GA1A2S100SS - Sharp Microelectronics

1Sheet No.: D1-A00501EN

Date: October 1, 2007

©SHARP Corporation

GA1A2S100SS/GA1A2S100LY

GA1A2S100SS/

GA1A2S100LY

OPIC™ Linear Output

Ambient Light Sensor

Notice The content of data sheet is subject to change without prior notice.

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP

devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

■Features

1. Linear output, suitable for indoor or outdoor use

2. Light sensitivity and response curve similar to that

of the human eye

3. OPIC light detector: integrated photodiode and sig-

nal processing circuit

4. Lead frame packages:

Straight leads: GA1A2S100SS

L-bend: GA1A2S100LY

5. Stable over specified temperature range

6. Lead-free and RoHS-directive compliant

■Agency Approvals/Compliance

1. Compliant with RoHS directive (2002/95/EC)

2. Content information about the six substances

specified in “Management Methods for Control of

Pollution Caused by Electronic Information Prod-

ucts Regulation” (popular name: China RoHS)

(Chinese: );

refer to page 7.

■Applications

1. Auto-dimming circuits

2. Office automation equipment

3. Audio visual equipment

4. Home appliances

5. Touch panels

OPIC is a trademark of Sharp Corporation.

Sheet No.: D1-A00501EN

GA1A2S100SS/GA1A2S100LY

■External Dimensions

2-C0.5

Center of

light detection

GA1A2S100SS

1.8

3.0

0.7

0.1 MAX.

0.15

(4°)

(1.7)

(2.54)

(1.27)

0.2 MAX.

Resin burr

16.8 ±2.0

1.45

2.6

(4°)

(52°)

(6°)

(6°) (6°)

(6°)

(4°)

1.27

1.27 1.27

1.4

4.0

0.3 MAX.

Gate burr

1.4 MAX.

resin burr

3 - 0.4+0.3

-0.1 3 - 0.45+0.3

-0.1

2 - 0.9

0.50

R0.5

φ1.5E.PIN

φ1.60

3-φ0.90

GND

No. Name

Pin Arrangement

NOTES:

1. Units: mm

2. Unspecified tolerence: ±0.2 mm

3. ( ): Reference dimensions

4. Package: Transparent

5. The thin burr thickness (0.05 mm MAX.) and the gate burr (0.3 mm MAX.) are not included in outline dimensions

6. Resin protrusion: 1.4 mm MAX. however, the thin burr adheres to the lead 1.4 mm MAX. from the resin

Sheet No.: D1-A00501EN

GA1A2S100SS/GA1A2S100LY

GND

No. Name

0.87

(1.7)

(6°) (6°)

(4°)

(4°) (4°)

(4°)

(2.54)

3.0

Center of light

detection

1.8

0.7

0.1 MAX.

2.54

3 - φ1.0

φ1.80 2.54

2.20

1.27

PCB layout pattern

1.27

0.15

1.5

2 - C0.5

R0.7

1.45

4.0

1.4

1.4 MAX.

Resin burr

0.3 MAX.

Gate burr

0.2 MAX.

Resin burr

Pin Arrangement

14.5

±1.5

16.7

±1.5

3 - 0.45

+0.3

-0.1

0.4

+0.30

-0.10

(3.70)

2.20

NOTES:

1. Units: mm

2. Unspecified tolerance: ±0.2 mm

3. ( ): Reference dimensions

4. Package: Transparent

5. Burr thickness (0.05 mm MAX.) and gate burr thickness

(0.3 mm MAX.) are not included in the outline dimensions.

6. Resin protrusion: 1.4 mm MAX. however, the thin burr adheres to the lead 1.4 mm MAX. from the resin.

GA1A2S100LY

Sheet No.: D1-A00501EN

GA1A2S100SS/GA1A2S100LY

■Detector Shape

■Absolute Maximum Ratings

*1 Within 5 s (MAX.), no closer than 1.4 mm from edge.

■Recommended Operating Conditions

Parameter Symbol Rating Unit

Supply voltage VCC -0.3 to +7.0 V

Output current IO5mA

Operating temperature Topr -40 to +85°C

Storage temperature Tstg -40 to +85°C

Soldering temperature *1 Tsol 260 °C

Parameter Symbol MIN. MAX. Unit

Operating Supply Voltage VCC 2.7 3.6 V

Output Voltage VOUT 0VCC – 1.0 V

Illuminance Range EV10 10000 lx

328

Center of light detection

(PDB center)

PDA

center

Detector

chip

NOTE: Unit: µm

328

8888

PDC

center

(Ta = 25°C)

(Ta = 0°C to 70°C)

Sheet No.: D1-A00501EN

GA1A2S100SS/GA1A2S100LY

■Electro-optical Characteristics

*1 Ev = Illuminance by CIE standard light source A (tungsten lamp).

*2 Illuminance is white LED.

Parameter Symbol Condition Min. Typ. Max. Unit

Supply current ICC EV = 1000 lx 325 500 675 µA

Output current *1

IO1E

V = 1000 lx 312 480648µA

IO2E

V = 100 lx 31.2 4864.8µA

IO3E

V = 10 lx 3.12 4.86.48µA

IO4E

V = 0 lx — — 1 µA

Output current

temperature coefficient *2

EV = 1000 lx

Ta = -20°C to +60°C -10 — +10 %

Peak sensitivity λP—555 — nm

Rise time (10% to 90%)*2

tr1 EV = 10 to 100 lx, RL = 1 kΩ—— 10 ms

tr2 EV = 100 to 1000 lx, RL = 1 kΩ—— 2 ms

tr3 EV = 1000 to 10000 lx, RL = 100 kΩ—— 500 µs

Fall time (10% to 90%)*2

tf1 EV = 10 to 100 lx, RL = 1 kΩ—— 10 ms

tf2 EV = 100 to 1000 lx, RL = 1 kΩ—— 1 ms

tf3 EV = 1000 to 10000 lx, RL = 100 Ω—— 250 µs

Fig. 1 Output Current Characteristics (Typ.)

10000

1000

100

Output Current IO (µA)

Illuminance EV (lx)

11 10 100 1000 10000 100000

(Ta = 25°C, VCC = 3.3 V)

Sheet No.: D1-A00501EN

GA1A2S100SS/GA1A2S100LY

■Design Considerations

Design Guidelines

1. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.

2. Sharp recommends bypass capacitors of at least 0.01 µF between VCC and ground, as close as

possible to the device.

3. This device contains three photodiodes and amplifies the differential of the photocurrent in each diode. Sharp

recommends that the light which falls on the device illuminate it as uniformly as possible.

4. For the most reliable sensing, Sharp recommends guarding the device from stray incident light.

■Manufacturing Guidelines

Soldering Instructions

1. Sharp does not recommend soldering this part using methods that include preheat or solder reflow.

2. When mounting, care should be taken to avoid boundary exfoliation (pad lifting) between the solder and the cir-

cuit board.

3. If hand soldering, use temperatures ≤260°C for ≤5 seconds.

4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or

defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-

age due to the PCB flexing during the soldering process.

Cleaning Instructions

1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the

optical characteristics.

2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.

3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning

time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-

tions to confirm the harmlessness of the ultrasonic cleaning methods.

4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.

Fig. 2 Block Diagram (Equivalent Circuit)

Current AMP 2

(With temperature

compensation function)

Current AMP 1

OUT

GND

PD for spectral

sensitivity

compensation

(PDB)

Main PD

(PDA, PDC)

Sheet No.: D1-A00501EN

GA1A2S100SS/GA1A2S100LY

■Presence of ODCs (RoHS Compliance)

This product shall not contain the following materials, and they are not used in the production process for this

product:

• Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific

brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.

This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).

• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl

ethers (PBDE).

• Content information about the six substances specified in “Management Methods for Control of Pollution

Caused by Electronic Information Products Regulation” (Chinese: )

NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement

as described in SJ/T 11363-2006 standard.

■Packing Specifications

1. Box shape and general dimensions for GA1A2S100SS conform to those shown in Fig. 3, and to those shown

in Fig. 4 for GA1A2S100LY.

2. Inner packing is as shown in the Figures.

3. For GA1A2S100SS:

Average quantity per bag = 1000 pcs.

Average quantity per box = 2000 pcs.

4. For GA1A2S100LY:

Average quantity per sleeve = 100 pcs.

Average quantity per box = 2000 pcs.

5. Product mass: 0.1 g (approximately)

Category

Toxic and Hazdardous Substances

Lead (Pb) mercury (Hg) Cadmium (Cd) Hexavalent

chromiun (Cr6+)

Polybrominated

biphenyls (PBB)

Polybrominated

diphenyl ethers

(PBDE)

OPIC Light Sensors ✓✓✓✓✓✓

Sheet No.: D1-A00501EN

GA1A2S100SS/GA1A2S100LY

■Packing Specification

Fig. 3 GA1A2S100SS Packing Composition

Inner packing

Antistatic zipper bag with products (2 bags)

Cellophane tape

Packing case

Model No., Quantity, and Lot No.

Cushioning material (2 sheets)

Antistatic zipper bag

Product (1000 pieces)

NOTES:

1. Inner packing material : Antistatic zipper bag (Polyethylene)

2. Quantity: 1000 pieces/bag

NOTES:

1. Outer material : Packing case (Corrugated cardboard),

Cushioning material (Urethane), Cellophane tape

2. Quantity: 2000 pieces/box

3. Regular packaged mass: Approximately 280 g

4. Indication: Model No., Quantity, and Lot No.

Outer packing

Cushioning material (2 sheets)

Sheet No.: D1-A00501EN

GA1A2S100SS/GA1A2S100LY

Fig. 4 GA1A2S100LY Packing Composition

Inner packing

GA1A2S100LY

Ta bless stopper

Ta bbed stopper

Sleeve

(5 each in 4 rows)

NOTES:

1. Inner packing material: Sleeve (HIPS), Stopper (SBR)

2. Quantity: 100 pieces/sleeve

Outer packing

NOTES:

1. Outer material: Packing case (Corrugated cardboard),

Packing tape

2. Quantity: 2000 pieces/box

3. Label: Model number, quantity, and inspection date

Inspection date

Quantity

Model number

Packing case

Packing tape

■Important Notices

· The circuit application examples in this publication are

provided to explain representative applications of

SHARP devices and are not intended to guarantee any

circuit design or license any intellectual property rights.

SHARP takes no responsibility for any problems

related to any intellectual property right of a third party

resulting from the use of SHARP’s devices.

· Contact SHARP in order to obtain the latest device

specification sheets before using any SHARP device.

SHARP reserves the right to make changes in the

specifications, characteristics, data materials, struc-

ture, and other contents described herein at any time

without notice in order to improve design or reliability.

Manufacturing locations are also subject to change

without notice.

· Observe the following points when using any devices

in this publication. SHARP takes no responsibility for

damage caused by improper use of the devices which

does not meet the conditions and absolute maximum

ratings to be used specified in the relevant specification

sheet nor meet the following conditions:

(i) The devices in this publication are designed for use

in general electronic equipment designs such as:

--- Personal computers

--- Office automation equipment

--- Telecommunication equipment (terminal)

--- Test and measurement equipment

--- Industrial control

--- Audio visual equipment

--- Consumer electronics

(ii) Measures such as fail-safe function and redundant

design should be taken to ensure reliability and safety

when SHARP devices are used for or in connection

with equipment that requires higher reliabilty such as:

--- Transportation control and safety equipment

(i.e., aircraft, trains, automobiles, etc.)

--- Traffic signals

--- Gas leakage sensor breakers

--- Alarm equipment

--- Various safety devices, etc.

(iii) SHARP devices shall not be used for or in connec-

tion with equipment that requires an extremely high

level of reliability and safety such as:

--- Space applications

--- Telecommunication equipment (trunk lines)

--- Nuclear power control equipment

--- Medical and other life support equipment (e.g.

scuba)

· If the SHARP devices listed in this publication fall

within the scope of strategic products described in the

Foreign Exchange and Foreign Trade Law of Japan, it

is necessary to obtain approval to export such SHARP

devices.

· This publication is the proprietary product of SHARP

duced or transmitted in any form or by any means,

electronic or mechanical, for any purpose, in whole or

in part, without the express written permission of

SHARP. Express written permission is also required

before any use of this publication may be made by a

third party.

· Contact and consult with a SHARP representative if

there are any questions about the contents of this pub-

lication.

Sheet No.: D1-A00501EN

GA1A2S100SS/GA1A2S100LY