CUSTOMER PRODUCT SPECIFICATION
DOCUMENT NBR : 78D-128C800ALFTR
TITLE : IND, SMD
REV : B PAGE: 1 OF 5
NOTICE OF PROPRIETARY PROPERTY
THE INFORMATION CONTAINED HEREIN IS THE PROPRIETARY PROPERTY OF BI TECHNOLOGIES MALAYSIA SUBSIDIARY OF
TT ELECTRONICS. THE POSSESSOR AGREES TO THE FOLLOWING:
(i) NOT TO REPRODUCE OR COPY IT, (ii) NOT TO REVEAL OR PUBLISH IT IN WHOLE OR IN PART, (iii) ALL RIGHTS RESERVED
MODEL NBR : HM78D-128C800ALFTR
CUSTOMER PART NBR : N/A
CUSTOMER DWG NBR / REV / DATE : N/A N/A N/A
CUSTOMER CODE : C00065
REV CHANGE DETAILS ECN # DATE PREPARED APPD
A Preliminary release. C10033 12/02/10 PJ Chong CS Teor
B Update operating temperature range. C12088 16/05/12 PJ Chong TS Huang
UNLESS OTHERWISE SPECIFIED, ALL DIMENSIONS ARE IN
mm
TOLERANCES:
WHOLE NO ± 1.0
DECIMAL .X ± 0.5
.XX ± 0.3
PROJECTION ANGLE SCALE
1: N.T.S
CUSTOMER PRODUCT SPECIFICATION
DOCUMENT NBR : 78D-128C800ALFTR
TITLE : IND, SMD
REV : B PAGE: 2 OF 5
NOTICE OF PROPRIETARY PROPERTY
THE INFORMATION CONTAINED HEREIN IS THE PROPRIETARY PROPERTY OF BI TECHNOLOGIES MALAYSIA SUBSIDIARY OF
TT ELECTRONICS. THE POSSESSOR AGREES TO THE FOLLOWING:
(i) NOT TO REPRODUCE OR COPY IT, (ii) NOT TO REVEAL OR PUBLISH IT IN WHOLE OR IN PART, (iii) ALL RIGHTS RESERVED
1. MECHANICAL OUTLINE
FIGURE 1. MECHANICAL OUTLINE
1.1 RECOMMENDED PCB PATTERN
FIGURE 2. RECOMMENDED PCB PATTERN
2. ELECTRICAL SCHEMATIC
FIGURE 3. ELECTRICAL SCHEMATIC
3. FINISH
X UNVARNISH DIP VARNISH VACUUM VARNISH
POTTING X EPOXY X LEAD FREE
4. MARKING
X BI LOGO X DATE CODE COUNTRY OF ORIGIN
HI-POT X BI PART NBR CUSTOMER PART NBR
CUSTOMER PRODUCT SPECIFICATION
DOCUMENT NBR : 78D-128C800ALFTR
TITLE : IND, SMD
REV : B PAGE: 3 OF 5
NOTICE OF PROPRIETARY PROPERTY
THE INFORMATION CONTAINED HEREIN IS THE PROPRIETARY PROPERTY OF BI TECHNOLOGIES MALAYSIA SUBSIDIARY OF
TT ELECTRONICS. THE POSSESSOR AGREES TO THE FOLLOWING:
(i) NOT TO REPRODUCE OR COPY IT, (ii) NOT TO REVEAL OR PUBLISH IT IN WHOLE OR IN PART, (iii) ALL RIGHTS RESERVED
5. ELECTRICAL SPECIFICATION
NO PARAMETER TEST CONDITION TERMINAL MIN TYP MAX UNIT
5.1 Inductance, L 1kHz, 1Vac, 0Adc 1-2 37.6 47.0 56.4
µ
H
5.2 LBias 1kHz, 1Vac, 2.5Adc 1-2 Refer note 5.4
µ
H
5.3 DCR @ 25
°
C 1-2 71 85 m
Ω
5.4 At 2.5Adc, inductance shall not drop more than 10% from its initial (0Adc) value.
6. MATERIAL LIST
NO ITEM MATERIAL DESCRIPTION SOURCE UL FILE
6.1 Core Ferrite, NiZn Various N/A
6.2 Coil Polyurethane overcoated with polyamide,
180°C, MW 83-C or equivalent.
Various -
6.3 Epoxy TB2285 Three Bond -
6.4 Base LCP E4008 LianCheng
Metal Plastic
-
Base terminal Phosphor bronze, matte tin
6.5 Tape Polyester film tape, UL510 3M -
7. PACKING REQUIREMENT
FIGURE 4. TAPE & REEL PACKAGING
1 reel 500 pcs
1 shipping carton 6 reels or 3000 pcs
8. ENVIRONMENTAL
8.1 RESISTANCE TO SOLDERING HEAT
8.1.1 IR reflow solder, preheat at 1 – 4 °C/second to 235°C and using lead free
Sn96.5/Ag3.0/Cu0.5 solder, IR at 235°C for 20 – 60 second, and 255 ± 5°C for 10 ±
5 second maximum. (refer figure 5 below).
8.1.2 Component must withstand minimum 3 IR reflow solder cycle with a cool down
between.
CUSTOMER PRODUCT SPECIFICATION
DOCUMENT NBR : 78D-128C800ALFTR
TITLE : IND, SMD
REV : B PAGE: 4 OF 5
NOTICE OF PROPRIETARY PROPERTY
THE INFORMATION CONTAINED HEREIN IS THE PROPRIETARY PROPERTY OF BI TECHNOLOGIES MALAYSIA SUBSIDIARY OF
TT ELECTRONICS. THE POSSESSOR AGREES TO THE FOLLOWING:
(i) NOT TO REPRODUCE OR COPY IT, (ii) NOT TO REVEAL OR PUBLISH IT IN WHOLE OR IN PART, (iii) ALL RIGHTS RESERVED
After resistance to soldering heat test, there shall be no evidence of cracking or
deformation. The parts shall meet all electrical and mechanical requirements.
FIGURE 5. IR SOLDERING
8.2 MARKING PERMANENCY
8.2.1 Mix 1 part of isopropyl alcohol with 3 parts of mineral spirit. Brush 10 strokes on
marking. Repeat 3 cycles per MIL-STD-202F, method 215J.
Accept criteria: Markings are still legible after test
8.3 OPERATING TEMPERATURE
8.3.1 Product operating temperature : -40°C to +150°C
8.3.2 The part temperature (ambient + temperature rise) should not exceed 150°C.
8.4 TERMINAL STRENGTH
8.4.1 After soldering the part to a PCB, perform a pull test with 1kg of force in any
direction for 5 to 10 seconds.
8.5 THERMAL SHOCK
8.5.1 -40°C for 15 minutes, +150°C for 15 minutes, 5 cycles.
8.6 HUMIDITY
8.6.1 96 hours at 40°C±2°C at 90-95% RH per MIL-STD-202F, method 103B, test B.
235°C
255°C ± 5°C
30°C
10 ± 5 sec Max
20 - 60 sec
6°C/sec Max
1 - 4°C/sec
50 - 210 sec
Cool down
CUSTOMER PRODUCT SPECIFICATION
DOCUMENT NBR : 78D-128C800ALFTR
TITLE : IND, SMD
REV : B PAGE: 5 OF 5
NOTICE OF PROPRIETARY PROPERTY
THE INFORMATION CONTAINED HEREIN IS THE PROPRIETARY PROPERTY OF BI TECHNOLOGIES MALAYSIA SUBSIDIARY OF
TT ELECTRONICS. THE POSSESSOR AGREES TO THE FOLLOWING:
(i) NOT TO REPRODUCE OR COPY IT, (ii) NOT TO REVEAL OR PUBLISH IT IN WHOLE OR IN PART, (iii) ALL RIGHTS RESERVED
9. NOTES
9.1 Co-planarity to be 0.12 mm maximum.
9.2 This component and all homogeneous sub-components are RoHS compliant.
9.3 Unit weight is approximately 4.3 grams.
9.4 See below table for lead free solder content.
Solder Content Information
S/No
Item / Chemicals Content (%) S/No
Item / Chemicals
Content (%)
1 Sn Balance 7 Fe Less than 0.020
2 Ag 3.0 ~ 4.0 8 As Less than 0.030
3 Cu 0.5 ~ 1.0 9 Ni Less than 0.010
4 Pb Less than 0.100 10 Bi Less than 0.100
5 Sb Less than 0.250 11 Cd Less than 0.002
6 Zn Less than 0.002 12 Al Less than 0.002
