4-3
Absolute Maximum Ratings Thermal Information
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44.0V
V- to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V
Digital Inputs, VS, VD (Note 1). . . . . . . . . . . . . (V-) - 2V to (V+) + 2V
or 30mA, Whichever Occurs First
Continuous Current, (Any Terminal). . . . . . . . . . . . . . . . . . . . . 30mA
Peak Current, S or D (Pulsed 1ms, 10% Duty Cycle Max) . . 100mA
Operating Conditions
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15V
Temperature Range
“A” Suffix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
“B” Suffix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25oC to 85oC
“C” Suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8V (Max)
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.0V (Min)
Input Rise and Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤20ns
Thermal Resistance (Typical, Note 2) θJA (oC/W) θJC (oC/W)
SOIC Package . . . . . . . . . . . . . . . . . . . 100 N/A
PDIP Package . . . . . . . . . . . . . . . . . . . 100 N/A
CERDIP Package. . . . . . . . . . . . . . . . . 75 20
Maximum Junction Temperature
Hermetic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175oC
Plastic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range. . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering, 10s). . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Signals on SX, DX or INX exceeding V+ or V- will be clamped by internal diodes. Limit diode forward current to maximum current ratings.
2. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications V+ = +15V, V- = -15V, GND = 0V, TA = 25oC
PARAMETER TEST CONDITIONS
“A” SUFFIX “B” AND “C” SUFFIX
UNITSMIN (NOTE 3)
TYP MAX MIN (NOTE 3)
TYP MAX
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON See Figure 3 - 150 300 - 150 - ns
Turn-OFF Time, tOFF See Figure 3 - 130 250 - 130 - ns
Break-Before-Make
Interval, tDSee Figure 2, DG301A/DG303A - 50 - - 50 - ns
Charge Injection, Q CL = 10nF, RS = 0, VS = 0 -3--3-mV
OFF Isolation (Note 4) VIN = 0, RL = 1kΩ, VS = 1VRMS,
f = 500kHz -62--62-dB
Crosstalk
(Channel-to-Channel) - -74 - - -74 - dB
Source OFF Capacitance,
CS(OFF) f = 1MHz,
VIN = 0.8V or
VIN = 4.0V
VS = 0 - 14 - - 14 - pF
Drain OFF Capacitance,
CD(OFF) VD = 0 - 14 - - 14 - pF
Channel ON Capacitance,
CD(ON) + CS(ON) VS = VD = 0 - 40 - - 40 - pF
Input Capacitance, CIN f = 1MHz VIN = 0 -6--6-pF
VIN = 15V - 7 - - 7 - pF
DIGITAL INPUT CHARACTERISTICS
Input Current with Voltage
High, IIH VIN = 5.0V -1 -0.001 - -1 -0.001 - µA
VIN = 15.0V - 0.001 1 - 0.001 1 µA
Input Current with Voltage
Low, IIL VIN = 0V -1 -0.001 - -1 -0.001 - µA
DG300A, DG301A, DG303A