1
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Specications are subject to change
NMC-P Series
Multilayer Ceramic Chip Capacitors
Temperature Coefcient NPO X7R
Capacitance Range 5pF ~ 0.22μF 180pF ~ 10μF
Capacitance Tolerance
For 2.2pF ~ 10pF: ±0.1pF (B), ±0.25pF (C),
±0.5pF (D), ±1pF (F)
Above 10pF: ±1% (F), ±2% (G), ±5% (J),
±10% (K)
±10% (K) & ±20% (M)
Operating Temperature Range -55°C ~ +125°C
Temperature Characteristics ±30ppm/°C ±15% ∆ Cap.
Rated Voltages 16Vdc, 25Vdc, 50Vdc, 100Vdc, 200Vdc, 250Vdc, 500Vdc, 630Vdc, 1KVdc, 2Kvdc,
3Kvdc & 5Kvdc
Q or Dissipation Factor Q = > 1000 (more then 30pF)*
Q = > 400 + 20 x C in pF (30pF and below)*
2.5% max.@1KHz,
1.0V ± 0.2Vrms
insulation Resistance 10,000Megohm or 500Megohm/μF whichever is less @ +25°C
Dielectric Withstanding Voltage
200% of rated voltage for 5 seconds, 50mA max. (16V ~ 250V)
150% of rated voltage for 5 seconds, 50mA max. (500V ~ 630V)
120% of rated voltage for 5 seconds, 50mA max. (1KV ~ 5KV)
FEATURES
• CRACK RESISTANT TERMINATION
• SOFT TERMINATION, OPEN MODE FAILURE
• WIDE VOLTAGE RANGE (16V TO 5KV)
• HIGH CAPACITANCE (UP TO 10mF)
• RoHS COMPLIANT
• SAC SOLDER COMPATIBLE**
**Reow soldering is recommended. Contact NIC regarding the use of other soldering methods.
Base layer (Cu 50V ~ 250V)
(Ag 500V ~ up) Flexible layer (Polymer)
Barrier layer (Ni)
Finish layer (Sn)
CONSTRUCTION
Termination Separation
(Open Failure Mode)
OPEN MODE FAILURE AS A RESULT OF BENDING STRESS
*Test Frequency & Voltage: Up to 100pF 1MHz/1.0Vrms, Above 100pF 1KHz/1.0Vrms
NMC-P 1206 X7R 105 K 50 TRP or TRPLP F
RoHS Compliant
Tape & Reel (Plastic Carrier)
Tape & Reel (Punched Carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF, rst 2 digits are
signicant, 3rd digit is no. of zeros
Temperature Characteristic (NPO or X7R)
Size Code (see chart)
Series
PART NUMBER SYSTEM
*See Part Number System for Details
RoHS
Compliant
Includes all homogeneous materials
2
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Specications are subject to change
NMC-P Series
Multilayer Ceramic Chip Capacitors
NPO VALUES AND SIZES (mm)
EIA Case Size 0603 0805 1206 1210
Length (L) 1.60 ± 0.1 2.00 ± 0.2 3.20 ± 0.3 3.20 ± 0.30
Width (W) 0.80 ± 0.1 1.25 ± 0.25 1.60 ± 0.2 2.50 ± 0.20
Thickness max. (T) 0.90 max. 1.45 max. 1.80 max. 2.60 max.
Termination Width (P) 0.15 min. 0.20 min. 0.30 min. 0.30 min.
Capacitance Working Voltage (Vdc)
200 16 25 50 200 250 500 16 25 50 200 250 500 1K 2K 3K 16 25 50 200 250 500
5.0
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
0.001μF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01μF
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.1μF
3
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Specications are subject to change
NPO VALUES AND SIZES (mm)
EIA Case Size 1808 1812 1825 2220
Length (L) 4.60 ± 0.3 4.60 ± 0.3 4.60 ± 0.3 5.70 ± 0.4
Width (W) 2.00 ±0.2 3.20 ±0.3 6.35 ±0.4 5.00 ±0.4
Thickness max. (T) 2.20 max. 3.00 max. 2.60 max. 3.00 max.
Termination Width (P) 0.30 min. 0.30 min. 0.30 min. 0.30 min.
Capacitance Working Voltage (Vdc)
1K 2K 3K 5K 16 25 50 1K 2K 3K 250 500 1K 1K 5K
5.0
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
0.001μF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01μF
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.1μF
0.12
0.15
0.22
NMC-P Series
Multilayer Ceramic Chip Capacitors
4
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Specications are subject to change
X7R LOW VOLTAGE VALUES AND SIZES (mm)
EIA Case Size 0805 1206 1210 1812 1825 2220 2225
Length (L) 2.00 ± 0.2 3.20 ± 0.3 3.20 ± 0.3 4.60 ± 0.3 4.60 ± 0.3 5.70 ± 0.4 5.70 ± 0.4
Width (W) 1.25 ± 0.25 1.60 ± 0.2 2.50 ± 0.2 3.20 ± 0.3 6.35 ± 0.4 5.00 ± 0.4 6.35 ± 0.4
Thickness max. (T) 1.45 max. 1.80 max. 2.60 max. 3.00 max. 2.60 max. 3.00 max. 3.00 max.
Termination Width (P) 0.20 min. 0.30 min. 0.30 min. 0.30 min. 0.30 min. 0.30 min. 0.30 min
Capacitance Working Voltage (Vdc)
50 100 50 100 50 100 50 100 50 100 50 100 50 100
0.1μF
0.15
0.22
0.33
0.47
0.68
1.0μF
1.5
2.2
3.3
4.7
6.8
10μF
NMC-P Series
Multilayer Ceramic Chip Capacitors
X7R HIGH V0LTAGE VALUES AND SIZES (mm)
EIA Case Size 0805 1206 1210
Length (L) 2.00 ± 0.2 3.20 ± 0.3 3.20 ± 0.3
Width (W) 1.25 ± 0.25 1.60 ± 0.2 2.50 ± 0.2
Thickness max. (T) 1.45 max. 1.80 max. 2.60 max.
Termination Width (P) 0.20 min. 0.30 min. 0.30 min.
Capacitance Working Voltage (Vdc)
200 250 500 200 250 500 630 1K 200 250 500 1K
180pF
220
270
330
390
470
560
680
0.001μF
0.0015μF
0.0022μF
0.0027μF
0.0033μF
0.0039μF
0.0047μF
0.0056μF
0.0068μF
0.01μF
0.012μF
0.015μF
0.018μF
0.022μF
0.027μF
0.033μF
0.039μF
0.047μF
0.056μF
0.068μF
0.1μF
0.12μF
0.15μF
0.18μF
0.22μF
5
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Specications are subject to change
PP
L
W
T
100% Sn over Ni barrier
X7R HIGH V0LTAGE VALUES AND SIZES (mm)
EIA Case Size 1808 1812 1825 2220 2225
Length (L) 4.60 ± 0.3 4.60 ± 0.3 4.60 ± 0.3 5.70 ± 0.4 5.70 ± 0.4
Width (W) 2.0 ± 0.2 3.2 ± 0.3 6.35 ± 0.4 5.00 ± 0.4 6.35 ± 0.4
Thickness max. (T) 2.20 max. 3.00 max. 2.60 max. 3.00 max. 3.00 max.
Termination Width (P) 0.30 min. 0.30 min. 0.30 min. 0.30 min. 0.30 min.
Capacitance Working Voltage (Vdc)
500 1K 2K 3K 200 250 500 1K 2K 3K 250 500 1K 250 500 1K 2K 250 500 1K
150pF
180
220
270
330
390
470
560
680
0.001μF
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.01μF
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.1μF
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
1.0μF
1.5
2.2
NMC-P Series
Multilayer Ceramic Chip Capacitors
6
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Specications are subject to change
Taping Specications
EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm)
REEL DIMENSIONS (mm)
7 INCH REEL QUANTITIES*
*Quantity dependent on chip thickness. Contact NIC for reel
quantities on larger diameter reels.
Notes:
1. Specications are in compliance with EIA RS481-1-A
“Taping of surface Mount Components for Automatic Placement”
2. Dimensions Ao (max.) equals component width dimension plus 0.5mm
3. Dimension Bo (max.) equals component length dimension plus 0.5mm
PUNCHED CARRIER TAPE DIMENSIONS (mm)
Type AoBoWF E P1 P0 D0 T1
max.
T2
max.
Mounting
Hole
0603 1.1 ± 0.2 1.9 ± 0.2
8.0 ± 0.3 3.5 ± 0.05 1.75 ± 0.1 4.0 ± 0.10 4.0 ± 0.1 1.5
+0.1/-0.0 1.1 1.4
Angular
Punch
Hole
0805 1.65 ± 0.2 2.4 ± 0.2
1206 2.0 ± 0.2 3.6 ± 0.2
Size 0603 0805 1206 1210 1812
Tape Size 8mm 8mm 8mm 8mm 12mm
Min. Qty
Per Reel 4,000 4,000 4,000 2,000 1,000
Max. Qty
Per Reel 4,000 5,000 5,000 5,000 2,000
Multilayer Ceramic Chip Capacitors
Reel Diameter (A) B C D T max.
7” (178 ± 2.0)
13 ± 0.5
50 min.
21 ± 1.0
8.4 +1.0/-0
(1812 case size
12.4 +2.0/-0)
10” (250 ± 2.0) 100 ± 1.0
13” (330 ± 2.0) 100 ± 1.0
C
B
T
A
REEL
D
Tape Size WF E P0P2D K max. T max. P
8mm 8.0 ± 0.2 3.5 ± 0.05 1.75 ± 0.10 4.0 ± 0.1 2.0 ± 0.5 1.5 +0.1
-0.0 3.0 2.0 4.0 ± 0.1
12mm 12 ± 0.2 5.5 ± 0.05 4.5 8.0 ± 0.1
Parts with a thickness of >1mm will be taped on embossed
plastic carrier. Parts with a thickness of less then 1mm
will be taped on paper carrier
CARRIER TAPE MATERIAL
EMBOSSED PLASTIC CARRIER TAPE
K
T
DP
o
W
F
A
o
P
B
o
E
P
2
See notes 2 & 3 regarding dimensions
Ao and Bo
t2
t1
DP
o
W
F
A
o
P1
Component
Pitch
B
o
E
PUNCHED CARRIER TAPE