In no case, neither after manual nor reflow soldering, a board wash shall be applied. Therefore, it is strongly recommended to
use a “no-clean” solder paste. In case of applications with exposure of the sensor to corrosive gases or condensed water (i.e.
environments with high relative humidity) the soldering pads shall be sealed (e.g. conformal coating) to prevent loose contacts
or short cuts.
• Storage Conditions and Handling Instructions
It is recommended to store HTU21D(F) sensor in its original packaging at following conditions: Temperature shall be in the
range of -40°C – 125°C.
• Temperature Effects
Relative humidity reading strongly depends on temperature. Therefore, it is essential to
keep humidity sensors at the same temperature as the air of which the relative humidity is
to be measured.
In case of testing or qualification the reference sensor and test sensor must show equal
temperature to allow for comparing humidity readings.
The HTU21D(F) sensor should be mounted in a way that prevents heat transfer from
electronic sensor or that keeps it as low as possible. Advice can be ventilation, reduction of
copper layers between the HTU21D(F) sensor and the rest of the PCB or milling a slit into
the PCB around the sensor (1mm minimum width).
Example of HTU21D(F) sensor mounting
with slits mills to minimize heat transfer
• Materials Used for Sealing / Mounting
For sealing and gluing (use sparingly), use high filled epoxy for electronic packaging and silicone. For any specific material
please request to humidity.application@meas-spec.com.
Window must remain uncovered.
• Wiring Considerations and Signal Integrity
Carrying the SCK and DATA signal parallel and in close proximity (e.g. in wires) for more than 10 cm may result in cross talk
and loss of communication.
This may be resolved by routing VDD and/or GND between the two data signals and/or using shielded cables. Furthermore,
slowing down SCK frequency will possibly improve signal integrity.
Power supply pins (VDD, GND) must be bypassed with a 100nF capacitor if wires are used. Capacitor should be placed as
close as possible to the sensor.
• ESD (ElectroStatic Discharge)
ESD immunity is qualified according to:
▪ JEDEC JESD22-A114 method (Human Body Model at ±4kV) for pads & open window
▪ JEDEC JESD22-A115 method (Machine Model ±200V)
▪ ESDA ESD-STM5.3.1-1999 and AEC-Q100-011 (charged device model, 750V corner pins, 500V other pins)
Latch-up immunity is provided at a force current of ±100mA with Tamb=25°C according to JEDEC JESD78. For exposure
beyond named limits the sensor need additional protection circuit.