Standard Power
Data Sheet
Rev. 1.0, 2015-02-04
IFX30081SJV
50mA, Adjustable Linear Voltage Regulator with Ultra Low Quiescent Current
PG-DSO-8
Type Package Marking
IFX30081SJV PG-DSO-8 30081SJV
Data Sheet 2 Rev. 1.0, 2015-02-04
50mA, Adjustable Linear Voltage Regulator with Ultra
Low Quiescent Current
IFX30081SJV
1Overview
Features
• Ultra Low Current Consumption of typ. 5 µA
• Wide Input Voltage Range of 2.75 V to 42 V
• Output Current Capability up to 50 mA
• Shutdown Current less than 1 µA
• Low Drop Out Voltage of typ. 100mV @ 50mA
• Output Current Limit Protection
• Overtemperature Shutdown
• Enable Feature
• Available in PG-DSO-8
• Wide Temperature Range -40°C Tj 125°C
• Green Product (RoHS compliant)
Applications
• Battery Operated Systems
• Sensor Supplies
• Smoke and Fire Detectors
The IFX30081SJV is not qualified and manufactured according to the requirements of Infineon Technologies with
regards to automotive and/or transportation applications. For automotive applications please refer to the Infineon
TLx (TLE, TLS, TLF...) voltage regulator products.
Description
The IFX30081SJV is a wide input voltage, low drop out voltage and ultra low quiescent current linear voltage
regulator.
With a wide input voltage range of 2.75 V to 42 V and ultra low current consumption of only 5 µA this regulator is
perfectly suitable for battery operated systems as well as supplies for sensors.
The IFX30081SJV is available with an adjustable output voltage with an accuracy of 2 % and maximum output
current up to 50 mA.
The regulation concept implemented in the IFX30081SJV combines fast regulation and very good stability while
requiring only a small ceramic capacitor of 1 F at the output. Internal protection features like output current
IFX30081SJV
Overview
Data Sheet 3 Rev. 1.0, 2015-02-04
limitation and overtemperature shutdown are implemented to protect the device against failures like output short
circuit to GND, over-current and over-temperature. The device can be switched on and off by the Enable feature.
When the device is switched off, the current consumption is less than 1 µA.
Choosing External Components
An input capacitor CIN is recommended to compensate line influences. The output capacitor COUT is necessary for
the stability of the regulating circuit. Stability is guaranteed at values COUT 1µF and an ESR 100 within the
whole operating range.
Data Sheet 4 Rev. 1.0, 2015-02-04
IFX30081SJV
Block Diagram
2 Block Diagram
Figure 1 Block Diagram IFX30081SJV
Bandgap
Reference
GND
OUT
IN
Temperature
Shutdown
EN
Enable
Current
Limitation
ADJ
IFX30081SJV
Pin Configuration
Data Sheet 5 Rev. 1.0, 2015-02-04
3 Pin Configuration
3.1 Pin Assignment in PG-DSO-8 Package
Figure 2 Pin Configuration IFX30081SJV in PG-DSO-8 package
3.2 Pin Definitions and Functions in PG-DSO-8 Package
Pin Symbol Function
1IN Input
It is recommended to place a small ceramic capacitor (e.g. 100 nF), to GND, close
to the IC terminals, in order to compensate line influences.
2N.C. Not Connected
3EN Enable
Integrated pull-down resistor
Enable the IC with high level input signal.
Disable the IC with low level input signal.
4GND Ground
5N.C. Not Connected
6N.C. Not Connected
7ADJ Voltage Adjustment
Connect an external voltage divider to determine the output voltage.
8OUT Output
Connect an output capacitor COUT to GND close to the IC’s terminals, respecting the
values specified for its capacitance and ESR in Table 2 “Functional Range” on
Page 7.
IN
EN
N.C.
OUT
ADJ
N.C.
N.C.
GND
1
3
2
8
7
6
45
IFX30081SJV
General Product Characteristics
Data Sheet 6 Rev. 1.0, 2015-02-04
4 General Product Characteristics
4.1 Absolute Maximum Ratings
Note:
1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not
designed for continuous repetitive operation.
Table 1 Absolute Maximum Ratings1)
Tj = -40°C to +125°C; all voltages with respect to ground, positive current flowing into pin (unless otherwise
specified)
1) Not subject to production testing, specified by design.
Parameter Symbol Values Unit Note /
Test Condition
Number
Min. Typ. Max.
Voltage Input, Enable EN
Voltage VIN, VEN -0.3 – 45 V – P_4.1.1
Voltage Output OUT, Voltage Adjustment ADJ
Voltage VOUT -0.3 – 45 V – P_4.1.2
Voltage VADJ -0.3 - 7 V – P_4.1.3
Temperatures
Junction Temperature Tj-40 – 150 °C – P_4.1.4
Storage Temperature Tstg -55 – 150 °C – P_4.1.5
ESD Absorption
ESD Absorption VESD,HBM -2–2kVHBM
2)
2) ESD susceptibility, HBM Test according to ANSI/ESDA/JEDEC JS-001 (1.5k, 100pF).
P_4.1.6
ESD Absorption VESD,CDM -750 – 750 V CDM3) at all pins
3) ESD susceptibility, Charged Device Model “CDM” according to JEDEC JESD22-C101
P_4.1.7
Data Sheet 7 Rev. 1.0, 2015-02-04
IFX30081SJV
General Product Characteristics
4.2 Functional Range
Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the Electrical Characteristics table.
Table 2 Functional Range
Parameter Symbol Values Unit Note /
Test Condition
Number
Min. Typ. Max.
Input Voltage Range VIN VOUT,nom
+ Vdr
–42 V–
1)
1) Output current is limited internally and depends on the input voltage, see Electrical Characteristics for more details.
P_4.2.1
Extended Input Voltage Range VIN,ext 2.75 – 42 V –2)
2) Between min. value and VOUT,nom + Vdr: VOUT = VIN- Vdr. Below min. value: VOUT can drop down to 0 V.
P_4.2.2
Output Voltage Adjustable
Range
VOUT 1.2 – VIN - Vdr VVIN < 42V P_4.2.3
Output Capacitor COUT 1 – – µF –3)
3) The minimum output capacitance requirement is applicable for a worst case capacitance tolerance of 30%.
P_4.2.4
Output Capacitor’s ESR ESR(COUT)– – 100 –4)
4) Relevant ESR value at f = 10 kHz.
P_4.2.5
Junction temperature Tj-40 – 125 °C – P_4.2.6
IFX30081SJV
General Product Characteristics
Data Sheet 8 Rev. 1.0, 2015-02-04
4.3 Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Table 3 Thermal Resistance
Parameter Symbol Values Unit Note /
Test Condition
Number
Min. Typ. Max.
Junction to Case1)
1) Not subject to production test, specified by design.
RthJC – 40 – K/W – P_4.3.1
Junction to Ambient1) RthJA – 114 – K/W 2s2p board2)
2) Specified RthJA value is according to JEDEC JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm3 board with two inner copper layers (2 x 70µm Cu, 2 x 35µm
Cu). Whereever applicable a thermal via array under the exposed pad contacted the first inner copper layer.
P_4.3.2
Junction to Ambient1) RthJA – 172 – K/W footprint only3)
3) Specified RthJA value is according to JEDEC JESD51-3 at natural convection on FR4 1s0p board; The product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm3 board with one inner copper layers (1 x 70µm Cu)
P_4.3.3
Junction to Ambient1) RthJA – 139 – K/W 300 mm2 heatsink
area on PCB3)
P_4.3.4
Junction to Ambient1) RthJA – 133 – K/W 600 mm2 heatsink
area on PCB3)
P_4.3.5
IFX30081SJV
Block Description and Electrical Characteristics
Data Sheet 9 Rev. 1.0, 2015-02-04
5 Block Description and Electrical Characteristics
5.1 Voltage Regulation
The output voltage VOUT is divided by a resistor network. This fractional voltage is compared to an internal voltage
reference and drives the pass transistor accordingly.
The control loop stability depends on the output capacitor COUT, the load current, the chip temperature and the
internal circuit structure. To ensure stable operation, the output capacitor’s capacitance and its equivalent series
resistor ESR requirements given in “Functional Range” on Page 7 have to be maintained. For details see the
typical performance graph “Output Capacitor Series Resistor ESR(COUT) versus Output Current IOUT” on
Page 12. Since the output capacitor is used to buffer load steps, it should be sized according to the application’s
needs.
An input capacitor CIN is not required for stability, but is recommended to compensate line fluctuations. An
additional reverse polarity protection diode and a combination of several capacitors for filtering should be used, in
case the input is connected to a battery. Connect the capacitors close to the regulator terminals.
In order to prevent overshoots during start-up, a smooth ramping up function is implemented. This ensures almost
no overshoots during start-up, mostly independent from load and output capacitance.
Whenever the load current exceeds the specified limit, e.g. in case of a short circuit, the output current is limited
and the output voltage decreases.
The overtemperature shutdown circuit prevents the IC from immediate destruction under fault conditions (e.g.
output continuously short-circuit) by switching off the power stage. After the chip has cooled down, the regulator
restarts. This oscillatory thermal behaviour causes the junction temperature to exceed the 150° C maximum and
significantly reducing the IC’s lifetime.
Figure 3 Block Diagram Voltage Regulation
Bandgap
Reference
GND
OUT
IN
Temperature
Shutdown
Current
Limitation
ADJ
Regulated
Output Voltage
I
OUT
V
OUT
R
1
R
2
C
OUT
Supply
V
IN
LOAD
C
ESR
C
IN
IFX30081SJV
Block Description and Electrical Characteristics
Data Sheet 10 Rev. 1.0, 2015-02-04
Table 4 Electrical Characteristics
Tj = -40°C to +125°C, VIN = 13.5 V, all voltages with respect to ground; positive current defined flowing out of pin
(unless otherwise specified). Typical values are given at Tj = 25°C, VIN = 13.5 V
Parameter Symbol Values Unit Note / Test Condition Number
Min. Typ. Max.
Output Voltage Precision1)
1) Referring to the device tolerance only, the tolerance of the resistor divider can cause additional deviation. Parameter is
tested with the ADJ pin directly connected to the output pin OUT.
VOUT -2 – 2 % 50 µA IOUT 50 mA,
VOUT+ Vdr VIN 28 V,
VIN 3V, R2 250 k
P_5.1.2
Output Voltage Precision VOUT -2 – 2 % 50 µA IOUT 25 mA,
VOUT+ Vdr VIN 42 V,
VIN 3V, R2 250 k
P_5.1.3
Output Current Limitation IOUT,lim 51 85 120 mA 0 V VOUT
VOUT,nom - 0.1 V
P_5.1.4
Line Regulation
steady-state
ΔVOUT,line –120mVIOUT = 1 mA,
6V VIN 32 V
P_5.1.6
Load Regulation
steady-state
ΔVOUT,load -20 -1 – mV VIN = 6 V,
50 µA IOUT 50 mA
P_5.1.7
Dropout Voltage2)
Vdr = VIN - VOUT
2) Measured when the output voltage VOUT has dropped 100mV from the nominal value obtained at VIN = 13.5 V
Vdr – 100 300 mV IOUT =50mA, VIN = 5.4 V P_5.1.11
Reference Voltage Vref 1.17 1.2 1.23 V – P_5.1.12
Output Voltage Adjustable
Range
VOUT,Rang
e
1.2 – VIN - Vdr VVIN < 42V P_5.1.1
Ripple Rejection3)
3) Not subject to production test, guaranteed by design
PSRR –60–dBIOUT =50mA,
VOUT =1.2V
fripple = 100 Hz,
Vripple = 0.5 Vp-p
P_5.1.13
Overtemperature Shutdown
Threshold
Tj,sd 151 175 – °C Tj increasing P_5.1.14
Overtemperature Shutdown
Threshold Hysteresis
Tj,sdh –10–KTj decreasing P_5.1.15
IFX30081SJV
Block Description and Electrical Characteristics
Data Sheet 11 Rev. 1.0, 2015-02-04
5.2 Typical Performance Characteristics Voltage Regulation
Typical Performance Characteristics
Output Voltage VOUT versus
Junction Temperature Tj
Output Voltage VOUT versus
Input Voltage VIN
Dropout Voltage Vdr versus
Junction Temperature Tj
Dropout Voltage Vdr versus
Output Current IOUT
0 50 100
1.15
1.16
1.17
1.18
1.19
1.2
1.21
1.22
1.23
1.24
T
j
[°C]
V
OUT
[V]
V
IN
= 3 V
V
IN
= 13.5 V
V
IN
= 28 V
0 1 2 3 4 5 6
0
1
2
3
4
5
6
V
IN
[V]
V
OUT
[V]
I
OUT
= 50 mA
T
j
= 25 °C
0 50 100
0
50
100
150
200
250
T
j
[°C]
V
dr
[mV]
I
OUT
= 10 mA
I
OUT
= 25 mA
I
OUT
= 50 mA
0 10 20 30 40 50
0
50
100
150
200
250
I
OUT
[mA]
V
dr
[mV]
T
j
= −40 °C
T
j
= 25 °C
T
j
= 125 °C
IFX30081SJV
Block Description and Electrical Characteristics
Data Sheet 12 Rev. 1.0, 2015-02-04
Load Regulation ∆VOUT,load versus
Output Current Change ∆IOUT
Line Regulation ∆VOUT,line versus
Input Voltage VIN
Power Supply Ripple Rejection PSRR versus
ripple frequency fr
Output Capacitor Series Resistor ESR(COUT) versus
Output Current IOUT
0 10 20 30 40 50
−10
−8
−6
−4
−2
0
2
4
6
8
10
I
OUT
[mA]
dV
load
[mV]
V
IN
= 6 V
T
j
= −40 °C
T
j
= 25 °C
T
j
= 125 °C
10 15 20 25 30 35 40
−10
−8
−6
−4
−2
0
2
4
6
8
10
V
IN
[V]
dV
line
[mV]
I
OUT
= 10 mA
T
j
= −40 °C
T
j
= 25 °C
T
j
= 125 °C
10
−2
10
−1
10
0
10
1
10
2
10
3
0
10
20
30
40
50
60
70
80
90
100
f [kHz]
PSRR [dB]
I
OUT
= 10 mA
C
OUT
= 1 μF
V
IN
= 13.5 V
V
ripple
= 0.5 V
pp
T
j
= 25 °C
0 10 20 30 40 50
10
−2
10
−1
10
0
10
1
10
2
10
3
I
OUT
[mA]
ESR(C
OUT
) [Ω]
C
OUT
= 1 μF
V
IN
= 3...28 V
Stable Region
Unstable Region
IFX30081SJV
Block Description and Electrical Characteristics
Data Sheet 13 Rev. 1.0, 2015-02-04
Maximum Output Current IOUT,Max versus
Input Voltage VIN
0 10 20 30 40
0
20
40
60
80
100
120
V
IN
[V]
I
OUT,Max
[mA]
T
j
= −40°C
T
j
= 25°C
T
j
= 125°C
IFX30081SJV
Block Description and Electrical Characteristics
Data Sheet 14 Rev. 1.0, 2015-02-04
5.3 Current Consumption
Table 5 Electrical Characteristics Current Consumption IFX30081SJV
Tj = -40°C to +125°C, VIN = 13.5 V, all voltages with respect to ground; positive current defined flowing out of pin
(unless otherwise specified).
Parameter Symbol Values Unit Note / Test Condition Number
Min. Typ. Max.
Current Consumption
Iq = IIN
Iq,OFF ––1µAVEN 0.4 V, Tj < 105 °C P_5.3.1
Current Consumption
Iq = IIN - IOUT
Iq–57.5µAIOUT = 50µA, Tj = 25 °C P_5.3.2
Current Consumption
Iq = IIN - IOUT
Iq–610µAIOUT = 50 µA, Tj < 105 °C P_5.3.3
Current Consumption
Iq = IIN - IOUT
Iq–6.511µAIOUT = 50 µA, Tj < 125 °C P_5.3.4
Current Consumption
Iq = IIN - IOUT
Iq–6.511µAIOUT = 50 mA, Tj < 125 °C P_5.3.5
IFX30081SJV
Block Description and Electrical Characteristics
Data Sheet 15 Rev. 1.0, 2015-02-04
5.4 Typical Performance Characteristics Current Consumption
Typical Performance Characteristics
Current Consumption in OFF mode Iq,OFF versus
Junction Temperature Tj
Current Consumption in OFF mode Iq,OFF versus
Input Voltage VIN
Current Consumption Iq versus
Input Voltage VIN
Current Consumption Iq versus
Input Voltage VIN
0 50 100
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
T
j
[°C]
I
q,off
[μA]
V
EN
≤ 0.4 VV
IN
= 6 V
V
IN
= 13.5 V
0 5 10 15 20 25 30
0
2
4
6
8
10
12
14
16
V
IN
[V]
I
q,off
[μA]
V
EN
≤ 0.4 V
T
j
= −40 °C
T
j
= 25 °C
T
j
= 125 °C
10 15 20 25 30 35 40
0
5
10
15
20
25
30
35
40
V
IN
[V]
I
q
[μA]
I
OUT
= 50 μA
T
j
= −40 °C
T
j
= 25 °C
T
j
= 105 °C
T
j
= 125 °C
10 15 20 25 30 35 40
0
5
10
15
20
25
30
35
40
V
IN
[V]
I
q
[μA]
I
OUT
= 50 mA
T
j
= −40 °C
T
j
= 25 °C
T
j
= 105 °C
T
j
= 125 °C
IFX30081SJV
Block Description and Electrical Characteristics
Data Sheet 16 Rev. 1.0, 2015-02-04
Current Consumption Iq versus
Junction Temperature Tj
Current Consumption Iqversus
Output Current IOUT
0 50 100
0
5
10
15
20
25
T
j
[°C]
I
q
[μA]
V
IN
= 28 V
I
OUT
= 0.05 mA
I
OUT
= 50 mA
0 10 20 30 40 50
0
4
8
12
16
20
I
OUT
[mA]
I
q
[μA]
V
IN
= 13.5 V
T
j
= −40 °C
T
j
= 25 °C
T
j
= 105 °C
T
j
= 125 °C
IFX30081SJV
Block Description and Electrical Characteristics
Data Sheet 17 Rev. 1.0, 2015-02-04
5.5 Enable
The device IFX30081SJV can be switched on and off by the Enable feature: Connect a HIGH level as specified
below (e.g. the battery voltage) to pin EN to enable the device; connect a LOW level as specified below (e.g. GND)
to shut it down. The enable has a build in hysteresis to avoid toggling between ON/OFF state, if signals with slow
slopes are appiled to the input.
Table 6 Electrical Characteristics Enable
Tj = -40°C to +125°C, VIN = 13.5 V, all voltages with respect to ground; positive current defined flowing out of pin
(unless otherwise specified). Typical values are given at Tj = 25°C, VIN = 13.5 V
Parameter Symbol Values Unit Note / Test Condition Number
Min. Typ. Max.
High Level Input Voltage VEN,H 2––VVOUT settled P_5.5.1
Low Level Input Voltage VEN,L ––0.8VVOUT 0.1 V P_5.5.2
High Level Input Current IEN,H ––4µAVEN = 5 V P_5.5.4
Enable Internal Pull-down
Resistor
REN 1.25 2 3.5 MP_5.5.6
IFX30081SJV
Block Description and Electrical Characteristics
Data Sheet 18 Rev. 1.0, 2015-02-04
5.6 Typical Performance Characteristics Enable
Typical Performance Characteristics
Enable Input Voltage VEN versus
Junction Temperature Tj
Enable Input Current IEN versus
Enable Input Voltage VEN
0 50 100
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2
T
j
[°C]
V
EN
[V]
V
IN
≤ 13.5 V V
EN
Low
V
EN
High
0 10 20 30 40
0
5
10
15
20
25
30
35
40
V
EN
[V]
I
EN
[μA]
T
j
= −40 °C
T
j
= 25 °C
T
j
= 125 °C
IFX30081SJV
Application Information
Data Sheet 19 Rev. 1.0, 2015-02-04
6 Application Information
Note: The following information is given as a hint for the implementation of the device only and shall not be
regarded as a description or warranty of a certain functionality, condition or quality of the device.
6.1 Application Diagram
Figure 4 Application Diagram IFX30081SJV
6.2 Selection of External Components
6.2.1 Input Pin
The typical input circuitry for a linear voltage regulator is shown in the application diagram above.
A ceramic capacitor at the input, in the range of 100 nF to 470 nF, is recommended to filter out the high frequency
disturbances imposed by the line. This capacitor must be placed very close to the input pin of the linear voltage
regulator on the PCB.
An aluminum electrolytic capacitor in the range of 10 µF to 470 µF is recommended as an input buffer to smooth
out high energy pulses. This capacitor should be placed close to the input pin of the linear voltage regulator on the
PCB.
An overvoltage suppressor diode can be used to further suppress any high voltage beyond the maximum rating
of the linear voltage regulator and protect the device against any damage due to over-voltage.
The external components at the input are not mandatory for the operation of the voltage regulator, but they are
recommended in case of possible external disturbances.
IFX30081
OUT
EN
ADJ
Regulated
Output Voltage
I
OUT
C
OUT
1µF
Supply
100nF10µF
C
IN1
C
IN2
<45V
D
IN2
I
IN
GND
Load
(e.g.
Micro
Controller,
Sensors)
GND
R
1
D
IN1
R
2
IN
IFX30081SJV
Application Information
Data Sheet 20 Rev. 1.0, 2015-02-04
6.2.2 Output Pin
An output capacitor is mandatory for the stability of linear voltage regulators.
The requirement to the output capacitor is given in “Functional Range” on Page 7. The graph “Output
Capacitor Series Resistor ESR(COUT) versus Output Current IOUT” on Page 12 shows the stable operation
range of the device.
IFX30081SJV is designed to be stable with extremely low ESR capacitors.
The output capacitor should be placed as close as possible to the regulator’s output and GND pins and on the
same side of the PCB as the regulator itself.
In case of rapid transients of input voltage or load current, the capacitance should be dimensioned in accordance
and verified in the real application that the output stability requirements are fulfilled.
6.3 Output Voltage Adjust
The output voltage of IFX30081SJV can be adjusted between 1.2 V and VIN -Vdr by an external resistor divider,
connected to the adjust pin ADJ, as shown in Figure 4.
The ADJ pin is connected internally to an error amplifier comparing the voltage at this pin with the internal
reference voltage of typically 1.2 V.
The output voltage can be easily calculated, neglecting the current flowing into the ADJ pin:
(6.1)
with
•Vref: internal reference voltage, typically 1.2V
•R1: resistor between regulator output OUT and adjust pin ADJ
•R2: resistor between adjust pin ADJ and GND
The bigger the resistors R1 and R2, the less the current flowing through the resistor divider. However, using very
big resistors makes the current flowing into the ADJ pin non-negligible. In oder to neglect the current flowing into
the ADJ pin, the values of R1 and R2 should be selected fulfilling the criteria R2 250 k.
To set the output voltage to 1.2 V, the adjust pin ADJ should be directly connected to the output pin OUT.
Take into consideration that an additional error to the output voltage tolerance may be introduced by the accuracy
of the resistors R1 and R2.
6.4 Thermal Considerations
Knowing the input voltage, the output voltage and the load profile of the application, the total power dissipation
can be calculated:
(6.2)
with
•PD: continuous power dissipation
•VIN: input voltage
•VOUT: output voltage
•IOUT: output current
•Iq: quiescent current
VOUT
R1R2
+
R2
------------------- Vref
×=
PDVIN VOUT
–()IOUT VIN Iq
×+×=
IFX30081SJV
Application Information
Data Sheet 21 Rev. 1.0, 2015-02-04
The maximum acceptable thermal resistance RthJA can then be calculated:
(6.3)
with
•Tj,max: maximum allowed junction temperature
•Ta: ambient temperature
Based on the above calculation the proper PCB type and the necessary heat sink area can be determined with
reference to the specification in “Thermal Resistance” on Page 8.
Example
Application conditions:
VIN = 12 V
VOUT = 5 V
IOUT = 40 mA
Ta= 85 °C
Calculation of RthJA,max:
PD=(VIN – VOUT) x IOUT + VIN x Iq
= (12V – 5V) x 40 mA + 12 V x 0.0115 mA
=0.28W
RthJA,max =(Tj,max – Ta) / PD
= (125 °C – 85 °C) / 0.28 W
= 142.857 K/W
As a result, the PCB design must ensure a thermal resistance RthJA lower than 143 K/W. According to “Thermal
Resistance” on Page 8 , at least 300 mm² heatsink area is needed on a FR4 1s0p PCB, or the FR4 2s2p board
could be used for this application.
6.5 Reverse Polarity Protection
IFX30081SJV is not self protected against reverse polarity faults. To protect the device against negative supply
voltage, an external reverse polarity diode is needed, as shown in Figure 4. The absolute maximum ratings of the
device as specified in“Absolute Maximum Ratings” on Page 6 must be kept.
6.6 Further Application Information
For further information you may contact http://www.infineon.com/
RthJA max,
Tjmax,Ta
–
PD
----------------------------=
IFX30081SJV
Package Outlines
Data Sheet 22 Rev. 1.0, 2015-02-04
7 Package Outlines
Figure 5 Package Outline PG-DSO-8 (Plastic Dual Small Outline Package) (RoHS-Compliant)
0.35 x 45°
1)
-0.2
4C
+0.06
0.19
0.64
±0.2
6
±0.25
0.2 8x
MC
1.27
+0.1
0.41 0.2 MA
-0.06 8x
SEATING PLANE
B
2)
Index Marking
41
85
5-0.21) A
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Lead width can be 0.61 max. in dambar area
1.75 MAX.
(1.45)
±0.07
0.175
B
0.1
PG-DSO-8-16, -24, -25, -28, -31, -33, -36, -44, -49-
PO V06
8° MAX.
IFX30081SJV
Package Outlines
Data Sheet 23 Rev. 1.0, 2015-02-04
Figure 6 Footprint PG-DSO-8 (Plastic Dual Small Outline Package) (RoHS-Compliant)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
PG-DSO-8-16, -24, -25, -28, -31, -33, -36, -44, -49-FP V01
1.27
5.69
0.65
1.31
Data Sheet 24 Rev. 1.0, 2015-02-04
IFX30081SJV
Revision History
8 Revision History
Revision Date Changes
1.0 2015-02-04 Data Sheet - Initial Version
Edition 2015-02-04
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2013 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems
and/or automotive, aviation and aerospace applications or systems only with the express written approval of
Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-
support automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device
or system. Life support devices or systems are intended to be implanted in the human body or to support and/or
maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user
or other persons may be endangered.
