MIL SPECS W4E D MM 0000125 0031932 1 MEMILS rT 1 | The documentation and process conversion | | INCH-POUND | . | measures necessary to comply with this | 195 revision shall be leted b MIL-S-19500/356D | revision shalt be comp 18 Dec 92 19 June 1992 SUPERSEDING MIL-S-19500/356 . 8 July 1980 MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, DIODE, SILICON, VOLTAGE REGULATOR - TYPES 1N4954 THROUGH 1N4996, 1N5968, 1N5969, AND 1N6632 THROUGH 1N6637, 1N4954US THROUGH 1N4996US, 1N5968US, 1N5969US, AND 1N6632US THROUGH 1N6637US JANTX, JANTXV, JANS, AND JANC This specification is approved for use by all Depart- ments and Agencies of the Oepartment of Defense. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for silicon, voltage regulator diodes. Three levels of product assurance are provided for each device type as specified in MIL-S-19500, and one level of product assurance for die. 1.2 Physical dimensions. See figures 1, 2, and 3. 1.3. Maximum ratings. Maximum ratings are as shown in columns 4, 8, and 10 of table VI herein, and as follows: Py Swat tT = 75C, & = 3/8 inch (see figure 3 and 6.2), derate 50 mw/C above TF 75C. 4/ P, = 2.25 Wat T, = 25C, derate 15 mW/C above T, = 25C. Asc < Typ < *173C Cambient); -65C < Ter, < e2obec (ambient). Barometric pressure reduced (high altitude operation): 8 mm Hg. 1.4 Primary electrical characteristics. Primary electrical characteristics are as shown in columns 2, 12, and 14 of table VI herein, and as follows: R = 20C/W (max) at L = 3/8 inch 1/ Jt a = 7C/W (max) (surface mount) 34h de s V, = 390 de 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those Listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION MILITARY MIL-S-19500 - Semiconductor Devices, General Specification for. 1/ Does not apply to surface mount devices. |Beneficial comments (recommendations, additions, deletions) and any pertinent data which may of | |be use in improving this document should be addressed to: Commander, Defense Electronics Supply | |Center, DESC-ECT, 1507 Wilmington Pike, Dayton, OH 45444-5270, by using the Standardization | [Document Improvement Proposal (00 Form 1426) appearing at the end of this document or by letter. | AMSC N/A FSC 5961 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.MIL SPECS 4Y4E D MM 0000125 0031933 3 MMILS MIL-S-19500/356D STANDARD MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise tndicated, copies of federal and military specifications, standards, and handbooks are available from the Standardization Documents Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 3. REQUIREMENTS 3.1 Detail specification. The individual item requirements shall be in accordance with MIL-S-19500 and as specified herein. 3.2 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-S-19500, and as follows: 3.2.1 Symbols. us -------+--+---- Surface mount device (square end cap). Tee ----- ee ee eee Temperature, end cap. 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-S-19500, and figures 1, 2, and 3 herein. 3.3.1 Construction. Devices shali metallurgically bonded-thermally matched-noncavity-double plug construction in accordance with MIL~S-19500, 3.3.1.1, and 3.3.1.2 herein. The US" version shall be structurally identical to the axial lead type except for lead attachment. 3.3.1.1 Diodes with Vv, 2 6.8 Vdc. Diodes with V, = 6.8 V de shall utilize category I metatlurgical bonds (see MIL-S-19500). 3.3.1.2 Diodes with , $6.8 de. Diodes with V, < 6.8 V de shall utilize category I or category [11 metallurgical bonds (see MIL-S-19500). 3.4 Marking. Marking shall be in accordance with MIL-S-19500. It is permissible to have the type designation on more than one line. At the option of the manufacturer, the following marking may be omitted: a. Country of origin. b. Manufacturer's identification. c. Lot identification code. d. "IN" portion of the type designation. . 3.4.1 Marking of US version. For US version only, all marking (except see 3.5 below) may be omitted from the body, but shell be retained on the initial container. 3.5 Polarity. The polarity of all types shall be indicated with a contrasting color band to denote the cathode end. Alternatively, for U suffix devices, a minimum of three contrasting color dots spaced around the periphery on the cathode end say be used.MIL SPECS H4E D M@@ 0000325 0031934 5 MENILS MIL-S-19500/3560 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and_inspection. Sampling and inspection shall be in accordance with MIL-S-19500 and as specified herein. Lot, accumulation period shall be 6 months in lieu of 6 weeks. This applies to TX and TXV quality levels only. 4.2 Screening (all levels). Screening shall be in accordance with MIL-S-19500 (table 11), and as specified herein. Devices that exceed the Limits of table I herein shall not be acceptable. - Screen (see table II of MIL-S-19500) Measurements | | | | | i | | | | | JANS level | JANTX and JANTXV Levels | | | | | | VV | Thermal impedance, see 4.5.2 | Thermal impedance, see 4.5.2 | | | 1 | | | | | | 7 |Hermetic seal, gross leak |Hermetic seal, gross leak | | | | | | | | | { 9 [Igq and VZ {Not applicable | | L l | | | | | | 11 |Ipq and V7; Alp, = 100% of initial | Ipq and V, | | [reading or 250 nA, whichever is | | | [greater; AV, = t2.5% of initial | | ! reading L | | | | ! 42 See 4.2.2 [See 4.2.2 L | - | | 13 |Subgroups 2 and 3 of table I herein; |Subgroup 2 of table 1 herein; | | |Sinq = 100% of initial reading or |AIp4 = 100% of initial reading or = | | |250 nA, whichever is greater; {250 nA, whichever is greater; | | |AV, = 2.5% of initial reading |AV, = 22.5% of initial reading | | | l l 1/ Shall be performed anytime after screen 3. 4.2.1 Screening (JANG). Screening of JANC die shall be in accordance with MIL-S-19500, appendix H. As a minimum, die shall be 100 percent probed in accordance with group A, subgroup 2. 4.2.2 Power burn-in conditions. Power burn-in conditions are as follows: . 1,2 25% of coluan 8 (Lay) of table vi. The test current (I,) shall be adjusted to achieve a junction temperature of T, = +175 (+25, -30)C. The diode shall be suspended in a free air ambient temperature equal to or greater than 25C and equal to or Less than 100C. The mounting clips for leaded devices shall be a ainimum of 3/8" from the device body; for "US" devices, the mounting clips shall contact the endcaps with T, = 125 maximus. Ty = Py Re) + 1 or Ty z Pr (Re jendeap? + Tendeap ("US" devices)MIL SPECS 44E D M@@ 00001325 0031935 7 MMILS MIL-S-19500/356D 4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-S-19S00 and as specified herein, 4.3.1 Group E inspection. Group E inspection shall be conducted in accordance with MIL-$-19500 and group E inspection in table IV herein. 4.3.2 JANC devices. Qualification for JANC devices shall be via appendix q of MIL-S-19500. 4.4 Quality conformance inspection. Quality conformance inspection shall be in accordarnte with MIL-S-19500, and as specified herein. Group A inspection shail be performed on each sublot. 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-S-19500, and table I herein. End-point electrical measurements shall be in accordance with the applicable steps of table V herein. 4.4.2 Group 8 inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in table IVa (JANS) and table IVb (JANTX and JANTXV) of MIL-S-19500, and tables Ila and [Ib herein. Electrical measurements (end-points) and delta requirements shall be in accordance with the applicable steps of table V herein. 4.4.3 Group C inspection. Group C inspection shalt be conducted in accordance with the conditions specified for subgroup testing in table V of MIL-S-19500, and table [II herein. Electrical measurements (end-points) and delta requirements shall be in accordance with the applicable steps of table Vv herein. 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows: 4.5.1 Pulse measurements. Conditions for pulse measurements shall be as specified in section 4 of MIL-STD-750, unless otherwise specified herein. 4.5.2 Thermal impedance (Ze yx measurements). The Zoux measurements shall be performed in accordance with MIL-STD~750C, method 3101. Read and record data (2 yx? shatl be supplied to the qualifying activity on one tot (random sample of 500 devices minimum). Twenty-two of these samples shald be serialized and they shall be provided to the qualifying activity for test correlation prior to implementation date on this specification or prior to shipments as applicable. a. I, measurement current... 2... .....2. 2. TmAzL b. I, forward heating current... 2... ...2.2. 4OA. c. t, heating time. 2... ee. 10 ms. d. yy measurement delay time... 2 22... 2 2. 100 ps. The maximum Limit for Zoax under these test conditions are Z = 1.5C/W. oJX (max) a 4.5.3 Regulator voltage ()). Regulator voltage shail be measured in accordance with MIL-STD-750C, method 4022, except that the test shall be performed by the pulse method with ty = 0.2 to 300 ms. The thermal equilibrium requirement does not apply. 4.5.4 Voltage regulation W, (reg)). The breakdown voltage shall be measured at I, = 10% of column 8 of table VI and at I, 2 50% of column & of table VI. The difference between these voltages shall then be. determined and shall not exceed column 9 of table VI. The voltage measurement at I, = 10% of column 5 of table VI shall be a pulse measurement in accordance with 4.5.1. The measurement at I, = 50% of column 8 of table VI shall be made after current has been applied for 30 #3 seconds. for this tine interval, the device shall be suspended in free air by its leads with mounting clips with inside edge 0.375 to 0.50 inch from the body, and the point of connection shall be maintained at a temperature of 25 (+8, -2)C. No forced air across the device shalt be permitted. The Av, measurement may be performed after a shorter time interval following application of the test current 1f Correlation can be established to the satisfaction of the Government.MIL SPECS 44E D MM 0000125 0031536 9 MNILS MIL-S-19500/3560 pot SSE re T < _ go | | Dimensions | | | | | | {| ltr | Inches | Millimeters | Notes | | | | | | | | | [Min | Max [Min {| Max | | | | | | | | | LG L.140 | ~.300 Ct 3.56 7.62 | 3. | | | | | | | | $0 [090 | 145 229 | 38 3. | | | | | { | { t {| .900 | 1.500. | 22.8% | 38.10 | _ | | | | | \v | | 1 8 [| .o36 | .045) | 97 4 l . NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Dimensions G and D include all components of the diode periphery except the sections of leads over which the diameter is controlled. FIGURE 1. Semiconductor device, diode, silicon, voltage requlator, types 1N4954 through 1N6996, 1N5968,_1N5969, and _1N6632_ through 1N6637.MIL SPECS WUE D M@ O0003e5 0031937 O MENILS MIL-S-19500/356D 5 be F he F a eed i A | J .020 A MAX TYP | | { Dimensions { | | | {utr | Inches [__Mitlimeteps | | | | | | | Hin | Max | Min | Max | | | | | G .200 225 | 5.08 | 5.72 | | FL .o19 | 028 | 0.48) 90.71 | | | | $s] 003} --- | o.08| --- J | | | Lo] .137 | 148 | 3.48 | 3.76 | FIGURE 2. Physical dimensions (surface mount devices).MIL SPECS HUE D MM 0000125 00319346 2 MEMILS MIL-S-19500/356D eee (Qe | | | | l Type | Dim A | OimB ] | | | | |_1N46954-1N49711 |. 063 sa {| .058 sa | | | | \ t_1N4972-1N6996 | .065 S@ | .058 SQ } FIGURE 3. Physical dimensions (die).MIL SPECS 44UE D MM 0000325 00313935 4 MMILS MIL-S-19500/3560 22 20 18 16 14 12 10 MAXIMUM POWER DISSIPATION IN WATTS 0 25 50 75 100 125 150 175 Maximum lead temperature in C (T,) at point "L" from body (for maximum operating junction temperature of 175C with equal two-lead conditions). | | | | L (see note 3) | Rodt | | | l | | fo | Inches mm | C/w | | | { .000 0.00 | | | .125 3.18 | 9 | | .250 6.35 | 14 | | .375 9.52 | 20S [..750 19.05 | 34 NOTES: 1. Oimensions are in inches. 2. Metric equivalents are given for general information only. 3. Lead distance point L and thermal resistance data. 4. Inclhudes surface mount devices. FIGURE 4. Maximum power in watts versus lead temperature.MIL SPECS UGE D Mf 0000125 0031940 O MBNILS MIL-S-19500/3560 TABLE I. Group A_inspection. | MIL-STO-750 _| Symbol | ints Unit | | | | Inspection 1/ | | | | | | | | | | [Method | Conditions | | Min | Max | | | P| ft to Subgroup 1 ( | | | | | | | |Visual and mechanical | 2077 | | | | | | | inspection | | | | | | | | | | | | | | | | Sena? ; Poo | | | nernet impedance | 3101 Se 4.5.2 |7eux | | 4.5 , | | | | | | | | | Forward voltage 4011 |I, = 1A de |v 1.5 V de | | |" pF | | | |Reverse current | 4016 |0 method; Vp = column 11 [Ipq | {Column |uA de | | | jor table VI | | | 12 of | | table VI | | | | | | | | |Regulator voltage 4022 [I column 5 of table VI; Vv | Column Column V de 27 Zz | (pulsed) | [O.2 ms St p= 300 ms |. | 3 of | 4 of | | ) (see 4.5.1) | | | [table VI |table vI | | oes | C pope | ubgrou | | | | | | | | [High-temperature } [T, = 150C | | | | | | operation | | | | | | | | | | | | | | [Reverse current | 4016 [DC method; V, = column 11 of [Ip I |Column |pA de | | | |table VI; pulsed (see 4.5.1) | | | \S of | | | | | | | |table VI | | meres || pop ubgrou | | | | | | | | |Small-signal reverse | 4051 \I, = coluan 5 of table VI |Z, | {Column johas | | breakdown impedance | Ilsig = 10% of I, | | | 6 of | | | | [Ig ig 70-5 mA de (1NS96B only) | | {table VI | | | | | | | | | | |Knee impedance | 4051 IT = column 16 of table VI; = |Z2, | {Column fohas = | | | Itgig 7 10% of 11, | 4 | | Pof | | | | | | |table VI | | | subgroup ; | PoE ubgr | | | | | | | | | (Not applicable) | | | | | | | | | | ! i | | | See footnotes at end of table.MIL SPECS 44E D MM 0000325 0031941 2 MMILS MIL-S-19500/3560 TABLE I. Group A inspection - Continued. | - | Inspection 1/ | | | | | | MIL-STD-750 | Symbol [| Limits ssf Units | | | | | | | | | | [Method | Conditions | [Min [Max | | | | | | | ie | | | Subgroup 6 | {JANS Level only | | | | | | | | | | | | | [Surge current | 4066 | Loon = column 10 of table VI, lTaom | | | | | | |S surges, 1 per minute, | | | | | | | [1/120 second duration super- | | | | | | | | imposed on 1, = column 5 of | | | \ | | | |table VI | | | | | | | { | | | | | {End-point electrical | |See table v, steps 1, 4, and 5 | | | | | [| measurements | | | | | | | | | | | | i | | | Subgroup 7 { | | | | | { | | | | | | | | (Not applicable) | | | | | | | | | | | | | | | | Subgroup 8 | | | { | | { | | | | i | | |Voltage regulation | |T, = 10U to 50u of column MP | {Column = |Vide |, | (see 4.5.4) | |8 of table VI \(reg) | | 9 of | | | | | \ | {table VI | | | | | | | | | | | Temperature | 4071 |JANS Level only lov, | |Column |[%/C | | coefficient | [I, = column 5 of table VI | { {| 14 of = | | | of regulator | [Ty = 25 #5; | | [table VI | | | voltage |. |T> = 120C = Ty = 130C | | | | | | | 2 | | l | | 1/ For sampling plan, see MIL-S-19500. 10MIL SPECS YUE D MM 00001205 0031942 4 MBNMILS MIL-S-19500/356D TABLE Ila. Group B inspection for JANS devices. . | Inspection 1/ l MIL-ST0-750 _t | | | | { | Method | Conditions _i | | { F | Subgroup 1 | | | | | | | | Physical dimensions | 2066 |See figures 1, 2, and 3. | | { | | | Subgroup _2 | | | { | | | | Solderability | 2026 [Immersion depth to within 0.10 inch (0.3 ma) | | | lof body. | | | | | | Resistance to solvents | 1022 | | | | | | | Subgroup 3 | | | | | | | | Thermal shock (liquid to j{ 1051 {25 cycles, condition A | | Liquid) I | | | | | | | Hermetic seal | 1071 [Test condition E | | (gross leak) 2/ | | | | | | | | Electrical measurements | |See table V, steps 1, 3, 4, 5, and 6 | | | { | | Decap internal visual { 2075 | | | (design verification) | | | | | | | | Subgroup 4 | | | | | | | | Intermittent operating | 1037 | 1, = 40% of coluan 8 of table VI; | | life 3/ { [L = 3/8 inch, to. = tygg = 3 minutes | | | [minimum for 2000" cycles. No heat sink | | | jor forced air cooling on the devices | { | [shall be permitted (see 3.2.2). | | | | | Electrical measurements | |See table V, steps 1, 3, 4, 5, and 6 | | | | | | Subgr: 5 | | | | | | | | Accelerated steady state | 1027 [ty = 40% of column & of table VI for % | { operation life 3/ | [T, = 125C or adjusted as required, to give | | | jan average lot T, = 275C | | | | | | | | | | Electrical seasurements { [See table V, steps 2, 3, 4, 5, and 6 | | | | _I See footnotes at end of table. 11MIL SPECS HUE D MM O0001eS 0031943 & MEMILS MIL-S-19500/356D TABLE Ila. Group B inspection for JANS devices - Continued. Inspection 4/ MIL-STD-750 | | | | | | | | | | { | Method | Conditions | | | | . | { Subgroup 6 | | | | | | | Thermal resistance | 4081 |R Rese = 7C/W (surface mount), | I | jR 20C/W (max) at L = 3/8"; | | | |r8rence temperature (T,) point at L = 3/8"; | | | |e 7 (surface mount devices); +25C | | | I<, < +35C; mtg arrangement, see 3.2.3 | | | or | | | | | ; ; | | { 3101 = 42C/W maximum; Rojee = 20C/W; | | | | | | | | | | { | | |" 3u6, <1, < +35C; lreference temperature measuring point is the |inside of the mounting clip. Mounting [conditions shall _ be in accordance with 4.2.2. For sampling plan, see MIL-S-19500. For non-transparent devices, hermetic seal shall be performed after electrical measurements. Leaded samples from the same lot may be used in Lieu of the U suffix sample life test. 12MIL SPECS Y4E D M@@ 0000325 0031944 8 MENILS MIL-S-19500/356D TABLE IIb. Group 8 inspection for JANTX and _JANTXV devices. | | | | Inspection 1/ MIL-STO-750 | | - | | | {| Method | Conditions _t | | | | | Subgroup 4 | | | | | \ - | | Solderability | 2026 } | | | | [Resistance to solvents {| 1022 | | | | | | | Subgroup 2 | | | | | | | |Thermal shock (Liquid to | 1056 | | | Liquid) | | | | | | | |Surge current | 4066 |Ly5q = column 10 of table VI, 5 surges, | | | {1 per minute, 1/120 second duration | | | | superimposed on I, = column 5 of table VI | | | |<{mtg conditions to be as specified in | | | |MIL-STD-750, method 1026) | | | | | [Hermetic seal | 1071 [Test condition E | | (gross leak) 2/ | | | | | | | |Electrical measurements | |See table V, steps 1, 4, and 5 | | | | | | Subgroup 3 3 | | | | | | | | Steady-state operation | 1027 |See 4.2.2 i | life | | | | | | | |Electrical measurements | |See table V, steps 2, 3, and 4 | | | | { | Subgroup 4 | | | | | | | |Decap internal visual j 2075 | | | (design verification) | | | | | | | | Subgroup 5 | | | | | | | |Not applicable | i | | | | | | Subgroup 6 | | | | . | |High-temperature life | 1032 |T, = 200C { | (nonoperat ing) | | | | | | | |Electrical measurements | {See table V, steps 2, 3, and 4 | | I | i measurements. For sampling plan, see MIL-S-19500. for non-transparent devices, hermetic seal shall be performed after electrical Leaded samples from the same lot may be substituted for US" devices. 13MIL SPECS 44E D MM 0000125 0031945 T MEMILS MIL-S-19500/3560 TABLE III. Group C inspection (all quality tevels). MIL-STD-750 Symbol Limits Unit | | | Inspection j/ | I Method Conditions Min Max | | Subgroup 1 | Physical dimensions 2066 |See figures 1, 2, and 3 Subgroup 2 Thermal shock 1056 (glass strain) Terminal strength 2036 |Test condition E (leaded devices only) Hermetic seal 1071 (gross leak) 2/ Test condition E Moisture resistance 1021 External visual 2071 Electrical measurements See table V, steps 1, 3, 4, 5, and 6 (JANS) and steps 1, 3, and 4 (JANTX and JANTXV) wa ubgroup 3 Shock 2016 Vibration, variable frequency Electrical measurements See table V, steps 1, 3, 4, 5, and 6 (JANS) and steps 1, 3, and & CJANTX and JANTXV) Subgroup 4 Salt atmosphere 1041 (corrosion) wa ey bg Fr Not applicable . J a ne me a mr a ee ce A at me a a FP { | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | fs me weer we rene eee het enn er re re mr en ee ce ee ee ee ee e P | | | | i | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | { | | | | | | | | | | | | | | | | | | I | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | L See footnotes at end of tadle. 14MIL SPECS 44E D MM 0000125 0031946 1 MBMILS MIL-S-19500/356D TABLE II1. Group inspection (all quality levels) - Continued. | | | | | | | Inspection 1/ | MIL-STO-750 [Symbol | Limits [ unit | | - | | | | | | | | [Method | Conditions | {Min | Max | | | | | | | | | | | Subgroup 6 2/ | | | | | | | | | | | | | | | | Steady-state | 1026 |See 4.2.1 | | | | | | operation Life | | | | | | | | | | | | | | | |Electrical | |See table V, steps 1, 3, 4, 5, | | | | | | measurements | Jand 6 (JANS) and steps 2, 3, | | | | | | | Jand & (JANTX and JANTXY) | | | | | | | | | | | | | Subgroup ? | | JANTX and JANTXV levels only = | | | | | | | | | | | | | | Temperature | 4071 [ty = column 5 of table VI lov, | | Column | sec | | coefficient | [T, = 25 +5C, | | {| 14 0f | | | of regulator I [To = Ty +100C = 3/ | | [table VI | | |__ voltage | | | | | | { 1/ For sampling plan, see MIL-S-19500, (subgroups 1-6). 2/ Leaded samples from the same lot may be substituted for "US" devices. 3/ The sample plan for subgroup 7 is 22 devices, = 0. 15MIL SPECS 44E D MM 0000125 003194? 3 MEMILS MIL-S-19500/3560 TABLE IV. Group E inspection (alt quality levels) for qualification only. 4081 = 7C/W (surface mount); Jende rea BBecry (max) at L = 3/8"; ire = 7C/W (surface mount); Ire or ence temperature (Tp) point at |L = 3/8"; L = 0 (surface mount |devices); 425C < Tp < +35C. un ubgr 5 Barometric pressure (reduced)| 1001 | | | Inspection 1/ { MIL-STD-750 { Sampling | . | | plan | L_ Method | Conditions | | | | | | Subgroup 1 | | | 22 devises | | | | cto | Thermal shock | 1056 [S00 cycles, condition A | | | | | |lectrical measurements | |See table V, steps 1, 3, 4, and 6 | { | | | | Subgroup 2 | | | 22 devices | { i | =0 [Intermittent operation Life | 1037 [I, = 40% of column 8 of table VI; | | | |T, = 95C min, L = 3/8 inch, | | | Ito, = toge = 3 minutes minimum for | | | [10,000 cyctes. No heat sink or | | | jforced air cooling on the devices . | | | [shall be permitted (see 3.2.2). | | | | | |Electrical measurements | |See table V, steps 2, 3, 4, 5, and 6] | | | | Subgroup 3 | | i | i |Destructive physical | [Photos of cross sections shall be | analysis | | submitted in the qualification | | |report. Vendors shall retain | | |duplicate photos. | i | | Subgroup 4 | | | | | . Thermal resistance | 3107 fR JL = 20C/W (max) at 3/8" Lead | | be ength. #25C = Tp = 435C | or | | le | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | I 1/ For sampling plan, see MIL-S-19500, unless otherwise specified. 2/ For non-transparent devices, hermetic seal shall be performed after electrical meesurements. 16MIL SPECS 44E D MM 0000125 0033948 5 MEMILS MIL-S-19500/356D TABLE V. Groups A, B, C, and E electrical measurements. | | | | | | {Step | Inspection | MIL-STD-750 | Symbol | Limits | Unit | | | | | | | | | | l [Method | Conditions | | Min | Max L | | | | | | | | | | 1. | Reverse current | 4016 [{0C method; Vp = column {1p4 | {Column [uA de | | | | [11 of table VI | | | 12 of + | | | | | | | |table VI | | | | | { 2. | Reverse current 4016 {DC method; V, = column |! | {column = |uA de | R R1 | | | 11 of table VI | | | 13 of =| | | | | | | | {table VI | | | | | | | 3. | Regulator voltage | 4022 |I, = column 5 of table [Vy {Column |Column | V de | | | (see 4.5.3) | ivi | [30f |4of | | | | | [table VI [table VI | | | | | | | | | | | | 4. | Small signal break- | 4051 |I, = column 5 of table |Z, | {Column | ohms | | | down impedance i ivi; Ieig = 10% of Ip; | | | 6 of | | | | [lgig = U-5 mA de | | [table VI | | | | | C1N5968 only) | | | | | | | | 5. | Knee impedance | 4051 |L,, = 1 mA de; |Z2% | {Column {| ohms | | | [1554 7 0.1 mA de; | | 7of | | | | | ll, = 5 mA de | | {table VI | | | | | | ~~ (1N5968 only) | | |table VI | | | | | { | | | | | 6. | Forward voltage | 4011 [Ie = 1.0 Ade, pulsed |AV, | | #50 av de | | | | | (see 4.5.1) { we | change from | | | | | | | | previous = | | | | | | | measured value | | } | | | | | a 1/ Devices which exceed the group A Limits, for this test, shall not be accepted. 17-91qeB) JO pua 1& aJOUJ00) 295 44E D MM 0000325 0031945 7? 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The device shall be temperature stabilized with current applied prior to reading regulator voltage at the specified ambient temperature. 5. PACKAGING 5.1 Packaging*requirements. The requirements for packaging shall be in accordance with MIL-$-19500. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Notes. The notes specified in MIL-S-19500 are applicable to this specification. 6.2 Application data. Device power capability may be determined from figure 4 which shows maximum power dissipation versus lead temperature as a function of lead distance L from the device body. 6.3 Acquisition requirements. Acquisition documents should specify the following: a. Title, number, and date of this specification. ob. Issue of DODISS to be cited in the solicitation, and if required, the specific issue of individual documents referenced (see 2.1). c. Lead formation material and finish may be specified (see 3.3.1). d. Project assurance Level and type designation. 6.4 Suppliers of JANC die. The qualified JANC suppliers with the applicable letter version Cexample JANCA7218) will be identified on the QPL. | | L_ JANC ordering information | | | { | I Manufacturer | | | | i | PIN | 12969 } theu | thru | L | | | | | 1N4954 [| Ad954 | | | | 1 1N46996 | A4996 | | 6.5 Changes from previous issue. Asterisks are not used in this revision to identify changes with respect to the previous issue, due to the extensiveness of the changes. 20MIL SPECS Custodians: Army - ER Navy - EC Air Force - 17 NASA - NA Review activities: Army - AR, AV, MI Navy - SH Air Force - 85 OLA - ES User activities: Army - SM Navy - AS, CG, MC, OS Air Force - 13, 19 44E D Mi 00002325 MIL-S-19500/3560 CONCLUDING MATERIAL 21 0031952 7? M@BMILS Preparing activity: Navy - EC Agent: DLA - ES (Project 59617-1211)