HLMP-D101/D105, HLMP-K101/K105
T-13/4 (5 mm), T-1 (3 mm),
High Intensity, Double Heterojunction
AlGaAs Red LED Lamps
Data Sheet
Description
These solid state LED lamps utilize newly developed
double heterojunction (DH) AlGaAs/GaAs material tech-
nology. This LED material has outstanding light output
e ciency over a wide range of drive currents. The color is
deep red at the dominant wavelength of 637 nanometres.
These lamps may be DC or pulse driven to achieve desired
light output.
Features
Exceptional brightness
Wide viewing angle
Outstanding material e ciency
Low forward voltage
CMOS/MOS compatible
TTL compatible
Deep red color
Applications
Bright ambient lighting conditions
Moving message panels
Portable equipment
General use
Package Dimensions
1.14 (0.045)
0.51 (0.020)
3.43 (0.135)
2.92 (0.115)
24.1
(0.95)MIN.
4.70 (0.185)
4.19 (0.165)
3.17 (0.125)
2.67 (0.105)
2.79 (0.110)
2.29 (0.090)
1.52 (0.060)
1.02 (0.040)
6.35 (0.250)
5.58 (0.220)
0.55 (0.022)
0.40 (0.016)
CATHODE
0.65 (0.026) MAX.
SQ. TYP.
SHOULDER
ABC
2
Selection Guide
Package Description Device HLMP-
Luminous Intensity Iv (mcd) at 20 mA 21/2[1]
Degree
Package
Outline Min. Typ. Max.
T-1 3/4 Red Tinted Di used
D101 35.2 70.0 – 65 A
D101-J00xx 35.2 70.0 – 65 A
D101-JK0xx 35.2 70.0 112.8 65 A
T-1 3/4 Red Untinted Non-di used
D105 138.0 240.0 – 24 B
D105-M00xx 138.0 240.0 – 24 B
D105-NO0xx 200.0 290.0 580.0 24 B
T-1 Red Tinted Di used
K101 22.0 45.0 – 60 C
K101-I00xx 22.0 45.0 – 60 C
T-1 Red Untinted Non-di used
K105 35.2 65.0 – 45 C
K105-J00xx 35.2 65.0 – 45 C
Note:
1. 1/2 is the o axis angle from lamp centerline where the luminous intensity is 1/2 the on-axis value.
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Option
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
A1: Right Angle Housing, Uneven Leads, T1
A2: Right Angle Housing, Even Leads, T1
B1: Right Angle Housing, Uneven Leads, T-13/4
B2: Right Angle Housing, Even Leads, T-13/4
DD, UQ: Ammo Pack
Color Bin Options
0: Full Color Bin Distribution
Maximum Iv Bin Options
0: Open (no max. limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Lens Type
01: Tinted, Di used
05: Untinted, Nondi used
Color Options
1: AlGaAs Red
Package Options
D: T-13/4
K: T-1
3
Absolute Maximum Ratings at TA = 25°C
Parameter Value
Peak Forward Current[1,2] 300 mA
Average Forward Current[2] 20 mA
DC Current[3] 30 mA
Power Dissipation 87 mW
Reverse Voltage (IR = 100 A) 5 V
Transient Forward Current (10 s Pulse)[4] 500 mA
LED Junction Temperature 110°C
Operating Temperature Range -20 to +100°C
Storage Temperature Range -40 to +100°C
Notes:
1. Maximum IPEAK at f = 1 kHz, DF = 6.7%.
2. Refer to Figure 6 to establish pulsed operating conditions.
3. Derate linearly as shown in Figure 5.
4. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds.
It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.
Electrical/Optical Characteristics at TA = 25°C
Symbol Description Min. Typ. Max. Unit Test Condition
VF Forward Voltage 1.8 2.2 V IF = 20 mA
VR Reverse Breakdown Voltage 5.0 15.0 V IR = 100 A
p Peak Wavelength 645 nm Measurement at Peak
d Dominant Wavelength 637 nm Note 1
1/2 Spectral Line Halfwidth 20 nm
S Speed of Response 30 ns Exponential Time
Constant, e-t/TS
C Capacitance 30 pF VF = 0, f = 1 MHz
RJ-PIN Thermal Resistance 260[3]
210[4]
290[5]
°C/W Junction to Cathode
Lead
V Luminous E cacy 80 Im/W Note 2
Notes:
1. The dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the color of the device.
2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = lV/V, where IV is the luminous intensity in candelas and V is
luminous e cacy in lumens/watt.
3. HLMP-D101.
4. HLMP-D105.
5. HLMP-K101/-K105.
4
Figure 3. Relative luminous intensity vs. dc forward current. Figure 4. Relative e ciency vs. peak forward current.
Figure 5. Maximum forward dc current vs. ambient temperature.
Derating based on TJ MAX. = 110°C.
Figure 6. Maximum tolerable peak current vs. peak duration
(IPEAK MAX. determined from temperature derated IDC MAX.).
Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage.
5
Figure 7. Relative luminous intensity vs. angular displacement. HLMP-D101. Figure 8. Relative luminous intensity vs. angular displacement. HLMP-K101.
Figure 9. Relative luminous intensity vs. angular displacement. HLMP-D105. Figure 10. Relative luminous intensity vs. angular displacement. HLMP-K105.
6
Mechanical Option Matrix
Mechanical Option Code De nition
00 Bulk Packaging, minimum increment 500 pcs/bag
01 Tape & Reel, crimped leads, minimum increment 1300 pcs (T-13/4)/1800 pcs (T-1)
02 Tape & Reel, straight leads, minimum increment 1300 pcs (T-13/4)/1800 pcs (T-1)
A1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
A2 Right Angle Housing, even leads, minimum increment 500 pcs/bag
B1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
B2 Right Angle Housing, even leads, minimum increment 500 pcs/bag
DD Ammo Pack, straight leads in 2K increment
UQ Ammo Pack, horizontal leads in 2K increment
Note:
All categories are established for classi cation of products. Products may not be available in all categories. Please contact your local Avago representative
for further clari cation/information.
Intensity Bin Limits
Color Bin
Intensity Range (mcd)
Min. Max.
Red I 24.8 39.6
J 39.6 63.4
K 63.4 101.5
L 101.5 162.4
M 162.4 234.6
N 234.6 340.0
O 340.0 540.0
P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
Maximum tolerance for each bin limit is ± 18%.
7
Precautions:
Lead Forming:
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
LED component may be e ectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
Recommended soldering condition:
Wave Manual Solder
Soldering[1],[2] Dipping
Pre-heat Temperature 105°C Max. –
Pre-heat Time 60 sec Max. –
Peak Temperature 250°C Max. 260°C Max.
Dwell Time 3 sec Max. 5 sec Max.
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.45 x 0.45 mm 0.636 mm 0.98 to 1.08 mm
(0.018 x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)
0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering pro le to ensure that it is always conforming
to recommended soldering conditions.
Note:
1. PCB with di erent size and design (component density) will
have di erent heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering pro le again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature
does not exceed 250°C and the solder contact time does not
exceeding 3sec. Over-stressing the LED during soldering process
might cause premature failure to the LED due to delamination.
Any alignment xture that is being applied during
wave soldering should be loosely tted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment xture or pallet.
If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using re ow soldering prior to insertion the TH LED.
Recommended PC board plated through holes (PTH)
size for LED component leads.
Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause di culty inserting the TH LED.
Refer to application note AN5334 for more information
about soldering and handling of TH LED lamps.
1.59 mm
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-0230EN - April 25, 2011
Example of Wave Soldering Temperature Pro le for TH LED
0 10 20 30 40 50 60 70 80 90 100
250
200
150
100
50
TIME (MINUTES)
PREHEAT
TURBULENT WAVE LAMINAR
HOT AIR KNIFE
TEMPERATURE (°C)
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
