AOT12N60/AOTF12N60 600V,12A N-Channel MOSFET General Description Product Summary The AOT12N60 & AOTF12N60 have been fabricated using an advanced high voltage MOSFET process that is designed to deliver high levels of performance and robustness in popular AC-DC applications. By providing low RDS(on), Ciss and Crss along with guaranteed avalanche capability these parts can be adopted quickly into new and existing offline power supply designs. VDS ID (at VGS=10V) 700V@150 12A RDS(ON) (at VGS=10V) < 0.55 100% UIS Tested 100% Rg Tested For Halogen Free add "L" suffix to part number: AOT12N60L & AOTF12N60L TO-220 Top View G TO-220F D G D G D S S S Absolute Maximum Ratings TA=25C unless otherwise noted Parameter AOT12N60 Symbol Drain-Source Voltage VDS 600 Gate-Source Voltage 30 Continuous Drain Current VGS TC=25C TC=100C AOTF12N60 V 12 ID Units V 12* 9.7 9.7* A Pulsed Drain Current C IDM 48 Avalanche Current C IAR 5.5 A Repetitive avalanche energy C EAR 450 mJ Single plused avalanche energy G Peak diode recovery dv/dt TC=25C Power Dissipation B Derate above 25oC Junction and Storage Temperature Range Maximum lead temperature for soldering purpose, 1/8" from case for 5 seconds Thermal Characteristics Parameter Maximum Junction-to-Ambient A,D EAS dv/dt 900 5 mJ V/ns W PD 50 2.2 0.4 TJ, TSTG -55 to 150 W/ oC C 300 C TL Symbol RJA RCS AOT12N60 65 AOTF12N60 65 Units C/W 0.5 0.45 -2.5 C/W C/W Maximum Case-to-sink A Maximum Junction-to-Case RJC * Drain current limited by maximum junction temperature. Rev5: March 2010 278 www.aosmd.com Page 1 of 6 AOT12N60/AOTF12N60 Electrical Characteristics (TJ=25C unless otherwise noted) Symbol Parameter Conditions Min ID=250A, VGS=0V, TJ=25C 600 Typ Max Units STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage BVDSS /TJ Zero Gate Voltage Drain Current IDSS Zero Gate Voltage Drain Current IGSS Gate-Body leakage current VDS=0V, VGS=30V Gate Threshold Voltage VDS=5V ID=250A VGS(th) ID=250A, VGS=0V, TJ=150C V 700 ID=250A, VGS=0V V/ oC 0.65 VDS=600V, VGS=0V 1 VDS=480V, TJ=125C 10 100 3 A 4 4.5 n V 0.55 1 V RDS(ON) Static Drain-Source On-Resistance VGS=10V, ID=6A 0.46 gFS Forward Transconductance VDS=40V, ID=6A 20 VSD Diode Forward Voltage IS=1A,VGS=0V IS Maximum Body-Diode Continuous Current 12 A ISM Maximum Body-Diode Pulsed Current 48 A DYNAMIC PARAMETERS Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Rg Gate resistance 1400 1751 2100 pF VGS=0V, VDS=25V, f=1MHz 130 164 200 pF 10 13 16 pF VGS=0V, VDS=0V, f=1MHz 2.5 3.3 5 40 50 nC SWITCHING PARAMETERS Qg Total Gate Charge Qgs Gate Source Charge Qgd Gate Drain Charge tD(on) Turn-On DelayTime tr Turn-On Rise Time tD(off) Turn-Off DelayTime tf trr Turn-Off Fall Time Qrr S 0.72 VGS=10V, VDS=480V, ID=12A 9 11 nC 17.9 22 nC 39 50 ns VGS=10V, VDS=300V, ID=12A, RG=25 70 85 ns 122 150 ns 74 90 ns IF=12A,dI/dt=100A/s,VDS=100V 311 373 5.2 6.2 ns C Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge IF=12A,dI/dt=100A/s,VDS=100V A. The value of R JA is measured with the device in a still air environment with T A =25C. B. The power dissipation PD is based on TJ(MAX)=150C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150C, Ratings are based on low frequency and duty cycles to keep initial TJ =25C. D. The R JA is the sum of the thermal impedence from junction to case R JC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300 s pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=150C. The SOA curve provides a single pulse ratin g. G. L=60mH, IAS=5.5A, VDD=150V, RG=25, Starting TJ=25C THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev5: March 2010 www.aosmd.com Page 2 of 6 AOT12N60/AOTF12N60 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 30 100 10V VDS=40V 25 -55C 6.5V 10 6V ID(A) ID (A) 20 15 125C 10 1 5 25C VGS=5.5V 0 0.1 0 5 10 15 20 25 30 2 4 VDS (Volts) Fig 1: On-Region Characteristics 1.0 8 10 Normalized On-Resistance 3 0.8 RDS(ON) ( ) 6 VGS(Volts) Figure 2: Transfer Characteristics 0.6 VGS=10V 0.4 0.2 2.5 VGS=10V ID=6A 2 1.5 1 0.5 0 0 5 10 15 20 25 -100 ID (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage -50 0 50 100 150 200 Temperature (C) Figure 4: On-Resistance vs. Junction Temperature 1.0E+01 1.2 40 125C 1.0E-01 IS (A) BVDSS (Normalized) 1.0E+00 1.1 1 1.0E-02 25C 1.0E-03 0.9 1.0E-04 1.0E-05 0.8 -100 -50 0 50 100 150 200 TJ (C) Figure 5:Break Down vs. Junction Temparature Rev5: March 2010 www.aosmd.com 0.0 0.2 0.4 0.6 0.8 1.0 VSD (Volts) Figure 6: Body-Diode Characteristics (Note E) Page 3 of 6 AOT12N60/AOTF12N60 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 15 10000 VDS=480V ID=12A 12 Ciss Capacitance (pF) VGS (Volts) 1000 9 6 Coss 100 10 3 Crss 0 1 0 10 20 30 40 50 Qg (nC) Figure 7: Gate-Charge Characteristics 60 100 0.1 1 10 VDS (Volts) Figure 8: Capacitance Characteristics 100 100 10s RDS(ON) limited 1ms 1 10ms DC TJ(Max)=150C TC=25C 0.1 RDS(ON) limited 10 100s ID (Amps) ID (Amps) 10 1 1ms TJ(Max)=150C TC=25C 0.1 0.01 10s 100s DC 10ms 0.1s 1s 0.01 1 10 100 1000 1 10 100 1000 VDS (Volts) VDS (Volts) Figure 9: Maximum Forward Biased Safe Operating Area for AOT12N60 (Note F) Figure 10: Maximum Forward Biased Safe Operating Area for AOTF12N60 (Note F) 14 Current rating ID(A) 12 10 8 6 4 2 0 0 25 50 75 100 125 150 TCASE (C) Figure 11: Current De-rating (Note B) Rev5: March 2010 www.aosmd.com Page 4 of 6 AOT12N60/AOTF12N60 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS Z JC Normalized Transient Thermal Resistance 10 1 D=Ton/T TJ,PK=TC+PDM.ZJC.RJC RJC=0.45C/W In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 0.1 PD Ton 0.01 T Single Pulse 0.001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 Pulse Width (s) Figure 12: Normalized Maximum Transient Thermal Impedance for AOT12N60 (Note F) Z JC Normalized Transient Thermal Resistance 10 1 D=Ton/T TJ,PK=TC+PDM.ZJC.RJC RJC=2.5C/W In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 0.1 PD 0.01 Ton T Single Pulse 0.001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 Pulse Width (s) Figure 13: Normalized Maximum Transient Thermal Impedance for AOTF12N60 (Note F) Rev5: March 2010 www.aosmd.com Page 5 of 6 AOT12N60/AOTF12N60 Gate Charge Test Circuit & Waveform Vgs Qg 10V + + VDC - VDC DUT Qgs Vds Qgd - Vgs Ig Charge Res istive Switching Test Circuit & Waveforms RL Vds Vds DUT Vgs + VDC 90% Vdd - Rg 10% Vgs Vgs t d(on) tr t d(off) t on tf t off Unclamped Inductive Switching (UIS) Test Circuit & Waveforms L EAR= 1/2 LI Vds 2 AR BVDSS Vds Id + Vgs Vgs VDC - Rg Vdd I AR Id DUT Vgs Vgs Diode Recovery Tes t Circuit & Waveforms Qrr = - Idt Vds + DUT Vgs Vds - Isd Vgs Ig Rev5: March 2010 L Isd + Vdd trr dI/dt IRM Vdd VDC - IF Vds www.aosmd.com Page 6 of 6