BIPOLAR ANALOG INTEGRATED CIRCUIT PC3240TB D 3.3 V, SILICON MMIC WIDE BAND AMPLIFIER UE DESCRIPTION The PC3240TB is a silicon monolithic integrated circuit designed as IF amplifier for DBS LNB. This device exhibits low noise figure and high power gain characteristics. This IC is manufactured using our UHS0 (Ultra High Speed Process) bipolar process. FEATURES * Low current : ICC = 13 mA TYP. * High linearity : PO (1 dB) = +1 dBm TYP. @ f = 1.0 GHz O NT IN : PO (1 dB) = 4 dBm TYP. @ f = 2.2 GHz * Power gain : GP = 25 dB TYP. @ f = 1.0 GHz : GP = 24.5 dB TYP. @ f = 2.2 GHz : GP = 1.0 dB TYP. @ f = 1.0 to 2.2 GHz * Gain flatness * Noise figure : NF = 4.3 dB TYP. @ f = 1.0 GHz : NF = 4.5 dB TYP. @ f = 2.2 GHz * Supply voltage : VCC = 3.0 to 3.6 V * Port impedance APPLICATIONS : input/output 50 * IF amplifiers in DBS LNB, other L-band amplifiers, etc. ORDERING INFORMATION Part Number PC3240TB-E3 Order Number Package PC3240TB-E3-A 6-pin super minimold SC (Pb-Free) Marking C3W Supplying Form Embossed tape 8 mm wide Pin 1, 2, 3 face the perforation side of the tape Qty 3 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office. DI Part number for sample order: PC3240TB-A Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge Document No. PU10751EJ01V0DS (1st edition) Date Published February 2009 NS PC3240TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin Name 1 OUTPUT 2 GND 3 VCC 4 INPUT 5 GND D Pin No. NC Note UE 6 Note NC: Non-Connection (Connect with pin 5) Remark A NC pin is non-connection in the mold package. (When NC pin is open state, it will get influences of floating capacitance. Therefore, we recommend connect to NC pin and GND pin). Part No. VCC (V) PC2711TB 5.0 PC2712TB ICC GP NF PO (sat) PO (1 dB) (mA) (dB) (dB) (dBm) (dBm) 12.0 13.0 (1.0 GHz) 5.0 (1.0 GHz) 12.0 PC3215TB PC3224TB PC3227TB 4.5 (1.0 GHz) 3.0 (1.0 GHz) 6-pin - super 20.5 (1.5 GHz) 2.3 (1.5 GHz) 3.5 (1.5 GHz) 1.5 (1.5 GHz) 9.0 21.5 (1.0 GHz) 4.3 (1.0 GHz) 4.0 (1.0 GHz) -3.5 (1.0 GHz) 21.5 (2.2 GHz) 4.3 (2.2 GHz) 1.5 (2.2 GHz) -5.5 (2.2 GHz) 22.0 (1.0 GHz) 4.7 (1.0 GHz) -1.0 (1.0 GHz) -6.5 (1.0 GHz) 22.0 (2.2 GHz) 4.6 (2.2 GHz) -3.5 (2.2 GHz) -8.0 (2.2 GHz) 25 (1.0 GHz) 4.3 (1.0 GHz) - 1.0 (1.0 GHz) 24.5 (2.2 GHz) 4.5 (2.2 GHz) - -4.0 (2.2 GHz) 13.0 DI Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. 2 Data Sheet PU10751EJ01V0DS Package - 14.0 4.8 3.3 20.0 (1.0 GHz) 1.0 (1.0 GHz) SC PC3240TB O NT IN PRODUCT LINE-UP OF 5 V or 3.3 V-BIAS SILICON MMIC WIDE BAND AMPLIFIER (T A = +25C, VCC = 5.0 V or 3.3 V, ZS = ZL = 50 ) Marking C1G C1H minimold C3H C3K C3P C3W PC3240TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25C 4.0 V Total Circuit Current ICC TA = +25C 25 mA Power Dissipation PD TA = +85C 270 mW Operating Ambient Temperature TA 40 to +85 C Storage Temperature Tstg 55 to +150 C Input Power Pin 10 dBm D UE TA = +25C Note Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter VCC Conditions MIN. TYP. MAX. Unit 3.0 3.3 3.6 V O NT IN Supply Voltage Symbol TA 40 +25 +85 C Input Power Pin 20 dBm DI SC Operating Ambient Temperature Data Sheet PU10751EJ01V0DS 3 PC3240TB ELECTRICAL CHARACTERISTICS (T A = +25C, VCC = 3.3 V, ZS = ZL = 50 , unless otherwise specified) Symbol Test Conditions MIN. TYP. MAX. Unit No input signal 9.5 13 17 mA 25 28 dB ICC Power Gain 1 GP1 f = 0.25 GHz, Pin = 40 dBm 22 Power Gain 2 GP2 f = 1.0 GHz, Pin = 40 dBm 22 Power Gain 3 GP3 f = 1.8 GHz, Pin = 40 dBm 22.5 Power Gain 4 GP4 f = 2.2 GHz, Pin = 40 dBm 21.5 Gain 1 dB Compression Output Power 4.3 5.1 4.5 5.3 f = 1.0 GHz, Pin = 40 dBm 37 42 ISL2 f = 2.2 GHz, Pin = 40 dBm 37 44 RLin1 f = 1.0 GHz, Pin = 40 dBm 10 23 RLin2 f = 2.2 GHz, Pin = 40 dBm 10 13 RLout1 f = 1.0 GHz, Pin = 40 dBm 8 12 RLout2 f = 2.2 GHz, Pin = 40 dBm 7 12 Noise Figure 1 NF1 f = 1.0 GHz Noise Figure 2 NF2 f = 2.2 GHz Isolation 1 ISL1 O NT IN Output Return Loss 2 27.5 4 f = 2.2 GHz Output Return Loss 1 24.5 7 PO (1 dB) 2 Input Return Loss 2 28.5 2 Input Return Loss 1 25.5 +1 f = 1.0 GHz Isolation 2 28 2 PO (1 dB) 1 1 Gain 1 dB Compression Output Power 25 UE Circuit Current D Parameter dBm dB dB dB dB STANDARD CHARACTERISTICS FOR REFERENCE (T A = +25C, VCC = 3.3 V, ZS = ZL = 50 , unless otherwise specified) Parameter Power Gain 5 Power Gain 6 Gain Flatness K factor 2 Test Conditions Reference Value Unit dB GP5 f = 2.6 GHz, Pin = 40 dBm 22.5 GP6 f = 3.0 GHz, Pin = 40 dBm 20 GP f = 1.0 to 2.2 GHz, Pin = 40 dBm 1.0 dB K1 f = 1.0 GHz, Pin = 40 dBm 3.2 K2 f = 2.2 GHz, Pin = 40 dBm 4.6 dBm SC K factor 1 Symbol Output 3rd Order Intercept Point 1 OIP31 f1 = 1 000 MHz, f2 = 1 001 MHz 12.5 Output 3rd Order Intercept Point 2 OIP32 f1 = 2 200 MHz, f2 = 2 201 MHz 5.5 Input 3rd Order Intercept Point 1 IIP31 f1 = 1 000 MHz, f2 = 1 001 MHz 13 Input 3rd Order Intercept Point 2 IIP32 f1 = 2 200 MHz, f2 = 2 201 MHz 19 IM2 f1 = 1 000 MHz, f2 = 1 001 MHz, 38 dBc 44 dBc DI 2nd Order Intermodulation Distortion 2nd Harmonics 4 dBm Pin = 40 dBm/tone 2f0 f0 = 1.0 GHz, Pin = 40 dBm Data Sheet PU10751EJ01V0DS PC3240TB UE D TEST CIRCUIT O NT IN The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Type Value C1, C2 Chip Capacitor 100 pF C3 Chip Capacitor 1 000 pF C4 Feed-through Capacitor 1 000 pF CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial SC impedance. Their capacitances are therefore selected as lower impedance against a 50 load. The capacitors thus DI perform as high pass filters, suppressing low frequencies to DC. Data Sheet PU10751EJ01V0DS 5 PC3240TB O NT IN UE D ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Notes 1. 30 30 0.4 mm double sided 35 m copper clad COMPONENT LIST Value polyimide board. Size 2. Back side: GND pattern 100 pF 1608 C3 1 000 pF 1005 C4 1 000 pF Feed-through Capacitor 3. Au plated on pattern 4. : Through holes DI SC C1, C2 6 Data Sheet PU10751EJ01V0DS PC3240TB DI SC O NT IN UE D TYPICAL CHARACTERISTICS (T A = +25C, VCC = 3.3 V, ZS = ZL = 50 , unless otherwise specified) Remark The graphs indicate nominal characteristics. Data Sheet PU10751EJ01V0DS 7 DI SC O NT IN UE D PC3240TB Remark The graphs indicate nominal characteristics. 8 Data Sheet PU10751EJ01V0DS DI SC O NT IN UE D PC3240TB Remark The graphs indicate nominal characteristics. Data Sheet PU10751EJ01V0DS 9 DI SC O NT IN UE D PC3240TB Remark The graphs indicate nominal characteristics. 10 Data Sheet PU10751EJ01V0DS DI SC O NT IN UE D PC3240TB Remark The graphs indicate nominal characteristics. Data Sheet PU10751EJ01V0DS 11 DI SC O NT IN UE D PC3240TB Remark The graphs indicate nominal characteristics. 12 Data Sheet PU10751EJ01V0DS O NT IN UE D PC3240TB DI SC Remark The graphs indicate nominal characteristics. Data Sheet PU10751EJ01V0DS 13 PC3240TB S-PARAMETERS (T A = +25C, VCC = 3.3 V, Pin = 40 dBm) DI SC S22FREQUENCY O NT IN UE D S11FREQUENCY Remarks 1. Measured on the test circuit of evaluation board. 2. The graphs indicate nominal characteristics. 14 Data Sheet PU10751EJ01V0DS PC3240TB DI SC O NT IN UE D S-PARAMETERS Data Sheet PU10751EJ01V0DS 15 PC3240TB PACKAGE DIMENSIONS DI SC O NT IN UE D 6-PIN SUPER MINIMOLD (UNIT: mm) 16 Data Sheet PU10751EJ01V0DS PC3240TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC line. D (4) The DC cut capacitor must be attached to input and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering Soldering Method Infrared Reflow Soldering Conditions : 260C or below Time at peak temperature : 10 seconds or less Preheating time at 120 to 180C Maximum number of reflow processes IR260 : 60 seconds or less : 12030 seconds : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below O NT IN Partial Heating Condition Symbol Peak temperature (package surface temperature) Time at temperature of 220C or higher Wave Soldering UE methods and conditions other than those recommended below, contact your nearby sales office. WS260 HS350 DI SC Caution Do not use different soldering methods together (except for partial heating). Data Sheet PU10751EJ01V0DS 17