
MC10EP57, MC100EP57
http://onsemi.com
10
PACKAGE DIMENSIONS
QFN−20, 4x4, 0.5P
CASE 485E
ISSUE B
2.88
20X
0.35
20X
0.58
4.30
0.50
DIMENSIONS: MILLIMETERS
1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
PITCH
PKG
OUTLINE
DIM MIN MAX
MILLIMETERS
D4.00 BSC
E4.00 BSC
A0.80 1.00
b0.20 0.30
e0.50 BSC
L1 0.00 0.15
A3 0.20 REF
A1 --- 0.05
L0.35 0.45
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
D2
E2
1
6
11
20
D2 2.60 2.90
E2 2.60 2.90
e
L1
DETAIL A
L
OPTIONAL CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPDEXPOSED Cu
OPTIONAL CONSTRUCTIONS
A
B
E
D
2X
0.15 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.15 C
A
A1
(A3)
0.08 C
0.10 C
CSEATING
PLANE
SIDE VIEW
DETAIL B
BOTTOM VIEW
b
20X
0.10 B
0.05
AC
CNOTE 3
DET AIL A
K0.20 REF
0.10 BAC
L20X
0.10 BAC
K
4.30
2.88
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