UC1710
UC2710
UC3710
05/99
High Current FET Driver
FEATURES
•Totem Pole Output with 6A
Source/Sink Drive
•3ns Delay
•20ns Rise and Fall Time into 2.2nF
•8ns Rise and Fall Time into 30nF
•4.7V to 18V Operation
•Inverting and Non-Inverting Outputs
•Under-Voltage Lockout with
Hysteresis
•Thermal Shutdown Protection
•MINIDIP and Power Packages
DESCRIPTION
The UC1710 family of FET drivers is made with a high-speed Schottky pro-
cess to interface between low-level control functions and very high-power
switching devices-particularly power MOSFET’s. These devices accept
low-current digital inputs to activate a high-current, totem pole output which
can source or sink a minimum of 6A.
Supply voltages for both VIN and VCcan independently range from 4.7V to
18V. These devices also feature under-voltage lockout with hysteresis.
The UC1710 is packaged in an 8-pin hermetically sealed dual in-line pack-
age for –55°C to +125°C operation. The UC2710 and UC3710 are speci-
fied for a temperature range of –40°C to +85°C and 0°C to +70°C
respectively and are available in either an 8-pin plastic dual in-line or a
5-pin, TO-220 package. Surface mount devices are also available.
INV N.I. Out
HHL
LHH
HLL
LLL
TRUTH TABLE
5
3
7
4VC
INTERNALLY CONNECTED IN T PACKAGE
OUTPUT BIAS
VIN
LOGIC BIAS
Out
2PwrGnd
TSD
UVLO1
8
Logic Gnd
INV IN
N.I. IN
INTERNALLY CONNECTED IN T PACKAGE
BLOCK DIAGRAM
UDG-99079
OUT= INV and N.I.
OUT= INV or N.I.
TEMPERATURE
RANGE PACKAGE
UC1710J –55°C to +125°C 8 pin CDIP
UC2710DW –40°C to +85°C 16 pin SOIC-wide
UC2710J 8 pin CDIP
UC2710N 8 pin PDIP
UC2710T 5 pin TO220
UC3710DW 0°C to +70°C 16 pin SOIC-wide
UC3710N 8 pin PDIP
UC3710T 5 pin TO220
ORDERING INFORMATION
2
UC1710
UC2710
UC3710
CONNECTION DIAGRAMS
N-Package J-Package T-Package
Supply Voltage, Vin . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V
Collector Supply Voltage, VC. . . . . . . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V
Operating Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18V . . . . . . . . . . . . . . 18V . . . . . . . . . . . . . . 18V
Output Current (Source or Sink)
Steady-State. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±500mA. . . . . . . . . . . . ±500mA . . . . . . . . . . . . . ± 1A
Digital Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V-VIN . . . . . . . . –0.3V – VIN . . . . . . . . –0.3V – VIN
Power Dissipation at Ta=25°C . . . . . . . . . . . . . . . . . . . 1W. . . . . . . . . . . . . . . 1W. . . . . . . . . . . . . . . 3W
Power Dissipation at T (Case) = 25°C. . . . . . . . . . . . . . 2W. . . . . . . . . . . . . . . 2W. . . . . . . . . . . . . . 25W
Operating Junction Temperature. . . . . . . –55°C to +150°C . . . . –55°C to +150°C . . . . –55°C to +150°C
Storage Temperature . . . . . . . . . . . . . . . –65°C to +150°C . . . . –65°C to +150°C . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 seconds). . . . . . . 300°C . . . . . . . . . . . . 300°C . . . . . . . . . . . . 300°C
Note 1: All currents are positive into, negative out of the specified terminal.
Note 2: Consult Unitrode Integrated Circuits databook for information regarding thermal specifications
and limitations of packages.
ABSOLUTE MAXIMUM RATINGS
DIL-8 MINIDIP (Top View)
J or N Package SOIC-16 (Top View)
DW Package
5-Pin TO-220 (Top View)
T Package
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for VIN = VC= 15V, No load,
TA= TJ. PARAMETERS TEST CONDITIONS MIN TYP MAX UNITS
VIN Supply Current VIN =18V, VC=18V, Output Low 26 35 mA
VIN =18V, VC=18V, Output High 21 30 mA
VCSupply Current VIN =18V, VC=18V, Output Low 1.5 5.0 mA
VIN =18V, VC=18V,Output High 5.0 8 mA
UVLO Threshold VIN High to Low 3.8 4.1 4.4 V
VIN Low to High 4.1 4.4 4.8 V
3
UC1710
UC2710
UC3710
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for VIN = VC= 15V, No load,
TA= TJ. PARAMETERS TEST CONDITIONS MIN TYP MAX UNITS
UVLO Threshold Hysteresis 0.1 0.3 0.5 V
Digital Input Low Level 0.8 V
Digital Input High Level 2.0 V
Digital Input Current Digital Input = 0.0V –70 –4.0 µA
Output High Sat., VC– VOIO= –100mA 1.35 2.2 V
IO= –6A 3.2 4.5 V
Output Low Sat., VOIO= 100mA 0.25 0.6 V
IO= 6A 3.4 4.5 V
Thermal Shutdown 165 °C
From Inv., Input to Output (Note 3, 4):
Rise Time Delay CL = 0 35 70 ns
CL = 2.2nF 35 70 ns
CL = 30nF 35 70 ns
10% to 90% Rise CL = 0 20 40 ns
CL = 2.2nF 25 40 ns
CL = 30nF 85 150 ns
Fall Time Delay CL = 0 35 70 ns
CL = 2.2nF 35 70 ns
CL = 30nF 35 80 ns
90% to 10% Fall CL = 0 15 40 ns
CL = 2.2nF 20 40 ns
CL = 30nF 85 150 ns
From N.I. Input to Output (Note 3,4):
Rise Time Delay CL = 0 35 70 ns
CL = 2.2nF 35 70 ns
CL = 30nF 35 70 ns
10% to 90% Rise CL = 0 20 40 ns
CL = 2.2nF 25 40 ns
CL = 30nF 85 150 ns
Fall Time Delay CL = 0 35 70 ns
CL = 2.2nF 35 70 ns
CL = 30nF 35 80 ns
90% to 10% Fall CL = 0 15 40 ns
CL = 2.2nF 20 50 ns
CL = 30nF 85 150 ns
Total Supply Current at 200kHz Input
Switching Frequency TA= 25°C (Note 5) CL = 0 30 40 mA
Note: 3. Delay measured from 50% input change to 10% output change.
Note: 4. Those parameters with CL = 30nF are not tested in production.
Note: 5. Inv. Input pulsed at 50% duty cycle with N.I. Input = 3V. or N.I. Input pulsed at 50% duty cycle with Inv. Input = 0V.
UNITRODE CORPORATION
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054
TEL. (603) 424-2410 FAX (603) 424-3460
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-0152001QPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI
5962-0152001VPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
5962-0152001VXA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1710J ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1710J883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1710L883B OBSOLETE TO/SOT L 20 TBD Call TI Call TI
UC1710SP OBSOLETE CDIP J 16 TBD Call TI Call TI
UC2710N ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2710NG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2710T ACTIVE TO-220 KC 5 50 Green (RoHS
& no Sb/Br) CU SN N / A for Pkg Type
UC2710TG3 ACTIVE TO-220 KC 5 50 Green (RoHS
& no Sb/Br) CU SN N / A for Pkg Type
UC3710DW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3710DWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3710N ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3710NG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3710T ACTIVE TO-220 KC 5 50 Green (RoHS
& no Sb/Br) CU SN N / A for Pkg Type
UC3710TG3 ACTIVE TO-220 KC 5 50 Green (RoHS
& no Sb/Br) CU SN N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 2
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1710, UC1710-SP, UC3710 :
•Catalog: UC3710, UC1710
•Military: UC1710
•Space: UC1710-SP
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connctivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright ©2011, Texas Instruments Incorporated
