1C3D06065A Rev. B
C3D06065A
Silicon Carbide Schottky Diode
Z-Rec®
Features
Benets
Applications
Package
Maximum Ratings (T
Symbol Parameter Value Unit Test Conditions Note
V 650 V
V 650 V
V 650 V
19
9
6
A
T
T
T
30
ATP
TP
63
49 AT
T
540
460 ATP
TP
Ptot
T
T
TJ -55 to
+175
1
Part Number Package Marking
VRRM = 650 V
IF (TC=135˚C) = 9 A
Qc
2C3D06065A Rev. B
8
12
16
20
Reverse Leakage Current, I
RR (mA)
T
J
= 175 °C
T
J
= 125 °C
T
J
= 75 °C
T
= 25
°
C
0
4
0 100 200 300 400 500 600 700 800 900 1000
Reverse Leakage Current, I
Reverse Voltage, VR(V)
T
J
= -55 °C
T
J
= 25
°
C
Electrical Characteristics
Symbol Parameter Typ. Max. Unit Test Conditions Note
V
V = 6 A TJ
= 6 A TJ
R
40
160 VR = 650 V TJ
VR = 650 V TJ
Q 15
VR = 6 A
it
TJ
VRJ
VRJ
VRJ
E VR = 400 V
Thermal Characteristics
Symbol Parameter Typ. Unit Note
Rθ
Typical Performance
6
8
10
12
14
Foward Current, I
F
(A)
TJ= -55 °C
TJ= 25 °C
TJ= 75 °C
TJ= 175 °C
TJ= 125 °C
0
2
4
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Foward Current, I
Foward Voltage, V
F
(V)
IF (A)
VF (V) VR (V)
IR (mA)
3C3D06065A Rev. B
30
40
50
60
70
IF
(A)
10% Duty
20% Duty
30% Duty
50% Duty
70% Duty
DC
0
10
20
25 50 75 100 125 150 175
TC(°C)
40
50
60
70
80
90
100
P
TOT
(W)
0
10
20
30
25 50 75 100 125 150 175
TC(°C)
Typical Performance
10
15
20
25
Capacitive Charge, Q
C
(nC)
Conditions:
TJ= 25 °C
0
5
0 100 200 300 400 500 600 700
Capacitive Charge, Q
Reverse Voltage, V
R
(V)
150
200
250
300
350
Capacitance (pF)
Conditions:
T
J
= 25 °C
F
test
= 1 MHz
V
test
= 25 mV
0
50
100
0 1 10 100 1000
Capacitance (pF)
Reverse Voltage, V
R
(V)
IF(peak) (A)
TC ˚C TC ˚C
PTot (W)
C (pF)
VR (V)
QC (nC)
VR (V)
4C3D06065A Rev. B
2
3
4
5
6
Capacitance Stored Energy, E
C
(µ
µ
µ
µJ)
0
1
2
0 100 200 300 400 500 600 700
Capacitance Stored Energy, E
Reverse Voltage, V
R
(V)
Typical Performance
100
1,000
I
FSM
(A)
TJ= 25 °C
TJ= 110 °C
10
10E-6 100E-6 1E-3 10E-3
Time, tp(s)
tp (s)
IFSM (A)
VR (V)
EC(mJ)
100E-3
1
Thermal Resistance (oC/W)
0.5
0.3
0.1
0.05
0.02
0.01
SinglePulse
1E-3
10E-3
1E-6 10E-6 100E-6 1E-3 10E-3 100E-3 1
Time, t
p
(s)
0.01
Thermal Resistance (˚C/W)
T (Sec)
5C3D06065A Rev. B
POS Inches Millimeters
Min Max Min Max
A
E
G
H
J
P
Q
S
T
V
X
Y
A
C
E
D
G
H
B
J
L
M
N
F
P
Q
S
T U
V
W
X
Y
M in M ax M in M ax
A .395 .410 10.033 10.414
B .235 .255 5.969 6.477
C .102 .112 2.591 2.845
D .337 .337 8.560 8.560
E .590 .610 14.986 15.494
F .149 .153 3.785 3.886
G 1.127 1.147 28.626 29.134
H .530 .550 13.462 13.970
J
L .028 .036 .711 .914
M .045 .055 1.143 1.397
N .195 .205 4.953 5.207
P .170 .180 4.318 4.572
Q .048 .054 1.219 1.371
S 3° 5° 3° 5°
T 3° 5° 3° 5°
U 3° 5° 3° 5°
V .100 .110 2.54 2.794
W .014 .021 .356 .533
X 3° 5° 3° 5°
Y .395 .410 10.033 10.414
Z .130 .150 3.302 3.810
Inc h es
M illim eters
P OS
R 0.010 R 0.254
1 2
Z
Package Dimensions
Recommended Solder Pad Layout
Part Number Package Marking
Note: Recommended soldering proles can be found in the applications note here:
66 C3D06065A Rev. B
Copyright © 2015 Cree, Inc. All rights reserved.
The information in this document is subject to change without notice.
Cree, the Cree logo, and Zero Recovery are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5451
www.cree.com/power
• RoHSCompliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the
threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/
EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or
from the Product Documentation sections of www.cree.com.
• REAChCompliance
REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA)
has published notice of their intent to frequently revise the SVHC listing for the foreseeable future,please contact a Cree represen-
tative to insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is
also available upon request.
• This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body
nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited
toequipmentusedintheoperationofnuclearfacilities,life-supportmachines,cardiacdebrillatorsorsimilaremergencymedical
equipment,aircraftnavigationorcommunicationorcontrolsystems,orairtrafccontrolsystems.
Notes
• Cree SiC Schottky diode portfolio: http://www.cree.com/diodes
• Schottky diode Spice models: http://response.cree.com/Request_Diode_model
• SiC MOSFET and diode reference designs: http://response.cree.com/SiC_RefDesigns
RelatedLinks
Diode Model
VT
RT
Diode Model CSD04060
Vf T = VT + If*RT
VT= 0.965 + (Tj * -1.3*10-3)
RT= 0.096 + (Tj * 1.06*10-3)
Note: Tj = Diode Junction Temperature In Degrees Celsius,
valid from 25°C to 175°C
T = VT T
VT J -3
RT J -4
