GE
Critical Power
The FLTR75V05 Filter Module is designed
to reduce the conducted
common-mode and dierential-
mode noise on input or output lines
of high-frequency switching power
supplies. The module has a maximum
current rating of 5 A. It provides high
insertion loss throughout the frequency
range regulated by the U.S. Federal
Communications Commission (FCC) and
the International Special Committee
on Radio Interference (CISPR) for
conducted emissions. The module is
25.4 mm long, 25.4 mm wide, and 10.2
mm high (1.0 in. x 1.0 in. x 0.4 in.) and
mounts on a PC board in a natural
convection or forced-air environment.
Introduction
High-density power modules are usually
designed to operate at a high switching
frequency to reduce the size of the
internal lter components. The small
EMI lters internal to the modules are
often inadequate to meet stringent
international EMI requirements. Many
high-density electronic packaging
techniques can increase the noise
conducted onto the modules’ input and
output lines. For example, the close
proximity of switching components to
the input pins increases internal noise
coupling; and planar transformers,
designed to handle high-power levels
in lowprole packages, have high
interwinding capacitance that can
increase common-mode current levels.
Also, metal substrates used to facilitate
heat transfer from the power train
components to an external heat sink add
to common-mode noise because of the
large capacitance between switching
components and the metal substrate.
Many international agencies specify
conducted and radiated emissions
limits for electronic products. Included
among these are CISPR, FCC, VCCI,
and the new CE specications. Most
agency-conducted noise limits apply
only to noise currents induced onto
the ac power lines in nished products.
European Telecommunication Standard
Instructions (ETSI) are an exception,
applying CE requirements to dc supplies
with cables over three meters long.
Although not required to do so by agency
standards, some system designers apply
the conducted emissions requirements
to subassemblies within the product to
reduce internal interference between
subsystems and to reduce the diculty
of meeting overall system requirements.
To meet these requirements, external
ltering of the power module is often
required. When used in conjunction with
the recommended external components
and layout, the Lineage Power lter
module will signicantly reduce the
conducted dierential and
common-mode noise returned to
the power source. CISPR and FCC
class B requirements can be met
by using the lter as described
in the following sections.
FLTR75V05 Filter Module
75 Vdc Input Maximum,
5 A Maximum
RoHS Compliant
• RoHS compliant to
Directive 2011/65/EU
• Compatible in Pb- free or SnPb
reflow environment
• Small size: 25.4 mm x 25.4 mm x
10.2 mm (1.0 in. x 1.0 in. x 0.4 in.)
• Optimized for use with
high-frequency switching
dc-to-dc power modules
• Printed-circuit board mountable
• Operating case temperature range:
–40 °C to +100 °C
• Choice of pin lengths
• Common-mode and differential-
mode filtering of power supply
dc input and output lines
• Distributed power architectures
• Telecom
• Datacom
• CAN/CSA C22.2 No. 60950-1-07
/ UL* 60950-1, Second Edition,
dated March 27, 2007; VDE
0805 (EN60950) Licensed
2Filter Modules Datasheet | www.gecriticalpower.com
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely aect device reliability.
PARAMETER SYMBOL MIN MAX UNIT
Input Voltage:
Continuous
Transient (100 ms)
VI
VI, trans
—
—
75
100
Vdc
V
Voltage from GND to Either Input Lead ——1500 Vdc
Operating Case Temperature Tc Tc 100 °C
Storage Temperature Tstg –55 125 °C
PARAMETER SYMBOL MIN TYP MAX UNIT
Resistance per Leg R ——20 mΩ
Maximum Average Current
(TA = 92 °C, 2.0 m/s (400 lfm) air)
I max — — 5 A
Maximum Average Current
(TA = 75 °C, natural convection)
I max ——3.3 A
Common-mode Insertion Loss
(50 Ω circuit, 500 kHz)
——37 —dB
Dierential-mode Insertion Loss
(50 Ω circuit, 500 kHz)
——43 —dB
Electrical Specications
Unless otherwise indicated, specications apply over all operating input voltage and temperature conditions.
3
Filter Modules Datasheet | www.gecriticalpower.com
Characteristics
Figure 1. Typical Case Temperature Rise vs.
Average Current (Case Temperature
Must Be Kept Below 100 °C)
Figure 2. Typical Common-Mode Insertion Loss in
a 50 Ω Circuit
Internal Schematics
Figure 4. Internal Schematic
Figure 3. Typical Dierential-Mode
Insertion Loss in a 50 Ω Circuit
4Filter Modules Datasheet | www.gecriticalpower.com
Application
Conducted noise on the input
power lines can occur as either
dierential-mode or common-mode
noise currents. Dierential-mode noise is
measured between the two input lines,
and is found mostly at the lowfrequency
end of the spectrum. This noise
shows up as noise at the fundamental
switching frequency and its harmonics.
Common-mode noise is measured
between the input lines and ground
and is mostly broadband noise above
10 MHz. The high-frequency nature of
common-mode noise is mostly due to
the high-speed switching transitions
of power train components. Either or
both types of noise may be covered in a
specication, as well as a combination
of the two. An approved measurement
technique is often described, as well.
Dierential-mode noise is best
attenuated using a lter composed of
line-to-line capacitors (X caps) and series
inductance, provided by either a discrete
inductor or the leakage inductance of
a common-mode choke. In addition to
the dierential ltering provided by the
lter module, it is recommended that
an electrolytic capacitor be located at
the converter side of the lter to provide
additional attenuation of low-frequency
dierential noise and to provide a low
source impedance for the converter,
preventing input lter oscillations and
loadtransient induced input voltage dips.
Common-mode noise is best attenuated
by capacitors from power module input
to power module output, capacitors
from each input line to a shield plane
(Y caps), and common-mode chokes.
It is recommended that ceramic
capacitors be added around each
power module from each input and
output pin to a shield plane under
the module. The shield plane should
be connected to the CASE pin.
The GND pin of the lter module is
attached to Y caps within the module.
This pin should be tied to a quiet chassis
ground point away from the power
modules. GND of the lter module should
not be tied to the CASE pin of the power
module since this is a noisy node and
will inject noise into the lter, increasing
the input common-mode noise.
If no quiet grounding point is available,
it is best to leave the lter module GND
pin unattached. Each power system
design will be dierent, and some
experimentation may be necessary
to arrive at the best conguration.
Figure 5 shows a typical schematic
of a power module with lter
module and recommended external
components. Figure 6 is a proposed
layout. More than one power module
may be attached to a single lter
module as long as input current does
not exceed 5 A. Figure 7 shows the
recommended schematic for two power
modules attached to a single lter.
In applications where the addition of
input to output capacitors is undesirable,
do not use C3 and C4 shown in
Figures 5 and 6, and do not use C3,
C4, C8, and C9 shown in Figure 7.
In –48 V applications where the shield
plane and the power module case
must be tied to a signal, remove C1 in
Figures 5 and 6, remove C1 and C6 in
Figure 7, and connect the shield plane
and CASE pin to the VI(+) plane.
In +48 V applications where the shield
plane and the power module case
must be tied to a signal, remove C2 in
Figures 5 and 6, remove C2 and C7 in
Figure 7, and connect the shield plane
and CASE pin to the VI(–) plane.
5
Filter Modules Datasheet | www.gecriticalpower.com
Application
Figure 5. Recommended Schematic When Used as the Input Filter to a High-Frequency dc-to-dc Converter
Figure 6. Recommended Layout When Used as the Input Filter to a High-Frequency dc-to-dc Converter
6Filter Modules Datasheet | www.gecriticalpower.com
Application (continued)
Figure 7. Recommended Schematic of Filter Module with Two Power Modules
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Filter Modules Datasheet | www.gecriticalpower.com
Application (continued)
Figures 9, 10 & 11 show some experimental results for various Lineage
Power modules obtained by using the lter module, together with the
recommended external components shown in Figures 5 and 6. Measured
noise is highly dependent on layout, grounding, cable orientation, and
load characteristics and will, vary from application to application.
Thermal Considerations
The case temperature must be kept below 100 °C. The case temperature (TC)
should be measured at the position indicated in Figure 8. Therefore, for a particular
current and ambient temperature, the airow at the lter must be adequate.
Example:
Given: IO, max = 4 A; TA, max = 95 °C
Therefore ΔT, max allowable = 5 °C
Determine airow required (Figure 1): v = 2.0 m/s (400lfm)
Figure 8. Case Temperature
Measurement Location
Other Considerations
It is essential for good EMI performance
that the input lines not be contaminated
with noise after passing through the lter.
Filtered input traces should therefore
be kept away from noise sources such
as power modules and switching logic
lines. If input voltage sense traces must
be routed past the power modules from
the quiet side of the lter module, they
should be ltered at the point where
they leave the quiet input lines. Input
traces should be kept as far away from
output power traces as possible.
The fundamental switching frequency
noise spike can be somewhat reduced
by adding a high-frequency capacitor
of a few microfarads across the
input lines of the lter module.
Adding additional components to the
input lter to improve performance
usually has very limited payback,
and may actually increase the noise
conducted onto the input lines. Adding
Y caps to the input side of the lter
module couples any noise in the
ground plane directly into the input
lines, usually degrading performance.
Adding additional X and Y caps to
the power module side of the lter
module produces lowimpedance loops
for high-frequency currents to ow,
possibly degrading performance.
Adding additional common-mode or
dierential-mode ltering to the
power module output leads decreases
the power module output noise,
and also frequently reduces the input
noise by decreasing the noise coupled
from output leads to input leads.
Common-mode output ltering is
particularly important if the load is
tied to chassis ground.
If common-mode ltering
is added to the power
module output, ensure that
remote-sense leads sense the output
voltage before the common mode lter.
Do not use remote-sense on the load
side of an output common-mode lter.
If input noise performance is
unsatisfactory after applying the lter
module as described previously,
the best remedy is to modify the layout
and grounding scheme. It is often
useful to make a model of the power
card, using copper tape and a vector
card, to experiment with various layout
and grounding approaches prior to
committing to a printed-wiring board.
8
Filter Modules Datasheet | www.gecriticalpower.com
Other Considerations (continued)
Figure 9. HW050FG Conducted Noise with Filter
Compared to Class B Limits
Figure 10.JAW075A1 Conducted Noise with Filter
Compared to Class B Limits
Figure 11.QHW100F1 Conducted Noise with Filter
Compared to Class B Limits
9
Filter Modules Datasheet | www.gecriticalpower.com
Outline Diagram
Dimensions are in millimeters and (inches).
Tolerances: x.xx ± 0.50 mm (0.02 in.), x.xxx ± 0.250 mm (0.010 in.).
Top View
Side View
Bottom View
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Filter Modules Datasheet | www.gecriticalpower.com
Recommended Hole Pattern
Component-side footprint.
Dimensions are in millimeters and (inches).
Tolerances: x.xx ± 0.50 mm (0.02 in.), x.xxx ± 0.250 mm (0.010 in.).
Note: Do not route copper paths beneath power module standos.
Post Solder Cleaning and
Drying Considerations
Post solder cleaning is usually the nal circuit-board
assembly process prior to electrical board testing.
The result of inadequate cleaning and drying can aect
both the reliability of a power module and the testability
of the nished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Lineage Power Board Mounted Power
Modules: Soldering and Cleaning Application Note.
Through-Hole Lead Free
Soldering Information
The RoHS-compliant through-Hole products use the SAC(Sn/
Ag/Cu) Pb-free solder and RoHS- compliant components.
They are designed to be processed through single or dual
wave soldering machines. The pins have an RoHS-compliant
nish that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate 30C/s is
suggested. The wave preheat process should be such that
the temperature of the power module board is kept below
2100C. For Pb solder, the recommended pot temperature
is 2600C,while the Pb-free solder pot is 2700C max. Not all
RoHS-compliant through-hole products can be processed
with paste-through-hole Pb or Pb-free reow process.
If additional information is needed,please consult with
your Lineage Power representative for more details.
DEVICE CODE COMCODE
FLTR75V05Z CC109102654
FLTR75V055Z CC109128237
Ordering Information
Please contact your Lineage Power Account Manager or Field Application Engineer for pricing and availability.
Table 1. Device Codes
OPTION DEVICE CODE SUFFIX
Short pins: 4.57 mm (+0.38 mm/ –0.25 mm)
(0.180 in. (+0.015 in./ –0.010 in.))
5
Option Codes
Optional features may be ordered using the suxes shown in the Table below.
*Registered trademark of the General Electric Company.
The GE brand, logo, and lumination are trademarks of the General Electric Company. © 2015 General Electric Company.
Information provided is subject to change without notice. All values are design or typical values when measured under
laboratory conditions.
04/2015
GE
Critical Power
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