IFX30081SJV 50mA, Adjustable Linear Voltage Regulator with Ultra Low Quiescent Current Data Sheet Rev. 1.0, 2015-02-04 Standard Power 50mA, Adjustable Linear Voltage Regulator with Ultra Low Quiescent Current 1 IFX30081SJV Overview Features * Ultra Low Current Consumption of typ. 5 A * Wide Input Voltage Range of 2.75 V to 42 V * Output Current Capability up to 50 mA * Shutdown Current less than 1 A * Low Drop Out Voltage of typ. 100mV @ 50mA * Output Current Limit Protection * Overtemperature Shutdown * Enable Feature * Available in PG-DSO-8 * Wide Temperature Range -40C Tj 125C * Green Product (RoHS compliant) PG-DSO-8 Applications * Battery Operated Systems * Sensor Supplies * Smoke and Fire Detectors The IFX30081SJV is not qualified and manufactured according to the requirements of Infineon Technologies with regards to automotive and/or transportation applications. For automotive applications please refer to the Infineon TLx (TLE, TLS, TLF...) voltage regulator products. Description The IFX30081SJV is a wide input voltage, low drop out voltage and ultra low quiescent current linear voltage regulator. With a wide input voltage range of 2.75 V to 42 V and ultra low current consumption of only 5 A this regulator is perfectly suitable for battery operated systems as well as supplies for sensors. The IFX30081SJV is available with an adjustable output voltage with an accuracy of 2 % and maximum output current up to 50 mA. The regulation concept implemented in the IFX30081SJV combines fast regulation and very good stability while requiring only a small ceramic capacitor of 1 F at the output. Internal protection features like output current Type Package Marking IFX30081SJV PG-DSO-8 30081SJV Data Sheet 2 Rev. 1.0, 2015-02-04 IFX30081SJV Overview limitation and overtemperature shutdown are implemented to protect the device against failures like output short circuit to GND, over-current and over-temperature. The device can be switched on and off by the Enable feature. When the device is switched off, the current consumption is less than 1 A. Choosing External Components An input capacitor CIN is recommended to compensate line influences. The output capacitor COUT is necessary for the stability of the regulating circuit. Stability is guaranteed at values COUT 1F and an ESR 100 within the whole operating range. Data Sheet 3 Rev. 1.0, 2015-02-04 IFX30081SJV Block Diagram 2 Block Diagram IN OUT Current Limitation EN ADJ Enable Bandgap Reference Temperature Shutdown GND Figure 1 Data Sheet Block Diagram IFX30081SJV 4 Rev. 1.0, 2015-02-04 IFX30081SJV Pin Configuration 3 Pin Configuration 3.1 Pin Assignment in PG-DSO-8 Package IN 1 8 OUT N.C. 2 7 ADJ EN 3 6 N.C. GND 4 5 N.C. Figure 2 Pin Configuration IFX30081SJV in PG-DSO-8 package 3.2 Pin Definitions and Functions in PG-DSO-8 Package Pin Symbol Function 1 IN Input It is recommended to place a small ceramic capacitor (e.g. 100 nF), to GND, close to the IC terminals, in order to compensate line influences. 2 N.C. Not Connected 3 EN Enable Integrated pull-down resistor Enable the IC with high level input signal. Disable the IC with low level input signal. 4 GND Ground 5 N.C. Not Connected 6 N.C. Not Connected 7 ADJ Voltage Adjustment Connect an external voltage divider to determine the output voltage. 8 OUT Output Connect an output capacitor COUT to GND close to the IC's terminals, respecting the values specified for its capacitance and ESR in Table 2 "Functional Range" on Page 7. Data Sheet 5 Rev. 1.0, 2015-02-04 IFX30081SJV General Product Characteristics 4 General Product Characteristics 4.1 Absolute Maximum Ratings Table 1 Absolute Maximum Ratings1) Tj = -40C to +125C; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. -0.3 - 45 V - P_4.1.1 Voltage Input, Enable EN Voltage VIN, VEN Voltage Output OUT, Voltage Adjustment ADJ Voltage Voltage VOUT VADJ -0.3 - 45 V - P_4.1.2 -0.3 - 7 V - P_4.1.3 Tj Tstg -40 - 150 C - P_4.1.4 -55 - 150 C - P_4.1.5 VESD,HBM VESD,CDM -2 - 2 kV HBM2) P_4.1.6 3) P_4.1.7 Temperatures Junction Temperature Storage Temperature ESD Absorption ESD Absorption ESD Absorption -750 - 750 V CDM at all pins 1) Not subject to production testing, specified by design. 2) ESD susceptibility, HBM Test according to ANSI/ESDA/JEDEC JS-001 (1.5k, 100pF). 3) ESD susceptibility, Charged Device Model "CDM" according to JEDEC JESD22-C101 Note: 1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation. Data Sheet 6 Rev. 1.0, 2015-02-04 IFX30081SJV General Product Characteristics 4.2 Functional Range Table 2 Functional Range Parameter Symbol Values Unit Note / Test Condition Number Input Voltage Range VIN VOUT,nom - + Vdr 42 V -1) P_4.2.1 Extended Input Voltage Range VIN,ext VOUT 2.75 - 42 V -2) P_4.2.2 1.2 - VIN - Vdr V VIN < 42V P_4.2.3 Output Capacitor COUT 1 - - F -3) P_4.2.4 Output Capacitor's ESR ESR(COUT) - - 100 -4) P_4.2.5 Junction temperature Tj - 125 C - P_4.2.6 Min. Output Voltage Adjustable Range 1) 2) 3) 4) -40 Typ. Max. Output current is limited internally and depends on the input voltage, see Electrical Characteristics for more details. Between min. value and VOUT,nom + Vdr: VOUT = VIN- Vdr. Below min. value: VOUT can drop down to 0 V. The minimum output capacitance requirement is applicable for a worst case capacitance tolerance of 30%. Relevant ESR value at f = 10 kHz. Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the Electrical Characteristics table. Data Sheet 7 Rev. 1.0, 2015-02-04 IFX30081SJV General Product Characteristics 4.3 Thermal Resistance Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go to www.jedec.org. Table 3 Thermal Resistance Parameter Symbol 1) Junction to Case Junction to Ambient 1) Junction to Ambient1) Junction to Ambient 1) Junction to Ambient1) Values Unit Note / Test Condition Number K/W - P_4.3.1 Min. Typ. Max. RthJC RthJA RthJA RthJA - 40 - - 139 - K/W 300 mm heatsink P_4.3.4 area on PCB3) RthJA - 133 - K/W 600 mm2 heatsink P_4.3.5 area on PCB3) 2) - 114 - K/W 2s2p board - 172 - K/W footprint only3) P_4.3.2 P_4.3.3 2 1) Not subject to production test, specified by design. 2) Specified RthJA value is according to JEDEC JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm3 board with two inner copper layers (2 x 70m Cu, 2 x 35m Cu). Whereever applicable a thermal via array under the exposed pad contacted the first inner copper layer. 3) Specified RthJA value is according to JEDEC JESD51-3 at natural convection on FR4 1s0p board; The product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm3 board with one inner copper layers (1 x 70m Cu) Data Sheet 8 Rev. 1.0, 2015-02-04 IFX30081SJV Block Description and Electrical Characteristics 5 Block Description and Electrical Characteristics 5.1 Voltage Regulation The output voltage VOUT is divided by a resistor network. This fractional voltage is compared to an internal voltage reference and drives the pass transistor accordingly. The control loop stability depends on the output capacitor COUT, the load current, the chip temperature and the internal circuit structure. To ensure stable operation, the output capacitor's capacitance and its equivalent series resistor ESR requirements given in "Functional Range" on Page 7 have to be maintained. For details see the typical performance graph "Output Capacitor Series Resistor ESR(COUT) versus Output Current IOUT" on Page 12. Since the output capacitor is used to buffer load steps, it should be sized according to the application's needs. An input capacitor CIN is not required for stability, but is recommended to compensate line fluctuations. An additional reverse polarity protection diode and a combination of several capacitors for filtering should be used, in case the input is connected to a battery. Connect the capacitors close to the regulator terminals. In order to prevent overshoots during start-up, a smooth ramping up function is implemented. This ensures almost no overshoots during start-up, mostly independent from load and output capacitance. Whenever the load current exceeds the specified limit, e.g. in case of a short circuit, the output current is limited and the output voltage decreases. The overtemperature shutdown circuit prevents the IC from immediate destruction under fault conditions (e.g. output continuously short-circuit) by switching off the power stage. After the chip has cooled down, the regulator restarts. This oscillatory thermal behaviour causes the junction temperature to exceed the 150 C maximum and significantly reducing the IC's lifetime. Supply IN OUT Regulated Output Voltage IOUT Current Limitation R1 ADJ CIN VIN Bandgap Reference Temperature Shutdown COUT C ESR VOUT LOAD R2 GND Figure 3 Data Sheet Block Diagram Voltage Regulation 9 Rev. 1.0, 2015-02-04 IFX30081SJV Block Description and Electrical Characteristics Table 4 Electrical Characteristics Tj = -40C to +125C, VIN = 13.5 V, all voltages with respect to ground; positive current defined flowing out of pin (unless otherwise specified). Typical values are given at Tj = 25C, VIN = 13.5 V Parameter Symbol 1) Values Min. Typ. Max. Unit Note / Test Condition Number Output Voltage Precision VOUT -2 - 2 % 50 A IOUT 50 mA, VOUT+ Vdr VIN 28 V, VIN 3 V, R2 250 k P_5.1.2 Output Voltage Precision VOUT -2 - 2 % 50 A IOUT 25 mA, VOUT+ Vdr VIN 42 V, VIN 3 V, R2 250 k P_5.1.3 Output Current Limitation IOUT,lim 51 85 120 mA 0 V VOUT VOUT,nom - 0.1 V P_5.1.4 Line Regulation steady-state VOUT,line - 1 20 mV IOUT = 1 mA, 6 V VIN 32 V P_5.1.6 Load Regulation steady-state VOUT,load -20 -1 - mV VIN = 6 V, 50 A IOUT 50 mA P_5.1.7 Dropout Voltage2) Vdr = VIN - VOUT Vdr - 100 300 mV IOUT = 50 mA, VIN = 5.4 V P_5.1.11 Reference Voltage Vref 1.17 1.2 1.23 V - P_5.1.12 Output Voltage Adjustable Range VOUT,Rang 1.2 - VIN - Vdr V VIN < 42V P_5.1.1 Ripple Rejection3) PSRR - 60 - dB IOUT = 50 mA, VOUT = 1.2 V fripple = 100 Hz, Vripple = 0.5 Vp-p P_5.1.13 Overtemperature Shutdown Threshold Tj,sd 151 175 - C Tj increasing P_5.1.14 Overtemperature Shutdown Threshold Hysteresis Tj,sdh - 10 - K Tj decreasing P_5.1.15 e 1) Referring to the device tolerance only, the tolerance of the resistor divider can cause additional deviation. Parameter is tested with the ADJ pin directly connected to the output pin OUT. 2) Measured when the output voltage VOUT has dropped 100mV from the nominal value obtained at VIN = 13.5 V 3) Not subject to production test, guaranteed by design Data Sheet 10 Rev. 1.0, 2015-02-04 IFX30081SJV Block Description and Electrical Characteristics 5.2 Typical Performance Characteristics Voltage Regulation Typical Performance Characteristics Output Voltage VOUT versus Junction Temperature Tj Output Voltage VOUT versus Input Voltage VIN 6 VIN = 3 V 1.24 1.23 VIN = 13.5 V VIN = 28 V 5 1.22 4 VOUT [V] VOUT [V] 1.21 1.2 3 1.19 2 1.18 1.17 1 IOUT = 50 mA Tj = 25 C 1.16 1.15 0 50 Tj [C] 0 100 Dropout Voltage Vdr versus Junction Temperature Tj 1 2 3 VIN [V] 4 5 6 Dropout Voltage Vdr versus Output Current IOUT 250 200 0 250 IOUT = 10 mA Tj = -40 C IOUT = 25 mA Tj = 25 C IOUT = 50 mA Tj = 125 C 200 Vdr [mV] 150 Vdr [mV] 150 100 100 50 50 0 Data Sheet 0 50 Tj [C] 0 100 11 0 10 20 30 IOUT [mA] 40 50 Rev. 1.0, 2015-02-04 IFX30081SJV Block Description and Electrical Characteristics Load Regulation VOUT,load versus Output Current Change IOUT Line Regulation VOUT,line versus Input Voltage VIN 10 10 Tj = -40 C 8 8 Tj = 25 C Tj = 125 C 6 4 4 2 2 0 -2 -4 -4 -6 -6 -8 -8 0 10 Tj = 125 C 0 -2 -10 20 30 IOUT [mA] 40 -10 50 Power Supply Ripple Rejection PSRR versus ripple frequency fr IOUT = 10 mA Tj = 25 C 6 dVline [mV] dVload [mV] Tj = -40 C VIN = 6 V 10 15 20 25 VIN [V] 30 35 40 Output Capacitor Series Resistor ESR(COUT) versus Output Current IOUT 3 100 10 90 Unstable Region 2 80 10 70 ESR(COUT) [] PSRR [dB] 60 50 40 1 10 Stable Region 0 10 30 20 10 0 -2 10 IOUT = 10 mA COUT = 1 F VIN = 13.5 V Vripple = 0.5 Vpp Tj = 25 C -1 10 -1 10 0 1 10 10 2 10 10 3 10 f [kHz] Data Sheet COUT = 1 F VIN = 3...28 V -2 12 0 10 20 30 IOUT [mA] 40 50 Rev. 1.0, 2015-02-04 IFX30081SJV Block Description and Electrical Characteristics Maximum Output Current IOUT,Max versus Input Voltage VIN 120 Tj = -40C Tj = 25C Tj = 125C 100 IOUT,Max [mA] 80 60 40 20 0 0 Data Sheet 10 20 VIN [V] 30 40 13 Rev. 1.0, 2015-02-04 IFX30081SJV Block Description and Electrical Characteristics 5.3 Current Consumption Table 5 Electrical Characteristics Current Consumption IFX30081SJV Tj = -40C to +125C, VIN = 13.5 V, all voltages with respect to ground; positive current defined flowing out of pin (unless otherwise specified). Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Number Current Consumption Iq = IIN Iq,OFF - - 1 A VEN 0.4 V, Tj < 105 C P_5.3.1 Current Consumption Iq = IIN - IOUT Iq - 5 7.5 A IOUT = 50A, Tj = 25 C P_5.3.2 Current Consumption Iq - 6 10 A IOUT = 50 A, Tj < 105 C P_5.3.3 Iq - 6.5 11 A IOUT = 50 A, Tj < 125 C P_5.3.4 Iq - 6.5 11 A IOUT = 50 mA, Tj < 125 C P_5.3.5 Iq = IIN - IOUT Current Consumption Iq = IIN - IOUT Current Consumption Iq = IIN - IOUT Data Sheet 14 Rev. 1.0, 2015-02-04 IFX30081SJV Block Description and Electrical Characteristics 5.4 Typical Performance Characteristics Current Consumption Typical Performance Characteristics Current Consumption in OFF mode Iq,OFF versus Junction Temperature Tj Current Consumption in OFF mode Iq,OFF versus Input Voltage VIN 1 16 VEN 0.4 V VIN = 6 V 0.9 Tj = -40 C VIN = 13.5 V VEN 0.4 V Tj = 25 C 14 Tj = 125 C 0.8 12 0.7 10 Iq,off [A] Iq,off [A] 0.6 0.5 0.4 8 6 0.3 4 0.2 2 0.1 0 0 50 Tj [C] 0 100 Current Consumption Iq versus Input Voltage VIN 0 5 20 25 30 40 IOUT = 50 A Tj = -40 C Tj = -40 C Tj = 25 C 35 35 Tj = 105 C Tj = 125 C 30 IOUT = 50 mA Tj = 25 C Tj = 105 C Tj = 125 C 30 25 Iq [A] 25 Iq [A] 15 VIN [V] Current Consumption Iq versus Input Voltage VIN 40 20 20 15 15 10 10 5 5 0 10 10 Data Sheet 15 20 25 VIN [V] 30 35 0 40 15 10 15 20 25 VIN [V] 30 35 40 Rev. 1.0, 2015-02-04 IFX30081SJV Block Description and Electrical Characteristics Current Consumption Iq versus Junction Temperature Tj Current Consumption Iqversus Output Current IOUT 25 20 IOUT = 0.05 mA IOUT = 50 mA Tj = -40 C VIN = 28 V VIN = 13.5 V Tj = 25 C 15 12 Tj = 105 C Tj = 125 C Iq [A] 16 Iq [A] 20 10 8 5 4 0 Data Sheet 0 50 Tj [C] 0 100 16 0 10 20 30 IOUT [mA] 40 50 Rev. 1.0, 2015-02-04 IFX30081SJV Block Description and Electrical Characteristics 5.5 Enable The device IFX30081SJV can be switched on and off by the Enable feature: Connect a HIGH level as specified below (e.g. the battery voltage) to pin EN to enable the device; connect a LOW level as specified below (e.g. GND) to shut it down. The enable has a build in hysteresis to avoid toggling between ON/OFF state, if signals with slow slopes are appiled to the input. Table 6 Electrical Characteristics Enable Tj = -40C to +125C, VIN = 13.5 V, all voltages with respect to ground; positive current defined flowing out of pin (unless otherwise specified). Typical values are given at Tj = 25C, VIN = 13.5 V Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Number High Level Input Voltage VEN,H 2 - - V VOUT settled P_5.5.1 Low Level Input Voltage VEN,L - - 0.8 V VOUT 0.1 V P_5.5.2 High Level Input Current IEN,H - - 4 A VEN = 5 V P_5.5.4 Enable Internal Pull-down Resistor REN 1.25 2 3.5 M Data Sheet 17 P_5.5.6 Rev. 1.0, 2015-02-04 IFX30081SJV Block Description and Electrical Characteristics 5.6 Typical Performance Characteristics Enable Typical Performance Characteristics Enable Input Voltage VEN versus Junction Temperature Tj Enable Input Current IEN versus Enable Input Voltage VEN 2 40 VIN 13.5 V VEN Low 1.9 Tj = -40 C VEN High Tj = 25 C 35 Tj = 125 C 1.8 30 1.7 25 IEN [A] VEN [V] 1.6 1.5 1.4 20 15 1.3 10 1.2 5 1.1 1 Data Sheet 0 50 Tj [C] 0 100 18 0 10 20 VEN [V] 30 40 Rev. 1.0, 2015-02-04 IFX30081SJV Application Information 6 Application Information Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device. 6.1 Application Diagram Supply DIN1 I IN Regulated IN OUT IOUT Output Voltage R1 EN IFX30081 DIN2 <45V CIN1 COUT 10F 100nF 1F CIN2 Load (e.g. Micro Controller , Sensors) ADJ R2 GND Figure 4 Application Diagram IFX30081SJV 6.2 Selection of External Components 6.2.1 Input Pin GND The typical input circuitry for a linear voltage regulator is shown in the application diagram above. A ceramic capacitor at the input, in the range of 100 nF to 470 nF, is recommended to filter out the high frequency disturbances imposed by the line. This capacitor must be placed very close to the input pin of the linear voltage regulator on the PCB. An aluminum electrolytic capacitor in the range of 10 F to 470 F is recommended as an input buffer to smooth out high energy pulses. This capacitor should be placed close to the input pin of the linear voltage regulator on the PCB. An overvoltage suppressor diode can be used to further suppress any high voltage beyond the maximum rating of the linear voltage regulator and protect the device against any damage due to over-voltage. The external components at the input are not mandatory for the operation of the voltage regulator, but they are recommended in case of possible external disturbances. Data Sheet 19 Rev. 1.0, 2015-02-04 IFX30081SJV Application Information 6.2.2 Output Pin An output capacitor is mandatory for the stability of linear voltage regulators. The requirement to the output capacitor is given in "Functional Range" on Page 7. The graph "Output Capacitor Series Resistor ESR(COUT) versus Output Current IOUT" on Page 12 shows the stable operation range of the device. IFX30081SJV is designed to be stable with extremely low ESR capacitors. The output capacitor should be placed as close as possible to the regulator's output and GND pins and on the same side of the PCB as the regulator itself. In case of rapid transients of input voltage or load current, the capacitance should be dimensioned in accordance and verified in the real application that the output stability requirements are fulfilled. 6.3 Output Voltage Adjust The output voltage of IFX30081SJV can be adjusted between 1.2 V and VIN - Vdr by an external resistor divider, connected to the adjust pin ADJ, as shown in Figure 4. The ADJ pin is connected internally to an error amplifier comparing the voltage at this pin with the internal reference voltage of typically 1.2 V. The output voltage can be easily calculated, neglecting the current flowing into the ADJ pin: R1 + R2 V OUT = ------------------- x V ref R2 (6.1) with * * * Vref: internal reference voltage, typically 1.2V R1: resistor between regulator output OUT and adjust pin ADJ R2: resistor between adjust pin ADJ and GND The bigger the resistors R1 and R2, the less the current flowing through the resistor divider. However, using very big resistors makes the current flowing into the ADJ pin non-negligible. In oder to neglect the current flowing into the ADJ pin, the values of R1 and R2 should be selected fulfilling the criteria R2 250 k. To set the output voltage to 1.2 V, the adjust pin ADJ should be directly connected to the output pin OUT. Take into consideration that an additional error to the output voltage tolerance may be introduced by the accuracy of the resistors R1 and R2. 6.4 Thermal Considerations Knowing the input voltage, the output voltage and the load profile of the application, the total power dissipation can be calculated: (6.2) P D = ( V IN - V OUT ) x I OUT + V IN x I q with * * * * * PD: continuous power dissipation VIN: input voltage VOUT: output voltage IOUT: output current Iq: quiescent current Data Sheet 20 Rev. 1.0, 2015-02-04 IFX30081SJV Application Information The maximum acceptable thermal resistance RthJA can then be calculated: T j, max - T a R thJA, max = --------------------------PD (6.3) with * * Tj,max: maximum allowed junction temperature Ta: ambient temperature Based on the above calculation the proper PCB type and the necessary heat sink area can be determined with reference to the specification in "Thermal Resistance" on Page 8. Example Application conditions: VIN = 12 V VOUT = 5 V IOUT = 40 mA Ta = 85 C Calculation of RthJA,max: PD = (VIN - VOUT) x IOUT + VIN x Iq = (12V - 5V) x 40 mA + 12 V x 0.0115 mA = 0.28 W RthJA,max = (Tj,max - Ta) / PD = (125 C - 85 C) / 0.28 W = 142.857 K/W As a result, the PCB design must ensure a thermal resistance RthJA lower than 143 K/W. According to "Thermal Resistance" on Page 8 , at least 300 mm heatsink area is needed on a FR4 1s0p PCB, or the FR4 2s2p board could be used for this application. 6.5 Reverse Polarity Protection IFX30081SJV is not self protected against reverse polarity faults. To protect the device against negative supply voltage, an external reverse polarity diode is needed, as shown in Figure 4. The absolute maximum ratings of the device as specified in"Absolute Maximum Ratings" on Page 6 must be kept. 6.6 Further Application Information For further information you may contact http://www.infineon.com/ Data Sheet 21 Rev. 1.0, 2015-02-04 IFX30081SJV Package Outlines 7 Package Outlines B 0.1 SEATING PLANE 2) 0.41+0.1 -0.06 0.2 8 5 1 4 5 -0.2 1) M 0.64 0.25 6 0.2 A B 8x C 0.19 +0.06 8 MAX. 1.27 4 -0.21) 1.75 MAX. 0.175 0.07 (1.45) 0.35 x 45 0.2 M C 8x A Index Marking 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Lead width can be 0.61 max. in dambar area PG-DSO-8-16, -24, -25, -28, -31, -33, -36, -44, -49-PO V06 Figure 5 Data Sheet Package Outline PG-DSO-8 (Plastic Dual Small Outline Package) (RoHS-Compliant) 22 Rev. 1.0, 2015-02-04 IFX30081SJV 5.69 0.65 1.31 Package Outlines 1.27 PG-DSO-8-16, -24, -25, -28, -31, -33, -36, -44, -49-FP V01 Figure 6 Footprint PG-DSO-8 (Plastic Dual Small Outline Package) (RoHS-Compliant) Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). Data Sheet 23 Rev. 1.0, 2015-02-04 IFX30081SJV Revision History 8 Revision History Revision Date Changes 1.0 2015-02-04 Data Sheet - Initial Version Data Sheet 24 Rev. 1.0, 2015-02-04 Edition 2015-02-04 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2013 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.