BCX6825
Datasheet Number: DS33010 Rev. 4 - 2 1 of 5
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BCX6825
A
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f
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20V NPN SILICON PLANAR MEDIUM POWER TRANSISTOR IN SOT89
Features
• BVCEO > 20V
• High current capability Maximum Continuous Current IC = 1A
• Low saturation voltage VCE(sat) < 500mV @ 1A
• Complementary PNP type: BCX69
• Lead Free, RoHS Compliant (Note 1)
• Halogen and Antimony Free, “Green” Device (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
Application
• Power MOSFET gate driving
• Low loss power switching
Mechanical Data
• Case: SOT89
• Case Material: Molded Plastic, “Green” Molding Compound
• Moisture Sensitivity: Level 1 per J-STD-020
• UL Flammability Rating 94V-0
• Terminals: Matte Tin Finish
• Weight: 0.052 grams (Approximate)
Ordering Information (Notes 3 & 4)
Product Status Marking Reel size (inches) Tape width (mm) Quantity per reel
BCX6825TA Commercial CD 7 12 1000
BCX6825QTA Automotive CD 7 12 1000
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free.
2. Diodes Inc’s “Green” Policy can be found on our website at http://www.diodes.com
3. For packaging details, go to our website at http://www.diodes.com
4. Products with Q-suffix are automotive grade. Automotive products are electrical and thermal the same as the commercial, except where specified.
Marking Information
Top View
SOT89
Device symbol Top View
Pin-out
CD = Product Type Marking Code
CD
C
E
C
B
C
E
B
BCX6825
Datasheet Number: DS33010 Rev. 4 - 2 2 of 5
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Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector-Base Voltage VCBO 25 V
Collector-Emitter Voltage VCEO 20 V
Emitter-Base Voltage VEBO 5 V
Continuous Collector Current IC 1 A
Peak Pulse Current ICM 2 A
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector Power Dissipation PD1 W
Thermal Resistance, Junction to Ambient Air (Note 5) RθJA 125 °C/W
Thermal Resistance, Junction to Leads (Note 6) RθJL 10.01 °C/W
Operating and Storage Temperature Range TJ,TSTG -65 to +150 °C
Notes: 5. For the device mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
6.Thermal resistance from junction to solder-point (on the exposed collector pad).
Thermal Characteristics
0 25 50 75 100 125 150
0.0
0.2
0.4
0.6
0.8
1.0
D era t in g C urve
Temperature (°C)
Max Power Dissipation (W)
100µ 1m 10m 100m 1 10 100 1k
0
20
40
60
80
100
120
Transient Therm al Imped ance
D=0.5
D=0.2
D=0.1
Single Pulse
D=0.05
Thermal Resistance (°C/W)
Pulse Width (s)
100µ 1m 10m 100m 1 10 100 1k
1
10
100 Single Pulse. Tamb=25°C
Pulse Power Dissipation
Pulse Width (s)
Max Powe r Di ssipation (W)
BCX6825
Datasheet Number: DS33010 Rev. 4 - 2 3 of 5
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Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ. Max Unit Test Condition
Collector-Base Breakdown Voltage BVCBO 25 - - V
IC = 100µA
Collector-Emitter Breakdown Voltage (Note 7) BVCEO 20 - - V
IC = 10mA
Emitter-Base Breakdown Voltage BVEBO 5 - - V
IE = 100µA
Collector Cutoff Current ICBO - -
100
10 nA
µA VCB = 25V
VCB = 25V, TA = 125°C
Emitter Cutoff Current IEBO - - 10 µA
VEB = 5V
DC current transfer Static ratio (Note 7) hFE 50
160
60
-
250
-
-
400
- - IC = 5mA, VCE = 10V
IC = 500mA, VCE = 1V
IC = 1A, VCE = 1V
Collector-Emitter Saturation Voltage (Note 7) VCE
(
sat
)
- - 0.5 V
IC = 1A, IB = 100mA
Base-Emitter Turn-on Voltage (Note 7) VBE
(
on
)
- - 1.0 V
IC = 1A, VCE = 1V
Transitional Frequency fT 100 - - MHz
IC = 100mA, VCE = 5V
f = 100MHz
Output capacitance Cobo - - 25 pF
VCB = 10V, f = 1MHz
Notes: 7. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ≤2%.
Typical Characteristics
BCX6825
Datasheet Number: DS33010 Rev. 4 - 2 4 of 5
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Package Outline Dimensions
Suggested Pad Layout
SOT89
Dim Min Max
A 1.40 1.60
B 0.44 0.62
B1 0.35 0.54
C 0.35 0.43
D 4.40 4.60
D1 1.52 1.83
E 2.29 2.60
e 1.50 Typ
e1 3.00 Typ
H 3.94 4.25
L 0.89 1.20
All Dimensions in mm
Dimensions Value (in mm)
X 0.900
X1 1.733
X2 0.416
Y 1.300
Y1 4.600
Y2 1.475
Y3 0.950
Y4 1.125
C 1.500
e
D
H
L
A
C
E
8° (4X)
B1
B
D1
R0.200
e1
Y1
X1
Y2
Y
C
X (3 x)
Y3 Y4
X2 (2x)
BCX6825
Datasheet Number: DS33010 Rev. 4 - 2 5 of 5
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BCX6825
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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noted herein may also be covered by one or more United States, international or foreign trademarks.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the e xpress
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their pro ducts and an y
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
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