M1MA151AT3 - ON Semiconductor L.L.C.

 Semiconductor Components Industries, LLC, 2002

May, 2002 – Rev. 6 1Publication Order Number:

M1MA151AT1/D

M1MA151AT1,

M1MA152AT1

Preferred Device

Single Silicon Switching

Diodes

These Silicon Epitaxial Planar Diodes are designed for use in ultra

high speed switching applications. These devices are housed in the

SC–59 package which is designed for low power surface mount

applications.

•Fast trr, < 3.0 ns

•Low CD, < 2.0 pF

•Available in 8 mm Tape and Reel

Use M1MA151/2AT1 to order the 7 inch/3000 unit reel.

Use M1MA151/2AT3 to order the 13 inch/10,000 unit reel.

MAXIMUM RATINGS (TA = 25°C)

Rating Symbol Value Unit

Reverse Voltage M1MA151AT1 VR40 Vdc

M1MA152AT1 80

Peak Reverse Voltage M1MA151AT1 VRM 40 Vdc

M1MA152AT1 80

Forward Current IF100 mAdc

Peak Forward Current IFM 225 mAdc

Peak Forward Surge Current IFSM

(Note 1) 500 mAdc

THERMAL CHARACTERISTICS

Rating Symbol Max Unit

Power Dissipation PD200 mW

Junction Temperature TJ150 °C

Storage Temperature Tstg –55 to +150 °C

1. t = 1 SEC

Preferred devices are ON Semiconductor recommended choices for future use and best overall value.

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Preferred devices are recommended choices for future use

and best overall value.

SC–59

SUFFIX

CASE 318D

SC–59 PACKAGE SINGLE SILICON

SWITCHING DIODES 40/80 V–100 mA

SURFACE MOUNT

MARKING DIAGRAM

ANODE

CATHODE

NO CONNECTION

Mx M

x = A for 151

B for 152

M = Date Code

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ELECTRICAL CHARACTERISTICS (TA = 25°C)

Characteristic Symbol Condition Min Max Unit

Reverse Voltage Leakage Current M1MA151AT1 IRVR = 35 V — 0.1 Adc

M1MA152AT1 VR = 75 V — 0.1

Forward Voltage VFIF = 100 mA — 1.2 Vdc

Reverse Breakdown Voltage M1MA151AT1 VRIR = 100 A40 — Vdc

M1MA152AT1 80 —

Diode Capacitance CDVR = 0, f = 1.0 MHz — 2.0 pF

Reverse Recovery Time (Figure 1) trr (Note 2) IF = 10 mA, VR = 6.0 V,

RL = 100 , Irr = 0.1 IR— 3.0 ns

2. trr Test Circuit

trtp

10%

90%

VRtp = 2 s

tr = 0.35 ns

trr

Irr = 0.1 IR

IF = 10 mA

VR = 6 V

RL = 100 Ω

RECOVERY TIME EQUIVALENT TEST CIRCUIT INPUT PULSE OUTPUT PULSE

Figure 1. Reverse Recovery Time Equivalent Test Circuit

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PD = TJ(max) – TA

RθJA

PD = 150°C – 25°C

370°C/W = 338 milliwatts

•The soldering temperature and time should not exceed

260°C for more than 10 seconds.

•When shifting from preheating to soldering, the

maximum temperature gradient should be 5°C or less.

•After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and

result in latent failure due to mechanical stress.

•Mechanical stress or shock should not be applied dur-

ing cooling

* Soldering a device without preheating can cause exces-

sive thermal shock and stress which can result in damage

to the device.

INFORMATION FOR USING THE SC–59 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

SC–59 POWER DISSIPATION

The power dissipation of the SC–59 is a function of the

pad size. This can vary from the minimum pad size for sol-

dering to the pad size given for maximum power dissipa-

tion. Power dissipation for a surface mount device is deter-

mined b y T J(max), the maximum rated junction temperature

of the die, RθJA, the thermal resistance from the device

junction t o ambient; and the operating temperature, TA. Us-

ing the values provided on the data sheet, PD can be calcu-

lated as follows.

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

the equation for an ambient temperature TA of 25°C, one

can calculate the power dissipation of the device which in

this case is 338 milliwatts.

The 370°C/W assumes the use of the recommended foot-

print on a glass epoxy printed circuit board to achieve a

power dissipation of 338 milliwatts. Another alternative

would be to use a ceramic substrate or an aluminum core

board such as Thermal Clad. Using a board material such

as Thermal Clad, the power dissipation can be doubled us-

ing the same footprint.

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within

a short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

•Always preheat the device.

•The delta temperature between the preheat and

soldering should be 100°C or less.*

•When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering

method, the difference should be a maximum of 10°C.

inches

0.039

1.0

0.094

0.8

2.4

0.031

0.95

0.037

0.95

0.037

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STEP 1

PREHEAT

ZONE 1

RAMP"

STEP 2

VENT

SOAK"

STEP 3

HEATING

ZONES 2 & 5

RAMP"

STEP 4

HEATING

ZONES 3 & 6

SOAK"

STEP 5

HEATING

ZONES 4 & 7

SPIKE"

STEP 6

VENT

STEP 7

COOLING

200°C

150°C

100°C

50°C

TIME (3 TO 7 MINUTES TOTAL) TMAX

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

205° TO 219°C

PEAK AT

SOLDER JOINT

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

100°C

150°C

160°C

140°C

Figure 2. Typical Solder Heating Profile

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES

170°C

For any given circuit board, there will be a group of

control settings that will give the desired heat pattern. The

operator must set temperatures for several heating zones,

and a figure for belt speed. Taken together, these control

settings make up a heating “profile” for that particular

circuit board. On machines controlled by a computer, the

computer remembers these profiles from one operating

session t o the next. Figure 7 shows a typical heating profile

for use when soldering a surface mount device to a printed

circuit board. This profile will vary among soldering

systems but it is a good starting point. Factors that can

affect the profile include the type of soldering system in

use, density and types of components on the board, type of

solder used, and the type of board or substrate material

being used. This profile shows temperature versus time.

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed

circuit board, solder paste must be applied to the pads. A

solder stencil is required to screen the optimum amount of

solder paste onto the footprint. The stencil is made of brass

or stainless steel with a typical thickness of 0.008 inches.

The stencil opening size for the surface mounted package

should be the same as the pad size on the printed circuit

board, i.e., a 1:1 registration.

TYPICAL SOLDER HEATING PROFILE

The line on the graph shows the actual temperature that

might be experienced on the surface of a test board at or

near a central solder joint. The two profiles are based on a

high density and a low density board. The Vitronics

SMD310 convection/infrared reflow soldering system was

used to generate this profile. The type of solder used was

62/36/2 Tin Lead Silver with a melting point between

177–189°C. When this type of furnace is used for solder

reflow work, the circuit boards and solder joints tend to

heat first. The components on the board are then heated by

conduction. The circuit board, because i t has a lar ge surface

area, absorbs the thermal energy more efficiently, then

distributes this energy to the components. Because of this

effect, the main body of a component may be up to 30

degrees cooler than the adjacent solder joints.

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PACKAGE DIMENSIONS

CASE 318D–04

ISSUE F

SC–59

DIM

MIN MAX MIN MAX

INCHES

2.70 3.10 0.1063 0.1220

MILLIMETERS

B1.30 1.70 0.0512 0.0669

C1.00 1.30 0.0394 0.0511

D0.35 0.50 0.0138 0.0196

G1.70 2.10 0.0670 0.0826

H0.013 0.100 0.0005 0.0040

J0.09 0.18 0.0034 0.0070

K0.20 0.60 0.0079 0.0236

L1.25 1.65 0.0493 0.0649

S2.50 3.00 0.0985 0.1181

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

STYLE 4:

PIN 1. N.C.

2. CATHODE

3. ANODE

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Notes

M1MA151AT1, M1MA152AT1

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Notes

M1MA151AT1, M1MA152AT1

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M1MA151AT1/D

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