jig capacitance.
3. All diodes are 1N3064 or equivalent.
Figure 5. Switching time test circuit.
TABLE III. Group A inspection for device type 01.
Terminal conditions (pins not designated are open)
Cases 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Test limits
A,B,C,D
Subgroup Symbol MIL-
STD-883
method Test No. 1A 1B 1Y 2A 2B 2Y GND 3Y 3A 3B 4Y 4A 4B
VCC
Meas.
terminal Min Max Unit
VOL
“
“
“
“
“
“
“
3007
“
“
“
“
“
“
“
1
2
3
4
5
6
7
8
0.8 V
5.5 V
“
“
“
“
“
“
5.5 V
0.8 V
5.5 V
“
“
“
“
“
16 mA
16 mA
5.5 V
5.5 V
0.8 V
5.5 V
“
“
“
“
5.5 V
5.5 V
5.5 V
0.8 V
5.5 V
“
“
“
16 mA
16 mA
GND
“
“
“
“
“
“
“
16 mA
16 mA
5.5 V
“
“
“
0.8 V
5.5 V
“
“
5.5 V
“
“
“
“
0.8 V
5.5 V
“
16 mA
16 mA
5.5 V
“
“
“
“
“
0.8 V
5.5 V
5.5 V
“
“
“
“
“
“
0.8 V
4.5V
“
“
“
“
“
“
“
1Y
1Y
2Y
2Y
3Y
3Y
4Y
4Y
0.4
“
“
“
“
“
“
“
V
VOH
“
“
“
3006
“
“
“
9
10
11
12
2.0 V
5.5 V
“
“
2.0 V
5.5 V
“
“
-.8 mA “
2.0 V
5.5 V
5.5 V
“
2.0 V
5.5 V
5.5 V
-.8 mA
“
“
“
“
-.8 mA
“
“
2.0 V
5.5 V
“
“
2.0 V
5.5 V
-.8 mA
5.5 V
“
“
2.0 V
5.5 V
“
“
2.0 V
“
“
“
“
1Y
2Y
3Y
4Y
2.4
“
“
“
“
“
“
“
IOS
“
“
“
3011
“
“
“
13
14
15
16
“ “ GND
5.5 V
5.5 V
GND
“
“
“
“
GND
5.5 V
5.5 V
GND
5.5 V
5.5 V
5.5 V
“
“
“
1Y
2Y
3Y
4Y
-20
“
“
“
-55
“
“
“
mA
“
“
“
IIH1
“
“
“
“
“
“
“
3010
“
“
“
“
“
“
“
17
18
19
20
21
22
23
24
2.4 V
GND
“
“
“
“
“
“
GND
2.4 V
GND
“
“
“
“
“
GND
GND
2.4 V
GND
“
“
“
“
GND
“
“
2.4 V
GND
“
“
“
“
“
“
“
“
“
“
“
GND
“
“
“
2.4 V
GND
“
“
GND
“
“
“
“
2.4 V
GND
“
GND
“
“
“
“
“
2.4 V
GND
GND
“
“
“
“
“
“
2.4 V
“
“
“
“
“
“
“
“
1A
1B
2A
2B
3A
3B
4A
4B
40
“
“
“
“
“
“
“
µA
“
“
“
“
“
“
“
IIH2
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
25
26
27
28
29
30
31
32
5.5 V
GND
“
“
“
“
“
“
“
5.5 V
GND
“
“
“
“
“
“
“
5.5 V
GND
“
“
“
“
“
“
“
5.5 V
GND
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
5.5 V
GND
“
“
“
“
“
“
“
5.5 V
GND
“
“
“
“
“
“
“
5.5 V
GND
GND
“
“
“
“
“
“
5.5 V
“
“
“
“
“
“
“
“
1A
1B
2A
2B
3A
3B
4A
4B
100
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
IIL
“
“
“
“
“
“
“
3009
“
“
“
“
“
“
“
33
34
35
36
37
38
39
40
0.4 V
5.5 V
“
“
“
“
“
“
5.5 V
0.4 V
5.5 V
“
“
“
“
“
5.5 V
5.5 V
0.4 V
5.5 V
5.5 V
“
“
“
5.5 V
“
“
0.4 V
5.5 V
“
“
“
“
“
“
“
“
“
“
“
5.5 V
“
“
“
0.4 V
5.5 V
“
“
5.5 V
“
“
“
“
0.4 V
5.5 V
“
5.5 V
“
“
“
“
“
0.4 V
5.5 V
5.5 V
“
“
“
“
“
“
0.4 V
“
“
“
“
“
“
“
“
1A
1B
2A
2B
3A
3B
4A
4B
-0.7
“
“
“
“
“
“
“
-1.6
“
“
“
“
“
“
“
mA
“
“
“
“
“
“
“
ICCH 3005 41 “ “ “ “ “ “ “ 5.5 V 5.5 V “
VCC 21 “
ICCL 3005 42 GND GND GND GND “ GND GND GND GND “ VCC 33 “
1
TC = 25°C
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
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“
“
“
“
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“
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“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
"
VIC
“
“
“
“
“
“
"
43
44
45
46
47
48
49
50
-12 mA
-12 mA
-12 mA
-12 mA
“
“
“
“
“
“
“
“
-12 mA
-12 mA
-12 mA
-12 mA
4.5 V
“
“
“
“
“
“
“
1A
1B
2A
2B
3A
3B
4A
4B
-1.5
“
“
“
“
“
“
“
V
“
“
“
“
“
“
“
2 Same tests, terminal conditions and limits as subgroup 1, except TC = 125°C and VIC tests are omitted.
3 Same tests, terminal conditions and limits as subgroup 1, except TC = -55°C and VIC tests are omitted.
MIL
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38510/16A
11
TABLE III. Group A inspection for device type 01. – Continued.
Terminal conditions (pins not designated are open)
Cases 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Test limits
A,B,C,D
Subgroup Symbol MIL-
STD-883
method Test No. 1A 1B 1Y 2A 2B 2Y GND 3Y 3A 3B 4Y 4A 4B
VCC
Meas.
terminal Min Max Unit
tPHL
“
“
“
3003
(Fig 5)
“
“
51
52
53
54
IN 2.4 V OUT
IN
2.4 V
OUT
GND
“
“
“
OUT
IN
2.4 V
OUT
IN
2.4 V
5.0 V
“
“
“
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
3
“
“
“
25
“
“
“
ns
“
“
“
9
TC = 25°C
“
“
“
“
“
“
tPLH
“
“
“
“
“
“
“
55
56
57
58
IN 2.4 V OUT
IN
2.4 V
OUT
“
“
“
“
OUT
IN
2.4 V
OUT
IN
2.4 V
“
“
“
“
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
“
“
“
“
31
“
“
“
“
“
“
“
tPHL
“
“
“
“
“
“
“
59
60
61
62
IN 2.4 V OUT
IN
2.4 V
OUT
“
“
“
“
OUT
IN
2.4 V
OUT
IN
2.4 V
“
“
“
“
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
“
“
“
“
32
“
“
“
“
“
“
“
10
TC = 125°C
“
“
“
“
“
“
tPLH
“
“
“
“
“
“
“
63
64
65
66
IN 2.4 V OUT
IN
2.4 V
OUT
“
“
“
“
OUT
IN
2.4 V
OUT
IN
2.4 V
“
“
“
“
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
“
“
“
“
40
“
“
“
“
“
“
“
tPHL
“
“
“
“
“
“
“
67
68
69
70
IN 2.4 V OUT
IN
2.4 V
OUT
“
“
“
“
OUT
IN
2.4 V
OUT
IN
2.4 V
“
“
“
“
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
“
“
“
“
32
“
“
“
“
“
“
“
11
TC = -55°C
“
“
“
“
“
“
tPLH
“
“
“
“
“
“
“
71
72
73
74
IN 2.4 V OUT
IN
2.4 V
OUT
“
“
“
“
OUT
IN
2.4 V
OUT
IN
2.4 V
“
“
“
“
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
“
“
“
“
40
“
“
“
“
“
“
“
MIL
-
M
-
38510/16A
12
TABLE III. Group A inspection for device type 02.
Terminal conditions (pins not designated are open)
Cases 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Test limits
A,B,C,D
Subgroup Symbol MIL-
STD-883
method Test No. 1A 1B 1Y 2A 2B 2Y GND 3Y 3A 3B 4Y 4A 4B
VCC
Meas.
terminal Min Max Unit
VOL
“
“
“
“
“
“
“
3007
“
“
“
“
“
“
“
1
2
3
4
5
6
7
8
0.8 V
5.5 V
“
“
“
“
“
“
5.5 V
0.8 V
5.5 V
“
“
“
“
“
16 mA
16 mA
5.5 V
5.5 V
0.8 V
5.5 V
“
“
“
“
5.5 V
“
“
0.8 V
5.5 V
“
“
“
16 mA
16 mA
GND
“
“
“
“
“
“
“
16 mA
16 mA
5.5 V
“
“
“
0.8 V
5.5 V
“
“
5.5 V
“
“
“
“
0.8 V
5.5 V
“
16 mA
16 mA
5.5 V
“
“
“
“
“
0.8 V
5.5 V
5.5 V
“
“
“
“
“
“
0.8 V
4.5 V
“
“
“
“
“
“
“
1Y
1Y
2Y
2Y
3Y
3Y
4Y
4Y
0.4
“
“
“
“
“
“
“
V
“
“
“
“
“
“
“
ICEX
“
“
“
9
10
11
12
2.0 V
5.5 V
“
“
2.0 V
5.5 V
“
“
5.5 V “
2.0 V
5.5 V
5.5 V
“
2.0 V
5.5 V
5.5 V
5.5 V
“
“
“
“
5.5 V
“
“
2.0 V
5.5 V
“
“
2.0 V
5.5 V
5.5 V
“
“
“
2.0 V
5.5 V
“
“
2.0 V
“
“
“
“
1Y
2Y
3Y
4Y
250
"
"
"
µA
“
“
“
IIH1
“
“
“
“
“
“
“
3010
“
“
“
“
“
“
“
13
14
15
16
17
18
19
20
2.4 V
GND
“
“
“
“
“
“
GND
2.4 V
GND
“
“
“
“
“
GND
GND
2.4 V
GND
“
“
“
“
GND
“
“
2.4 V
GND
“
“
“
“
“
“
“
“
“
“
“
GND
“
“
“
2.4 V
GND
“
“
GND
“
“
“
“
2.4 V
GND
“
GND
“
“
“
“
“
2.4 V
GND
GND
“
“
“
“
“
“
2.4 V
5.5 V
“
“
“
“
“
“
“
1A
1B
2A
2B
3A
3B
4A
4B
40
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
IIH2
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
21
22
23
24
25
26
27
28
5.5 V
GND
“
“
“
“
“
“
“
5.5 V
GND
“
“
“
“
“
“
“
5.5 V
GND
“
“
“
“
“
“
“
5.5 V
GND
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
5.5 V
GND
“
“
“
“
“
“
“
5.5 V
GND
GND
“
“
“
“
“
“
5.5 V
GND
“
“
“
“
“
“
“
5.5 V
“
“
“
“
“
“
“
“
1A
1B
2A
2B
3A
3B
4A
4B
100
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
IIL
“
“
“
“
“
“
“
3009
“
“
“
“
“
“
“
29
30
31
32
33
34
35
36
0.4 V
5.5 V
“
“
“
“
“
“
5.5 V
0.4 V
5.5 V
“
“
“
“
“
5.5 V
5.5 V
0.4 V
5.5 V
“
“
“
“
5.5 V
“
“
0.4 V
5.5 V
“
“
“
“
“
“
“
“
“
“
“
5.5 V
“
“
“
0.4 V
5.5 V
“
“
5.5 V
“
“
“
“
0.4 V
5.5 V
“
5.5 V
“
“
“
“
“
0.4 V
5.5 V
5.5 V
“
“
“
“
“
“
0.4 V
“
“
“
“
“
“
“
“
1A
1B
2A
2B
3A
3B
4A
4B
-0.7
“
“
“
“
“
“
“
-1.6
“
“
“
“
“
“
“
mA
“
“
“
“
“
“
“
ICCL 3005 37 GND GND GND GND “ GND GND GND GND “ VCC 33 “
ICCH 3005 38 5.5 V 5.5 V 5.5 V 5.5 V “ 5.5 V 5.5 V 5.5 V 5.5 V “ VCC 21 “
1
TC = 25°C
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
“
VIC
“
“
“
“
“
“
“
39
40
41
42
43
44
45
46
-12 mA
-12 mA
-12 mA
-12 mA
“
“
“
“
“
“
“
“
-12 mA
-12 mA
-12 mA
-12 mA
4.5 V
“
“
“
“
“
“
“
1A
1B
2A
2B
3A
3B
4A
4B
-1.5
“
“
“
“
“
“
“
V
“
“
“
“
“
“
“
2 Same tests, terminal conditions and limits as subgroup 1, except TC = 125°C and VIC tests are omitted.
3 Same tests, terminal conditions and limits as subgroup 1, except TC = -55°C and VIC tests are omitted.
MIL
-
M
-
38510/16A
13
TABLE III. Group A inspection for device type 02. – Continued.
Terminal conditions (pins not designated are open)
Cases 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Test limits
A,B,C,D
Subgroup Symbol MIL-
STD-883
method Test No. 1A 1B 1Y 2A 2B 2Y GND 3Y 3A 3B 4Y 4A 4B
VCC
Meas.
terminal Min Max Unit
tPHL
“
“
“
3003
(Fig 5)
47
48
49
50
IN 2.4 V OUT
IN
2.4 V
OUT
GND
“
“
“
OUT
IN
2.4 V
OUT
IN
2.4 V
5.0 V
“
“
“
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
3
“
“
“
33
“
“
“
ns
“
“
“
9
TC = 25°C
“
“
“
“
“
“
tPLH
“
“
“
51
52
53
54
IN 2.4 V OUT
IN
2.4 V
OUT
“
“
“
“
OUT
IN
2.4 V
OUT
IN
2.4 V
“
“
“
“
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
“
“
“
“
39
“
“
“
“
“
“
“
tPHL
“
“
“
55
56
57
58
IN 2.4 V OUT
IN
2.4 V
OUT
“
“
“
“
OUT
IN
2.4 V
OUT
IN
2.4 V
“
“
“
“
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
“
“
“
“
38
“
“
“
“
“
“
“
10
TC = 125°C
“
“
“
“
“
“
tPLH
“
“
“
59
60
61
62
IN 2.4 V OUT
IN
2.4 V
OUT
“
“
“
“
OUT
IN
2.4 V
OUT
IN
2.4 V
“
“
“
“
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
“
“
“
“
49
“
“
“
“
“
“
“
tPHL
“
“
“
63
64
65
66
IN 2.4 V OUT
IN
2.4 V
OUT
“
“
“
“
OUT
IN
2.4 V
OUT
IN
2.4 V
“
“
“
“
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
“
“
“
“
38
“
“
“
“
“
“
“
11
TC = -55°C
“
“
“
“
“
“
tPLH
“
“
“
67
68
69
70
IN 2.4 V OUT
IN
2.4 V
OUT
“
“
“
“
OUT
IN
2.4 V
OUT
IN
2.4 V
“
“
“
“
1A to 1Y
2A to 2Y
3A to 3Y
4A to 4Y
“
“
“
“
49
“
“
“
“
“
“
“
MIL
-
M
-
38510/16A
14
MIL-M-38510/16A
15
5. PACKAGING
5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the
contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel,
these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging
requirements are maintained by the Inventory Control Point's packaging activity within the Military Service or Defense
Agency, or within the military service's system command. Packaging data retrieval is available from the managing
Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the
responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but it is not mandatory)
6.1 Intended use. Microcircuits conforming to this specification are intended for logistic support of existing
equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a. Title, number, and date of the specification.
b. PIN and compliance identifier, if applicable (see 1.2).
c. Requirements for delivery of one copy of the conformance inspection data pertinent to the device
inspection lot to be supplied with each shipment by the device manufacturer, if applicable.
d. Requirement for certificate of compliance, if applicable.
e. Requirements for notification of change of product or process to acquiring activity in addition to
notification to the qualifying activity, if applicable.
f. Requirements for failure analysis (including required test condition of method 5003), corrective action and
reporting of results, if applicable.
g. Requirements for product assurance options.
h. Requirements for carriers, special lead lengths or lead forming, if applicable. These requirements shall
not affect the part number. Unless otherwise specified, these requirements will not apply to direct
purchase by or direct shipment to the Government.
i. Requirements for "JAN" marking.
j. Packaging requirements (see 5.1).
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which
are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not
such products have actually been so listed by that date. The attention of the contractors is called to these
requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal
Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for
the products covered by this specification. Information pertaining to qualification of products may be obtained from
DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43123-1199.
6.4 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the
available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M-
38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements
now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have
been retained to avoid adversely impacting existing government logistics systems and contractor's parts lists.
MIL-M-38510/16A
16
6.5 Abbreviations, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined
in MIL-PRF-38535 and MIL-HDBK-1331, and as follows:
GND .................................................. Electrical ground (common terminal)
V
IN ..................................................... Voltage level at an input terminal
V
IC ..................................................... Input clamp voltage
I
IN ...................................................... Current-flowing into an input terminal
6.6 Logistic support. Lead materials and finishes (see 3.3) are interchangeable. Unless otherwise specified,
microcircuits acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material
and finish A (see 3.4). Longer lead lengths and lead forming shall not affect the part number.
6.7 Substitutability. The cross-reference information below is presented for the convenience of users.
Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry
microcircuit types may not have equivalent operational performance characteristics across military temperature
ranges or reliability factors equivalent to MIL-M-35810 device types and may have slight physical variations in relation
to case size. The presence of this information should not be deemed as permitting substitution of generic-industry
types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535.
Device type Commercial type
01 5408
02 5409
6.8 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect
to the previous issue due to the extensiveness of the changes.
Custodians: Preparing activity:
Army - CR DLA - CC
Navy - EC
Air Force - 11 (Project 5962-2105)
DLA - CC
Review activities:
Army - MI, SM
Navy - AS, CG, MC, SH, TD
Air Force - 03, 19, 99
NOTE: The activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using the
ASSIST Online database at http://assist.daps.dla.mil.
